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  • CPC
  • H01F2017/048
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Parent Industries

HELECTRICITY H01Electric elements H01FMAGNETS INDUCTANCES TRANSFORMERS SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES

Current Industry

H01F2017/048with encapsulating core
Industries

Patents Grantslast 30 patents

  • Information Patent Grant

    Coil component
    • Patent number 12,165,801
    • Issue date Dec 10, 2024
    • SAMSUNG ELECTRO-MECHANICS CO., LTD.
    • No Il Park
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Manufacturing method of an integrally formed inductor
    • Patent number 12,148,564
    • Issue date Nov 19, 2024
    • Shenzhen Sunlord Electronics Co., Ltd.
    • Xinshu Yu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Coil device
    • Patent number 12,142,415
    • Issue date Nov 12, 2024
    • TDK Corporation
    • Kyosuke Inui
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Inductor
    • Patent number 12,125,621
    • Issue date Oct 22, 2024
    • Nitto Denko Corporation
    • Keisuke Okumura
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Laminated coil
    • Patent number 12,119,152
    • Issue date Oct 15, 2024
    • Murata Manufacturing Co., Ltd.
    • Shingo Ito
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Inductor component
    • Patent number 12,087,502
    • Issue date Sep 10, 2024
    • Murata Manufacturing Co., Ltd.
    • Yoshimasa Yoshioka
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Coil component and method of manufacturing coil component
    • Patent number 12,073,970
    • Issue date Aug 27, 2024
    • Murata Manufacturing Co., Ltd.
    • Yasuhiro Itani
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Coil-embedded dust core, inductance element, and electric or electr...
    • Patent number 12,073,978
    • Issue date Aug 27, 2024
    • Alps Alpine Co., Ltd.
    • Ryo Nakabayashi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Inductor component
    • Patent number 12,073,982
    • Issue date Aug 27, 2024
    • Murata Manufacturing Co., Ltd.
    • Riku Kanemoto
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Coil component
    • Patent number 12,062,484
    • Issue date Aug 13, 2024
    • SAMSUNG ELECTRO-MECHANICS CO., LTD.
    • Ju Hwan Yang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Chip electronic component and board having the same
    • Patent number 12,062,476
    • Issue date Aug 13, 2024
    • SAMSUNG ELECTRO-MECHANICS CO., LTD.
    • Dong Jin Jeong
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Inductor array component and inductor array component built-in subs...
    • Patent number 12,057,258
    • Issue date Aug 6, 2024
    • Murata Manufacturing Co., Ltd.
    • Yoshimasa Yoshioka
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Coil component
    • Patent number 12,057,249
    • Issue date Aug 6, 2024
    • SAMSUNG ELECTRO-MECHANICS CO., LTD.
    • Hwi Dae Kim
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Coil component
    • Patent number 12,051,535
    • Issue date Jul 30, 2024
    • SAMSUNG ELECTRO-MECHANICS CO., LTD.
    • Dong Hwan Lee
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Coil component and method for manufacturing the same
    • Patent number 12,046,407
    • Issue date Jul 23, 2024
    • SAMSUNG ELECTRO-MECHANICS CO., LTD.
    • Jae Hun Kim
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Coil component
    • Patent number 12,046,411
    • Issue date Jul 23, 2024
    • SAMSUNG ELECTRO-MECHANICS CO., LTD.
    • Jae Wook Lee
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Coil component
    • Patent number 12,033,790
    • Issue date Jul 9, 2024
    • SAMSUNG ELECTRO-MECHANICS CO., LTD.
    • Myoung Soon Park
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Magnetic sheet and coil component using the same
    • Patent number 12,033,786
    • Issue date Jul 9, 2024
    • SAMSUNG ELECTRO-MECHANICS CO., LTD.
    • Young Il Lee
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Inductor component and inductor component embedded substrate
    • Patent number 12,033,789
    • Issue date Jul 9, 2024
    • Murata Manufacturing Co., Ltd.
    • Yoshimasa Yoshioka
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Coil component
    • Patent number 12,020,854
    • Issue date Jun 25, 2024
    • TDK Corporation
    • Hitoshi Ohkubo
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Coil component
    • Patent number 12,020,860
    • Issue date Jun 25, 2024
    • SAMSUNG ELECTRO-MECHANICS CO., LTD.
    • Byung Soo Kang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Inductive device and manufacturing method thereof
    • Patent number 12,020,838
    • Issue date Jun 25, 2024
    • Chilisin Electronics Corp.
    • Chia-Chen Chen
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Coil electronic component
    • Patent number 12,014,866
    • Issue date Jun 18, 2024
    • SAMSUNG ELECTRO-MECHANICS CO., LTD.
    • Young Il Lee
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Magnetic paste
    • Patent number 12,014,854
    • Issue date Jun 18, 2024
    • Ajinomoto Co., Inc.
    • Ichiro Oura
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Coil component
    • Patent number 11,978,579
    • Issue date May 7, 2024
    • Murata Manufacturing Co., Ltd.
    • Kenichi Araki
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Magnetic material and coil component
    • Patent number 11,972,885
    • Issue date Apr 30, 2024
    • Taiyo Yuden Co., Ltd.
    • Kenji Otake
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Coil component and electronic device
    • Patent number 11,961,654
    • Issue date Apr 16, 2024
    • Taiyo Yuden Co., Ltd.
    • Hirotaka Wakabayashi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Inductive component
    • Patent number 11,955,265
    • Issue date Apr 9, 2024
    • Sumida Components & Modules GmbH
    • Martin Grubl
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Coil electronic component
    • Patent number 11,942,257
    • Issue date Mar 26, 2024
    • SAMSUNG ELECTRO-MECHANICS CO., LTD.
    • Jae Hun Kim
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Composite magnetic particle including metal magnetic particle
    • Patent number 11,942,249
    • Issue date Mar 26, 2024
    • Taiyo Yuden Co., Ltd.
    • Atsushi Tanada
    • B22 - CASTING POWDER METALLURGY

Patents Applicationslast 30 patents

  • Information Patent Application

    COIL COMPONENT AND METHOD OF MANUFACTURING COIL COMPONENT
    • Publication number 20240371560
    • Publication date Nov 7, 2024
    • Murata Manufacturing Co., Ltd.
    • Yasuhiro ITANI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PACKAGE SUBSTRATE AND INDUCTOR COMPONENT
    • Publication number 20240355527
    • Publication date Oct 24, 2024
    • Murata Manufacturing Co., Ltd.
    • Kenji NISHIYAMA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COIL COMPONENT AND METHOD FOR MANUFACTURING THE SAME
    • Publication number 20240347259
    • Publication date Oct 17, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Jae Hun KIM
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COIL COMPONENT
    • Publication number 20240312700
    • Publication date Sep 19, 2024
    • TDK Corporation
    • Yuichi OYANAGI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INDUCTOR AND METHOD FOR MANUFACTURING THE SAME
    • Publication number 20240274347
    • Publication date Aug 15, 2024
    • SHENZHEN POCO MAGNETIC CO., LTD.
    • ZHUOQUAN WU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD FOR PRODUCING ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT
    • Publication number 20240266108
    • Publication date Aug 8, 2024
    • TDK Corporation
    • Youichi Kazuta
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INTEGRALLY FORMED INDUCTOR AND MANUFACTURING METHOD THEREFOR
    • Publication number 20240258028
    • Publication date Aug 1, 2024
    • MAZO TECH CO., LTD.
    • Haibo LIU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INDUCTOR
    • Publication number 20240212925
    • Publication date Jun 27, 2024
    • TAI-TECH ADVANCED ELECTRONICS CO., LTD.
    • Hsiang-Chung Yang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    THROUGH-MAGNETIC INDUCTOR
    • Publication number 20240212908
    • Publication date Jun 27, 2024
    • ADVANCED MICRO DEVICES, INC.
    • Robert Grant Spurney
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COIL COMPONENT
    • Publication number 20240186059
    • Publication date Jun 6, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Mi Geum KIM
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COIL COMPONENT
    • Publication number 20240161971
    • Publication date May 16, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Ji Hoon Hwang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INDUCTOR
    • Publication number 20240120139
    • Publication date Apr 11, 2024
    • Murata Manufacturing Co., Ltd.
    • Yasuo SHIMOMURA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COIL COMPONENT
    • Publication number 20240105381
    • Publication date Mar 28, 2024
    • Taiyo Yuden Co., Ltd.
    • Motoki MATSUI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    REACTOR, CONVERTER AND POWER CONVERSION DEVICE
    • Publication number 20240029930
    • Publication date Jan 25, 2024
    • AUTONETWORKS TECHNOLOGIES, LTD.
    • Takehito KOBAYASHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COIL COMPONENT
    • Publication number 20240029944
    • Publication date Jan 25, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Sang Jin KIM
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC COMPONENT
    • Publication number 20240013970
    • Publication date Jan 11, 2024
    • Murata Manufacturing Co., Ltd.
    • Ryuichiro TOMINAGA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INDUCTOR ARRAY COMPONENT AND INDUCTOR ARRAY COMPONENT BUILT-IN SUBS...
    • Publication number 20230420180
    • Publication date Dec 28, 2023
    • Murata Manufacturing Co., Ltd.
    • Yoshimasa YOSHIOKA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COIL COMPONENT AND ADHESIVE FOR COIL COMPONENT
    • Publication number 20230386725
    • Publication date Nov 30, 2023
    • Murata Manufacturing Co., Ltd.
    • Hiroshi Marusawa
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF MAKING A SHIELDED INDUCTOR
    • Publication number 20230343502
    • Publication date Oct 26, 2023
    • Vishay Dale Electronics, LLC
    • Darek Blow
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INDUCTOR COMPONENT
    • Publication number 20230260696
    • Publication date Aug 17, 2023
    • MURATA MANUFACTURING CO., LTD.
    • Yoshimasa Yoshioka
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Method For Manufacturing Electronic Component With Coil
    • Publication number 20230253151
    • Publication date Aug 10, 2023
    • Sumida Corporation
    • Shinichi SAKAMOTO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COIL COMPONENT AND MANUFACTURING METHOD THEREFOR
    • Publication number 20230238170
    • Publication date Jul 27, 2023
    • TDK Corporation
    • Yuuichi KAWAGUCHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC COMPONENT AND METHODS RELATING TO SAME
    • Publication number 20230230753
    • Publication date Jul 20, 2023
    • COILCRAFT, INCORPORATED
    • Andrew Klesyk
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC COMPONENT AND COIL COMPONENT
    • Publication number 20230215617
    • Publication date Jul 6, 2023
    • TDK Corporation
    • Takahiro KAWAHARA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC COMPONENT AND COIL COMPONENT
    • Publication number 20230215618
    • Publication date Jul 6, 2023
    • TDK Corporation
    • Takahiro KAWAHARA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Ferromagnetic Metal-Ferrite Composites for High Frequency Inductor...
    • Publication number 20230207169
    • Publication date Jun 29, 2023
    • Northeastern University
    • Parisa ANDALIB
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COIL COMPONENT
    • Publication number 20230197332
    • Publication date Jun 22, 2023
    • Samsung Electro-Mechanics Co., Ltd.
    • So Young Jun
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COIL COMPONENT AND METHOD OF MANUFACTURING THE COIL COMPONENT
    • Publication number 20230191484
    • Publication date Jun 22, 2023
    • Murata Manufacturing Co., Ltd.
    • Takashi TOMOHIRO
    • B22 - CASTING POWDER METALLURGY
  • Information Patent Application

    Coil Component
    • Publication number 20230187129
    • Publication date Jun 15, 2023
    • Samsung Electro-Mechanics Co., Ltd.
    • Byung Soo KANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COIL COMPONENT
    • Publication number 20230170123
    • Publication date Jun 1, 2023
    • Samsung Electro-Mechanics Co., Ltd.
    • Jae Wook LEE
    • H01 - BASIC ELECTRIC ELEMENTS