Inorganic, non-metallic particles

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  • Information Patent Application

    CIRCUIT BOARD AND METHOD OF FABRICATING CIRCUIT BOARD

    • Publication number 20240422896
    • Publication date Dec 19, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Chulmun Kang
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED WIRING BOARD

    • Publication number 20240407094
    • Publication date Dec 5, 2024
    • IBIDEN CO., LTD.
    • Masashi KUWABARA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    RADIATION-SENSITIVE COMPOSITION FOR FORMING INSULATION FILM, RESIN...

    • Publication number 20240389227
    • Publication date Nov 21, 2024
    • JSR Corporation
    • Ryouji TATARA
    • G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
  • Information Patent Application

    METHOD FOR MANUFACTURING SUBSTRATE MATERIAL FOR SEMICONDUCTOR PACKA...

    • Publication number 20240381529
    • Publication date Nov 14, 2024
    • Resonac Corporation
    • Shunsuke OTAKE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WIRING SUBSTRATE

    • Publication number 20240365468
    • Publication date Oct 31, 2024
    • IBIDEN CO., LTD.
    • Masashi KUWABARA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE INCLUDING THE SAME

    • Publication number 20240357741
    • Publication date Oct 24, 2024
    • Samsung Electronics Co., Ltd.
    • Yeonkyung CHUNG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE

    • Publication number 20240341034
    • Publication date Oct 10, 2024
    • IBIDEN CO., LTD.
    • Masashi KUWABARA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE

    • Publication number 20240334598
    • Publication date Oct 3, 2024
    • Shinko Electric Industries Co., Ltd.
    • Yuki KOBAYASHI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE

    • Publication number 20240324103
    • Publication date Sep 26, 2024
    • IBIDEN CO., LTD.
    • Masashi KUWABARA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    THERMAL SOLUTIONS FOR COOLING ELECTRONIC DEVICES

    • Publication number 20240314921
    • Publication date Sep 19, 2024
    • Intel Corporation
    • Jeff Ku
    • F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
  • Information Patent Application

    SHEET FOR COMPONENT CARRIER COMPRISING SEPARATE STRUCTURES WITH FIL...

    • Publication number 20240314927
    • Publication date Sep 19, 2024
    • AT&S Austria Technologie & Systemtechnik AG
    • Nina WANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PRINTED CIRCUIT BOARD

    • Publication number 20240306293
    • Publication date Sep 12, 2024
    • HAMILTON SUNDSTRAND CORPORATION
    • Andrew Edward PAGE
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    WIRING SUBSTRATE

    • Publication number 20240306296
    • Publication date Sep 12, 2024
    • IBIDEN CO., LTD.
    • Toshiki FURUTANI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED WIRING BOARD

    • Publication number 20240306312
    • Publication date Sep 12, 2024
    • IBIDEN CO., LTD.
    • Jun SAKAI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED WIRING BOARD

    • Publication number 20240298406
    • Publication date Sep 5, 2024
    • IBIDEN CO., LTD.
    • Jun SAKAI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED WIRING BOARD

    • Publication number 20240292537
    • Publication date Aug 29, 2024
    • IBIDEN CO., LTD.
    • Susumu KAGOHASHI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    THERMOSETTING RESIN COMPOSITION, CURED PRODUCT, AND PRINTED WIRING...

    • Publication number 20240287373
    • Publication date Aug 29, 2024
    • TAIYO HOLDINGS CO., LTD.
    • Yoshikazu DAIGO
    • C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
  • Information Patent Application

    PRINTED WIRING BOARD

    • Publication number 20240292536
    • Publication date Aug 29, 2024
    • IBIDEN CO., LTD.
    • Susumu KAGOHASHI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE

    • Publication number 20240284606
    • Publication date Aug 22, 2024
    • IBIDEN CO., LTD.
    • Toshiki FURUTANI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED WIRING BOARD

    • Publication number 20240268021
    • Publication date Aug 8, 2024
    • IBIDEN CO., LTD.
    • Susumu KAGOHASHI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED WIRING BOARD

    • Publication number 20240268038
    • Publication date Aug 8, 2024
    • IBIDEN CO., LTD.
    • Susumu KAGOHASHI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED WIRING BOARD

    • Publication number 20240260179
    • Publication date Aug 1, 2024
    • IBIDEN CO., LTD.
    • Jun SAKAI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    INDUCTION COOKING HOB HAVING TWO BOARD ELEMENTS ELECTRICALLY AND ME...

    • Publication number 20240260190
    • Publication date Aug 1, 2024
    • Electrolux Appliances Aktiebolag
    • Alex VIROLI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC DEVICE AND MANUFACTURING METHOD OF ELECTRONIC DEVICE

    • Publication number 20240237195
    • Publication date Jul 11, 2024
    • InnoLux Corporation
    • Ker-Yih KAO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    WIRING SUBSTRATE

    • Publication number 20240237204
    • Publication date Jul 11, 2024
    • IBIDEN CO., LTD.
    • Keisuke SHIMIZU
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    WIRING SUBSTRATE

    • Publication number 20240206061
    • Publication date Jun 20, 2024
    • IBIDEN CO., LTD.
    • Ryo ANDO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD AND ELECTRONIC DEVICE THEREOF

    • Publication number 20240206050
    • Publication date Jun 20, 2024
    • WUHAN TIANMA MICROELECTRONICS CO., LTD.
    • Xuejing XIAO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    RESIN COMPOSITION, PREPREG, RESIN-COATED FILM, RESIN-COATED METAL F...

    • Publication number 20240182657
    • Publication date Jun 6, 2024
    • Panasonic Intellectual Property Management Co., Ltd.
    • Akira IRIFUNE
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    PRINTED WIRING BOARD

    • Publication number 20240107685
    • Publication date Mar 28, 2024
    • IBIDEN CO., LTD.
    • Susumu KAGOHASHI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED WIRING BOARD

    • Publication number 20240107684
    • Publication date Mar 28, 2024
    • IBIDEN CO., LTD.
    • Jun SAKAI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR