Diamonds

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H01L23/3732

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/3732Diamonds

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Heat radiation member
- Patent number 12,112,993
- Issue date Oct 8, 2024
- A.L.M.T. Corp.
- Ryota Matsugi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit device and method
- Patent number 12,085,769
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out interconnect integration processes and structures
- Patent number 12,074,106
- Issue date Aug 27, 2024
- Applied Materials, Inc.
- Richard W. Plavidal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronics package assemblies and processes for making
- Patent number 12,074,099
- Issue date Aug 27, 2024
- Materion Corporation
- Ramesh Kothandapani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite having diamond crystal base
- Patent number 12,027,440
- Issue date Jul 2, 2024
- National Institute of Advanced Industrial Science and Technology
- Takashi Matsumae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,027,438
- Issue date Jul 2, 2024
- Mitsubishi Electric Corporation
- Daisuke Nakaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transferring large-area group III-nitride semiconductor material an...
- Patent number 12,020,985
- Issue date Jun 25, 2024
- The Government of the United States of America, as represented by the Secreta...
- Travis J. Anderson
- C30 - CRYSTAL GROWTH
Information Patent Grant
Thermally enhanced silicon back end layers for improved thermal per...
- Patent number 12,021,016
- Issue date Jun 25, 2024
- Intel Corporation
- Chandra Mohan Jha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface materials, 3D semiconductor packages and methods...
- Patent number 12,021,008
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and heat distribution devices for thermal management of chi...
- Patent number 11,990,386
- Issue date May 21, 2024
- Google LLC
- Madhusudan K. Iyengar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor substrate and device by bo...
- Patent number 11,961,765
- Issue date Apr 16, 2024
- Mitsubishi Electric Corporation
- Shuichi Hiza
- C30 - CRYSTAL GROWTH
Information Patent Grant
Semiconductor apparatuses and methods involving diamond and GaN-bas...
- Patent number 11,961,837
- Issue date Apr 16, 2024
- The Board of Trustees of the Leland Stanford Junior University
- Srabanti Chowdhury
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite substrate and method of producing the composite substrate...
- Patent number 11,929,294
- Issue date Mar 12, 2024
- Nichia Corporation
- Masatsugu Ichikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method of manufacturing semiconductor device,...
- Patent number 11,923,447
- Issue date Mar 5, 2024
- Fujitsu Limited
- Junya Yaita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier, assembly comprising a substrate and a carrier, and method...
- Patent number 11,810,845
- Issue date Nov 7, 2023
- OSRAM OLED GmbH
- Jörg Erich Sorg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing heat dissipation substrate and method of produc...
- Patent number 11,799,065
- Issue date Oct 24, 2023
- Nichia Corporation
- Shoichi Yamada
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method of manufacturing and modularizing assembled thermal manageme...
- Patent number 11,702,736
- Issue date Jul 18, 2023
- Korea Institute of Science and Technology
- Jae Kap Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out interconnect integration processes and structures
- Patent number 11,699,651
- Issue date Jul 11, 2023
- Applied Materials, Inc.
- Richard W. Plavidal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, semiconductor device fabrication method, and...
- Patent number 11,688,663
- Issue date Jun 27, 2023
- Fujitsu Limited
- Shirou Ozaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite member
- Patent number 11,668,009
- Issue date Jun 6, 2023
- Sumitomo Electric Industries, Ltd.
- Kengo Goto
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Thermally and electrically conductive interconnects
- Patent number 11,637,068
- Issue date Apr 25, 2023
- GLOBALFOUNDRIES U.S. Inc.
- Anthony K. Stamper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses and methods for implementing a sliding thermal interfac...
- Patent number 11,626,342
- Issue date Apr 11, 2023
- Cerebras Systems Inc.
- Jean-Philippe Fricker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and heat distribution devices for thermal management of chi...
- Patent number 11,600,548
- Issue date Mar 7, 2023
- Google LLC
- Woon-Seong Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wireless transmitter with improved thermal management
- Patent number 11,594,466
- Issue date Feb 28, 2023
- Akash Systems, Inc.
- Felix Ejeckam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a 3D semiconductor device and structure includ...
- Patent number 11,574,818
- Issue date Feb 7, 2023
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,551,992
- Issue date Jan 10, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jhih-Yang Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming board assembly with chemical vapor deposition di...
- Patent number 11,538,732
- Issue date Dec 27, 2022
- Microchip Technology Caldicot Limited
- Philip Andrew Swire
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a 3D semiconductor device and structure includ...
- Patent number 11,527,416
- Issue date Dec 13, 2022
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wireless communication system with improved thermal performance
- Patent number 11,495,515
- Issue date Nov 8, 2022
- Akash Systems, Inc.
- Tyrone D. Mitchell
- G01 - MEASURING TESTING
Information Patent Grant
Chemical vapor deposition diamond (CVDD) wires for thermal transport
- Patent number 11,488,888
- Issue date Nov 1, 2022
- Microchip Technology Caldicot Limited
- Philip Andrew Swire
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
Power Electronics Assembly
- Publication number 20240379508
- Publication date Nov 14, 2024
- SIEMENS AKTIENGESELLSCHAFT
- Christian Radüge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240379784
- Publication date Nov 14, 2024
- Sumitomo Electric Industries, Ltd.
- Akihiro HAYASAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION MEMBER AND ELECTRONIC DEVICE
- Publication number 20240371723
- Publication date Nov 7, 2024
- Denka Company Limited
- Motoi NAGASAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE MANUFACTURING METHOD
- Publication number 20240361546
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hao CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID DIAMOND BASED HEAT SPREADERS
- Publication number 20240363476
- Publication date Oct 31, 2024
- Phononics Ltd
- Shye Shapira
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION MEMBER AND ELECTRONIC DEVICE
- Publication number 20240347415
- Publication date Oct 17, 2024
- Denka Company Limited
- Motoi NAGASAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods And Heat Distribution Devices For Thermal Management Of Chi...
- Publication number 20240347414
- Publication date Oct 17, 2024
- Google LLC
- Madhusudan K. Iyengar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION MEMBER AND ELECTRONIC DEVICE
- Publication number 20240332120
- Publication date Oct 3, 2024
- Denka Company Limited
- Motoi NAGASAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER-DIAMOND COMPOSITE, HEAT DISSIPATION MEMBER, AND ELECTRONIC D...
- Publication number 20240309495
- Publication date Sep 19, 2024
- Denka Company Limited
- Hyojin Noguchi
- B22 - CASTING POWDER METALLURGY
Information Patent Application
THERMAL MANAGEMENT SYSTEM FOR ELECTRONIC DEVICE
- Publication number 20240290686
- Publication date Aug 29, 2024
- ADVANCED MICRO DEVICES, INC.
- Gamal REFAI-AHMED
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE LID INCLUDING A MULTI-LAYER STRUCTURE FOR HEAT DISSIPATION...
- Publication number 20240290683
- Publication date Aug 29, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Wen-Yi LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED BODY COMPRISING MOSAIC DIAMOND WAFER AND SEMICONDUCTOR OF DI...
- Publication number 20240258195
- Publication date Aug 1, 2024
- NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
- Hideaki YAMADA
- B32 - LAYERED PRODUCTS
Information Patent Application
COMPOSITE SUBSTRATE AND METHOD OF PRODUCING THE COMPOSITE SUBSTRATE...
- Publication number 20240222209
- Publication date Jul 4, 2024
- Nichia Corporation.
- Masatsugu ICHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES HAVING AND METHODS OF FORMING THERMALLY CONDUCTIVE SUBSTRATES
- Publication number 20240170362
- Publication date May 23, 2024
- Akash Systems, Inc.
- Daniel FRANCIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CONFORMAL THERMAL HEAT SPREADER FOR MULTICHIP COMPOSITE...
- Publication number 20240063076
- Publication date Feb 22, 2024
- Intel Corporation
- Mohammad Enamul Kabir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THEREOF
- Publication number 20240063074
- Publication date Feb 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY ENHANCED STRUCTURAL MEMBER AND/OR BOND LAYER FOR MULTICHI...
- Publication number 20240063091
- Publication date Feb 22, 2024
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20240047298
- Publication date Feb 8, 2024
- nD-HI Technologies Lab, Inc.
- Ho-Ming TONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF DIAMOND COMPOSITE WAFER
- Publication number 20240047297
- Publication date Feb 8, 2024
- nD-HI Technologies Lab, Inc.
- Ho-Ming TONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A TRANSISTOR WITH A HIGH DEGREE OF ELECTRON MO...
- Publication number 20230420542
- Publication date Dec 28, 2023
- Fraunhofer-Gesellschaft zur Forderung der angewandten Forschung e.V.
- Elke MEISSNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FEATURES IN THERMALLY CONDUCTIVE MATERIALS
- Publication number 20230420333
- Publication date Dec 28, 2023
- Akash Systems, Inc.
- Daniel FRANCIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIAMOND-METAL COMPOSITE HIGH POWER DEVICE PACKAGES
- Publication number 20230352360
- Publication date Nov 2, 2023
- MACOM Technology Solutions Holdings, Inc.
- Quinn Don Martin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT INTERCONNECT INTEGRATION PROCESSES AND STRUCTURES
- Publication number 20230352402
- Publication date Nov 2, 2023
- Applied Materials, Inc.
- Richard W. Plavidal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURES WITH PATTERNED DIE BACKSIDE LAYER
- Publication number 20230317545
- Publication date Oct 5, 2023
- Intel Corporation
- Pilin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FOR IMPROVED HEAT DISSIPATION AND METHOD
- Publication number 20230307313
- Publication date Sep 28, 2023
- Intel Corporation
- Carlton Hanna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROEPITAXIAL STRUCTURE WITH A DIAMOND HEAT SINK
- Publication number 20230307249
- Publication date Sep 28, 2023
- Maksim Leonidovich ZANAVESKIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH IMPROVED HEAT DISSIPATION
- Publication number 20230290705
- Publication date Sep 14, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chin LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL MATRIX COMPOSITE LAYERS FOR HEAT DISSIPATION FROM INTEGRATED...
- Publication number 20230282542
- Publication date Sep 7, 2023
- Intel Corporation
- Wenhao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE FABRICATION METHOD, AND...
- Publication number 20230275001
- Publication date Aug 31, 2023
- Fujitsu Limited
- Shirou OZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230268243
- Publication date Aug 24, 2023
- Huawei Technologies Co., Ltd
- Bin Hu
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Heat radiation member

Integrated circuit device and method

Fan-out interconnect integration processes and structures

Microelectronics package assemblies and processes for making

Composite having diamond crystal base

Semiconductor device

Transferring large-area group III-nitride semiconductor material an...

Thermally enhanced silicon back end layers for improved thermal per...

Thermal interface materials, 3D semiconductor packages and methods...

Methods and heat distribution devices for thermal management of chi...

Method for manufacturing a semiconductor substrate and device by bo...

Semiconductor apparatuses and methods involving diamond and GaN-bas...

Composite substrate and method of producing the composite substrate...

Semiconductor device, method of manufacturing semiconductor device,...

Carrier, assembly comprising a substrate and a carrier, and method...

Method of producing heat dissipation substrate and method of produc...

Method of manufacturing and modularizing assembled thermal manageme...

Fan-out interconnect integration processes and structures

Semiconductor device, semiconductor device fabrication method, and...

Composite member

Thermally and electrically conductive interconnects

Apparatuses and methods for implementing a sliding thermal interfac...

Methods and heat distribution devices for thermal management of chi...

Wireless transmitter with improved thermal management

Method for producing a 3D semiconductor device and structure includ...

Semiconductor device

Method for forming board assembly with chemical vapor deposition di...

Method for producing a 3D semiconductor device and structure includ...

Wireless communication system with improved thermal performance

Chemical vapor deposition diamond (CVDD) wires for thermal transport

Patents Applicationslast 30 patents

Power Electronics Assembly

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

HEAT DISSIPATION MEMBER AND ELECTRONIC DEVICE

INTEGRATED CIRCUIT DEVICE MANUFACTURING METHOD

HYBRID DIAMOND BASED HEAT SPREADERS

HEAT DISSIPATION MEMBER AND ELECTRONIC DEVICE

Methods And Heat Distribution Devices For Thermal Management Of Chi...

HEAT DISSIPATION MEMBER AND ELECTRONIC DEVICE

COPPER-DIAMOND COMPOSITE, HEAT DISSIPATION MEMBER, AND ELECTRONIC D...

THERMAL MANAGEMENT SYSTEM FOR ELECTRONIC DEVICE

PACKAGE LID INCLUDING A MULTI-LAYER STRUCTURE FOR HEAT DISSIPATION...

BONDED BODY COMPRISING MOSAIC DIAMOND WAFER AND SEMICONDUCTOR OF DI...

COMPOSITE SUBSTRATE AND METHOD OF PRODUCING THE COMPOSITE SUBSTRATE...

DEVICES HAVING AND METHODS OF FORMING THERMALLY CONDUCTIVE SUBSTRATES

INTEGRATED CONFORMAL THERMAL HEAT SPREADER FOR MULTICHIP COMPOSITE...

SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THEREOF

THERMALLY ENHANCED STRUCTURAL MEMBER AND/OR BOND LAYER FOR MULTICHI...

SEMICONDUCTOR STRUCTURE

MANUFACTURING METHOD OF DIAMOND COMPOSITE WAFER

METHOD FOR PRODUCING A TRANSISTOR WITH A HIGH DEGREE OF ELECTRON MO...

SUBSTRATE FEATURES IN THERMALLY CONDUCTIVE MATERIALS

DIAMOND-METAL COMPOSITE HIGH POWER DEVICE PACKAGES

FAN-OUT INTERCONNECT INTEGRATION PROCESSES AND STRUCTURES

PACKAGE STRUCTURES WITH PATTERNED DIE BACKSIDE LAYER

SUBSTRATE FOR IMPROVED HEAT DISSIPATION AND METHOD

HETEROEPITAXIAL STRUCTURE WITH A DIAMOND HEAT SINK

SEMICONDUCTOR STRUCTURE WITH IMPROVED HEAT DISSIPATION

METAL MATRIX COMPOSITE LAYERS FOR HEAT DISSIPATION FROM INTEGRATED...

SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE FABRICATION METHOD, AND...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF