This application claims benefit of priority to Korean Patent Application No. 10-2017-0113142 filed on Sep. 5, 2017 in the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety.
The present disclosure relates to a coil component.
In accordance with miniaturization and thinning of electronic devices such as digital televisions (TVs), mobile phones, laptop computers, and the like, demand has developed for the miniaturization and thinning of coil components used in these electronic devices. In order to satisfy such a demand, research and development of various winding type or thin film type coil components have been actively conducted.
A main difficulty in miniaturizing and thinning of the coil components is maintaining characteristics equal to characteristics of an existing coil component in spite of the miniaturization and thinning. In order to satisfy this demand, a sufficient size of a core in which a magnetic material is filled and a low direct current (DC) resistance Rdc generally need to be secured. To this end, development progresses of products having increased aspect ratios of coil patterns and cross-sectional areas of coil portions, such as products made using anisotropic plating technology.
Meanwhile, when the aspect ratio of the coil pattern is increased, stability of the coil pattern needs to be secured in a manufacturing process. When the stability of the coil pattern is decreased, the coil pattern may be bent or may collapse.
An aspect of the present disclosure may provide a coil component including a coil pattern having improved structural stability in spite of having a high aspect ratio.
According to an aspect of the present disclosure, a coil component may include a body, a coil portion embedded in the body and including a coil pattern having trenches formed in surfaces thereof, and external electrodes electrically connected to the coil portion.
A plurality of coil pattern may include a plurality of turns, and trenches in adjacent turns of the coil pattern may be aligned with each other.
Multiple trenches may be formed in different regions of the coil pattern.
The trenches may be disposed at symmetrical locations with respect to a center line of the body.
Alternatively, the trenches may be disposed at asymmetrical locations with respect to a center line of the body.
The coil component may further include a support member supporting the coil portion, and the trench may be formed in a surface of the coil patterns opposing a surface of the coil pattern facing the support member.
Coil patterns may be disposed on opposite surfaces of the support member.
The trenches may be filled with a material constituting the body.
The coil component may further include an insulating layer covering the coil pattern, and the trenches may be filled with a material constituting the insulating layer.
A depth of the trench may be a half or less of a thickness of the coil pattern.
An aspect ratio of the coil pattern may be 3 to 20.
The coil pattern may have a multilayer structure.
According to another aspect of the present disclosure, a coil component may include a support member and a coil disposed on a surface of the support member. The coil includes a plurality of trenches disposed in a surface of the coil facing away from the support member.
The coil may have a thickness measured orthogonally to the surface of the support member, and a width measured orthogonally to the thickness. Each trench of the plurality of trenches may extend through a partial thickness of the coil and through an entire width of the coil.
Each trench of the plurality of trenches may extend through less than half of a thickness of the coil.
The coil may include a plurality of turns disposed on the surface of the support member, and each trench of the plurality of trenches may extend through all turns of the plurality of turns of the coil at locations aligned with each other.
The coil component may include a body formed of a magnetic material dispersed in a resin, the coil may be embedded in the body, and the body may extend into the trenches of the plurality of trenches.
The coil component may include an insulating layer formed of an insulating material, the coil may be embedded in the insulating layer, and the insulating layer may extend into the trenches of the plurality of trenches.
The above and other aspects, features, and advantages of the present disclosure will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings, in which:
Hereinafter, exemplary embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.
Electronic Device
Referring to
In detail, the power inductor 1 may be used to store electricity in a magnetic field form to maintain an output voltage, thereby stabilizing power. In addition, the high frequency (HF) inductor 2 may be used to perform impedance matching to secure a required frequency or cut off noise and/or an alternating current (AC) component. Further, the general bead 3 may be used to remove noise of power and signal lines or remove a high frequency ripple. Further, the bead 4 for a high frequency (GHz) may be used to remove high frequency noise of a signal line and a power line related to an audio. Further, the common mode filter 5 may be used to pass a current therethrough in a differential mode and remove only common mode noise.
An electronic device may be typically a smartphone, but is not limited thereto. The electronic device may also be, for example, a personal digital assistant, a digital video camera, a digital still camera, a network system, a computer, a monitor, a television, a video game, a smartwatch, or the like. The electronic device may also be various other electronic devices, in addition to the devices described above.
Coil Component
Hereinafter, a coil component will be described, particularly an inductor for convenience of explanation. However, the coil component according to the present disclosure may also be used as the coil components for various purposes as described above.
Referring to
The body 101 may include the coil portion 103 and a magnetic material disposed in the vicinity of the coil portion 103. As an example of such a magnetic material, there may be ferrite or metal magnetic particles filled in a resin. In this case, the ferrite may be a material such as Mn—Zn based ferrite, Ni—Zn based ferrite, Ni—Zn—Cu based ferrite, Mn—Mg based ferrite, Ba based ferrite, Li based ferrite, or the like. In addition, the metal magnetic particle may include one or more selected from the group consisting of iron (Fe), silicon (Si), chromium (Cr), aluminum (Al), and nickel (Ni). For example, the metal magnetic particle may be a Fe—Si—B—Cr based amorphous metal, but is not limited thereto. The metal magnetic particle may have a diameter of about 0.1 μm to 30 μm. The body 101 may have a form in which the ferrite or the metal magnetic particles are dispersed in a thermosetting resin such as an epoxy resin, a polyimide resin, or the like.
As illustrated in
The coil portion 103 may be formed in a spiral shape and have a plurality of turns. In detail, the plurality of turns of the coil portion 103 may be formed by connecting a plurality of coil patterns, each having at least one turn, to each other. The coil portion 103 may include lead portions C formed at the outermost portions of the plurality of the turns. The lead portions C may be exposed to the outside of the body 101 for the purpose of electrical connection to the external electrodes 111 and 112. In this case, the lead portions C may be formed to have a thickness smaller than that of other regions of the coil portion 103, that is, regions corresponding to the coil patterns.
The coil pattern may have a shape in which a ratio of a height h to a width w of the coil pattern, that is, an aspect ratio of the coil pattern is high (e.g., h may be larger than w) in order to increase a cross-sectional area of the coil portion 103 within a limited space. For example, a high aspect ratio of the coil pattern may be about 3 to 20 (e.g., h may be 3 to 20 times larger than w). When the aspect ratio of the coil pattern is high, a mask used in a plating process, or the like, needs to have structural stability in order to improve stability of the coil pattern in a manufacturing process. In the present exemplary embodiment, the trenches T may be formed in the surfaces of the coil patterns, and may correspond to regions in which bridges connecting adjacent mask patterns to each other are formed.
The support member 102 supporting the coil portion 103 may be formed of a polypropylene glycol (PPG) substrate, a ferrite substrate, a metal based soft magnetic substrate, or the like. In this case, a through-hole may be formed in a central region of the support member 102, and a magnetic material may be filled in the through-hole to form a core region. The core region may constitute a portion of the body 101. As described above, the core region having a form in which the magnetic material is filled may be formed to improve performance of the coil component 100.
The external electrodes 111 and 112 may be formed on the body 101 to be connected to the lead portions C, respectively. The external electrodes 111 and 112 may be formed of a paste including a metal having excellent electrical conductivity, such as a conductive paste including nickel (Ni), copper (Cu), tin (Sn), or silver (Ag), or alloys thereof. In addition, plating layers (not illustrated) may further be formed on the external electrodes 111 and 112. In this case, the plating layers may include one or more selected from the group consisting of nickel (Ni), copper (Cu), and tin (Sn). For example, nickel (Ni) layers and tin (Sn) layers may be sequentially formed in the plating layers.
As described above, in the present exemplary embodiment, the trenches T may be formed on the surfaces of the coil patterns constituting the coil portion 103. In detail, the trenches T may be formed in surfaces of the coil patterns disposed opposite to surfaces of the coil patterns facing the support member 102, and both of the coil patterns formed on the opposite surfaces of the support member 102 may have the trenches T. A form of the trenches T will be described in more detail. As illustrated in
As described below in connection with processes of manufacturing a coil component, mask patterns having a high aspect ratio may be used in order to manufacture coil patterns having a high aspect ratio by a plating process, or the like. In this case, the mask patterns remain in a partition wall form between void regions in which the coil patterns are formed, and have the high aspect ratio. Because of the high aspect ratio, it is generally difficult to secure structural stability of the mask patterns, such that the coil patterns may be bent or collapse. In the present exemplary embodiment, the bridges that may connect the mask patterns to each other may be formed at upper portions of the mask patterns of the void regions, and the trenches T corresponding to bridge regions may remain in the coil patterns obtained using the mask patterns. Therefore, structural stability of mask patterns and of the formed coil portion 103 to which the trenches T are applied may be improved. Shapes of the trenches T may depend on that of the bridges connecting the mask patterns to each other, and a form, a depth, or the like, of the trenches T may be appropriately controlled in consideration of a structural stability securing function. For example, the depth of the trenches T may be a half or less of a thickness of the coil pattern. When the depth of the trenches T is excessively deep, an electrical resistance of the coil portion 103 may be increased, such that electrical characteristics of the coil component 100 may be deteriorated.
Modified examples will be described with reference to
Next, a coil component according to another exemplary embodiment illustrated in
An example of processes of manufacturing the coil component having the structure described above will hereinafter be described with reference to
First, as illustrated in
Then, as illustrated in
Then, as illustrated in
As described above, the coil patterns constituting the coil portion 103 may have a high aspect ratio so as to have a large cross-sectional area. For example, the coil patterns may have an aspect ratio of about 3 to 20. The coil patterns may have a multilayer structure to have the high aspect ratio as described above. For example, three plating layers 131, 132, and 133 may be sequentially formed by performing a plating process three times. In this case, all of the three plating layers 131, 132, and 133 are not formed by the same plating process or step, but may be formed by an appropriate combination of isotropic plating and anisotropic plating processes.
After the coil patterns are formed, the mask patterns 122 may be removed as shown in
As set forth above, in the coil component according to the exemplary embodiment, even in a case in which the coil patterns have the high aspect ratio, structural stability of the coil patterns may be excellent, such that characteristics and reliability of the coil component may be improved.
While exemplary embodiments have been shown and described above, it will be apparent to those skilled in the art that modifications and variations could be made without departing from the scope of the present invention as defined by the appended claims.
Number | Date | Country | Kind |
---|---|---|---|
10-2017-0113142 | Sep 2017 | KR | national |
Number | Name | Date | Kind |
---|---|---|---|
4494100 | Stengel | Jan 1985 | A |
4794358 | Steingroever | Dec 1988 | A |
5015972 | Cygan | May 1991 | A |
5111169 | Ikeda | May 1992 | A |
5363081 | Bando | Nov 1994 | A |
5369249 | Kwon | Nov 1994 | A |
6002161 | Yamazaki | Dec 1999 | A |
6315914 | Silverbrook | Nov 2001 | B1 |
6380834 | Canzano et al. | Apr 2002 | B1 |
7084728 | Hyvonen | Aug 2006 | B2 |
7948346 | Hebert | May 2011 | B2 |
8193893 | Erturk | Jun 2012 | B2 |
8242872 | Lim | Aug 2012 | B2 |
9142343 | Ohkubo | Sep 2015 | B2 |
9230725 | Erturk | Jan 2016 | B2 |
9894768 | Kim | Feb 2018 | B2 |
10553353 | Vanukuru | Feb 2020 | B2 |
10736214 | Wölfel | Aug 2020 | B2 |
10847298 | Kudo | Nov 2020 | B2 |
20020130751 | Chow | Sep 2002 | A1 |
20080284553 | Lim | Nov 2008 | A1 |
20150155084 | Kim | Jun 2015 | A1 |
20160163444 | Choi et al. | Jun 2016 | A1 |
20160351316 | Ohkubo et al. | Dec 2016 | A1 |
20160357314 | Liu | Dec 2016 | A1 |
20170323851 | Wei | Nov 2017 | A1 |
20180114631 | Ida | Apr 2018 | A1 |
Number | Date | Country |
---|---|---|
105280336 | Jan 2016 | CN |
106486267 | Mar 2017 | CN |
107275058 | Oct 2017 | CN |
107437457 | Dec 2017 | CN |
208796806 | Apr 2019 | CN |
107993791 | May 2020 | CN |
2006-032579 | Feb 2006 | JP |
2016-004928 | Jan 2016 | JP |
2016-225465 | Dec 2016 | JP |
10-1598295 | Feb 2016 | KR |
Entry |
---|
Office Action issued in corresponding Chinese Patent Application No. 201810889025.X dated Oct. 10, 2020, with English translation. |
Korean Office Action issued in corresponding Korean Patent Application No. 10-2017-0113142, dated Sep. 8, 2018, with English Translation. |
Office Action issued in corresponding Chinese Patent Application No. 201810889025.X dated Jun. 7, 2021, with English translation. |
Number | Date | Country | |
---|---|---|---|
20190074126 A1 | Mar 2019 | US |