Patent Application
20060214295
The present invention relates to a circuit board used for various electronic instruments, such as an inverter and a power supply circuit.
With the high-density packaging of electronic devices in recent years, heat generated by devices on a circuit board has been increasing. An increase in temperature of electronic devices affects the characteristics and life of the devices and, therefore, reduces the overall reliability of electronic instruments. This increase in temperature with high-density packaging is highlighted in the field of power circuits. To improve the reliability of power circuits, it is an important task to help dissipate the heat from the heat generating devices. For this reason, a power circuit uses such a circuit board that a conductive circuit pattern is formed on a high thermal conductive metal base plate through an insulating layer. When a circuit pattern is formed on a metal base plate through an insulating layer for heat dissipation, there can be a warpage because of a difference in coefficient of linear expansion between the heat generating devices and the circuit pattern and between the heat generating devices and the base plate. This has caused electronic components to be broken in the worst case.
To ensure efficient heat dissipation while preventing board warpage, a circuit board made of a combination of materials with a low coefficient of linear expansion has been developed. For example, the circuit board shown in
The present invention is directed to providing a circuit board that reduces the board warpage due to thermal stress without using an expensive material having a low coefficient of linear expansion.
In accordance with the present invention, a circuit board has a base plate, an insulating layer and a conductive circuit portion. The insulating layer is fixed to the base plate. The insulating layer can include a resin layer. The conductive circuit portion is fixed to the insulating layer on a side opposite to the base plate. The base plate and the conductive circuit portion have substantially the same coefficient of linear expansion and thickness.
Other aspects and advantages of the invention will become apparent from the following description, taken in conjunction with the accompanying drawings, illustrating by way of example the principles of the invention.
The features of the present invention that are believed to be novel are set forth with particularity in the appended claims. The invention together with objects and advantages thereof, may best be understood by reference to the following description of the presently preferred embodiments together with the accompanying drawings in which:
The following will describe a first preferred embodiment of a circuit board according to the present invention with reference to
The base plate 1 desirably has a high thermal conductivity for improving heat dissipation. The base plate 1 may be made of alloy or composite material including metal. However, it is preferably made of simple metal, such as Cu and Al, which are inexpensive. Not taking cost into consideration, the base plate 1 may be made of Ag or Au. The base plate 1 should be thick for higher heat dissipation. However, the base plate 1 having a thickness of 10 mm or less is preferable for saving weight and lowering cost.
The circuit portion 3 is made of material having a low electric resistivity and the same coefficient of linear expansion as the base plate 1. For this reason, when the base plate 1 is made of Cu, the circuit portion 3 is desirably made of Cu. The circuit portion 3 has substantially the same thickness as the base plate 1. If the base plate 1 has a thickness of 2.5 mm, the circuit portion 3 should have a thickness of 2.375 to 2.625 mm.
The insulating layer 2 is preferably made of resin The resin desirably has high insulation properties and high thermal conductivity. For example, epoxy resin mixed with inorganic filler, such as Al2O3 powder and AlN power, is preferable for the resin. The insulating layer 2 should have a smaller thickness in view of thermal conductivity but have a greater thickness in view of insulation properties. Thus, the insulating layer 2, for example, can have a thickness of 100 to 200 μm.
The heat spreader 4 desirably has a low electric resistivity and low coefficient of linear expansion. The heat spreader 4 is, for example, made of composite material of Cu and Invar as expanded metal. Invar is a nickel/iron alloy, for example, with 36% nickel. The term of “expanded metal” in this composite material means that a metal plate is alternately slit and expanded to form a mesh, which is, for example, disclosed in the unexamined Japanese patent application publication No. 2003-152144. This composite material has a coefficient of linear expansion of 5×10−6/° C. This relatively small coefficient is due to the coefficient of linear expansion of Invar, which is 1×10−6/° C. This composite material has an electric resistivity of 2.5 μohm-cm, which is as small as that of Al. This relatively small resistivity is due to the electric resistivity of Cu, which is 1.7 μΩ-cm. The heat spreader 4, for example, has a thickness of 0.5 mm.
The base plate 1, the insulating layer 2 and the circuit portion 3 are fixed, for example, by hot pressing. In hot pressing, the base plate 1, the insulating layer 2 and the circuit portion 3 are superimposed and then pressed while being heated in vacuo, thereby fixing them. When the insulating layer 2 is made of epoxy resin, they may be fixed by pressing under a pressure of 4 MPa at a temperature of 170° C. for 1 hour. The heat spreader 4 may be fixed to the circuit portion 3 on the side opposite to the insulating layer 2 by soldering, brazing or diffusion bonding.
The following will describe a second preferred embodiment of the present invention with reference to
The resin layer 21 is, for example, made of epoxy resin mixed with inorganic filler, such as Al2O3 powder or AlN powder. It can have a thickness of several dozen μm. In this case, insulation properties are provided not by the resin layer 21 but by the inorganic insulating film 22, so that the resin layer 21 is preferably made as thin as possible.
The inorganic insulating film 22 is made of AlN, Si3N4, Al2O3, or the like. It can have a thickness of 100 to 200 μm. The inorganic insulating film 22 is formed on the base plate 1 by sputtering, chemical vapor deposition (CVD), physical vapor deposition (PVD), or the like. Then, resin is applied between the inorganic insulating film 22 and the circuit portion 3 as an adhesive to form the resin layer 21. The inorganic insulating film 22 and this resin layer cooperate to form the insulating layer 2′. In an alternative embodiment, the inorganic insulating film 22 may be formed on the bottom of the circuit portion 3.
Resin generally has a lower thermal conductivity than ceramic or metal, so that the resin layer 21 has a lower thermal conductivity than ceramic or metal. However, in this embodiment, since the insulating layer 2′ includes not only the resin layer 21 but also the inorganic insulating film 22, the resin layer 21, which is environmentally degradable and low in thermal conductivity, may be thinner and the insulation layer 2′ as a whole has insulation properties. Thus, the circuit board is resistant to environmental degradation.
This example 1 describes the circuit board according to the first preferred embodiment shown in
This example 2 describes the circuit board according to the second preferred embodiment shown in
This comparative example 1 describes the circuit board according to the prior art shown in
The comparative example 2 differs from the comparative example 1 in that the base plate 10 was made of Cu.
A semiconductor chip (transistor) is soldered onto the heat spreader 4 of the examples 1 and 2 and onto the circuit portions 30 of the comparative examples 1 and 2, respectively, and the thermal resistances of these chips are then measured. The results of the measurements are shown in TABLE 1. Thermal resistances are calculated from the measured current magnitude and temperature difference between the chip and the base plate during energization of the chip.
The results shown in TABLE 1 affirm that the circuit boards of the examples 1 and 2 have equivalent or lower thermal resistances than those of the comparative examples 1 and 2. In conclusion, it has been demonstrated that the circuit boards according to the examples 1 and 2 have lower thermal resistances and higher heat dissipation properties without using an expensive AlN insulating layer or a base plate including expensive Mo as in the comparative examples 1 and 2.
Therefore, the present examples and embodiments are to be considered as illustrative and not restrictive. The invention is not to be limited to the embodiments described herein. It is to be understood that other similar embodiments may be used or modifications and additions may be made to the described embodiments for performing the same function. Therefore, the claimed invention should not be limited to any single embodiment, but rather should be construed in breadth and scope in accordance with the appended claims.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2005-089337 | Mar 2005 | JP | national |
