Inorganic, non-metallic particles

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CPC
H05K2201/0209

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/0209Inorganic, non-metallic particles

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing dielectric sheet, method for manufacturing...
- Patent number 12,213,249
- Issue date Jan 28, 2025
- Sumitomo Electric Industries, Ltd.
- Shingo Kaimori
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Circuit board
- Patent number 12,207,404
- Issue date Jan 21, 2025
- LG Innotek Co., Ltd
- Yong Suk Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper-clad laminate and method of forming the same
- Patent number 12,173,201
- Issue date Dec 24, 2024
- VERSIV COMPOSITES LIMITED
- Jennifer Adamchuk
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Resin composition, prepreg, resin sheet, laminate, metal foil-clad...
- Patent number 12,134,696
- Issue date Nov 5, 2024
- Mitsubishi Gas Chemical Company, Inc.
- Takaaki Ogashiwa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal base substrate, electronic component mounting substrate
- Patent number 12,127,342
- Issue date Oct 22, 2024
- Mitsubishi Materials Corporation
- Fumiaki Ishikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Nanocomposite material for ultraviolet curable direct write semicon...
- Patent number 12,096,561
- Issue date Sep 17, 2024
- Raytheon Company
- Craig A. Armiento
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Dielectric substrate and method of forming the same
- Patent number 12,049,577
- Issue date Jul 30, 2024
- VERSIV COMPOSITES LIMITED
- Jennifer Adamchuk
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Circuit structure
- Patent number 12,035,467
- Issue date Jul 9, 2024
- Ticona LLC
- Young Shin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low dielectric substrate for high-speed millimeter-wave communication
- Patent number 12,035,461
- Issue date Jul 9, 2024
- Shin-Etsu Chemical Co., Ltd.
- Toshio Shiobara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Prepreg, metal-clad laminate, and wiring board
- Patent number 12,022,611
- Issue date Jun 25, 2024
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yasunori Hoshino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 11,997,801
- Issue date May 28, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Woo Seok Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board
- Patent number 11,979,981
- Issue date May 7, 2024
- Kyocera Corporation
- Takayuki Umemoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low dielectric substrate for high-speed millimeter-wave communication
- Patent number 11,974,389
- Issue date Apr 30, 2024
- Shin-Etsu Chemical Co., Ltd.
- Toshio Shiobara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate for high-frequency printed wiring board
- Patent number RE49929
- Issue date Apr 16, 2024
- Sumitomo Electric Industries, Ltd.
- Shingo Kaimori
Information Patent Grant
Fluorine-containing resin composition, and resin vanish, fluorine-c...
- Patent number 11,945,924
- Issue date Apr 2, 2024
- SHENGYI TECHNOLOGY CO., LTD.
- Songgang Chai
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Thermosetting composition, prepreg, metal foil-clad laminate, resin...
- Patent number 11,939,447
- Issue date Mar 26, 2024
- Mitsubishi Gas Chemical Company, Inc.
- Yoshihiro Nakazumi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Materials for printed circuit boards
- Patent number 11,930,596
- Issue date Mar 12, 2024
- Thintronics, Inc.
- Tarun Amla
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and semiconductor module including the same
- Patent number 11,903,145
- Issue date Feb 13, 2024
- Samsung Electronics Co., Ltd.
- Seung-Yeol Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board substrate comprising a coated boron nitride
- Patent number 11,895,768
- Issue date Feb 6, 2024
- ROGERS CORPORATION
- Eui Kyoon Kim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plate-like composite material containing polytetrafluoroethylene an...
- Patent number 11,884,796
- Issue date Jan 30, 2024
- Nitto Denko Corporation
- Shimpei Yakuwa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Organic insulating body, metal-clad laminate, and wiring board
- Patent number 11,879,049
- Issue date Jan 23, 2024
- Kyocera Corporation
- Satoshi Kajita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board and manufacturing method for same
- Patent number 11,871,525
- Issue date Jan 9, 2024
- Kyocera Corporation
- Yoshihiro Hasegawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal cure dielectric ink
- Patent number 11,851,572
- Issue date Dec 26, 2023
- LIQUID X PRINTED METALS, INC.
- Robert G Swisher
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Thermally conductive board
- Patent number 11,778,739
- Issue date Oct 3, 2023
- Polytronics Technology Corp.
- Kuo Hsun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin composition, prepreg, resin sheet, metal foil-clad laminate,...
- Patent number 11,769,607
- Issue date Sep 26, 2023
- Mitsubishi Gas Chemical Company, Inc.
- Katsuya Tomizawa
- B32 - LAYERED PRODUCTS
Information Patent Grant
Resin composition
- Patent number 11,725,104
- Issue date Aug 15, 2023
- Ajinomoto Co., Inc.
- Nana Namekata
- B32 - LAYERED PRODUCTS
Information Patent Grant
Circuit structure
- Patent number 11,729,908
- Issue date Aug 15, 2023
- Ticona LLC
- Young Shin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally inkjettable acrylic dielectric ink formulation and process
- Patent number 11,708,503
- Issue date Jul 25, 2023
- FUNAI ELECTRIC HOLDINGS CO., LTD.
- Xiaorong Cai
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Resin composition for printed wiring board, prepreg, laminate, meta...
- Patent number 11,702,504
- Issue date Jul 18, 2023
- Mitsubishi Gas Chemical Company, Inc.
- Shohei Yamaguchi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Low dielectric substrate for high-speed millimeter-wave communication
- Patent number 11,678,432
- Issue date Jun 13, 2023
- Shin-Etsu Chemical Co., Ltd.
- Toshio Shiobara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CERAMIC WIRING MEMBER
- Publication number 20250024592
- Publication date Jan 16, 2025
- NGK Electronics Devices, Inc.
- Hiroshi KOUNO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier and Method for Manufacturing the Same Using a Des...
- Publication number 20250024611
- Publication date Jan 16, 2025
- AT&S Austria Technologie & Systemtechnik AG
- Nina WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC WIRING MEMBER
- Publication number 20250024599
- Publication date Jan 16, 2025
- NGK Electronics Devices, Inc.
- Hiroshi KOUNO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20250008645
- Publication date Jan 2, 2025
- IBIDEN CO., LTD.
- Youhong WU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20250008652
- Publication date Jan 2, 2025
- IBIDEN CO., LTD.
- Masashi KUWABARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240431031
- Publication date Dec 26, 2024
- IBIDEN CO., LTD.
- Masashi KUWABARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD OF FABRICATING CIRCUIT BOARD
- Publication number 20240422896
- Publication date Dec 19, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Chulmun Kang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240407094
- Publication date Dec 5, 2024
- IBIDEN CO., LTD.
- Masashi KUWABARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RADIATION-SENSITIVE COMPOSITION FOR FORMING INSULATION FILM, RESIN...
- Publication number 20240389227
- Publication date Nov 21, 2024
- JSR Corporation
- Ryouji TATARA
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
METHOD FOR MANUFACTURING SUBSTRATE MATERIAL FOR SEMICONDUCTOR PACKA...
- Publication number 20240381529
- Publication date Nov 14, 2024
- Resonac Corporation
- Shunsuke OTAKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240365468
- Publication date Oct 31, 2024
- IBIDEN CO., LTD.
- Masashi KUWABARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE INCLUDING THE SAME
- Publication number 20240357741
- Publication date Oct 24, 2024
- Samsung Electronics Co., Ltd.
- Yeonkyung CHUNG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240341034
- Publication date Oct 10, 2024
- IBIDEN CO., LTD.
- Masashi KUWABARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240334598
- Publication date Oct 3, 2024
- Shinko Electric Industries Co., Ltd.
- Yuki KOBAYASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240324103
- Publication date Sep 26, 2024
- IBIDEN CO., LTD.
- Masashi KUWABARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL SOLUTIONS FOR COOLING ELECTRONIC DEVICES
- Publication number 20240314921
- Publication date Sep 19, 2024
- Intel Corporation
- Jeff Ku
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Application
SHEET FOR COMPONENT CARRIER COMPRISING SEPARATE STRUCTURES WITH FIL...
- Publication number 20240314927
- Publication date Sep 19, 2024
- AT&S Austria Technologie & Systemtechnik AG
- Nina WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240306293
- Publication date Sep 12, 2024
- HAMILTON SUNDSTRAND CORPORATION
- Andrew Edward PAGE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240306296
- Publication date Sep 12, 2024
- IBIDEN CO., LTD.
- Toshiki FURUTANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240306312
- Publication date Sep 12, 2024
- IBIDEN CO., LTD.
- Jun SAKAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240298406
- Publication date Sep 5, 2024
- IBIDEN CO., LTD.
- Jun SAKAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240292537
- Publication date Aug 29, 2024
- IBIDEN CO., LTD.
- Susumu KAGOHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMOSETTING RESIN COMPOSITION, CURED PRODUCT, AND PRINTED WIRING...
- Publication number 20240287373
- Publication date Aug 29, 2024
- TAIYO HOLDINGS CO., LTD.
- Yoshikazu DAIGO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240292536
- Publication date Aug 29, 2024
- IBIDEN CO., LTD.
- Susumu KAGOHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240284606
- Publication date Aug 22, 2024
- IBIDEN CO., LTD.
- Toshiki FURUTANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240268021
- Publication date Aug 8, 2024
- IBIDEN CO., LTD.
- Susumu KAGOHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240268038
- Publication date Aug 8, 2024
- IBIDEN CO., LTD.
- Susumu KAGOHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240260179
- Publication date Aug 1, 2024
- IBIDEN CO., LTD.
- Jun SAKAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INDUCTION COOKING HOB HAVING TWO BOARD ELEMENTS ELECTRICALLY AND ME...
- Publication number 20240260190
- Publication date Aug 1, 2024
- Electrolux Appliances Aktiebolag
- Alex VIROLI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD OF ELECTRONIC DEVICE
- Publication number 20240237195
- Publication date Jul 11, 2024
- InnoLux Corporation
- Ker-Yih KAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Inorganic, non-metallic particles

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for manufacturing dielectric sheet, method for manufacturing...

Circuit board

Copper-clad laminate and method of forming the same

Resin composition, prepreg, resin sheet, laminate, metal foil-clad...

Metal base substrate, electronic component mounting substrate

Nanocomposite material for ultraviolet curable direct write semicon...

Dielectric substrate and method of forming the same

Circuit structure

Low dielectric substrate for high-speed millimeter-wave communication

Prepreg, metal-clad laminate, and wiring board

Printed circuit board

Wiring board

Low dielectric substrate for high-speed millimeter-wave communication

Substrate for high-frequency printed wiring board

Fluorine-containing resin composition, and resin vanish, fluorine-c...

Thermosetting composition, prepreg, metal foil-clad laminate, resin...

Materials for printed circuit boards

Wiring board and semiconductor module including the same

Printed circuit board substrate comprising a coated boron nitride

Plate-like composite material containing polytetrafluoroethylene an...

Organic insulating body, metal-clad laminate, and wiring board

Wiring board and manufacturing method for same

Thermal cure dielectric ink

Thermally conductive board

Resin composition, prepreg, resin sheet, metal foil-clad laminate,...

Resin composition

Circuit structure

Thermally inkjettable acrylic dielectric ink formulation and process

Resin composition for printed wiring board, prepreg, laminate, meta...

Low dielectric substrate for high-speed millimeter-wave communication

Patents Applicationslast 30 patents

CERAMIC WIRING MEMBER

Component Carrier and Method for Manufacturing the Same Using a Des...

CERAMIC WIRING MEMBER

PRINTED WIRING BOARD

PRINTED WIRING BOARD

PRINTED WIRING BOARD

CIRCUIT BOARD AND METHOD OF FABRICATING CIRCUIT BOARD

PRINTED WIRING BOARD

RADIATION-SENSITIVE COMPOSITION FOR FORMING INSULATION FILM, RESIN...

METHOD FOR MANUFACTURING SUBSTRATE MATERIAL FOR SEMICONDUCTOR PACKA...

WIRING SUBSTRATE

PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE INCLUDING THE SAME

WIRING SUBSTRATE

WIRING SUBSTRATE

WIRING SUBSTRATE

THERMAL SOLUTIONS FOR COOLING ELECTRONIC DEVICES

SHEET FOR COMPONENT CARRIER COMPRISING SEPARATE STRUCTURES WITH FIL...

PRINTED CIRCUIT BOARD

WIRING SUBSTRATE

PRINTED WIRING BOARD

PRINTED WIRING BOARD

PRINTED WIRING BOARD

THERMOSETTING RESIN COMPOSITION, CURED PRODUCT, AND PRINTED WIRING...

PRINTED WIRING BOARD

WIRING SUBSTRATE

PRINTED WIRING BOARD

PRINTED WIRING BOARD

PRINTED WIRING BOARD

INDUCTION COOKING HOB HAVING TWO BOARD ELEMENTS ELECTRICALLY AND ME...

ELECTRONIC DEVICE AND MANUFACTURING METHOD OF ELECTRONIC DEVICE