This application claims benefit of priority to Japanese Patent Application No. 2020-204053 filed Dec. 9, 2020, the entire content of which is incorporated herein by reference.
The present disclosure relates to a winding-type coil component having a structure in which a wire is wound around a winding core portion, and particularly relates to a connection structure between a wire and a terminal electrode.
As a technique of interest for the present disclosure, for example, there is a technique described in Japanese Patent Application Laid-Open No. 10-312922. Japanese Patent Application Laid-Open No. 10-312922 describes a coil component having a structure in which a wire and a terminal electrode are connected by thermocompression bonding.
As shown in
In a step of performing thermocompression bonding described above, the terminal 8 of the core wire of the wire is arranged on the terminal electrode 4, and in this state, the terminal 8 of the core wire is pushed toward the terminal electrode 4 by a heater chip (not shown). As a result, the terminal 8 of the core wire is crushed so that its section is flat, and is embedded up to a position substantially flush with the surface of the solder affinity material layer 7. In this way, a desired bonding state is obtained between the terminal 8 of the core wire and the terminal electrode 4.
With changes in requirement specifications such as the progress in miniaturization of the core, in diversification of the wire diameter (thickening and thinning), in higher heat resistance of the insulating coating film of the wire, and the like and the increase in load of the reliability test, it has been found that a desired connection state may not be obtained even if the terminal 8 of the core wire and the terminal electrode 4 are connected by thermocompression bonding as described in Japanese Patent Application Laid-Open No. 10-312922 described above. For example, there have been a bonding failure between the terminal 8 of the core wire and the terminal electrode 4, and a disconnection of the core wire near the terminal electrode 4.
It should be noted that a coil component normally includes at least two terminal electrodes, and a terminal of a wire is connected to each of the terminal electrodes. Therefore, although it is ideal that the above-described problem is solved for connection between all the terminal electrodes and the terminals of wires, even if the problem is solved only for connection between one terminal electrode and one terminal of a wire, it should be considered that improvement is made toward solving the problem as compared with a case where no problem is to be solved.
Therefore, the present disclosure provides a coil component in which a bonding failure between a terminal of a core wire of a wire and a terminal electrode is less likely to occur and disconnection of the core wire is less likely to occur.
The present disclosure is directed toward a coil component including a core including a winding core portion extending in an axial direction, and a first flange portion and a second flange portion respectively provided at a first end and a second end opposite to each other in the axial direction of the winding core portion; a first terminal electrode provided in the first flange portion; a second terminal electrode provided in the second flange portion; and at least one wire wound around the winding core portion. The at least one wire includes a core wire made of copper or a copper alloy and an insulating coating film made of resin covering a peripheral surface of the core wire.
The core wire of the wire includes a first terminal electrically connected to the first terminal electrode and a second terminal electrically connected to the second terminal electrode.
Each of the first flange portion and the second flange portion has a bottom surface facing a mounting surface side.
Each of the first terminal electrode and the second terminal electrode includes a nickel-containing layer made of nickel or a nickel alloy, the nickel-containing layer being provided to cover the bottom surface of each of the first flange portion and the second flange portion, and a tin-containing layer made of tin or a tin alloy located on the nickel-containing layer.
Each of the first terminal and the second terminal includes a contact surface in contact with the nickel-containing layer, a pair of side surfaces adjacent to the contact surface, the pair of side surfaces extending in a direction rising from the nickel-containing layer, and a top surface adjacent to the side surfaces, the top surface facing the contact surface.
In the present disclosure, since tin included in the tin-containing layer in the terminal electrode and copper included in the core wire of the wire form an alloy, attention is paid to a phenomenon in which the core wire of the wire is thinned due to diffusion of copper on the wire side into the tin-containing layer of the terminal electrode at a high temperature during thermocompression bonding, for example. Therefore, the side surfaces of at least one of the first terminal and the second terminal have a region not in contact with the tin-containing layer at least on a top surface side.
According to the present disclosure, since the side surface of the terminal of the core wire of the wire has the region not in contact with the tin-containing layer in the terminal electrode at least on the top surface side, diffusion of copper into the tin-containing layer does not occur at least in the region not in contact with the tin-containing layer in the terminal of the core wire. Therefore, for example, inconvenience can be made less likely to occur such as copper contained in the core wire being diffused into the tin-containing layer in the terminal electrode over the whole side surface of the core wire by heat applied at the time of thermocompression bonding or at the time of use of the coil component in a high-temperature environment, and the core wire being thinned. Therefore, a bonding failure between the terminal of the core wire of the wire and the terminal electrode and disconnection of the core wire can be made less likely to occur.
Referring to
The coil component 11 further includes a top plate 16 that connects the pair of flange portions 13 and 14 included in the core 15. When both the core 15 and the top plate 16 are made of a magnetic material, the top plate 16 can constitute a closed magnetic path around which a magnetic flux circles in cooperation with the core 15.
The first flange portion 13 is provided with a first terminal electrode 17 and a third terminal electrode 19. The second flange portion 14 is provided with a second terminal electrode 18 and a fourth terminal electrode 20.
A first wire 21 and a second wire 22 are wound around the winding core portion 12 in directions identical to each other. As shown in an enlarged section of the first wire 21 in
As shown in
The first flange portion 13 has a first bottom surface 23 facing the mounting surface side. The second flange portion 14 has a second bottom surface 24 facing the mounting surface side.
The first terminal electrode 17 is provided on the first bottom surface 23 and is provided so as to extend from the first bottom surface 23 to a part of each of a plurality of surfaces adjacent thereto. The second terminal electrode 18 is provided on the second bottom surface 24 and is provided so as to extend from the second bottom surface 24 to a part of each of a plurality of surfaces adjacent thereto. The first terminal electrode 17 has a first main surface 25 extending along the first bottom surface 23. The second terminal electrode 18 has a second main surface 26 extending along the second bottom surface 24.
The third terminal electrode 19 is provided on the first bottom surface 23 in a state of being separated from the first terminal electrode 17 by a predetermined interval, and is provided so as to extend from the first bottom surface 23 to a part of each of the plurality of surfaces adjacent thereto. The fourth terminal electrode 20 is provided on the second bottom surface 24 in a state of being separated from the second terminal electrode 18 by a predetermined interval, and is provided so as to extend from the second bottom surface 24 to a part of each of the plurality of surfaces adjacent thereto. The third terminal electrode 19 has a third main surface 27 extending along the first bottom surface 23. The fourth terminal electrode 20 has a fourth main surface 28 extending along the second bottom surface 24.
The first terminal electrode 17 includes a baked electrode layer 31 positioned on the first bottom surface 23 of the first flange portion 13 and formed by baking a conductive paste containing, for example, silver as a conductive component, a copper-containing layer 32 formed on the baked electrode layer 31 by wet plating and made of copper or a copper alloy, a nickel-containing layer 33 formed on the copper-containing layer 32 by wet plating and made of nickel or a nickel alloy, and a tin-containing layer 34 formed on the nickel-containing layer 33 by wet plating and made of tin or a tin alloy. The copper-containing layer 32 formed by wet plating mainly provides good conductivity, the nickel-containing layer 33 formed by wet plating mainly provides solder resistance, and the tin-containing layer 34 formed by wet plating mainly has good connectivity with solder and provides affinity for solder.
It should be noted that not only the copper-containing layer 32 but also the baked electrode layer 31 provides good conductivity. Therefore, any one of the copper-containing layer 32 and the baked electrode layer 31 may be omitted. In addition, the copper-containing layer 32, the nickel-containing layer 33, and the tin-containing layer 34 may be formed by a method other than wet plating.
Although not shown, in the portion provided on the part of each of the plurality of surfaces adjacent to the first bottom surface 23 in the first terminal electrode 17, for example, a nickel-chromium layer and a nickel-copper layer on the nickel-chromium layer each of which is formed by dry plating such as sputtering are provided as a base material, and on the nickel-chromium layer and the nickel-copper layer, the above-described copper-containing layer 32, nickel-containing layer 33, and tin-containing layer 34 extend from the first bottom surface 23.
In
Hereinafter, a direction connecting the contact surface 37 and the top surface 40 is defined as a height direction, and a direction connecting the pair of side surfaces 38 and 39 is defined as a width direction.
It is assumed that the core wire 29 having a diameter of, for example, 30 μm is used as the first wire 21. In this case, as a result of thermocompression bonding, a dimension W1 in the width direction of the first terminal 21a of the core wire 29 crushed so as to have a flat section is about 40 μm, that is, shows an increase rate of about +33%. On the other hand, a dimension H1 in the height direction of the first terminal 21a of the core wire 29 is about 15 μm, that is, shows a decrease rate of about −50%.
In addition, as shown in
With the configuration as described above, diffusion of copper into the tin-containing layer 34 does not occur in the region 35 not in contact with at least the tin-containing layer 34 in the first terminal 21a of the core wire 29. Therefore, inconvenience such as the core wire 29 being thinned can be made less likely to occur. On the other hand, since the tin-containing surface by the tin-containing layer 34 having high affinity for solder exists around the first terminal 21a of the first terminal electrode 17, good connectivity of the coil component 11 to a mounting substrate can be maintained.
In addition, since providing the fillet 41 reduces unevenness with reference to the first main surface 25 of the first terminal electrode 17, spreading out of solder paste at the time of mounting the coil component 11 is less likely to be inhibited, and the attitude of the coil component 11 can be less likely to be destabilized.
As illustrated in
The generation of the molten and solidified material 43 described above has the following effects. At the time of thermocompression bonding, as described above, the insulating coating film 30 is melted, and the tin-containing layer 34 is also melted at a portion in contact with the first wire 21 and in the vicinity thereof. At this time, as a thermocompression bonding condition, it is preferable that the temperature is relatively low but that the pressure is relatively high. As a result, tin or a tin alloy constituting the tin-containing layer 34 is melted at the portion in contact with the first wire 21 and in the vicinity thereof, while is pushed away by the molten and solidified material 43 generated by melting the insulating coating film 30. Then, the side surfaces 38 and 39 of the first terminal 21a have the region 35 not in contact with the tin-containing layer 34 at least on the top surface 40 side, and the tin-containing layer 34 forms the fillet 41 in which the dimension in the height direction gradually decreases toward each of the pair of side surfaces 38 and 39 of the first terminal 21a.
It should be noted that although the insulating coating film 30 is melted to generate the molten and solidified material 43, not all the molten resin generated by melting the insulating coating film 30 becomes the molten and solidified material 43, but part of the molten resin may be decomposed and vaporized.
In addition, the top surface 40 of the first terminal 21a is normally exposed to the outside, but the molten and solidified material of the insulating coating film 30 may slightly remain on a part of the top surface 40.
The embodiment shown in
A dimension H2 in the height direction of the region where the fillet 41 is in contact with the side surfaces 38 and 39 of the first terminal 21a is ½ or less of the dimension W1 in the width direction of the first terminal 21a. Thus, even when copper is somewhat consumed by the tin-containing layer 34 on the side surfaces 38 and 39 of the first terminal 21a, the reliability of the electrical connection between the first terminal 21a and the nickel-containing layer 33 can be maintained.
In addition, a dimension H3 in the height direction of a portion excluding the fillet 41 of the tin-containing layer 34 is smaller than the dimension H1 in the height direction of the first terminal 21a. Thus, it is easy to further reduce the dimension H2 in the height direction of the region where the fillet 41 is in contact with the side surfaces 38 and 39 of the first terminal 21a, that is, to further widen the region 35 where the side surfaces 38 and 39 of the first terminal 21a are not in contact with the tin-containing layer 34.
In addition, a dimension W2 in the width direction of an interval between the portion excluding the fillet 41 of the tin-containing layer 34 and the first terminal 21a is smaller than the dimension W1 in the width direction of the first terminal 21a. Since this further reduces unevenness with reference to the first main surface 25 of the first terminal electrode 17, spreading out of solder paste at the time of mounting the coil component 11 is further less likely to be inhibited, and the attitude of the coil component 11 can be further less likely to be destabilized.
In addition, as shown in
Thus, diffusion of copper into the tin-containing layer 34 is less likely to occur in the whole contour of the first terminal 21a, and inconvenience such as thinning of the core wire 29 can be more reliably less likely to occur. In addition, since the tin-containing surface by the tin-containing layer 34 having high affinity for solder exists around the first terminal 21a of the first terminal electrode 17, high connectivity of the coil component 11 to the mounting substrate can be more reliably maintained.
A second embodiment of the present disclosure will be described with reference to
The embodiment shown in
According to this configuration, tin contained in the tin-containing layer 34 does not exist on the whole periphery of the first terminal 21a. Therefore, since it is possible to completely prevent copper contained in the first terminal 21a from being consumed by the tin-containing layer 34, it is possible to maintain a highly reliable connection state between the first wire 21 and the first terminal electrode 17. In addition, in this configuration, the first terminal 21a and the nickel-containing layer 33 are connected to be conductive.
A third embodiment of the present disclosure will be described with reference to
The embodiment shown in
According to this configuration, since the residue 44 of the tin-containing layer 34 has little influence on the diffusion of copper contained in the first terminal 21a, it is possible to expect substantially the same effect as the case of the embodiment shown in
It should be noted that the above-described features shown in
The above description with reference to
Although the present disclosure has been described above with reference to the illustrated embodiments, various other modifications are possible within the scope of the present disclosure.
For example, in the illustrated embodiments, as illustrated in
In addition, in the above case, a fillet may be formed in advance as with the formation of the recess or the opening.
In addition, although the illustrated embodiments relate to the coil component including two wires, the present disclosure can also be applied to a coil component including one wire or three or more wires. Therefore, the number of terminal electrodes can also be changed according to the number of wires.
In addition, the coil component 11 includes the top plate 16 that connects the pair of flange portions 13 and 14, but instead of this, a coating material may be assigned so as to cover the winding core portion 12 and the wires 21 and 22 on the side opposite to the respective bottom surfaces 23 and 24 of the pair of flange portions 13 and 14. As the coating material, a resin containing magnetic powder is preferably used.
In addition, in the coil component 11, both the top plate 16 and the coating material may be omitted.
In addition, each embodiment described in the present specification is exemplary, and partial replacement, or combination, of configurations is possible between different embodiments.
Number | Date | Country | Kind |
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2020-204053 | Dec 2020 | JP | national |