electrically connecting electric components or wires to printed circuits

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CPC
H05K3/32

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/32electrically connecting electric components or wires to printed circuits

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Wiring base and electronic device
- Patent number 12,322,700
- Issue date Jun 3, 2025
- Kyocera Corporation
- Toshihiko Kitamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrochemical three-dimensional printing and soldering
- Patent number 12,320,028
- Issue date Jun 3, 2025
- University of South Florida
- Arash Takshi
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Electronic component module, sub-module, and method for manufacturi...
- Patent number 12,309,932
- Issue date May 20, 2025
- Murata Manufacturing Co., Ltd.
- Tsuyoshi Takakura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 12,298,633
- Issue date May 13, 2025
- Samsung Display Co., Ltd.
- Han Ho Park
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Lighting device with connection to element electrodes using filler
- Patent number 12,302,494
- Issue date May 13, 2025
- Nichia Corporation
- Eiko Minato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor module and method for fabricating the same
- Patent number 12,300,588
- Issue date May 13, 2025
- Fuji Electric Co., Ltd.
- Yoshihiko Kawakami
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical system with hook-and-loop busbars
- Patent number 12,302,491
- Issue date May 13, 2025
- UNIVERSITY OF MASSACHUSETTS
- Ramaswamy Nagarajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lens driving device, camera device, and optical apparatus including...
- Patent number 12,302,506
- Issue date May 13, 2025
- LG Innotek Co., Ltd
- Do Yun Kim
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Flexible membrane adapted to carry high-frequency (RF) power signal...
- Patent number 12,292,457
- Issue date May 6, 2025
- Technoprobe S.p.A.
- Flavio Maggioni
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor packages
- Patent number 12,283,555
- Issue date Apr 22, 2025
- Analog Devices International Unlimited Company
- Bilge Bayrakci
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring circuit board
- Patent number 12,284,757
- Issue date Apr 22, 2025
- Nitto Denko Corporation
- Shusaku Shibata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hybrid circuit board
- Patent number 12,282,053
- Issue date Apr 22, 2025
- COBHAM ADVANCED ELECTRONIC SOLUTIONS INC.
- Mark Bates
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Press-in machine for pressing components into a substrate, in parti...
- Patent number 12,284,768
- Issue date Apr 22, 2025
- ERSA GmbH
- Kevin Friedrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically connected component carrier stacks with respective cav...
- Patent number 12,279,369
- Issue date Apr 15, 2025
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Bernhard Reitmaier
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Modular flight management system incorporating an autopilot
- Patent number 12,259,725
- Issue date Mar 25, 2025
- Skydio, Inc.
- Jonathan B. Downey
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Extension structure of flexible substrates with conductive wires th...
- Patent number 12,262,479
- Issue date Mar 25, 2025
- UNEO INC.
- Chih-Sheng Hou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Nitride-based semiconductor module and method for manufacturing the...
- Patent number 12,255,169
- Issue date Mar 18, 2025
- INNOSCIENCE (SUZHOU) TECHNOLOGY CO., LTD.
- Weigang Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor bank assembly
- Patent number 12,250,771
- Issue date Mar 11, 2025
- Rockwell Collins, Inc.
- Martin J. Jennings
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board manufacturing method and circuit board manufacturing...
- Patent number 12,250,778
- Issue date Mar 11, 2025
- FUJI CORPORATION
- Kenji Tsukada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for assembly of battery pack with compact shared PCM
- Patent number 12,243,987
- Issue date Mar 4, 2025
- Snap Inc.
- John Bernard Ardisana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing component embedded circuit board
- Patent number 12,238,871
- Issue date Feb 25, 2025
- QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
- Yong-Chao Wei
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Decoupled PCB structure to parallel power transistors
- Patent number 12,237,760
- Issue date Feb 25, 2025
- SCHNEIDER ELECTRIC IT CORPORATION
- Indra Prakash
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Connection method for chip and circuit board, and circuit board ass...
- Patent number 12,232,266
- Issue date Feb 18, 2025
- INTELLIMICRO MEDICAL CO., LTD.
- Yu-chong Tai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and manufacturing method thereof
- Patent number 12,232,254
- Issue date Feb 18, 2025
- Unimicron Technology Corporation
- Po-Hsiang Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronics assembly
- Patent number 12,232,267
- Issue date Feb 18, 2025
- TACTOTEK OY
- Vinski Bräysy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Transceiver antenna for wireless charging, apparatus and method of...
- Patent number 12,219,717
- Issue date Feb 4, 2025
- Passcon Co., LTD.
- Hyejoong Shin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Battery module printed circuit board assembly system and method
- Patent number 12,208,694
- Issue date Jan 28, 2025
- CPS Technology Holdings LLC
- Ronald J. Dulle
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Wiring circuit board
- Patent number 12,207,410
- Issue date Jan 21, 2025
- Nitto Denko Corporation
- Hayato Takakura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ground discontinuities for thermal isolation
- Patent number 12,193,142
- Issue date Jan 7, 2025
- International Business Machines Corporation
- Trevor Timpane
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Gold finger type fan frame and double-layer connection structure th...
- Patent number 12,193,186
- Issue date Jan 7, 2025
- Asia Vital Components (China) Co., Ltd.
- Helen Huang
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...

Patents Applicationslast 30 patents

Information Patent Application
CABLE MANUFACTURING PROCESS
- Publication number 20250192501
- Publication date Jun 12, 2025
- BIOSENSE WEBSTER (ISRAEL) LTD.
- Assaf Govari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER METHOD FOR HIGHER CURRENT ASIC POWER DELIVERY
- Publication number 20250151198
- Publication date May 8, 2025
- Cisco Technology, Inc.
- Joel Richard Goergen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD, METHOD FOR MANUFACTURING THE SAME AND TERMINAL DEVIC...
- Publication number 20250142717
- Publication date May 1, 2025
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- CHAO WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE CIRCUIT BOARD AND PAD CONNECTING SYSTEM
- Publication number 20250142725
- Publication date May 1, 2025
- SUZHOU METABRAIN INTELLIGENT TECHNOLOGY CO., LTD.
- Huali ZHOU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MASKING METHOD AND MASKED PRODUCT
- Publication number 20250133661
- Publication date Apr 24, 2025
- P2i Ltd.
- Graham HUBBARD
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS AND METHODS FOR TOOL MARK FREE STITCH BONDING
- Publication number 20250118704
- Publication date Apr 10, 2025
- Skyworks Solutions, Inc.
- Aldrin Quinones GARING
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICES, SOCKET LOADING MECHANISMS, AND METHODS
- Publication number 20250113443
- Publication date Apr 3, 2025
- Shyamjith Mohan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPACT INTERFACE THROUGH HINGE CONNECTOR
- Publication number 20250106995
- Publication date Mar 27, 2025
- Apple Inc.
- Parin R Dedhia
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ANISOTROPIC CONDUCTIVE ADHESIVE AND COMPOSITION THEREOF
- Publication number 20250066643
- Publication date Feb 27, 2025
- NOPION CO., LTD.
- Chang Hoon SIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTION METHOD FOR YARN WIRE AND CIRCUIT BOARD
- Publication number 20250056734
- Publication date Feb 13, 2025
- NEXTRONICS ENGINEERING CORP.
- HOU-AN SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRAPABLE, FLEXIBLE CIRCUITRY LAYERS AND METHODS THEREFOR
- Publication number 20250048559
- Publication date Feb 6, 2025
- LOOMIA Technologies, Inc.
- Madison Thea MAXEY
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FLEXIBLE PRINTED CIRCUIT ROGOWSKI COIL
- Publication number 20250048554
- Publication date Feb 6, 2025
- Littelfuse Europe GmbH
- Pavel Kucera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRE-CONNECTED ANALYTE SENSORS
- Publication number 20250040058
- Publication date Jan 30, 2025
- Dexcom, Inc.
- Jason Halac
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND ELECTRICAL CONTACT ELEMENT
- Publication number 20250031305
- Publication date Jan 23, 2025
- Rohde& Schwarz GmbH & Co. KG
- Mathias NAGEL
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BUS BAR LINK FOR BATTERY CELL INTERCONNECTIONS IN A BATTERY MODULE
- Publication number 20250018798
- Publication date Jan 16, 2025
- CPS Technology Holdings LLC
- Matthew R. TYLER
- B60 - VEHICLES IN GENERAL
Information Patent Application
HIGH-FREQUENCY HIGH-POWER PACKAGING MODULE, MANUFACTURING METHOD FO...
- Publication number 20250015021
- Publication date Jan 9, 2025
- SHANGHAI METAPWR ELECTRONICS CO., LTD
- Jianhong ZENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CIRCUIT FORMING METHOD AND ELECTRICAL CIRCUIT FORMING AP...
- Publication number 20240422917
- Publication date Dec 19, 2024
- FUJI CORPORATION
- Kenji TSUKADA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOW PRESSURE SINTERING POWDER
- Publication number 20240413117
- Publication date Dec 12, 2024
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Application
SYSTEM AND METHOD FOR MONITORING CONDITIONS OF A SUBJECT BASED ON W...
- Publication number 20240398347
- Publication date Dec 5, 2024
- Peerbridge Health, Inc.
- Angelo Joseph Acquista
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
LIQUID METAL PATCH INTERCONNECT FOR LARGE WARPAGE COMPONENTS
- Publication number 20240388018
- Publication date Nov 21, 2024
- Intel Corporation
- Karumbu MEYYAPPAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINTERING PASTE, METHOD FOR ELECTRICALLY CONDUCTIVE, MATERIALLY BON...
- Publication number 20240381539
- Publication date Nov 14, 2024
- MAHLE International GmbH
- Matthias Tuerpe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF ELECTRONIC DEVICE
- Publication number 20240381540
- Publication date Nov 14, 2024
- Innolux Corporation
- Yi-Hung Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE SUBSTRATE HAVING EMBEDDED ELECTRONIC COMPONENT IN A CORE OF...
- Publication number 20240373562
- Publication date Nov 7, 2024
- QUALCOMM Incorporated
- Seongryul CHOI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ULTRASONIC WELDING SYSTEMS, METHODS OF USING THE SAME, AND RELATED...
- Publication number 20240359255
- Publication date Oct 31, 2024
- KULICKE AND SOFFA INDUSTRIES, INC.
- Theodore J. Copperthite
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF PRODUCING THEREOF
- Publication number 20240357730
- Publication date Oct 24, 2024
- Harman Becker Automotive Systems GmbH
- Paul-Alexandru BILIGA-NISIPEANU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240341036
- Publication date Oct 10, 2024
- Darwin Precisions Corporation
- Yi Feng Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD LAYER BUILD-UP PROCESS WITH ENHANCED POSITIONING PREC...
- Publication number 20240314942
- Publication date Sep 19, 2024
- Chia-Ming LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EXTENSION STRUCTURE OF FLEXIBLE SUBSTRATES WITH CONDUCTIVE WIRES TH...
- Publication number 20240314938
- Publication date Sep 19, 2024
- UNEO INC.
- Chih-Sheng HOU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Connection of Two Components with One Connecting Element
- Publication number 20240306311
- Publication date Sep 12, 2024
- NanoWired GmbH
- Olav Birlem
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DECOUPLED PCB STRUCTURE TO PARALLEL POWER TRANSISTORS
- Publication number 20240305184
- Publication date Sep 12, 2024
- SCHNEIDER ELECTRIC IT CORPORATION
- Indra Prakash
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

electrically connecting electric components or wires to printed circuits

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Wiring base and electronic device

Electrochemical three-dimensional printing and soldering

Electronic component module, sub-module, and method for manufacturi...

Display device

Lighting device with connection to element electrodes using filler

Semiconductor module and method for fabricating the same

Electrical system with hook-and-loop busbars

Lens driving device, camera device, and optical apparatus including...

Flexible membrane adapted to carry high-frequency (RF) power signal...

Semiconductor packages

Wiring circuit board

Hybrid circuit board

Press-in machine for pressing components into a substrate, in parti...

Electrically connected component carrier stacks with respective cav...

Modular flight management system incorporating an autopilot

Extension structure of flexible substrates with conductive wires th...

Nitride-based semiconductor module and method for manufacturing the...

Capacitor bank assembly

Circuit board manufacturing method and circuit board manufacturing...

Method for assembly of battery pack with compact shared PCM

Method for manufacturing component embedded circuit board

Decoupled PCB structure to parallel power transistors

Connection method for chip and circuit board, and circuit board ass...

Printed circuit board and manufacturing method thereof

Electronics assembly

Transceiver antenna for wireless charging, apparatus and method of...

Battery module printed circuit board assembly system and method

Wiring circuit board

Ground discontinuities for thermal isolation

Gold finger type fan frame and double-layer connection structure th...

Patents Applicationslast 30 patents

CABLE MANUFACTURING PROCESS

POWER METHOD FOR HIGHER CURRENT ASIC POWER DELIVERY

CIRCUIT BOARD, METHOD FOR MANUFACTURING THE SAME AND TERMINAL DEVIC...

FLEXIBLE CIRCUIT BOARD AND PAD CONNECTING SYSTEM

MASKING METHOD AND MASKED PRODUCT

APPARATUS AND METHODS FOR TOOL MARK FREE STITCH BONDING

ELECTRONIC DEVICES, SOCKET LOADING MECHANISMS, AND METHODS

COMPACT INTERFACE THROUGH HINGE CONNECTOR

ANISOTROPIC CONDUCTIVE ADHESIVE AND COMPOSITION THEREOF

CONNECTION METHOD FOR YARN WIRE AND CIRCUIT BOARD

DRAPABLE, FLEXIBLE CIRCUITRY LAYERS AND METHODS THEREFOR

FLEXIBLE PRINTED CIRCUIT ROGOWSKI COIL

PRE-CONNECTED ANALYTE SENSORS

METHOD AND ELECTRICAL CONTACT ELEMENT

BUS BAR LINK FOR BATTERY CELL INTERCONNECTIONS IN A BATTERY MODULE

HIGH-FREQUENCY HIGH-POWER PACKAGING MODULE, MANUFACTURING METHOD FO...

ELECTRICAL CIRCUIT FORMING METHOD AND ELECTRICAL CIRCUIT FORMING AP...

LOW PRESSURE SINTERING POWDER

SYSTEM AND METHOD FOR MONITORING CONDITIONS OF A SUBJECT BASED ON W...

LIQUID METAL PATCH INTERCONNECT FOR LARGE WARPAGE COMPONENTS

SINTERING PASTE, METHOD FOR ELECTRICALLY CONDUCTIVE, MATERIALLY BON...

MANUFACTURING METHOD OF ELECTRONIC DEVICE

PACKAGE SUBSTRATE HAVING EMBEDDED ELECTRONIC COMPONENT IN A CORE OF...

ULTRASONIC WELDING SYSTEMS, METHODS OF USING THE SAME, AND RELATED...

PRINTED CIRCUIT BOARD AND METHOD OF PRODUCING THEREOF

ELECTRONIC DEVICE

CIRCUIT BOARD LAYER BUILD-UP PROCESS WITH ENHANCED POSITIONING PREC...

EXTENSION STRUCTURE OF FLEXIBLE SUBSTRATES WITH CONDUCTIVE WIRES TH...

Connection of Two Components with One Connecting Element

DECOUPLED PCB STRUCTURE TO PARALLEL POWER TRANSISTORS