TREA

Inorganic, non-metallic particles

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  • CPC
  • H05K2201/0209
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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/0209Inorganic, non-metallic particles
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    RESIN SHEET, LAMINATED BOARD, METAL-CLAD LAMINATED BOARD, PRINTED W...
    • Publication number 20250236723
    • Publication date Jul 24, 2025
    • Resonac Corporation
    • Yusuke SERA
    • B32 - LAYERED PRODUCTS
  • Information Patent Application

    METALLIZED RESIN FILM, PRINTED WIRING BOARD, CURRENT COLLECTOR FILM...
    • Publication number 20250230550
    • Publication date Jul 17, 2025
    • Kaneka Corporation
    • Takashi Itoh
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    COMPOSITION, FLUORORESIN SHEET, AND METHOD FOR PRODUCING SAME
    • Publication number 20250230298
    • Publication date Jul 17, 2025
    • DAIKIN INDUSTRIES, LTD.
    • Yuki UEDA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CONDUCTIVE ADHESIVE LAYER AND HEAT DISSIPATION STRUCTURE
    • Publication number 20250223471
    • Publication date Jul 10, 2025
    • Tatsuta Electric Wire & Cable Co., Ltd.
    • Tomohiro NAGATAKE
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
  • Information Patent Application

    RESIN COMPOSITION, PREPREG, FILM WITH RESIN, SHEET OF METAL FOIL WI...
    • Publication number 20250223423
    • Publication date Jul 10, 2025
    • Panasonic Intellectual Property Management Co., Ltd.
    • Akito HASHIMOTO
    • B32 - LAYERED PRODUCTS
  • Information Patent Application

    WIRING BOARD
    • Publication number 20250220813
    • Publication date Jul 3, 2025
    • KYOCERA CORPORATION
    • Hiroaki SANO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING BOARD
    • Publication number 20250185162
    • Publication date Jun 5, 2025
    • KYOCERA CORPORATION
    • Hiroaki SANO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PREPREG AND USES OF THE SAME
    • Publication number 20250176100
    • Publication date May 29, 2025
    • TAIWAN UNION TECHNOLOGY CORPORATION
    • Jui-Hsiang TANG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    THERMOSETTING RESIN COMPOSITION, PREPREG, RESIN FILM, LAMINATE, PRI...
    • Publication number 20250163267
    • Publication date May 22, 2025
    • Masashi OJI
    • C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
  • Information Patent Application

    WIRING BOARD
    • Publication number 20250142724
    • Publication date May 1, 2025
    • KYOCERA CORPORATION
    • Toshifumi HIGASHI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED WIRING BOARD
    • Publication number 20250126709
    • Publication date Apr 17, 2025
    • IBIDEN CO., LTD.
    • Tomoyuki IKEDA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTROLESS SEED LAYER DEPOSITION ON GLASS CORE SUBSTRATES
    • Publication number 20250106997
    • Publication date Mar 27, 2025
    • Intel Corporation
    • Ehsan ZAMANI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    HEAT SPREADING COATING FOR ELECTRONIC ASSEMBLIES
    • Publication number 20250071883
    • Publication date Feb 27, 2025
    • Elbit Systems Ltd.
    • Reut BEN ZAKEN (BITTON)
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20250048562
    • Publication date Feb 6, 2025
    • IBIDEN CO., LTD.
    • Masashi KUWABARA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CERAMIC WIRING MEMBER
    • Publication number 20250024592
    • Publication date Jan 16, 2025
    • NGK Electronics Devices, Inc.
    • Hiroshi KOUNO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Component Carrier and Method for Manufacturing the Same Using a Des...
    • Publication number 20250024611
    • Publication date Jan 16, 2025
    • AT&S Austria Technologie & Systemtechnik AG
    • Nina WANG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CERAMIC WIRING MEMBER
    • Publication number 20250024599
    • Publication date Jan 16, 2025
    • NGK Electronics Devices, Inc.
    • Hiroshi KOUNO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED WIRING BOARD
    • Publication number 20250008645
    • Publication date Jan 2, 2025
    • IBIDEN CO., LTD.
    • Youhong WU
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED WIRING BOARD
    • Publication number 20250008652
    • Publication date Jan 2, 2025
    • IBIDEN CO., LTD.
    • Masashi KUWABARA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED WIRING BOARD
    • Publication number 20240431031
    • Publication date Dec 26, 2024
    • IBIDEN CO., LTD.
    • Masashi KUWABARA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD AND METHOD OF FABRICATING CIRCUIT BOARD
    • Publication number 20240422896
    • Publication date Dec 19, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Chulmun Kang
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED WIRING BOARD
    • Publication number 20240407094
    • Publication date Dec 5, 2024
    • IBIDEN CO., LTD.
    • Masashi KUWABARA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    RADIATION-SENSITIVE COMPOSITION FOR FORMING INSULATION FILM, RESIN...
    • Publication number 20240389227
    • Publication date Nov 21, 2024
    • JSR Corporation
    • Ryouji TATARA
    • G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
  • Information Patent Application

    METHOD FOR MANUFACTURING SUBSTRATE MATERIAL FOR SEMICONDUCTOR PACKA...
    • Publication number 20240381529
    • Publication date Nov 14, 2024
    • Resonac Corporation
    • Shunsuke OTAKE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20240365468
    • Publication date Oct 31, 2024
    • IBIDEN CO., LTD.
    • Masashi KUWABARA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE INCLUDING THE SAME
    • Publication number 20240357741
    • Publication date Oct 24, 2024
    • Samsung Electronics Co., Ltd.
    • Yeonkyung CHUNG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20240341034
    • Publication date Oct 10, 2024
    • IBIDEN CO., LTD.
    • Masashi KUWABARA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20240334598
    • Publication date Oct 3, 2024
    • Shinko Electric Industries Co., Ltd.
    • Yuki KOBAYASHI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20240324103
    • Publication date Sep 26, 2024
    • IBIDEN CO., LTD.
    • Masashi KUWABARA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    THERMAL SOLUTIONS FOR COOLING ELECTRONIC DEVICES
    • Publication number 20240314921
    • Publication date Sep 19, 2024
    • Intel Corporation
    • Jeff Ku
    • F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...