Closed-loop latent heat cooling method and capillary force or non-nozzle module thereof

Abstract

A closed-loop latent heat cooling method and a capillary force or non-nozzle module thereof are provided, wherein a cooling fluid in a storage tank flows to a gasification pipe via a liquid pipe; the gasification pipe connects with a capillary force or non-nozzle structure; the cooling fluid keeps a liquid thin film in the gasification pipe, and after absorbing the heat of electronic components, it keeps a thin film in a boiling state; then, it is gasified and rises to a vapor chamber more efficiently; the gasified cooling fluid in the vapor chamber flows to a condenser via a vapor pipe and flows back to the storage tank via the liquid pipe after condensed to be a liquid in the condenser.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

The present invention will become more fully understood from the detailed description given herein below for illustration only, and which thus is not limitative of the present invention, and wherein:

FIG. 1 is a schematic view of a closed-loop latent heat cooling method and the module thereof in one preferred embodiment of the present invention;

FIG. 2 is a schematic view of maintaining the liquid film through the principle of communicating pipe for the closed-loop latent heat cooling method and the module thereof according to one preferred embodiment of the present invention;

FIG. 3 is a schematic view of maintaining the liquid film through the combination of a capillary phenomenon and externally applied pressure for the closed-loop latent heat cooling method and the module thereof according to one preferred embodiment of the present invention;

FIG. 4 is a schematic view of maintaining the liquid film through the combination of the waterfall and externally applied pressure principles for the closed-loop latent heat cooling method and the module thereof according to one preferred embodiment of the present invention; and

FIG. 5 is a schematic view of using the cooling fluid with a high boiling temperature through using an external cooling chip for the closed-loop latent heat cooling method and the module thereof according to one preferred embodiment of the present invention.

Claims

1. A closed-loop latent heat cooling method, comprising: providing a storage tank for storing a cooling fluid within the storage tank;utilizing a first liquid pipe connected with the storage tank to allow the cooling fluid flowing into a gasification pipe through an electronic component;gasifying the cooling fluid to be a vaporized state to enable the gasified cooling fluid to rise to a vapor chamber;utilizing a vapor pipe connected between the vapor chamber and a condenser to allow the gasified cooling fluid flowing into the condenser;condensing the gasified cooling fluid by the condenser; andutilizing a second liquid pipe connected between the condenser and the storage tank to allow the condensed cooling fluid flowing back to the storage tank.

2. The closed-loop latent heat cooling method as claimed in claim 1, wherein the side surface of the gasification pipe is connected to the vapor chamber by an open connection.

3. The closed-loop latent heat cooling method as claimed in claim 1, wherein the cooling fluid stored in the storage tank has the liquid level higher than the gasification pipe.

4. The closed-loop latent heat cooling method as claimed in claim 1, further comprising: forming a microstructure with capillary force inside the side surface of the gasification pipe for enabling the gasified cooling fluid to rise to a vapor chamber.

5. The closed-loop latent heat cooling method as claimed in claim 4, further comprising: providing a pump to the first liquid pipe for allowing the cooling fluid flowing into the gasification pipe.

6. The closed-loop latent heat cooling method as claimed in claim 1, further comprising: forming a microstructure with capillary force within the first liquid pipe connected between the storage tank with the gasification for enabling the cooling fluid stored in the storage tank flowing to the gasification pipe.

7. The closed-loop latent heat cooling method as claimed in claim 1, further comprising: configuring a triangle high heat-conductive material block outside the side surface of the gasification pipe connected with the electronic component to form a waterfall.

8. The closed-loop latent heat cooling method as claimed in claim 1, further comprising: providing a pump to the first liquid pipe for allowing the cooling fluid flowing into the gasification pipe.

9. The closed-loop latent heat cooling method as claimed in claim 1, further comprising: configuring a cooling chip outside the side surface of the gasification pipe connected with the electronic component.

10. The closed-loop latent heat cooling method as claimed in claim 1, further comprising: forming a microstructure with capillary force at the second liquid pipe from the condenser to the storage tank for allowing the cooling fluid in a liquid state flowing back to the storage tank from the condenser through the second liquid pipe.

11. The closed-loop latent heat cooling method as claimed in claim 1, further comprising: providing at least one pump to the second liquid pipe for allowing the cooling fluid in a liquid state flowing back to the storage tank from the condenser through the second liquid pipe.

12. The closed-loop latent heat cooling method as claimed in claim 1, wherein the condenser provides a reaction space for condensing the gasified cooling fluid into the liquid cooling fluid.

13. The closed-loop latent heat cooling method as claimed in claim 1, wherein the condenser further comprises at least one exchanger for condensing the gasified cooling fluid into the liquid cooling fluid.

14. A capillary force closed-loop latent heat cooling module, comprising: a cooling fluid, for absorbing the heat of an electronic component;a storage tank, for storing the cooling fluid;a vapor chamber, which is a region for accommodating the gas generated by the cooling fluid being boiling and vaporized after absorbing the heat of the electronic component;a condenser, for condensing the gasified cooling fluid into the cooling fluid in a liquid state; anda loop pipe, for connecting the storage tank, the vapor chamber, and the condenser into a closed loop, and including a liquid pipe, a vapor pipe, and a gasification pipe, wherein the liquid pipe connects the storage tank and the gasification pipe, connects the storage tank and the condenser, and serves as the pipe for the back flow of the storage tank itself; the vapor pipe connects the vapor chamber and the condenser; the gasification pipe connects between the liquid pipes, with two side surfaces being connected with the electronic component and the vapor chamber respectively, and a micro structure with capillary force is disposed in the gasification pipe to form a liquid film kept in a film boiling state.

15. The capillary force closed-loop latent heat cooling module as claimed in claim 14, wherein the microstructure with capillary force is located inside the side surface of the gasification pipe connecting with the electronic component.

16. The capillary force closed-loop latent heat cooling module as claimed in claim 14, wherein the micro structure with capillary force is further located in the liquid pipe from the storage tank to the gasification pipe or from the condenser to the storage tank.

17. The capillary force closed-loop latent heat cooling module as claimed in claim 14, wherein the thickness of the microstructure with capillary force falls within 2 millimeters to 10 millimeters.

18. The capillary force closed-loop latent heat cooling module as claimed in claim 14, wherein the micro structure with capillary force includes a multi-hole microstructure, a reticulated microstructure, or a sinter-particle microstructure.

19. The capillary force closed-loop latent heat cooling module as claimed in claim 14, wherein the material of the microstructure with capillary force includes a metal, a nonmetal, or a polymer.

20. The capillary force closed-loop latent heat cooling module as claimed in claim 14, wherein at least one pump is configured at the liquid pipe.

21. The capillary force closed-loop latent heat cooling module as claimed in claim 14, wherein the material of the gasification pipe includes a high heat-conductive material.

22. The capillary force closed-loop latent heat cooling module as claimed in claim 14, wherein each of the loop pipe, the storage tank, the vapor chamber, and the condenser is formed by integrating or bonding, and they are combined with one another by integrating or bonding.

23. The capillary force closed-loop latent heat cooling module as claimed in claim 22, wherein the bonding method is through sintering or installing at least one fastener.

24. The capillary force closed-loop latent heat cooling module as claimed in claim 14, wherein the condenser provides a reaction space for condensing the gas into liquid or uses at least one heat exchanger.

25. A non-nozzle closed-loop latent heat cooling module, comprising: a cooling fluid, for absorbing the heat of an electronic component;a storage tank, for storing the cooling fluid;a vapor chamber, which is a region for accommodating the gas generated by the cooling fluid being boiling and vaporized after absorbing the heat of the electronic component;a condenser, for condensing the gasified cooling fluid to be the cooling fluid in a liquid state; anda loop pipe, for connecting the storage tank, the vapor chamber, and the condenser into a closed loop, and including a liquid pipe, a vapor pipe, and a gasification pipe, wherein the liquid pipe connects the storage tank and the gasification pipe, connects the storage tank and the condenser, and serves as the pipe for the back flow of the storage tank itself; the vapor pipe connects the vapor chamber and the condenser; the gasification pipe connects at the liquid pipes, with two side surfaces connecting the electronic component and the vapor chamber respectively, and a non-nozzle structure is employed in the gasification pipe to form a liquid film kept in the film boiling state.

26. The non-nozzle closed-loop latent heat cooling module as claimed in claim 25, wherein the liquid level of the gasification pipe is lower than that of the storage tank.

27. The non-nozzle closed-loop latent heat cooling module as claimed in claim 25, wherein a cooling chip or a triangle high heat-conductive material block is disposed outside the side surface of the gasification pipe connecting with the electronic component.

28. The non-nozzle closed-loop latent heat cooling module as claimed in claim 25, wherein a hydrophilicity surface treatment is conducted within the side surface of the gasification pipe connecting with the electronic component.

29. The non-nozzle closed-loop latent heat cooling module as claimed in claim 28, wherein the hydrophilicity surface treatment includes forming a groove inside the side surface.

30. The non-nozzle closed-loop latent heat cooling module as claimed in claim 25, wherein at least one pump is configured at the liquid pipe.

31. The non-nozzle closed-loop latent heat cooling module as claimed in claim 25, wherein the material of the gasification pipe includes a high heat-conductive material.

32. The non-nozzle closed-loop latent heat cooling module as claimed in claim 25, wherein each of the loop pipe, the storage tank, the vapor chamber, and the condenser is formed by integrating or bonding, and they are combined with one another by integrating or bonding.

33. The non-nozzle closed-loop latent heat cooling module as claimed in claim 32, wherein the bonding method is sintering or installing at least one fastener.

34. The capillary force closed-loop latent heat cooling module as claimed in claim 25, wherein the condenser provides a reaction space for condensing the gas into liquid or uses at least one heat exchanger.