This application claims benefit of priority to Korean Patent Application No. 10-2017-0136476 filed on Oct. 20, 2017 in the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety.
The present disclosure relates to a coil electronic component and, more particularly, to a high frequency inductor.
Recently, as electronic products have become smaller, thinner, and lighter and have increasingly higher density due to personalization, electronic components installed therein have also become complicated and miniaturized.
Among passive electronic components, a high frequency inductor includes a thin film type inductor, a winding type inductor, and a multilayer type inductor, according to manufacturing methods. Such a thin film type inductor requires a large amount of time and incurs high costs due to a sequential stacking scheme using a dielectric material, and the like, while such a winding type inductor has limitations in manufacturing small devices. The multilayer type inductor is advantageous for manufacturing a very small device and ensures process stability through manufacturing, allowing for interlayer connections, utilizing a batch-stacking method.
Like any other passive electronic components, high frequency inductors require various electric properties such as inductance, a quality (Q) factor, resistance, and the like, and mechanical properties such as rigidity, or the like.
An aspect of the present disclosure may provide a coil electronic component which includes high inductance (L) and low resistance (R), while having a small size.
According to an aspect of the present disclosure, a coil electronic component may include a body including a multilayer structure including outer sheets including outermost coil patterns and a plurality of inner sheets disposed between the outer sheets and including inner coil patterns, and including a first side surface and a second side surface opposing each other in a width direction, an upper surface and a lower surface opposing each other in a thickness direction, and a first end surface and a second end surface opposing each other in a length direction; a first external electrode extending from the lower surface to the first side surface and electrically connected to a coil body of one of the outermost coil patterns; and a second external electrode extending from the lower surface to the second side surface and electrically connected to a coil body of another of the outermost coil patterns. Each of the outermost coil patterns may include a coil body and a corner portion spaced apart from the coil body and exposed to the body. Each of the inner coil patterns may include a coil body and corner portions spaced apart from the coil body and exposed to the body. Each corner portion may have an inner edge facing the coil body, the inner edge having a curved shape or a linear shape.
The above and other aspects, features and other advantages of the present disclosure will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings, in which:
Exemplary embodiments of the present disclosure will now be described in detail with reference to the accompanying drawings.
Hereinafter, a coil electronic component according to an exemplary embodiment in the present disclosure will be described but it is not necessarily limited thereto.
Referring to
The body 1 forms an appearance of the coil electronic component 100. The body 1 may have an upper surface and a lower surface opposing each other in a thickness direction T, a first end surface and a second end surface opposing each other in the length direction L, and a first side surface and a second side surface opposing each other in the width direction W. The body 1 may have a substantially hexahedral shape but is not limited thereto.
The body 1 has a multilayer structure 11 formed by stacking a plurality of sheets, and a stacking direction in which the plurality of sheets are stacked is the width W direction. Each of the plurality of sheets 11a1, 11b1, 11b2, . . . , 11a2 included in the multilayer structure 11 may be an insulating layer in the form of a thin film. The plurality of insulating layers forming the body 1 are in a sintered state and adjacent insulating layers may be integrated such that boundaries therebetween may not be readily apparent without using a scanning electron microscope (SEM).
The sheet is not limited and may include, for example, a known ferrite material or may be formed using a paste obtained by mixing ceramic powder and a resin. The resin may be, for example, polyvinyl butyral (PVB), ethyl cellulose (EC), or an acrylic resin, but, without being limited thereto, a thermosetting resin may also be employed.
Here, it may be sufficient for the sheet to have a thin film form and the sheet may have a thickness ranging from 10 μm to 50 μm, but may not need to be controlled to have a specific thickness. If the thickness of the sheet is less than 10 μm, it may be not be stable to print a coil pattern on the sheet, and if the thickness of the sheet is more than 50 μm, a problem of residues may frequently arise in the process of stacking a plurality of layers, forming a via hole, filling the via hole, and the like.
A coil pattern (or an electrically conductive pattern) is printed on each sheet. The coil patterns may be divided into an outermost coil pattern 12a1 directly connected to the first external electrode 21, an outermost coil pattern 12a2 directly connected to the second external electrode 22, and inner coil patterns 12b1, 12b2, . . . disposed between the outermost coil patterns. The outermost coil patterns 12a1 and 12a2 and the inner coil patterns 12b1, 12b2, . . . are connected through a via, constituting at least one coil having an overall spiral shape. A direction C of a core center of the coil is parallel to a direction in which the plurality of sheets are stacked.
The coil pattern is formed of a conductive metal layer having a predetermined thickness on the sheet. The coil pattern including corner portions if the coil pattern is an inner coil pattern, or the coil pattern including corner portions and an extending portion if the coil pattern is an outermost coil pattern, may be formed by printing a conductive paste. A material contained in the conductive paste is not limited as long as it is a metal having excellent electrical conductivity. For example, the material may include at least one of silver (Ag), palladium (Pd), aluminum (Al), copper (Cu), nickel (Ni), and the like.
The external electrodes 21 and 22 may be connected to the outermost coil patterns 12a1 and 12a2 so that the coil may be electrically conducted to an external electronic component. The external electrodes 21 and 22 may be disposed on the lower surface and the first end surface of the body 1 or on the lower surface and the second end surface of the body 1, having an overall L shape, but is not limited thereto.
For example, both the first and second external electrodes 21 and 22 may be disposed only on the lower surface of the body 1 to constitute bottom electrodes. In case where the first and second external electrodes are formed as bottom electrodes, loss of eddy current caused by the external electrodes formed on the first and second end surfaces and a self-resonant frequency (SRF) degradation of a high frequency inductor due to stray capacitance between the coil and the external electrodes may be prevented. However, in the case of the bottom electrodes, it is difficult to inspect mounting when the coil component is mounted on a printed circuit board (PCB), or the like, and coupling force between an internal coil and external electrodes is relatively weak.
Therefore, the first and second external electrodes 21 and 22 of the coil electronic component of
In the outermost coil pattern 12a1, one of the corner portions 122b1 may be connected to the extension portion 121a1 and the other of the corner portions 122b1 may be spaced-apart from the remaining portion of the coil pattern 12a1. In the outermost coil pattern 12a2, one of the corner portions 122b1 may be connected to the extension portion 121a2 and the other of the corner portions 122b1 may be spaced-apart from the remaining portion of the coil pattern 12a2. By contrast, on a same inner sheet, both corner portions may be spaced apart from the remaining portion of an inner coil pattern (to be described hereinafter). This is because the first and second external electrodes 21 and 22 and the coil body may be electrically conducted through the lead portions 121a1 and 121a2 and the respective corner portions 122b1.
The outermost coil pattern and the inner coil pattern have the substantially same structure, except that whether the lead portion is present and that sectional areas of the patterns are different.
Referring to
The first coil pattern 121b1 is for constituting a coil body, and as an area of the core center is increased, an inductance value may be increased. In this case, since an overall chip size of the coil electronic component cannot be increased infinitely, it is necessary to control the structure of the second coil patterns 122b1 printed on the same sheet on which the first coil pattern 121b1 is printed. Among edges of the second coil pattern 122b1 of
Meanwhile, even without changing the area of the central portion of the first coil pattern 121b1, electrical characteristics of a quality (Q) factor and Rs characteristics may be enhanced by controlling a shape of the second coil pattern 122b1 with respect to a determined area of the core center. In detail, Table 1 below shows that, in the case of the structure of the first and second coil patterns illustrated in
Meanwhile, a degree of concaveness of the inner edge of the second coil pattern may be appropriately designed by a person skilled in the art. A radius of curvature X of the inner edge of the second coil pattern may be adjusted within a range of 100% to 1000% of a longest edge Y of the other edges of the second coil pattern. If the radius of curvature is smaller than 100% of the length of the other edges of the second coil pattern, physical adhesion between the second coil pattern and the external electrode may not be sufficiently secured, and if it is larger than 1000%, there may be a limitation in controlling process facilities.
Further, edges other than the inner edge of the second coil pattern may be adjusted within a range of 20 μm or more and 150 μm or less. Since the length of the edge of the second coil pattern must be determined in consideration of the overall size of the sheet on which the second coil pattern (or the corner portion) is printed, a numerical range of the length of the edge limits an appropriate length of the edge which may be derived when the recently required chip size is taken into consideration. In this case, the length of the exterior edge of the second coil pattern may be appropriately set, but the length of the exterior edge extending in the thickness direction of the body or the length of the exterior edge extending in the length direction of the body may be shorter than a length of the external electrode in contact therewith and extending in the thickness direction or the length direction of the body. If the length of the exterior edge of the second coil pattern is longer than the external electrode so the external electrode cannot entirely cover the corner of the second coil pattern, reliability of a product may be problematic.
Next,
Referring to
When the second coil pattern 2212b1 is formed as a triangle, a shortest distance between the first and second coil patterns may be increased and the area of the internal core formed by the first coil pattern may be sufficiently secured, as compared with the related art high frequency inductor in which the second coil pattern has an L shape. As a result, parasitic capacitance of the coil electronic component may be reduced to improve the Q factor and the possibility of increasing the inductance value may also be increased.
Referring to
When the above-described coil electronic components 100 and 200 are used, a high frequency inductor having excellent electrical properties of inductance, Q value, R value and excellent mechanical properties relating to bonding between the external electrodes and the coil may be provided. By changing the shape of the second coil pattern in direct contact with the external electrodes, a sufficient electrode distance may be secured to reduce the R value and a room for increasing the inner area of the first coil pattern forming the coil body may be secured to realize inductance of high capacity. Further, by relatively increasing the area of the second coil pattern which is physically in direct contact with the external electrode in the outer sheet among the plurality of sheets, mechanical strength of the chip may be sufficiently ensured.
As set forth above, according to exemplary embodiments of the present disclosure, the high-frequency inductor having both electromagnetic characteristics of high inductance and a reduced resistance value and mechanical characteristics of mechanical rigidity, as required electromagnetic and mechanical characteristics, may be provided.
While exemplary embodiments have been shown and described above, it will be apparent to those skilled in the art that modifications and variations could be made without departing from the scope of the present invention as defined by the appended claims.
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Office Action issued in corresponding Korean Patent Application No. 10-2017-0136476 dated Feb. 15, 2022, with English translation. |
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