Heat pipes

Industry

CPC
H05K7/20336

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K7/00Constructional details common to different types of electric apparatus

Current Industry

H05K7/20336Heat pipes

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Electronic apparatus and heat transport device
- Patent number 12,363,867
- Issue date Jul 15, 2025
- Lenovo (Singapore) Pte. Ltd.
- Atsushi Ohyama
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Cooling system and methods
- Patent number 12,363,864
- Issue date Jul 15, 2025
- Shuaib Badat
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat dissipation device and electronic apparatus
- Patent number 12,363,866
- Issue date Jul 15, 2025
- Lenovo (Beijing) Limited
- Ting Tian
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Vapor chamber and manufacturing method thereof, middle frame assemb...
- Patent number 12,349,314
- Issue date Jul 1, 2025
- Huawei Technologies Co., Ltd.
- Lizhong Huang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Heat dissipation device
- Patent number 12,347,746
- Issue date Jul 1, 2025
- AURAS TECHNOLOGY CO., LTD.
- Cheng-Ju Chang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Thermal management devices
- Patent number 12,342,504
- Issue date Jun 24, 2025
- Hewlett-Packard Deveopment Company, L.P.
- Hendry Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Temperature equalization component and electronic device
- Patent number 12,336,146
- Issue date Jun 17, 2025
- Huawei Technologies Co., Ltd.
- Yongfu Sun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component cooler for a computing device
- Patent number 12,336,147
- Issue date Jun 17, 2025
- Advanced Micro Devices, Inc.
- Christopher M. Helberg
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Heat dissipation device having irregular shape
- Patent number 12,331,997
- Issue date Jun 17, 2025
- Cooler Master Co., Ltd.
- Xuemei Wang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Folded-fin vapor chamber cold plate
- Patent number 12,324,127
- Issue date Jun 3, 2025
- Hewlett Packard Enterprise Development LP
- Steven Dean
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic module comprising a pulsating heat pipe
- Patent number 12,322,675
- Issue date Jun 3, 2025
- Siemens Aktiengesellschaft
- Florian Schwarz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack-PCB architecture with embedded vapor chamber
- Patent number 12,317,408
- Issue date May 27, 2025
- Meta Platforms Technologies, LLC
- Michael Nikkhoo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat dissipating structure
- Patent number 12,317,452
- Issue date May 27, 2025
- Lenovo (Beijing) Limited
- Xintong Ding
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Air-cooled power converter
- Patent number 12,316,238
- Issue date May 27, 2025
- Marel Power Solutions, Inc.
- Ian Byers
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Boiler plates for computing systems
- Patent number 12,317,451
- Issue date May 27, 2025
- ZT GROUP INT'L, INC.
- Ting Yu Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic assemblies having embedded passive heat pipes and associ...
- Patent number 12,309,912
- Issue date May 20, 2025
- Eagle Technology, LLC
- Jason Thompson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Configurable multi-chip module heatsink for selective dissipation o...
- Patent number 12,309,962
- Issue date May 20, 2025
- International Business Machines Corporation
- William James Anderl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Receptacle with connectable spring finger for multipoint contact co...
- Patent number 12,309,969
- Issue date May 20, 2025
- Hewlett Packard Enterprise Development LP
- Harvey J. Lunsman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat dissipating plate, manufacturing method therefor and electroni...
- Patent number 12,309,973
- Issue date May 20, 2025
- THERLECT CO., LTD.
- Chien-Yu Chen
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Refrigeration system or a heat pump and method of operating a refri...
- Patent number 12,309,983
- Issue date May 20, 2025
- Thermo King LLC
- Ryan Wayne Schumacher
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Extruded heat pipe
- Patent number 12,303,957
- Issue date May 20, 2025
- Intel Corporation
- Christopher Michael Moore
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Handheld electronic device
- Patent number 12,302,531
- Issue date May 13, 2025
- ASUSTeK COMPUTER Inc.
- Chien-Feng Chung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
System and device with laser array illumination
- Patent number 12,302,043
- Issue date May 13, 2025
- Guangyi (Xiamen) Technology Co., Ltd.
- Siyang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat-dissipating module and projection device
- Patent number 12,292,675
- Issue date May 6, 2025
- Coretronic Corporation
- Pei-Rong Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cooling systems, cooling structures and electronic devices and meth...
- Patent number 12,284,793
- Issue date Apr 22, 2025
- Intel Corporation
- Ritu Bawa
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Thermal transfer system and method
- Patent number 12,283,823
- Issue date Apr 22, 2025
- Medtronic, Inc.
- Robert J. Monson
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Heat dissipation member and electronic apparatus
- Patent number 12,270,609
- Issue date Apr 8, 2025
- Lenovo (Beijing) Limited
- Lianming Guo
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Hardened optical platform with pluggable optics
- Patent number 12,274,034
- Issue date Apr 8, 2025
- Ciena Corporation
- Peter Saturley
- G02 - OPTICS
Information Patent Grant
Heat dissipation device
- Patent number 12,274,030
- Issue date Apr 8, 2025
- AURAS TECHNOLOGY CO., LTD.
- Chih-Wei Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Compliant thermal management devices, systems, and methods of fabri...
- Patent number 12,262,509
- Issue date Mar 25, 2025
- Georgios Karamanis
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LEAK PREVENTION AND DETECTION IN LIQUID-COOLED PACKAGES
- Publication number 20250234484
- Publication date Jul 17, 2025
- Lenovo Enterprise Solutions (Singapore) Pte. Ltd.
- TIANYI GAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT DISSIPATION ASSEMBLY, AND CIRCUIT SYSTEM
- Publication number 20250234490
- Publication date Jul 17, 2025
- Delta Electronics, Inc.
- Chia-Wei HSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electrically Isolating Heat Pipe Assembly
- Publication number 20250234491
- Publication date Jul 17, 2025
- TE Connectivity Solutions GMBH
- Matthew MISHRIKEY
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAVELENGTH CONVERTING APPARATUS, LIGHT SOURCE APPARATUS, AND PROJECTOR
- Publication number 20250224658
- Publication date Jul 10, 2025
- SEIKO EPSON CORPORATION
- Masato KADOTANI
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
CARBON MATERIAL AND APPLICATION THEREOF
- Publication number 20250223174
- Publication date Jul 10, 2025
- Huawei Technologies Co., Ltd
- Haoming Fang
- C01 - INORGANIC CHEMISTRY
Information Patent Application
HEAT SINK STRUCTURE AND METHODS THEREOF
- Publication number 20250227884
- Publication date Jul 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Hao HSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL DIFFUSION DEVICE AND ELECTRONIC DEVICE
- Publication number 20250227885
- Publication date Jul 10, 2025
- Murata Manufacturing Co., Ltd.
- Tatsuhiro NUMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Container for One or More Electronic Devices and Methods of Use The...
- Publication number 20250220856
- Publication date Jul 3, 2025
- ENGENDREN LLC
- Alan Paul Meissner
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
STATIONARY INDUCTION CHARGING DEVICE
- Publication number 20250220863
- Publication date Jul 3, 2025
- MAHLE International GmbH
- Stefan Dold
- B60 - VEHICLES IN GENERAL
Information Patent Application
ADDITIVELY MANUFACTURED COOLING ASSEMBLIES FOR THERMAL AND/OR MECHA...
- Publication number 20250208674
- Publication date Jun 26, 2025
- GENERAL ELECTRIC COMPANY
- Brian Magann Rush
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
WICK SHEET FOR VAPOR CHAMBER, VAPOR CHAMBER, AND ELECTRONIC APPARATUS
- Publication number 20250212367
- Publication date Jun 26, 2025
- DAI NIPPON PRINTING CO., LTD.
- Kazunori ODA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
AIRFLOW IN A CARD-BASED COMPUTING DEVICE
- Publication number 20250212313
- Publication date Jun 26, 2025
- NVIDIA Corporation
- Xiang SUN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT DISSIPATION SYSTEMS FOR ELECTRONIC DEVICES AND RELATED METHODS
- Publication number 20250212365
- Publication date Jun 26, 2025
- Intel Corporation
- Gaurav Patankar
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
VAPOR CHAMBER, ELECTRONIC DEVICE, AND CHIP PACKAGE STRUCTURE
- Publication number 20250212366
- Publication date Jun 26, 2025
- Huawei Technologies Co., Ltd
- Leonid Leonardovich VASILIEV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION APPARATUS FOR ELECTRONIC DEVICE
- Publication number 20250203816
- Publication date Jun 19, 2025
- KMW Inc.
- Duk Yong KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TWO-PHASE RADIATING FIN AND HEAT SINK
- Publication number 20250185211
- Publication date Jun 5, 2025
- ZTE Corporation
- Kaiwen DUAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM FOR COOLING IN A HEADSET DISPLAY
- Publication number 20250185223
- Publication date Jun 5, 2025
- Meta Platforms Technologies, LLC
- Giti Karimi Moghaddam
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ENERGY STORAGE INVERTER
- Publication number 20250175092
- Publication date May 29, 2025
- Jinko Energy Storage Technology Co., Ltd.
- Jian YU
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
HEAT SINK
- Publication number 20250176130
- Publication date May 29, 2025
- FURUKAWA ELECTRIC CO., LTD.
- Shuta HIKICHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HOLLOW PIPE COOLING DEVICE
- Publication number 20250176140
- Publication date May 29, 2025
- Delta Electronics, Inc.
- Jung-Sung Shih
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT SINK
- Publication number 20250176141
- Publication date May 29, 2025
- FURUKAWA ELECTRIC CO., LTD.
- Shuta HIKICHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER CONVERTERS
- Publication number 20250176147
- Publication date May 29, 2025
- Cummins Inc.
- Abhishek Khunte
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICES, SYSTEMS, AND METHODS FOR A HYBRID COOLING SYSTEM
- Publication number 20250169044
- Publication date May 22, 2025
- Microsoft Technology Licensing, LLC
- Brandon Earl GARY
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VAPOR CHAMBER BODY SHEET, VAPOR CHAMBER, AND ELECTRONIC APPARATUS
- Publication number 20250169041
- Publication date May 22, 2025
- DAI NIPPON PRINTING CO., LTD.
- Takayuki OTA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL ARCHITECTURE DESIGNS FOR A HEAD-WORN DEVICE, AND SYSTEMS AN...
- Publication number 20250155732
- Publication date May 15, 2025
- Meta Platforms Technologies, LLC
- Alex Ockfen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COOLING SYSTEM ASSEMBLY
- Publication number 20250159843
- Publication date May 15, 2025
- Cooler Master Co., Ltd.
- Tung-Yang Shieh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT DISSIPATION DEVICE
- Publication number 20250159841
- Publication date May 15, 2025
- National Tsing-Hua University
- Shwin-Chung Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER CONVERTER WITH INTEGRATED HEAT PIPE
- Publication number 20250151232
- Publication date May 8, 2025
- VERTIV CORPORATION
- AKSHAY SHAH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Heating Element Cooling Device
- Publication number 20250151234
- Publication date May 8, 2025
- KMW Inc.
- Hwang Ju LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Vapor Chamber with an Extended Base Plate
- Publication number 20250147561
- Publication date May 8, 2025
- Google LLC
- Tyler Jon Ewing
- G06 - COMPUTING CALCULATING COUNTING

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic apparatus and heat transport device

Cooling system and methods

Heat dissipation device and electronic apparatus

Vapor chamber and manufacturing method thereof, middle frame assemb...

Heat dissipation device

Thermal management devices

Temperature equalization component and electronic device

Component cooler for a computing device

Heat dissipation device having irregular shape

Folded-fin vapor chamber cold plate

Electronic module comprising a pulsating heat pipe

Stack-PCB architecture with embedded vapor chamber

Heat dissipating structure

Air-cooled power converter

Boiler plates for computing systems

Electronic assemblies having embedded passive heat pipes and associ...

Configurable multi-chip module heatsink for selective dissipation o...

Receptacle with connectable spring finger for multipoint contact co...

Heat dissipating plate, manufacturing method therefor and electroni...

Refrigeration system or a heat pump and method of operating a refri...

Extruded heat pipe

Handheld electronic device

System and device with laser array illumination

Heat-dissipating module and projection device

Cooling systems, cooling structures and electronic devices and meth...

Thermal transfer system and method

Heat dissipation member and electronic apparatus

Hardened optical platform with pluggable optics

Heat dissipation device

Compliant thermal management devices, systems, and methods of fabri...

Patents Applicationslast 30 patents

LEAK PREVENTION AND DETECTION IN LIQUID-COOLED PACKAGES

HEAT DISSIPATION ASSEMBLY, AND CIRCUIT SYSTEM

Electrically Isolating Heat Pipe Assembly

WAVELENGTH CONVERTING APPARATUS, LIGHT SOURCE APPARATUS, AND PROJECTOR

CARBON MATERIAL AND APPLICATION THEREOF

HEAT SINK STRUCTURE AND METHODS THEREOF

THERMAL DIFFUSION DEVICE AND ELECTRONIC DEVICE

Container for One or More Electronic Devices and Methods of Use The...

STATIONARY INDUCTION CHARGING DEVICE

ADDITIVELY MANUFACTURED COOLING ASSEMBLIES FOR THERMAL AND/OR MECHA...

WICK SHEET FOR VAPOR CHAMBER, VAPOR CHAMBER, AND ELECTRONIC APPARATUS

AIRFLOW IN A CARD-BASED COMPUTING DEVICE

HEAT DISSIPATION SYSTEMS FOR ELECTRONIC DEVICES AND RELATED METHODS

VAPOR CHAMBER, ELECTRONIC DEVICE, AND CHIP PACKAGE STRUCTURE

HEAT DISSIPATION APPARATUS FOR ELECTRONIC DEVICE

TWO-PHASE RADIATING FIN AND HEAT SINK

SYSTEM FOR COOLING IN A HEADSET DISPLAY

ENERGY STORAGE INVERTER

HEAT SINK

HOLLOW PIPE COOLING DEVICE

HEAT SINK

POWER CONVERTERS

DEVICES, SYSTEMS, AND METHODS FOR A HYBRID COOLING SYSTEM

VAPOR CHAMBER BODY SHEET, VAPOR CHAMBER, AND ELECTRONIC APPARATUS

THERMAL ARCHITECTURE DESIGNS FOR A HEAD-WORN DEVICE, AND SYSTEMS AN...

COOLING SYSTEM ASSEMBLY

HEAT DISSIPATION DEVICE

POWER CONVERTER WITH INTEGRATED HEAT PIPE

Heating Element Cooling Device

Vapor Chamber with an Extended Base Plate