Diamonds

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H01L23/3732

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/3732Diamonds

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Methods and heat distribution devices for thermal management of chi...
- Patent number 12,278,160
- Issue date Apr 15, 2025
- Google LLC
- Woon-Seong Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer semiconductor material structure and preparation method...
- Patent number 12,278,104
- Issue date Apr 15, 2025
- Institute of Microelectronics of the Chines Academy of Sciences
- Fengwen Mu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Arrangement and thermal management of 3D stacked dies
- Patent number 12,266,585
- Issue date Apr 1, 2025
- Advanced Micro Devices, Inc.
- John Wuu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite substrate and method of producing the composite substrate...
- Patent number 12,261,090
- Issue date Mar 25, 2025
- Nichia Corporation
- Masatsugu Ichikawa
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Composite material, heat sink and semiconductor device
- Patent number 12,252,766
- Issue date Mar 18, 2025
- Sumitomo Electric Industries, Ltd.
- Masatoshi Majima
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Methods and heat distribution devices for thermal management of chi...
- Patent number 12,243,802
- Issue date Mar 4, 2025
- Google LLC
- Madhusudan K. Iyengar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipating substrate comprising diamond and semiconductor int...
- Patent number 12,191,227
- Issue date Jan 7, 2025
- Electronics and Telecommunications Research Institute
- Hyung Seok Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid interposer of glass and silicon to reduce thermal crosstalk
- Patent number 12,191,220
- Issue date Jan 7, 2025
- Intel Corporation
- Zhimin Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface material and method for making the same
- Patent number 12,187,951
- Issue date Jan 7, 2025
- Google LLC
- Huijuan Chen
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Incorporating semiconductors on a polycrystalline diamond substrate
- Patent number 12,176,221
- Issue date Dec 24, 2024
- Texas State University
- Raju Ahmed
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Heat radiation member
- Patent number 12,112,993
- Issue date Oct 8, 2024
- A.L.M.T. Corp.
- Ryota Matsugi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit device and method
- Patent number 12,085,769
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out interconnect integration processes and structures
- Patent number 12,074,106
- Issue date Aug 27, 2024
- Applied Materials, Inc.
- Richard W. Plavidal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronics package assemblies and processes for making
- Patent number 12,074,099
- Issue date Aug 27, 2024
- Materion Corporation
- Ramesh Kothandapani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite having diamond crystal base
- Patent number 12,027,440
- Issue date Jul 2, 2024
- National Institute of Advanced Industrial Science and Technology
- Takashi Matsumae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,027,438
- Issue date Jul 2, 2024
- Mitsubishi Electric Corporation
- Daisuke Nakaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transferring large-area group III-nitride semiconductor material an...
- Patent number 12,020,985
- Issue date Jun 25, 2024
- The Government of the United States of America, as represented by the Secreta...
- Travis J. Anderson
- C30 - CRYSTAL GROWTH
Information Patent Grant
Thermally enhanced silicon back end layers for improved thermal per...
- Patent number 12,021,016
- Issue date Jun 25, 2024
- Intel Corporation
- Chandra Mohan Jha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface materials, 3D semiconductor packages and methods...
- Patent number 12,021,008
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and heat distribution devices for thermal management of chi...
- Patent number 11,990,386
- Issue date May 21, 2024
- Google LLC
- Madhusudan K. Iyengar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor substrate and device by bo...
- Patent number 11,961,765
- Issue date Apr 16, 2024
- Mitsubishi Electric Corporation
- Shuichi Hiza
- C30 - CRYSTAL GROWTH
Information Patent Grant
Semiconductor apparatuses and methods involving diamond and GaN-bas...
- Patent number 11,961,837
- Issue date Apr 16, 2024
- The Board of Trustees of the Leland Stanford Junior University
- Srabanti Chowdhury
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite substrate and method of producing the composite substrate...
- Patent number 11,929,294
- Issue date Mar 12, 2024
- Nichia Corporation
- Masatsugu Ichikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method of manufacturing semiconductor device,...
- Patent number 11,923,447
- Issue date Mar 5, 2024
- Fujitsu Limited
- Junya Yaita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier, assembly comprising a substrate and a carrier, and method...
- Patent number 11,810,845
- Issue date Nov 7, 2023
- OSRAM OLED GmbH
- Jörg Erich Sorg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing heat dissipation substrate and method of produc...
- Patent number 11,799,065
- Issue date Oct 24, 2023
- Nichia Corporation
- Shoichi Yamada
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method of manufacturing and modularizing assembled thermal manageme...
- Patent number 11,702,736
- Issue date Jul 18, 2023
- Korea Institute of Science and Technology
- Jae Kap Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out interconnect integration processes and structures
- Patent number 11,699,651
- Issue date Jul 11, 2023
- Applied Materials, Inc.
- Richard W. Plavidal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, semiconductor device fabrication method, and...
- Patent number 11,688,663
- Issue date Jun 27, 2023
- Fujitsu Limited
- Shirou Ozaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite member
- Patent number 11,668,009
- Issue date Jun 6, 2023
- Sumitomo Electric Industries, Ltd.
- Kengo Goto
- B22 - CASTING POWDER METALLURGY

Patents Applicationslast 30 patents

Information Patent Application
Diamond Wafer Based Electronic Component and Method of Manufacture
- Publication number 20250174513
- Publication date May 29, 2025
- Diamond Foundary Incorporated
- Jean-Claude Harel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH THERMAL DISSIPATION LAYER AND METHOD O...
- Publication number 20250149345
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sam Vaziri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit with Enhanced Thermal Dissipation Structure
- Publication number 20250140639
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Che Chi Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION BY NANO PIPES
- Publication number 20250140644
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hsien Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) STRUCTURES WITH THERMAL VIAS AND HEAT SPREA...
- Publication number 20250140632
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Isha Datye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH HEAT DISSIPATION LAYER AND METHOD OF FABR...
- Publication number 20250140640
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sam Vaziri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC STRUCTURE WITH HIGH THERMAL CONDUCTIVITY LAYER ON SEMICONDUCTOR...
- Publication number 20250125262
- Publication date Apr 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Che Chi Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME, AND ELECTRO...
- Publication number 20250113655
- Publication date Apr 3, 2025
- Sony Semiconductor Solutions Corporation
- TETSUO GOCHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR DIAMOND COMPOSITE MATERIALS MANUFACTURED VIA FIELD...
- Publication number 20250112112
- Publication date Apr 3, 2025
- Intel Corporation
- Carin Ruiz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE TRANSFER OF THERMAL MANAGEMENT DIES
- Publication number 20250112196
- Publication date Apr 3, 2025
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HOTSPOT-FREE SEMICONDUCTOR DEVICE CHIPS
- Publication number 20250105089
- Publication date Mar 27, 2025
- Diamond Foundry Inc.
- Jeroen Van Duren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL INTERFACE MATERIAL AND METHOD FOR MAKING THE SAME
- Publication number 20250092296
- Publication date Mar 20, 2025
- Google LLC
- Huijuan Chen
- B82 - NANO-TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250087552
- Publication date Mar 13, 2025
- Murata Manufacturing Co., Ltd.
- Mari SAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INCORPORATING SEMICONDUCTORS ON A POLYCRYSTALLINE DIAMOND SUBSTRATE
- Publication number 20250079188
- Publication date Mar 6, 2025
- Texas State University
- Raju Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH THERMAL CONDUCTIVITY SUBSTRATE
- Publication number 20250079187
- Publication date Mar 6, 2025
- Phononics Ltd
- Shaul Michaelson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR THERMAL DISSIPATION
- Publication number 20250031413
- Publication date Jan 23, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Che Chi SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SUBSTRATE, SEMICONDUCTOR DEVICE, METHOD FOR PRODUCING...
- Publication number 20250006799
- Publication date Jan 2, 2025
- AIR WATER INC.
- Keisuke KAWAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ORTHOGONAL BRIDGE PACKAGING TECHNOLOGY
- Publication number 20250006699
- Publication date Jan 2, 2025
- International Business Machines Corporation
- John Knickerbocker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Topside Cooling for Semiconductor Device
- Publication number 20240429120
- Publication date Dec 26, 2024
- Wolfspeed, Inc.
- Michael Lee Schuette
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Electronics Assembly
- Publication number 20240379508
- Publication date Nov 14, 2024
- SIEMENS AKTIENGESELLSCHAFT
- Christian Radüge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240379784
- Publication date Nov 14, 2024
- Sumitomo Electric Industries, Ltd.
- Akihiro HAYASAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION MEMBER AND ELECTRONIC DEVICE
- Publication number 20240371723
- Publication date Nov 7, 2024
- Denka Company Limited
- Motoi NAGASAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE MANUFACTURING METHOD
- Publication number 20240361546
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hao CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID DIAMOND BASED HEAT SPREADERS
- Publication number 20240363476
- Publication date Oct 31, 2024
- Phononics Ltd
- Shye Shapira
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION MEMBER AND ELECTRONIC DEVICE
- Publication number 20240347415
- Publication date Oct 17, 2024
- Denka Company Limited
- Motoi NAGASAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods And Heat Distribution Devices For Thermal Management Of Chi...
- Publication number 20240347414
- Publication date Oct 17, 2024
- Google LLC
- Madhusudan K. Iyengar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION MEMBER AND ELECTRONIC DEVICE
- Publication number 20240332120
- Publication date Oct 3, 2024
- Denka Company Limited
- Motoi NAGASAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER-DIAMOND COMPOSITE, HEAT DISSIPATION MEMBER, AND ELECTRONIC D...
- Publication number 20240309495
- Publication date Sep 19, 2024
- Denka Company Limited
- Hyojin Noguchi
- B22 - CASTING POWDER METALLURGY
Information Patent Application
THERMAL MANAGEMENT SYSTEM FOR ELECTRONIC DEVICE
- Publication number 20240290686
- Publication date Aug 29, 2024
- ADVANCED MICRO DEVICES, INC.
- Gamal REFAI-AHMED
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE LID INCLUDING A MULTI-LAYER STRUCTURE FOR HEAT DISSIPATION...
- Publication number 20240290683
- Publication date Aug 29, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Wen-Yi LIN
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Methods and heat distribution devices for thermal management of chi...

Multi-layer semiconductor material structure and preparation method...

Arrangement and thermal management of 3D stacked dies

Composite substrate and method of producing the composite substrate...

Composite material, heat sink and semiconductor device

Methods and heat distribution devices for thermal management of chi...

Heat dissipating substrate comprising diamond and semiconductor int...

Hybrid interposer of glass and silicon to reduce thermal crosstalk

Thermal interface material and method for making the same

Incorporating semiconductors on a polycrystalline diamond substrate

Heat radiation member

Integrated circuit device and method

Fan-out interconnect integration processes and structures

Microelectronics package assemblies and processes for making

Composite having diamond crystal base

Semiconductor device

Transferring large-area group III-nitride semiconductor material an...

Thermally enhanced silicon back end layers for improved thermal per...

Thermal interface materials, 3D semiconductor packages and methods...

Methods and heat distribution devices for thermal management of chi...

Method for manufacturing a semiconductor substrate and device by bo...

Semiconductor apparatuses and methods involving diamond and GaN-bas...

Composite substrate and method of producing the composite substrate...

Semiconductor device, method of manufacturing semiconductor device,...

Carrier, assembly comprising a substrate and a carrier, and method...

Method of producing heat dissipation substrate and method of produc...

Method of manufacturing and modularizing assembled thermal manageme...

Fan-out interconnect integration processes and structures

Semiconductor device, semiconductor device fabrication method, and...

Composite member

Patents Applicationslast 30 patents

Diamond Wafer Based Electronic Component and Method of Manufacture

SEMICONDUCTOR STRUCTURE WITH THERMAL DISSIPATION LAYER AND METHOD O...

Integrated Circuit with Enhanced Thermal Dissipation Structure

HEAT DISSIPATION BY NANO PIPES

INTEGRATED CIRCUIT (IC) STRUCTURES WITH THERMAL VIAS AND HEAT SPREA...

SEMICONDUCTOR DEVICE WITH HEAT DISSIPATION LAYER AND METHOD OF FABR...

IC STRUCTURE WITH HIGH THERMAL CONDUCTIVITY LAYER ON SEMICONDUCTOR...

SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME, AND ELECTRO...

TECHNOLOGIES FOR DIAMOND COMPOSITE MATERIALS MANUFACTURED VIA FIELD...

SELECTIVE TRANSFER OF THERMAL MANAGEMENT DIES

HOTSPOT-FREE SEMICONDUCTOR DEVICE CHIPS

THERMAL INTERFACE MATERIAL AND METHOD FOR MAKING THE SAME

SEMICONDUCTOR DEVICE

INCORPORATING SEMICONDUCTORS ON A POLYCRYSTALLINE DIAMOND SUBSTRATE

HIGH THERMAL CONDUCTIVITY SUBSTRATE

SEMICONDUCTOR DEVICE AND METHOD FOR THERMAL DISSIPATION

SEMICONDUCTOR SUBSTRATE, SEMICONDUCTOR DEVICE, METHOD FOR PRODUCING...

ORTHOGONAL BRIDGE PACKAGING TECHNOLOGY

Topside Cooling for Semiconductor Device

Power Electronics Assembly

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

HEAT DISSIPATION MEMBER AND ELECTRONIC DEVICE

INTEGRATED CIRCUIT DEVICE MANUFACTURING METHOD

HYBRID DIAMOND BASED HEAT SPREADERS

HEAT DISSIPATION MEMBER AND ELECTRONIC DEVICE

Methods And Heat Distribution Devices For Thermal Management Of Chi...

HEAT DISSIPATION MEMBER AND ELECTRONIC DEVICE

COPPER-DIAMOND COMPOSITE, HEAT DISSIPATION MEMBER, AND ELECTRONIC D...

THERMAL MANAGEMENT SYSTEM FOR ELECTRONIC DEVICE

PACKAGE LID INCLUDING A MULTI-LAYER STRUCTURE FOR HEAT DISSIPATION...