1. Field of the Invention
The invention relates to a cleaning device, and in particular, to a cleaning device for cleaning a brush of a wafer scrubber.
2. Description of the Related Art
During surface preparation in semiconductor manufacturing, wafers undergo a cleaning procedure to remove foreign particles or contamination (organic or inorganic). A wafer scrubber comprises a brush scrubbing wafer surfaces, which must be kept clean.
A conventional wafer scrubber 10, shown in
A scrubbing assembly for a wafer cleaning device exemplifies an improved method to clean the brush. Referring to
A cleaning device with an additional oscillator rearranges the disposition of the fixed components for improved particle removal. However, adding an oscillator requires adjustment of the height of the cup and increases fabrication costs.
The invention provides a cleaning device, for cleaning a brush of a wafer scrubber, comprising a cup and a dummy pad. The dummy pad is disposed in the cup. The brush rubs against the dummy pad.
The dummy pad comprises a plurality of protrusions, integrally formed thereon.
The cleaning device further comprises an inflow pipe, connected to the cup, continuously delivering water to the dummy pad.
The cleaning device further comprises an outflow pipe, connected to the cup, removing water from the cup.
Water is deionized.
The dummy pad has a water drain.
The dummy pad has a rough surface, and the brush rubs against the rough surface.
The invention provides a wafer scrubber, comprising a brush, a cup, and a dummy pad. The brush operates in scrubbing mode and cleaning mode. The dummy pad is disposed in the cup. In scrubbing mode, the brush scrubs the wafer, and in cleaning mode, the brush rubs against the dummy pad.
The brush rotates on the dummy pad during the cleaning mode.
The wafer scrubber further comprises a first water pipe, connected with the scrubber, selectively delivering water to the brush during scrubbing mode.
The wafer scrubber further comprises a second water pipe, connected with the cup, selectively delivering water to the brush during cleaning mode.
The invention also provides a method of cleaning a brush of a wafer scrubber. The method comprises providing a cup with a dummy pad disposed therein, and rubbing the brush against the dummy pad.
The brush rubs against the dummy pad in a rotating manner.
The dummy pad comprises a plurality of protrusions, formed on the dummy pad, against which the brush rubs when rubbing the brush against the dummy pad.
The method further comprises delivering water to the dummy pad, and removing water from the cup.
The dummy pad has a rough surface, against which the brush rubs when rubbing the brush against the dummy pad.
A detailed description is given in the following embodiments with reference to the accompanying drawings.
The invention can be more fully understood by reading the subsequent detailed description and examples with references made to the accompanying drawings, wherein:
Referring to
The scrubbing portion 120 comprises a brush 121′ and a body 122′, wherein the brush 121′ is disposed on the body 122′. The body 122 rotates around an axle A′, moving the brush 121′ between the bath 130 and the cup 140. A wafer W′ is placed within the bath 130.
As shown in
The first water pipe P1 connects with the brush 121′, selectively providing water to the brush 121′. The second water pipe P1′ connects with the cup 140, selectively providing water to the brush 121′. The inflow pipe P2 connects with the cup 140, continuously providing water to the dummy pad D. The outflow pipe P3 connects with the bottom of the cup 140, removing water stored in the cup 140. It is noted that water mentioned in this system is deionized, but it is not limited thereto.
The brush 121′ is in scrubbing mode and cleaning mode. During scrubbing mode, the brush 121′ moves to the bath 130, and scrubs the wafer W′. The first water pipe P1 delivers water to the brush 121′ when scrubbing the wafer W′. During cleaning mode, the first water pipe P1 stop delivering water; the brush 121′ moves to the cup 140, and rubs against the dummy pad D by self-rotation. In other words, the brush 121′ rotates on the dummy pad D. The second water pipe P1′ delivers water to the brush 121′ and the inflow pipe P2 delivers water to the dummy pad D, rinsing the brush 121′ and the dummy pad D. Used water drains to the bottom of the cup 140 through the water drains WD, and into the outflow pipe P3.
It should be noted that the first water pipe P1 and the second water pipe P1′ selectively deliver water when the brush 121′ is in two different modes. The inflow pipe P2 delivers water when the brush 121′ is in cleaning mode to rinse the brush 121′, and delivers water when the brush 121′ is in scrubbing mode to clean the dummy pad D.
Experimental results of a brush cleaned with and without a dummy pad are shown in a chart as follows. A brush, which has been used for 3000 minutes, rotates on the dummy pad to gain a better particle-removal rate of 99.70%. Compared to conventional methods (brushes idling in the cup), the brush cleaned with a dummy pad achieves a much better result.
The brush 121′ of the embodiment is cleansed by self-rotating on a dummy pad D. Particles are easily removed without making changes to the wafer scrubber 100. Not only is particle-removal rate improved, but economic efficiency is achieved.
While the invention has been described by way of example and in terms of preferred embodiment, it is to be understood that the invention is not limited thereto. To the contrary, it is intended to cover various modifications and similar arrangements (as would be apparent to those skilled in the art). Therefore, the scope of the appended claims should be accorded the broadest interpretation so as to encompass all such modifications and similar arrangements.