Heat pipes

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CPC
H05K7/20336

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K7/00Constructional details common to different types of electric apparatus

Current Industry

H05K7/20336Heat pipes

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Thermal management device for circuit breakers
- Patent number 12,171,086
- Issue date Dec 17, 2024
- EATON INTELLIGENT POWER LIMITED
- Ankit Bhagat
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Rack system for housing at least one immersion case
- Patent number 12,167,568
- Issue date Dec 10, 2024
- OVH
- Gregory Francis Louis Bauchart
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Vapor chamber, electronic device, metallic sheet for vapor chamber...
- Patent number 12,167,571
- Issue date Dec 10, 2024
- Dai Nippon Printing Co., Ltd.
- Shinichiro Takahashi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Heatpipe to help reduce radio frequency interference
- Patent number 12,160,216
- Issue date Dec 3, 2024
- Intel Corporation
- Kae-An Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation device
- Patent number 12,158,308
- Issue date Dec 3, 2024
- AURAS TECHNOLOGY CO., LTD.
- Chih-Wei Chen
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Devices, systems, and methods for a hybrid cooling system
- Patent number 12,156,383
- Issue date Nov 26, 2024
- Microsoft Technology Licensing, LLC
- Brandon Earl Gary
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal Interface Material (TIM) filling structure for high warpage...
- Patent number 12,156,324
- Issue date Nov 26, 2024
- Cisco Technology, Inc.
- Yongguo Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Rack system for housing an electronic device
- Patent number 12,156,370
- Issue date Nov 26, 2024
- OVH
- Ali Chehade
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Flexible vapor chamber with shape memory material
- Patent number 12,146,476
- Issue date Nov 19, 2024
- Intel Corporation
- Jeff Ku
- F03 - MACHINES OR ENGINES FOR LIQUIDS WIND, SPRING WEIGHT AND MISCELLANEOUS M...
Information Patent Grant
Cooling device, a receptacle assembly, a system and a printed board...
- Patent number 12,147,084
- Issue date Nov 19, 2024
- Telefonaktiebolaget LM Ericsson (publ)
- Mikkel Myhre
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Immersed cabinet and heat dissipation system thereof
- Patent number 12,150,276
- Issue date Nov 19, 2024
- Dongguan Luxshare Technologies Co., Ltd.
- PengFei Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for using additive manufacturing for thermal ma...
- Patent number 12,150,279
- Issue date Nov 19, 2024
- General Electric Company
- Brian Magann Rush
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Heat dissipation device assembly
- Patent number 12,146,714
- Issue date Nov 19, 2024
- Asia Vital Components Co., Ltd.
- Sheng-Huang Lin
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Data center rack system with integrated liquid and dielectric immer...
- Patent number 12,144,145
- Issue date Nov 12, 2024
- OVH
- Ali Chehade
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Device for transferring heat between a first module and a second mo...
- Patent number 12,136,937
- Issue date Nov 5, 2024
- Huawei Technologies Co., Ltd.
- Fredrik Ohlsson
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Dynamic exhaust fan operation to improve user experience
- Patent number 12,137,535
- Issue date Nov 5, 2024
- Microsoft Technology Licensing, LLC
- Donghwi Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Device and method for a two phase heat transfer
- Patent number 12,130,093
- Issue date Oct 29, 2024
- National University of Singapore
- Poh Seng Lee
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Cooling system and methods
- Patent number 12,133,365
- Issue date Oct 29, 2024
- Shuaib Badat
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Container for one or more electronic devices and methods of use the...
- Patent number 12,120,847
- Issue date Oct 15, 2024
- Engendren LLC
- Alan Paul Meissner
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Vapor chamber and manufacturing method of the same
- Patent number 12,117,244
- Issue date Oct 15, 2024
- Cooler Master Co., Ltd.
- Chi-Lung Chen
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Cooling module and electronic apparatus
- Patent number 12,120,848
- Issue date Oct 15, 2024
- Lenovo (Singapore) Pte. Ltd.
- Hao-Yu Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Heat pipe with in-plane heat spreader and loading mechanism
- Patent number 12,114,466
- Issue date Oct 8, 2024
- Intel Corporation
- Penchala Pratap Binni Boyina
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Heat transfer component reinforcement structure
- Patent number 12,111,113
- Issue date Oct 8, 2024
- Asia Vital Components Co., Ltd.
- Sheng-Huang Lin
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Heat dissipation connection structure of handheld device
- Patent number 12,108,569
- Issue date Oct 1, 2024
- Asia Vital Components Co., Ltd.
- Ching-Hang Shen
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Cooling of power semiconductors
- Patent number 12,107,032
- Issue date Oct 1, 2024
- ABB Schweiz AG
- Colin Tschida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vapor chamber
- Patent number 12,108,570
- Issue date Oct 1, 2024
- Furukawa Electric Co., Ltd.
- Yoshikatsu Inagaki
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Heat exchange system used for heat dissipation of electronic contro...
- Patent number 12,101,911
- Issue date Sep 24, 2024
- SANHUA (HANGZHOU) MICRO CHANNEL HEAT EXCHANGER CO., LTD.
- Xiaoming Ni
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Wearable display device
- Patent number 12,101,919
- Issue date Sep 24, 2024
- Microjet Technology Co., Ltd.
- Hao-Jan Mou
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Cooling device for use in alternating magnetic fields, coil arrange...
- Patent number 12,095,347
- Issue date Sep 17, 2024
- Airbus (S.A.S.)
- Ludovic Ybanez
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Electronic apparatus
- Patent number 12,096,598
- Issue date Sep 17, 2024
- Lenovo (Singapore) Pte. Ltd.
- Kengo Sano
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
SOLID-STATE THERMAL ENERGY STORAGE AND DISSIPATION
- Publication number 20240422943
- Publication date Dec 19, 2024
- U.S. Army DEVCOM, Army Research Laboratory
- Darin J. Sharar
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
THERMALLY CONDUCTIVE MOUNT
- Publication number 20240414894
- Publication date Dec 12, 2024
- SIEMENS AKTIENGESELLSCHAFT
- VOLKER MÜLLER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOOP HEAT PIPE, HOUSING ASSEMBLY AND ELECTRONIC DEVICE
- Publication number 20240407134
- Publication date Dec 5, 2024
- Beijing Xiaomi Mobile Software Co., Ltd.
- Mingyan LIU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COOLING METHOD AND APPARATUS, ESPECIALLY FOR APPLICATION IN THE FIE...
- Publication number 20240397666
- Publication date Nov 28, 2024
- FRESHAPE SA
- Mathieu Rubi
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
THERMAL MODULE AND JOINING METHOD FOR HERMETICALLY SEALED ENCLOSURE...
- Publication number 20240389269
- Publication date Nov 21, 2024
- Apple Inc.
- Anthony J. AIELLO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRONIC DEVICE INCLUDING THERMAL DIFFUSION MEMBER
- Publication number 20240389270
- Publication date Nov 21, 2024
- SAMSUNG ELECTRONICS CO,M LTD.
- Heecheul MOON
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
IMMERSION COOLING DEVICE
- Publication number 20240381587
- Publication date Nov 14, 2024
- Fulian Precision Electronics (Tianjin) Co., LTD.
- TSUNG-LIN LIU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STORAGE ASSEMBLY AND HEAT DISSIPATION DEVICE
- Publication number 20240373590
- Publication date Nov 7, 2024
- Cooler Master Co., Ltd.
- Bo-Zhang CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TRANSMISSION ELECTRON MICROSCOPE
- Publication number 20240373591
- Publication date Nov 7, 2024
- Samsung Electronics Co., Ltd.
- Daesung Moon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MANAGEMENT PLANES
- Publication number 20240369306
- Publication date Nov 7, 2024
- KELVIN THERMAL TECHNOLOGIES, INC.
- Ryan J. Lewis
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
CYLINDRICAL AND DIAMOND-SHAPED EVAPORATIVE COOLERS USING HOLLOW FIBERS
- Publication number 20240373592
- Publication date Nov 7, 2024
- 3M Innovative Properties Company
- Neeraj Sinai Borker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE INCLUDING THERMAL DIFFUSION MEMBER
- Publication number 20240365511
- Publication date Oct 31, 2024
- Samsung Electronics Co., Ltd.
- Heecheul MOON
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Thermal Conduction System for use with a Portable Information Handl...
- Publication number 20240361815
- Publication date Oct 31, 2024
- Dell Products L.P.
- Luke Adams
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HEAT DISSIPATION DEVICE
- Publication number 20240365500
- Publication date Oct 31, 2024
- AURAS Technology Co., Ltd.
- Chih-Wei CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Heat Pipes Featuring Coefficient of Thermal Expansion Matching and...
- Publication number 20240365510
- Publication date Oct 31, 2024
- Kuprion Inc.
- Alfred A. Zinn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL DIFFUSION DEVICE AND ELECTRONIC APPARATUS
- Publication number 20240365512
- Publication date Oct 31, 2024
- Murata Manufacturing Co., Ltd.
- Tatsuhiro NUMOTO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
THERMAL DIFFUSION DEVICE AND ELECTRONIC APPARATUS
- Publication number 20240361084
- Publication date Oct 31, 2024
- Murata Manufacturing Co., Ltd.
- Tatsuhiro NUMOTO
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
VAPOR CHAMBER, WICK SHEET FOR VAPOR CHAMBER, AND ELECTRONIC APPARATUS
- Publication number 20240353182
- Publication date Oct 24, 2024
- DAI NIPPON PRINTING CO., LTD.
- Kazunori ODA
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
METHOD AND APPARATUS FOR A PUMPED LIQUID COOLING SYSTEM USING A PHA...
- Publication number 20240349453
- Publication date Oct 17, 2024
- The Durbin Group, LLC
- Joseph Marsala
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PASSIVE, POROUS, PHASE-CHANGE COLD PLATE
- Publication number 20240341063
- Publication date Oct 10, 2024
- Raytheon Company
- James D. Saraidaridis
- F42 - AMMUNITION BLASTING
Information Patent Application
CONTROLLER WITH COOLING
- Publication number 20240334642
- Publication date Oct 3, 2024
- Eaton Intelligent Power Limited
- Sachin Appasaheb PATIL
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT DISSIPATION DEVICE AND PROCESSING METHOD OF HEAT DISSIPATION D...
- Publication number 20240334652
- Publication date Oct 3, 2024
- CHAMP TECH OPTICAL (FOSHAN) CORPORATION
- MENG FU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VAPOR CHAMBER WITH MICROSTRUCTURE LAYER
- Publication number 20240318921
- Publication date Sep 26, 2024
- Huawei Technologies Co., Ltd
- Xiaobang LIU
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
HEAT DISSIPATION STRUCTURE FOR OPTOELECTRONIC MODULE AND ELECTRONIC...
- Publication number 20240319456
- Publication date Sep 26, 2024
- Ruijie Networks Co., Ltd.
- Xiaolong LV
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Heat Pipe Panel for Solar Panel
- Publication number 20240324145
- Publication date Sep 26, 2024
- Sunowner Inc.
- Dennis Wilson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COOLING SYSTEMS WITH HEAT PIPES FOR ELECTRONIC DEVICES
- Publication number 20240324144
- Publication date Sep 26, 2024
- Intel Corporation
- Juha Tapani Paavola
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRONIC DEVICE WITH BELOW PCB THERMAL MANAGEMENT
- Publication number 20240314919
- Publication date Sep 19, 2024
- ADVANCED MICRO DEVICES, INC.
- Paul Theodore ARTMAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VAPOR CHAMBER SYSTEM
- Publication number 20240302108
- Publication date Sep 12, 2024
- National Tsing-Hua University
- Shwin-Chung Wong
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
THERMAL DIFFUSION DEVICE
- Publication number 20240302105
- Publication date Sep 12, 2024
- Murata Manufacturing Co., Ltd.
- Tatsuhiro NUMOTO
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
INTEGRATED HEAT DISSIPATION MODULE STRUCTURE
- Publication number 20240298425
- Publication date Sep 5, 2024
- TOP RANK TECHNOLOGY LIMITED
- TIEN-LAI WANG
- F28 - HEAT EXCHANGE IN GENERAL

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Thermal management device for circuit breakers

Rack system for housing at least one immersion case

Vapor chamber, electronic device, metallic sheet for vapor chamber...

Heatpipe to help reduce radio frequency interference

Heat dissipation device

Devices, systems, and methods for a hybrid cooling system

Thermal Interface Material (TIM) filling structure for high warpage...

Rack system for housing an electronic device

Flexible vapor chamber with shape memory material

Cooling device, a receptacle assembly, a system and a printed board...

Immersed cabinet and heat dissipation system thereof

Systems and methods for using additive manufacturing for thermal ma...

Heat dissipation device assembly

Data center rack system with integrated liquid and dielectric immer...

Device for transferring heat between a first module and a second mo...

Dynamic exhaust fan operation to improve user experience

Device and method for a two phase heat transfer

Cooling system and methods

Container for one or more electronic devices and methods of use the...

Vapor chamber and manufacturing method of the same

Cooling module and electronic apparatus

Heat pipe with in-plane heat spreader and loading mechanism

Heat transfer component reinforcement structure

Heat dissipation connection structure of handheld device

Cooling of power semiconductors

Vapor chamber

Heat exchange system used for heat dissipation of electronic contro...

Wearable display device

Cooling device for use in alternating magnetic fields, coil arrange...

Electronic apparatus

Patents Applicationslast 30 patents

SOLID-STATE THERMAL ENERGY STORAGE AND DISSIPATION

THERMALLY CONDUCTIVE MOUNT

LOOP HEAT PIPE, HOUSING ASSEMBLY AND ELECTRONIC DEVICE

COOLING METHOD AND APPARATUS, ESPECIALLY FOR APPLICATION IN THE FIE...

THERMAL MODULE AND JOINING METHOD FOR HERMETICALLY SEALED ENCLOSURE...

ELECTRONIC DEVICE INCLUDING THERMAL DIFFUSION MEMBER

IMMERSION COOLING DEVICE

STORAGE ASSEMBLY AND HEAT DISSIPATION DEVICE

TRANSMISSION ELECTRON MICROSCOPE

THERMAL MANAGEMENT PLANES

CYLINDRICAL AND DIAMOND-SHAPED EVAPORATIVE COOLERS USING HOLLOW FIBERS

ELECTRONIC DEVICE INCLUDING THERMAL DIFFUSION MEMBER

Thermal Conduction System for use with a Portable Information Handl...

HEAT DISSIPATION DEVICE

Heat Pipes Featuring Coefficient of Thermal Expansion Matching and...

THERMAL DIFFUSION DEVICE AND ELECTRONIC APPARATUS

THERMAL DIFFUSION DEVICE AND ELECTRONIC APPARATUS

VAPOR CHAMBER, WICK SHEET FOR VAPOR CHAMBER, AND ELECTRONIC APPARATUS

METHOD AND APPARATUS FOR A PUMPED LIQUID COOLING SYSTEM USING A PHA...

PASSIVE, POROUS, PHASE-CHANGE COLD PLATE

CONTROLLER WITH COOLING

HEAT DISSIPATION DEVICE AND PROCESSING METHOD OF HEAT DISSIPATION D...

VAPOR CHAMBER WITH MICROSTRUCTURE LAYER

HEAT DISSIPATION STRUCTURE FOR OPTOELECTRONIC MODULE AND ELECTRONIC...

Heat Pipe Panel for Solar Panel

COOLING SYSTEMS WITH HEAT PIPES FOR ELECTRONIC DEVICES

ELECTRONIC DEVICE WITH BELOW PCB THERMAL MANAGEMENT

VAPOR CHAMBER SYSTEM

THERMAL DIFFUSION DEVICE

INTEGRATED HEAT DISSIPATION MODULE STRUCTURE