Number | Date | Country | Kind |
---|---|---|---|
196 51 528 | Dec 1996 | DEX |
Number | Name | Date | Kind |
---|---|---|---|
4960643 | Lemelson | Oct 1990 | |
4979015 | Stierman et al. | Dec 1990 | |
5216807 | Yoshizawa et al. | Jun 1993 | |
5240749 | Chow | Aug 1993 | |
5324987 | Iacovangelo et al. | Jun 1994 | |
5532512 | Fillion et al. | Jul 1996 | |
5656862 | Papathomas | Aug 1997 | |
5773896 | Fujimoto et al. | Jun 1998 | |
5841197 | Adamic, Jr. | Nov 1998 |
Entry |
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"Direct Chip Interconnect With Adhesive Conductor Films" by Nagesh R. Basnhally, David Chang, Ben Cranston and Steve Segar, Jr., in IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol. 15, No. 6, Dec. 1992, pp. 972-976. |
"Mounting of High Power Laser Diodes on Diamond Heatsinks" by Stefan Weib, Elke Zakel and Herbert Reichl in IEEE Transactions on Components, Packaging, and Manufacturing Technology--Part A, vol. 19, no. 1, Mar. 1996, pp. 46-53. |