This application claims priority to Taiwanese Application Serial Number 102100947 filed Jan. 10, 2013, which is herein incorporated by reference.
Technical Field
The present disclosure relates to a circuit substrate structure, and more particularly, to a circuit substrate structure having a flattening material layer.
Description of Related Art
In
However, in a traditional display device, the sealant 170 is originally in liquid form without a fixed shape, so that the surface of the non-display area of the display area is not even. Besides, since the structure of the traditional display device has a difference in height forming several blind angles, the sealant 170 fails to uniformly infiltrate thereinto and thus generate several bubbles 180. The bubbles 180, after the heat-curing step of the sealant 170, are expanded to lift off the passivation layer 160 and the display unit 130, so as to deteriorate the reliability of the display device. Therefore, there is a need for an improved circuit substrate structure and a method of manufacturing the same, so as to solve the problems met in the art.
The present disclosure provides a circuit substrate structure having a flattening material layer and a method for manufacturing thereof, so as to solve the problems of the prior art and achieve the purpose of flattening the display device.
One embodiment of the present disclosure is to provide a circuit substrate structure. The circuit substrate structure comprises a substrate, a pixel array layer, a display unit, a peripheral circuit layer, at least one integrated circuit chip, a flexible printed circuit board, at least on flattening material layer and a passivation layer. The substrate has a display area and a non-display area. The pixel array layer is positioned on the display area of the substrate. The display unit is positioned on the pixel array layer. The peripheral circuit layer is positioned on the non-display area of the substrate, and electrically connected to the pixel array layer. The integrated circuit chip is positioned on the peripheral circuit layer, and electrically connected to the pixel array layer. The flexible printed circuit board is positioned on the peripheral circuit layer, and electrically connected to the integrated circuit chip, the pixel array layer or the combinations thereof. The flattening material layer is positioned on the peripheral circuit layer, and covers a portion of the flexible printed circuit board. Wherein the flattening material layer has at least one opening which corresponds to and surrounds the integrated circuit chip. The passivation layer is positioned on and covers the display unit and the flattening material layer.
Another embodiment of the present disclosure is to provide a method for manufacturing the circuit substrate structure. The method for manufacturing the circuit substrate structure comprises providing a substrate having a display area and a non-display area, forming a pixel array layer on the display area of the substrate, forming a display unit on the pixel array layer, forming a peripheral circuit layer, on the non-display area of the substrate, forming at least one integrated circuit chip, on the peripheral circuit layer, forming a flexible printed circuit board on the peripheral circuit board, forming at least one flattening material layer on the peripheral circuit layer, and forming a passivation layer on the display unit and the flattening material layer. In which, the peripheral circuit layer is electrically connected to the pixel array layer. The integrated circuit chip is electrically connected to the pixel array layer. The flexible printed circuit board is electrically connected to the integrated circuit chip, the pixel array layer or the combinations thereof. The flattening material layer covers a portion of the flexible printed circuit board, and has at least one opening corresponding to and surrounding the integrated circuit chip.
For a more complete understanding of the present invention, and the advantages thereof, reference is now made to the following descriptions taken in conjunction with the accompanying drawings, in which:
The embodiments of the circuit substrate structure and the method for manufacturing the same of the present disclosure are discussed in detail below, but not limited the scope of the present disclosure. The same symbols or numbers are used to the same or similar portion in the drawings or the description. And the applications of the present disclosure are not limited by the following embodiments and examples which the person in the art can apply in the related field.
In
The peripheral circuit layer 240 is positioned on the non-display area 212 of the substrate 210, and electrically connected to the pixel array layer 220. The integrated circuit chip 250, the flexible printed circuit board 260 and the flattening material layer 270a are positioned on the peripheral circuit layer 240. According to one example of the present disclosure, the peripheral circuit layer 240 comprises a thin-film transistor layer or a conductive circuit layer. According to one example of the present disclosure, the integrated circuit chip 250 comprises a driving circuit chip.
The flattening material layer 270a covers a portion of the flexible printed circuit board 260, and has at least one opening 271a. Each opening 271a corresponds to and surrounds the integrated circuit chip 250. Then, the passivation layer 280 is positioned on and covers the display unit 230 and the flattening material layer 270a. According to one example of the present disclosure, the material of the passivation layer 280 comprises flexible plastics.
According to one example of the present disclosure, the coefficient of linear thermal expansion of the flattening material layer 270a or 270b is less than 70×10−6/K. According to one example of the present disclosure, the material of the flattening material layer 270a or 270b comprises glass, polyethylene terephthalate (PET), polyethylene naphthalene dicarboxylate (PEN), polymethyl methacrylate (PMMA), polycarbonate (PC), polystyrene (PS), or the combinations thereof. According to one example of the present disclosure, the thickness of the flattening material layer 270a or 270b is the same as the thickness of the display unit 230. According to one example of the present disclosure, the thickness of the flattening material layer 270a or 270b is larger than or equal to the integrated circuit chip 250.
In
In
In
Noteworthy, because the flattening material layer 370a is tightly contacted with the display unit 330 without a gap, the circuit substrate structure 300a cannot occur the bubble issue as the prior art. According to one example of the present disclosure, the circuit substrate structure 300a can be applied to a display device.
In
Unlike to the traditional process, the method for manufacturing the circuit substrate structure 300b as one example of the present disclosure is firstly forming the sealant 390 between the flattening material layer 370b and the display unit 330, and then covering the passivation layer 380. This helps to avoid blind angle generated due to a height difference in the circuit substrate structure, and bubbles formed in the sealant filling. Besides, the method provided in the present disclosure can efficiently solve the bubble issue generated in the art.
It is noteworthy that the usage amount and area of the sealant, according to the embodiments of the present disclosure, can be significantly reduced by adding the flattening material layer into the circuit substrate structure, so as to achieve the purpose of flattening the surface of the circuit substrate structure. On the other hand, the method provided in the present disclosure can also solve the bubble issue generated in the circuit substrate structure. According to the example of the present disclosure, the steps of filling sealant and optical or heat curing can be completely omitted in the process of manufacturing the circuit substrate structure, so as to reduce the product cost and prevent the display device from the destruction after the heat-treatment.
Although embodiments of the present disclosure and their advantages have been described in detail, they are not used to limit the present disclosure. It should be understood that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the present disclosure. Therefore, the protecting scope of the present disclosure should be defined as the following claims.
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