Heat pipes

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CPC
H05K7/20336

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K7/00Constructional details common to different types of electric apparatus

Current Industry

H05K7/20336Heat pipes

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Conduction cooled chassis
- Patent number 12,213,285
- Issue date Jan 28, 2025
- Ametek, Inc.
- Peter Kortekaas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low-noise heat exchanger
- Patent number 12,207,443
- Issue date Jan 21, 2025
- Dell Products L.P.
- Qinghong He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for an ion emitter-assisted heatpipe
- Patent number 12,204,385
- Issue date Jan 21, 2025
- Dell Products L.P.
- Qinghong He
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Vehicle
- Patent number 12,204,104
- Issue date Jan 21, 2025
- MAXELL, LTD.
- Akio Misawa
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Housing comprising a composite wall integrating at least one coolin...
- Patent number 12,207,442
- Issue date Jan 21, 2025
- SAFRAN ELECTRONICS & DEFENSE
- Muriel Sabah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with heat-conductive cover
- Patent number 12,200,900
- Issue date Jan 14, 2025
- HTC Corporation
- Li-Hsun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Loop heat pipe
- Patent number 12,196,498
- Issue date Jan 14, 2025
- Shinko Electric Industries Co., Ltd.
- Yoshihiro Machida
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Method and extraction system for extracting an electronic device fr...
- Patent number 12,200,901
- Issue date Jan 14, 2025
- OVH
- Ali Chehade
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Portable electronic device
- Patent number 12,193,189
- Issue date Jan 7, 2025
- Sony Group Corporation
- Kiyohito Masuda
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
3-D structured two-phase microfluidic cooling with nano structured...
- Patent number 12,189,441
- Issue date Jan 7, 2025
- Microsoft Technology Licensing, LLC
- Bharath Ramakrishnan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Oscillating heat pipe
- Patent number 12,185,499
- Issue date Dec 31, 2024
- Nokia Technologies Oy
- Ryan Enright
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Vapor chamber and manufacturing method of the same
- Patent number 12,173,968
- Issue date Dec 24, 2024
- Cooler Master Co., Ltd.
- Chi-Lung Chen
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Airflow in a card-based computing device
- Patent number 12,177,961
- Issue date Dec 24, 2024
- NVIDIA Corporation
- Xiang Sun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal management device for circuit breakers
- Patent number 12,171,086
- Issue date Dec 17, 2024
- EATON INTELLIGENT POWER LIMITED
- Ankit Bhagat
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Rack system for housing at least one immersion case
- Patent number 12,167,568
- Issue date Dec 10, 2024
- OVH
- Gregory Francis Louis Bauchart
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Vapor chamber, electronic device, metallic sheet for vapor chamber...
- Patent number 12,167,571
- Issue date Dec 10, 2024
- Dai Nippon Printing Co., Ltd.
- Shinichiro Takahashi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Heatpipe to help reduce radio frequency interference
- Patent number 12,160,216
- Issue date Dec 3, 2024
- Intel Corporation
- Kae-An Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation device
- Patent number 12,158,308
- Issue date Dec 3, 2024
- AURAS TECHNOLOGY CO., LTD.
- Chih-Wei Chen
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Devices, systems, and methods for a hybrid cooling system
- Patent number 12,156,383
- Issue date Nov 26, 2024
- Microsoft Technology Licensing, LLC
- Brandon Earl Gary
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal Interface Material (TIM) filling structure for high warpage...
- Patent number 12,156,324
- Issue date Nov 26, 2024
- Cisco Technology, Inc.
- Yongguo Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Rack system for housing an electronic device
- Patent number 12,156,370
- Issue date Nov 26, 2024
- OVH
- Ali Chehade
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Flexible vapor chamber with shape memory material
- Patent number 12,146,476
- Issue date Nov 19, 2024
- Intel Corporation
- Jeff Ku
- F03 - MACHINES OR ENGINES FOR LIQUIDS WIND, SPRING WEIGHT AND MISCELLANEOUS M...
Information Patent Grant
Cooling device, a receptacle assembly, a system and a printed board...
- Patent number 12,147,084
- Issue date Nov 19, 2024
- Telefonaktiebolaget LM Ericsson (publ)
- Mikkel Myhre
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Immersed cabinet and heat dissipation system thereof
- Patent number 12,150,276
- Issue date Nov 19, 2024
- Dongguan Luxshare Technologies Co., Ltd.
- PengFei Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for using additive manufacturing for thermal ma...
- Patent number 12,150,279
- Issue date Nov 19, 2024
- General Electric Company
- Brian Magann Rush
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Heat dissipation device assembly
- Patent number 12,146,714
- Issue date Nov 19, 2024
- Asia Vital Components Co., Ltd.
- Sheng-Huang Lin
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Data center rack system with integrated liquid and dielectric immer...
- Patent number 12,144,145
- Issue date Nov 12, 2024
- OVH
- Ali Chehade
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Device for transferring heat between a first module and a second mo...
- Patent number 12,136,937
- Issue date Nov 5, 2024
- Huawei Technologies Co., Ltd.
- Fredrik Ohlsson
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Dynamic exhaust fan operation to improve user experience
- Patent number 12,137,535
- Issue date Nov 5, 2024
- Microsoft Technology Licensing, LLC
- Donghwi Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Device and method for a two phase heat transfer
- Patent number 12,130,093
- Issue date Oct 29, 2024
- National University of Singapore
- Poh Seng Lee
- F28 - HEAT EXCHANGE IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
VEHICLE DISPLAY DEVICE
- Publication number 20250035973
- Publication date Jan 30, 2025
- YAZAKI CORPORATION
- Naohisa Murata
- B60 - VEHICLES IN GENERAL
Information Patent Application
VAPOR COLUMNS WITH REDUCED CROSS-SECTIONAL AREA FOR INCREASED AIRFLOW
- Publication number 20250040094
- Publication date Jan 30, 2025
- NVIDIA Corporation
- Malcolm GUTENBURG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HEAT DISSIPATION MODULE
- Publication number 20250040078
- Publication date Jan 30, 2025
- ASUSTek COMPUTER INC.
- Ing-Jer Chiou
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HEAT DISSIPATION APPARATUS AND ELECTRONIC DEVICE
- Publication number 20250040098
- Publication date Jan 30, 2025
- XFUSION DIGITAL TECHNOLOGIES CO., LTD
- Hui Jia
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Three-Dimensional Meshes and Casings for Thermal Ground Planes
- Publication number 20250031347
- Publication date Jan 23, 2025
- KELVIN THERMAL TECHNOLOGIES, INC.
- Ryan Lewis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MEMORY SYSTEM THERMAL ISLANDING HEAT ISOLATION
- Publication number 20250021145
- Publication date Jan 16, 2025
- Micron Technology, Inc.
- Joseph L. Turmes
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HEAT SINK WITH HEAT PIPE FOR AN ELECTRONIC COMPONENT AND A CORRESPO...
- Publication number 20250024644
- Publication date Jan 16, 2025
- RITTAL GMBH & CO. KG
- Juan Carlos CACHO ALONSO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT SINK
- Publication number 20250024645
- Publication date Jan 16, 2025
- FURUKAWA ELECTRIC CO., LTD.
- Hirofumi AOKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEATPIPE WITH GRADUATED CONDENSER PORTION AND CONSTANT RATIO BETWEE...
- Publication number 20250012514
- Publication date Jan 9, 2025
- Dell Products L.P.
- QINGHONG HE
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
COOLING SYSTEM FOR ELECTRONIC COMPONENT RACKS
- Publication number 20250008700
- Publication date Jan 2, 2025
- JJ COOLING INNOVATION SÀRL
- John R. Thome
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DUAL-PHASE FLUID HEAT-DISSIPATING ELEMENT AND PRODUCT HAVING THE SAME
- Publication number 20250008693
- Publication date Jan 2, 2025
- EVERBRITE TECHNOLOGY CO., LTD.
- Tzu-Chia TAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VAPOR CHAMBER AND MANUFACTURING METHOD OF THE SAME
- Publication number 20250003693
- Publication date Jan 2, 2025
- Cooler Master Co., Ltd.
- Chi-Lung CHEN
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
SOLID-STATE THERMAL ENERGY STORAGE AND DISSIPATION
- Publication number 20240422943
- Publication date Dec 19, 2024
- U.S. Army DEVCOM, Army Research Laboratory
- Darin J. Sharar
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
THERMALLY CONDUCTIVE MOUNT
- Publication number 20240414894
- Publication date Dec 12, 2024
- SIEMENS AKTIENGESELLSCHAFT
- VOLKER MÜLLER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOOP HEAT PIPE, HOUSING ASSEMBLY AND ELECTRONIC DEVICE
- Publication number 20240407134
- Publication date Dec 5, 2024
- Beijing Xiaomi Mobile Software Co., Ltd.
- Mingyan LIU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COOLING METHOD AND APPARATUS, ESPECIALLY FOR APPLICATION IN THE FIE...
- Publication number 20240397666
- Publication date Nov 28, 2024
- FRESHAPE SA
- Mathieu Rubi
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
THERMAL MODULE AND JOINING METHOD FOR HERMETICALLY SEALED ENCLOSURE...
- Publication number 20240389269
- Publication date Nov 21, 2024
- Apple Inc.
- Anthony J. AIELLO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRONIC DEVICE INCLUDING THERMAL DIFFUSION MEMBER
- Publication number 20240389270
- Publication date Nov 21, 2024
- SAMSUNG ELECTRONICS CO,M LTD.
- Heecheul MOON
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
IMMERSION COOLING DEVICE
- Publication number 20240381587
- Publication date Nov 14, 2024
- Fulian Precision Electronics (Tianjin) Co., LTD.
- TSUNG-LIN LIU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STORAGE ASSEMBLY AND HEAT DISSIPATION DEVICE
- Publication number 20240373590
- Publication date Nov 7, 2024
- Cooler Master Co., Ltd.
- Bo-Zhang CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TRANSMISSION ELECTRON MICROSCOPE
- Publication number 20240373591
- Publication date Nov 7, 2024
- Samsung Electronics Co., Ltd.
- Daesung Moon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MANAGEMENT PLANES
- Publication number 20240369306
- Publication date Nov 7, 2024
- KELVIN THERMAL TECHNOLOGIES, INC.
- Ryan J. Lewis
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
CYLINDRICAL AND DIAMOND-SHAPED EVAPORATIVE COOLERS USING HOLLOW FIBERS
- Publication number 20240373592
- Publication date Nov 7, 2024
- 3M Innovative Properties Company
- Neeraj Sinai Borker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE INCLUDING THERMAL DIFFUSION MEMBER
- Publication number 20240365511
- Publication date Oct 31, 2024
- Samsung Electronics Co., Ltd.
- Heecheul MOON
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HEAT DISSIPATION DEVICE
- Publication number 20240365500
- Publication date Oct 31, 2024
- AURAS Technology Co., Ltd.
- Chih-Wei CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Thermal Conduction System for use with a Portable Information Handl...
- Publication number 20240361815
- Publication date Oct 31, 2024
- Dell Products L.P.
- Luke Adams
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
THERMAL DIFFUSION DEVICE AND ELECTRONIC APPARATUS
- Publication number 20240361084
- Publication date Oct 31, 2024
- Murata Manufacturing Co., Ltd.
- Tatsuhiro NUMOTO
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Heat Pipes Featuring Coefficient of Thermal Expansion Matching and...
- Publication number 20240365510
- Publication date Oct 31, 2024
- Kuprion Inc.
- Alfred A. Zinn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL DIFFUSION DEVICE AND ELECTRONIC APPARATUS
- Publication number 20240365512
- Publication date Oct 31, 2024
- Murata Manufacturing Co., Ltd.
- Tatsuhiro NUMOTO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
VAPOR CHAMBER, WICK SHEET FOR VAPOR CHAMBER, AND ELECTRONIC APPARATUS
- Publication number 20240353182
- Publication date Oct 24, 2024
- DAI NIPPON PRINTING CO., LTD.
- Kazunori ODA
- F28 - HEAT EXCHANGE IN GENERAL

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Conduction cooled chassis

Low-noise heat exchanger

Method and apparatus for an ion emitter-assisted heatpipe

Vehicle

Housing comprising a composite wall integrating at least one coolin...

Electronic device with heat-conductive cover

Loop heat pipe

Method and extraction system for extracting an electronic device fr...

Portable electronic device

3-D structured two-phase microfluidic cooling with nano structured...

Oscillating heat pipe

Vapor chamber and manufacturing method of the same

Airflow in a card-based computing device

Thermal management device for circuit breakers

Rack system for housing at least one immersion case

Vapor chamber, electronic device, metallic sheet for vapor chamber...

Heatpipe to help reduce radio frequency interference

Heat dissipation device

Devices, systems, and methods for a hybrid cooling system

Thermal Interface Material (TIM) filling structure for high warpage...

Rack system for housing an electronic device

Flexible vapor chamber with shape memory material

Cooling device, a receptacle assembly, a system and a printed board...

Immersed cabinet and heat dissipation system thereof

Systems and methods for using additive manufacturing for thermal ma...

Heat dissipation device assembly

Data center rack system with integrated liquid and dielectric immer...

Device for transferring heat between a first module and a second mo...

Dynamic exhaust fan operation to improve user experience

Device and method for a two phase heat transfer

Patents Applicationslast 30 patents

VEHICLE DISPLAY DEVICE

VAPOR COLUMNS WITH REDUCED CROSS-SECTIONAL AREA FOR INCREASED AIRFLOW

HEAT DISSIPATION MODULE

HEAT DISSIPATION APPARATUS AND ELECTRONIC DEVICE

Three-Dimensional Meshes and Casings for Thermal Ground Planes

MEMORY SYSTEM THERMAL ISLANDING HEAT ISOLATION

HEAT SINK WITH HEAT PIPE FOR AN ELECTRONIC COMPONENT AND A CORRESPO...

HEAT SINK

HEATPIPE WITH GRADUATED CONDENSER PORTION AND CONSTANT RATIO BETWEE...

COOLING SYSTEM FOR ELECTRONIC COMPONENT RACKS

DUAL-PHASE FLUID HEAT-DISSIPATING ELEMENT AND PRODUCT HAVING THE SAME

VAPOR CHAMBER AND MANUFACTURING METHOD OF THE SAME

SOLID-STATE THERMAL ENERGY STORAGE AND DISSIPATION

THERMALLY CONDUCTIVE MOUNT

LOOP HEAT PIPE, HOUSING ASSEMBLY AND ELECTRONIC DEVICE

COOLING METHOD AND APPARATUS, ESPECIALLY FOR APPLICATION IN THE FIE...

THERMAL MODULE AND JOINING METHOD FOR HERMETICALLY SEALED ENCLOSURE...

ELECTRONIC DEVICE INCLUDING THERMAL DIFFUSION MEMBER

IMMERSION COOLING DEVICE

STORAGE ASSEMBLY AND HEAT DISSIPATION DEVICE

TRANSMISSION ELECTRON MICROSCOPE

THERMAL MANAGEMENT PLANES

CYLINDRICAL AND DIAMOND-SHAPED EVAPORATIVE COOLERS USING HOLLOW FIBERS

ELECTRONIC DEVICE INCLUDING THERMAL DIFFUSION MEMBER

HEAT DISSIPATION DEVICE

Thermal Conduction System for use with a Portable Information Handl...

THERMAL DIFFUSION DEVICE AND ELECTRONIC APPARATUS

Heat Pipes Featuring Coefficient of Thermal Expansion Matching and...

THERMAL DIFFUSION DEVICE AND ELECTRONIC APPARATUS

VAPOR CHAMBER, WICK SHEET FOR VAPOR CHAMBER, AND ELECTRONIC APPARATUS