1. Technical Field
The present disclosure relates to circuits, and particularly to a circuit for measuring capacitance and parasitic resistance of a capacitor.
2. Description of Related Art
Capacitors are used for storing electrical charges and as filters. Electronic devices, such as mobile phones and notebook computers, require high quality and accurate capacitance value of capacitors. Thus capacitors need to be accurately measured before being used in these electronic devices. The present measurement apparatus uses a capacitance-bridge method to measure capacitance and parasitic resistance of the capacitors. However, the capacitance-bridge method is adapted to measure capacitors having small capacitances. When the capacitance of the capacitors is high, the measuring precision is not high enough. Therefore, there is room for improvement in the art.
Many aspects of the embodiments can be better understood with reference to the drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present embodiments. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
The disclosure, including the drawings, is illustrated by way of example and not by way of limitation. References to “an” or “one” embodiment in this disclosure are not necessarily to the same embodiment, and such references mean at least one.
Referring to
Referring to
The voltage converting circuit 100 includes capacitors C1-C5, resistors R1-R4, a power converting chip U1, an inductor L1, and a voltage output terminal Vout. Two input pins IN1 and IN2 of the power converting chip U1 are both connected to the power source P5V through the inductor L1. The resistors R1 and R2 are connected between the power source P5V and ground in series. An input/output (I/O) pin EN of the power converting chip U1 is connected to a node between the resistors R1 and R2. The capacitor C1 is connected between the input pin Ni of the power converting chip U1 and ground. An I/O pin PG of the power converting chip U1 is connected to the control circuit 400. An I/O pin BIAS of the power converting chip U1 is connected to the input pin IN1 of the power converting chip U1 and also grounded through the capacitor C2. Two output pins OUT1 and OUT2 of the power converting chip U1 are both connected to the voltage output terminal Vout. The capacitors C4 and C5 are connected between the voltage output terminal Vout and ground in parallel. The resistors R3 and R4 are connected between the output pin OUT2 of the power converting chip U1 and ground, in series. An I/O pin FB of the power converting chip U1 is connected to a node between the resistors R3 and R4. An I/O pin SS of the power converting chip U1 is grounded through the capacitor C3. Ground pins GND and EPAD of the power converting chip U1 are grounded.
The charging circuit 200 includes a field effect transistor (FET) Q1, a switch SW1, capacitors C6-C10, resistors R5-R8, a light emitting diode (LED) D1, and a charging chip U2. An input pin VIN of the charging chip U2 is connected to the power source P5V through the switch SW1. An anode of the LED D1 is connected to the input pin VIN of the charging chip U2. A cathode of the LED D1 is grounded through the resistor R5. The capacitors C6 and C7 are connected between the input pin VIN of the charging chip U2 and ground, in parallel. A drain of the FET Q1 is connected to an I/O pin SHDN of the charging chip U2, and also connected to the input pin VIN of the charging chip U2 through the resistor R6. A source of the FET Q1 is grounded. A gate of the FET Q1 is connected to the control circuit 400. The capacitor C8 is connected between I/O pins C+ and C− of the charging chip U2. An I/O pin PGOOD of the charging chip U2 is connected to the control circuit 400. Ground pins EPAD and GND of the charging chip U2 are grounded. An output pin COUT of the charging chip U2 is connected to the capacitor 30. The capacitors C9 and C10 are connected between the output pin COUT of the charging chip U2 and ground, in parallel. An I/O pin PROG of the charging chip U2 is grounded through the resistor R8. An I/O pin VSEL of the charging chip U2 is connected to the power source P5V, and also grounded through the resistor R7.
The discharging and sampling circuit 300 includes the discharging resistor R0, a FET Q2, an analog to digital (A/D) converting chip U3, a sampling chip U4, capacitors C11-C14, and resistors R9-R13. The capacitor C11 and the resistor R11 are connected between I/O pins CLK IN and CLK R of the A/D converting chip U3. An I/O pin CS of the A/D converting chip U3 is connected to the control circuit 400. An input pin Vin+ of the A/D converting chip U3 is connected to a first end of the capacitor 30 through the resistor R13. An input pin Vin− of the A/D converting chip U3 is connected to a second end of the capacitor 30 through the resistor R12. Ground pins AGND and DGND of the A/D converting chip U3 are connected to ground, and are also connected to the power source P5V through the resistors R10 and R9 connected in series. An I/O pin Vref of the A/D converting chip U3 is connected to a node between the resistors R9 and R10. A voltage pin Vcc of the A/D converting chip U3 is connected to the power source P5V. I/O pins DB0-DB7 of the A/D converting chip U3 are connected to the control circuit 400. The capacitor C12 is connected between the input pin Vin+ of the A/D converting chip U3 and ground. The capacitor C13 is connected between the input pin Vin− of the A/D converting chip U3 and ground. A drain of the FET Q2 is connected to the first end of the capacitor 30 through the discharging resistor RO. A source of the FET Q2 is connected to the second end of the capacitor 30, and is also grounded. A gate of the FET Q2 is connected to the control circuit 400. The capacitor C14 is connected between the drain of the FET Q2 and the source of the FET Q2. One end of the discharging resistor RO is connected to input pin VIN+ of the sampling chip U4, the other end of the discharging resistor RO is connected to VIN− of the sampling chip U4. A voltage pin Vs of the sampling chip U4 is connected to the voltage output terminal Vout of the voltage converting circuit 100. I/O pins SCL and SDA of the sampling chip U4 are connected to the control circuit 400. An I/O pin AO of the sampling chip U4 is connected to the I/O pin SDA of the sampling chip U4. Ground pins GND and Al of the sampling chip U4 are grounded.
The control circuit 400 includes the microprocessor U5, capacitors C15-C22, resistors R15-R20, a crystal oscillator Y1, a regulating diode Z1, and an inductor L2. In one embodiment, the microprocessor U5 is a single chip. I/O pins PB0-PB7 of the microprocessor U5 are connected to corresponding I/O pins DB0-DB7 of the A/D converting chip U3 of the discharging and sampling circuit 300. I/O pins PA0-PA3 of the microprocessor U5 are connected to the power source P5V through the resistors R19, R18, R17, and R16 respectively. A voltage pin VCC of the microprocessor U5 is connected to the power source P5V. A ground pin GND of the microprocessor U5 is grounded. An I/O Pin PD0 of the microprocessor U5 is connected to the instruction input unit 10. An I/O pin PD5 of the microprocessor U5 is connected to the I/O pin CS of the A/D converting chip U3 of the discharging and sampling circuit 300. An I/O pin PC7 of the microprocessor U5 is connected to the display unit 20. I/O pins PC1 and PC0 of the microprocessor U5 are respectively connected to the I/O pins SDA and SCL of the sampling chip U4. A reset pin RESET of the microprocessor U5 is connected to the power source P5V through the resistor R15, and is also grounded through the capacitor C16. The capacitor C15 is connected between the power source P5V and ground. A clock pin XTAL2 of the microprocessor U5 is grounded through the capacitor C17. A clock pin XTAL1 of the microprocessor U5 is grounded through the capacitor C18. The crystal oscillator Y1 is connected between the clock pins XTAL2 and XTAL1 of the microprocessor U5. A reference voltage pin AREF of the microprocessor U5 is connected to a control terminal of the regulating diode Z1. A cathode of the regulating diode Z1 is connected to the power source P5V through the resistor R20, and also connected to the control terminal of the regulating diode Z1. An anode of the regulating diode Z1 is grounded. The capacitors C21 and C22 are connected between the control terminal of the regulating diode Z1 and ground, in parallel. An analog voltage pin AVCC of the microprocessor U5 is connected to the power source P5V through the inductor L2. The capacitors C19 and C20 are connected between the analog voltage pin AVCC of the microprocessor U5 and ground, in parallel. The I/O pin PA3 of the microprocessor U5 is connected to the I/O pin PG of the power converting chip U1 of the voltage converting circuit 100. The I/O pin PA2 of the microprocessor U5 is connected to the gate of the FET Q2. The I/O pin PA1 of the microprocessor U5 is connected to the gate of the FET Q1 of the charging circuit 200. The I/O pin PA0 of the microprocessor U5 is connected to the I/O pin PGOOD of the charging chip U2 of the charging circuit 200.
In use, the voltage converting circuit 100 receives a 5 volt (5V) from the power source P5V, converts the 5V to 3.3V, and outputs the 3.3V to the discharging and sampling circuit 300 through the voltage output terminal Vout. The I/O pin PA1 of the microprocessor U5 outputs a low level signal to the FET Q1. The FET Q1 is turned off. After the switch SW1 is turned on, the 5V is provided to the charging chip U2 for charging the capacitor 30. The LED D1 is lit, indicating that the 5V is normal. When the capacitor 30 is fully charged, the I/O pin PGOOD of the charging chip U2 outputs a control signal to the I/O pin PA0 of the microprocessor U5, to control the I/O pin PA1 of the microprocessor U5 to output a high level signal to the FET Q1. The FET Q1 is turned on. The 5V is provided to the resistor R6 and the FET Q1, to prevent the 5V from charging the capacitor 30 through the charging chip U2. The input pins Vin+ and Vin− of the A/D converting chip U3 measure a saturation voltage, such as 5V, of the capacitor 30. The A/D converting chip U3 converts the saturation voltage to a digital signal, and outputs the digital signal to the microprocessor U5 through the input pins DB0-DB7 and PB0-PB7. The microprocessor U5 governs the display unit 20.
The I/O pin PA2 of the microprocessor U5 outputs a high level signal to the FET Q2. The FET Q2 is turned on. The capacitor 30 discharges through the discharging resistor RO and the FET Q2. The timer of the microprocessor U5 counts elapsed time. When the voltage of the capacitor 30 is 0V as measured by the A/D converting chip U3, the timer of the microprocessor U5 stops timing and controls the display unit 20 to display a discharging time of the capacitor 30. This is calculated according to the following format: τ=R×C, wherein τ is a discharging time, R is a resistance of the discharging resistor R0, and C is a capacitance of the capacitor 30. Thus, the capacitance C of the capacitor 30 can be obtained, which is C=τ/R.
For example, when the saturation voltage of the capacitor 30 is 5V, the microprocessor U5 controls the capacitor 30 to discharge, and the timer of the microprocessor U5 starts to time. When the voltage of the capacitor 30 is 0V, the timer of the microprocessor U5 stops timing and obtains a discharging time τ, such as τ=1.83 seconds (S) for example. If the discharging time τ of the capacitor 30 is 1.83 S, and the resistance R of the discharging resistor R0 is 2.2 ohms, thus, the capacitance C=τ/R=1.83/2.2=0.83 farad (F). In this example, the capacitance of the capacitor 30 is 0.83 F.
When a parasitic resistance of the capacitor 30 needs to be measured, the microprocessor U5 receives a sampling signal from the instruction input unit 10 during discharging of the capacitor 30. The microprocessor U5 obtains a discharging voltage VCAP1 of the capacitor 30 at any time through the A/D converting chip U3 and obtains a voltage drop VDrop of the discharging resistor R0 through the sampling chip U4. This is done according to the format: ESR=VDrop/I30, wherein VDrop is a difference between the saturation voltage VCAP and the discharging voltage VCAP1, I30 is a current value of the capacitor 30, and ESR is the parasitic resistance of the capacitor 30. Since the capacitor 30 is connected to the discharging resistor R0 in series, the current value IR0 of the discharging resistor R0 is the same as the current value I30 of the capacitor 30, according to the format IR0=ΔVR0/R, wherein the ΔVR0 is the voltage drop of the discharging resistor R0, and R is the resistance of the discharging resistor R0.
For example, if the voltage drop ΔVR0=4.28V, and R=2.2 ohm, the current value IR0=4.28/2.2=1.95 ampere (A). That is, the current value I30=IR0=1.95 A. The saturation voltage VCAP=5V and VCAP1=3.6V. Thus, VDrop=VCAP−VCAP1=1.4V, and ESR=Drop/I30=1.4/1.95=0.72 ohm. In this case, the parasitic resistance of the capacitor 30 is 0.72 ohm.
The measuring circuit 1 controls the charging circuit 200 to charge the capacitor 30 through the control circuit 400, and also controls the capacitor 30 to discharge through the discharging and sampling circuit 300, to obtain the saturation voltage and the discharging voltage of the capacitor 30 and the voltage of the discharging resistor R0 through the discharging and sampling circuit 300, for calculating the capacitance and the parasitic resistance of the capacitor 30.
Even though numerous characteristics and advantages of the disclosure have been set forth in the foregoing description, together with details of the structure and function of the disclosure, the disclosure is illustrative only, and changes may be made in detail, especially in the matters of shape, size, and arrangement of parts within the principles of the disclosure to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
Number | Date | Country | Kind |
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201110437279.6 | Dec 2011 | CN | national |