Claims
- 1. A method of processing a surface of a workpiece, said method comprising:
- providing a first workpiece and a second workpiece;
- rotating a first carrier holding said first workpiece in a rotational manner about a center region of a turret and positioning said first workpiece against a first surface of one of a plurality of rotatable polishing surfaces; and
- rotating a second carrier holding said second workpiece in a rotational manner about said center region of said turret and positioning said second workpiece against a second surface of one of said plurality of rotatable polishing surfaces;
- wherein said step of rotating said first carrier in said rotational manner about said center region of said turret is performed in a scissor-like manner independent of said step of rotating said second carrier in said rotational manner about said center region of said turret.
- 2. Method of claim 1 wherein said first workpiece is held using a first carrier device and said second workpiece is held using a second carrier device.
- 3. Method of claim 1 wherein each of said rotatable polishing surfaces includes a polishing pad attached to a rotatable platen positioned around said turret.
- 4. Method of claim 1 wherein each of said plurality of rotatable polishing surfaces is defined around a turret.
- 5. Method of claim 1 wherein said plurality of rotatable polishing surfaces include three rotatable polishing surfaces.
- 6. Method of claim 1 further comprising a step of picking up said first workpiece from a load/unload station.
- 7. Method of claim 1 further comprising a step of picking up said second workpiece from a load/unload station.
- 8. Method of claim 7 wherein said workpiece is selected from a group comprising a wafer, a semiconductor wafer, a patterned semiconductor wafer, a plate, and a display panel.
- 9. A method of processing a surface of a workpiece, said method comprising:
- providing a plurality of workpieces in a workpiece carrier said plurality of workpieces comprising a first workpiece;
- transferring said first workpiece from said workpiece carrier to an alignment station;
- aligning said first workpiece to a desired position;
- transferring said first workpiece to a load/unload station;
- positioning a first carrier in a rotational manner about a center region of a turret to said load/unload station to pick up said first workpiece from said load/unload station;
- positioning said first workpiece onto a first processing surface by moving said first carrier about said center region of said turret in a rotational manner from said load/unload station to said first processing surface; and
- positioning a second carrier comprising a second workpiece about said center region of said turret to a second processing surface;
- wherein said step of positioning said first workpiece in said rotational manner about said center region of said turret is performed in a scissor-like manner independent of said step of positioning said second workpiece about said center region of said turret to said second processing surface.
- 10. Method of claim 9 further comprising the step of processing said first workpiece with a polishing surface.
- 11. Method of claim 9 further comprising the step of processing said next workpiece with a polishing surface.
- 12. Method of claim 10 wherein said first polishing surface is one of three rotatable polishing surfaces.
- 13. Method of claim 11 wherein said second polishing surface is one of three rotatable polishing surfaces.
- 14. Method of claim 9 wherein said workpiece is selected from a group comprising a wafer, a semiconductor wafer, a patterned semiconductor wafer, a plate, and a display panel.
Parent Case Info
This application claims the benefit of U.S. Provisional Application No. 60/036,298 filed Mar. 12, 1997, the disclosure of which is incorporated by reference.
US Referenced Citations (1)
Number |
Name |
Date |
Kind |
5804507 |
Perlov et al. |
Sep 1998 |
|