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with a special conductive pattern

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  • CPC
  • H01F2017/0073
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HELECTRICITY H01Electric elements H01FMAGNETS INDUCTANCES TRANSFORMERS SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES

Current Industry

H01F2017/0073with a special conductive pattern
Industries

Patents Grantslast 30 patents

  • Information Patent Grant

    Planar coil and transformer, wireless electric power transmission d...
    • Patent number 12,205,740
    • Issue date Jan 21, 2025
    • Kyocera Corporation
    • Takeshi Muneishi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Bi-plane wireless power transmission pad
    • Patent number RE50259
    • Issue date Jan 7, 2025
    • Wireless Advanced Vehicle Electrification, LLC
    • Patrice Lethellier
  • Information Patent Grant

    Circuit board
    • Patent number 12,177,978
    • Issue date Dec 24, 2024
    • Toppan Printing Co., Ltd.
    • Jun Onohara
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Common-mode choke coil
    • Patent number 12,131,854
    • Issue date Oct 29, 2024
    • Murata Manufacturing Co., Ltd.
    • Kouhei Matsuura
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Laminated coil
    • Patent number 12,119,152
    • Issue date Oct 15, 2024
    • Murata Manufacturing Co., Ltd.
    • Shingo Ito
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Active shield structure
    • Patent number 12,114,471
    • Issue date Oct 8, 2024
    • ARM Limited
    • Narayan Prasad Ramachandran
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Grant

    Coil component
    • Patent number 12,112,873
    • Issue date Oct 8, 2024
    • TDK Corporation
    • Hidenori Tsutsui
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Coil component
    • Patent number 12,080,471
    • Issue date Sep 3, 2024
    • TDK Corporation
    • Junichiro Urabe
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Microcoil element, array-type microcoil element and device
    • Patent number 12,073,967
    • Issue date Aug 27, 2024
    • SOUNDS GREAT CO., LTD.
    • Hong-Da Zhou
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Chip electronic component and board having the same
    • Patent number 12,062,476
    • Issue date Aug 13, 2024
    • SAMSUNG ELECTRO-MECHANICS CO., LTD.
    • Dong Jin Jeong
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Three dimensional (3D) vertical spiral inductor and transformer
    • Patent number 12,051,534
    • Issue date Jul 30, 2024
    • QUALCOMM Incorporated
    • Xia Li
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Stacked inductor device
    • Patent number 12,046,403
    • Issue date Jul 23, 2024
    • Realtek Semiconductor Corporation
    • Hsiao-Tsung Yen
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Electronic component
    • Patent number 12,033,788
    • Issue date Jul 9, 2024
    • Murata Manufacturing Co., Ltd.
    • Yuta Shimoda
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Inductor device
    • Patent number 12,027,298
    • Issue date Jul 2, 2024
    • Realtek Semiconductor Corporation
    • Hsiao-Tsung Yen
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Electronic component
    • Patent number 11,961,653
    • Issue date Apr 16, 2024
    • Murata Manufacturing Co., Ltd.
    • Yuta Shimoda
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Inductor device
    • Patent number 11,942,258
    • Issue date Mar 26, 2024
    • Realtek Semiconductor Corporation
    • Hsiao-Tsung Yen
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Inductor device
    • Patent number 11,915,848
    • Issue date Feb 27, 2024
    • Realtek Semiconductor Corporation
    • Hsiao-Tsung Yen
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Broadband induction
    • Patent number 11,908,617
    • Issue date Feb 20, 2024
    • 3D GLASS SOLUTIONS, INC.
    • Jeb H. Flemming
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Switching power supply device
    • Patent number 11,909,310
    • Issue date Feb 20, 2024
    • Murata Manufacturing Co., Ltd.
    • Tatsuya Hosotani
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Coil component
    • Patent number 11,842,844
    • Issue date Dec 12, 2023
    • TDK Corporation
    • Junichiro Urabe
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Planar coil element and method for producing planar coil element
    • Patent number 11,785,724
    • Issue date Oct 10, 2023
    • SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
    • Hiroshi Ueda
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Tapered multipath inductors
    • Patent number 11,783,990
    • Issue date Oct 10, 2023
    • NXP B.V.
    • Thomas Jan Hoen
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Inductor
    • Patent number 11,728,084
    • Issue date Aug 15, 2023
    • Murata Manufacturing Co., Ltd.
    • Yasunari Nakashima
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Inductor structure
    • Patent number 11,699,550
    • Issue date Jul 11, 2023
    • Realtek Semiconductor Corporation
    • Hsiao-Tsung Yen
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Inductor device
    • Patent number 11,694,835
    • Issue date Jul 4, 2023
    • Realtek Semiconductor Corporation
    • Hsiao-Tsung Yen
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Inductor device
    • Patent number 11,682,518
    • Issue date Jun 20, 2023
    • Realtek Semiconductor Corporation
    • Chieh-Pin Chang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Electronic component
    • Patent number 11,664,152
    • Issue date May 30, 2023
    • Murata Manufacturing Co., Ltd.
    • Yuta Shimoda
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Coil component
    • Patent number 11,636,971
    • Issue date Apr 25, 2023
    • SAMSUNG ELECTRO-MECHANICS CO., LTD.
    • Ye Eun Jung
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    8-shaped inductive coil device
    • Patent number 11,631,517
    • Issue date Apr 18, 2023
    • Realtek Semiconductor Corporation
    • Hsiao-Tsung Yen
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Electronic component
    • Patent number 11,610,709
    • Issue date Mar 21, 2023
    • TDK Corporation
    • Yuto Shiga
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    COIL COMPONENT
    • Publication number 20250022645
    • Publication date Jan 16, 2025
    • TDK Corporation
    • Tomohiro MORIKI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Active Shield Structure
    • Publication number 20250016968
    • Publication date Jan 9, 2025
    • ARM Limited
    • Narayan Prasad Ramachandran
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    COMPOSITE ELEMENT
    • Publication number 20240396515
    • Publication date Nov 28, 2024
    • MODA-INNOCHIPS CO., LTD.
    • Myung Ho LEE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INDUCTOR COMPONENT AND INDUCTOR ARRAY
    • Publication number 20240355537
    • Publication date Oct 24, 2024
    • Murata Manufacturing Co., Ltd.
    • Yoshimitsu USHIMI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COIL COMPONENT
    • Publication number 20240331911
    • Publication date Oct 3, 2024
    • TDK Corporation
    • Yusuke Nagai
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INSULATION CHIP AND SIGNAL TRANSMISSION DEVICE
    • Publication number 20240331932
    • Publication date Oct 3, 2024
    • Rohm Co., Ltd.
    • Keiji WADA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTILAYER INDUCTOR
    • Publication number 20240312687
    • Publication date Sep 19, 2024
    • TDK Corporation
    • Takahiro Yata
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INDUCTOR DEVICE
    • Publication number 20240312691
    • Publication date Sep 19, 2024
    • REALTEK SEMICONDUCTOR CORPORATION
    • Hsiao-Tsung YEN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTILAYER-TYPE ON-CHIP INDUCTOR STRUCTURE
    • Publication number 20240266283
    • Publication date Aug 8, 2024
    • VIA Labs, INC.
    • Sheng-Yuan Lee
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COIL COMPONENT AND CIRCUIT BOARD
    • Publication number 20240258020
    • Publication date Aug 1, 2024
    • Taiyo Yuden Co., Ltd.
    • Daiki Mimura
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INDUCTOR DEVICE
    • Publication number 20240203638
    • Publication date Jun 20, 2024
    • REALTEK SEMICONDUCTOR CORPORATION
    • Cheng-Wei LUO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INDUCTOR COMPONENT
    • Publication number 20240194396
    • Publication date Jun 13, 2024
    • Murata Manufacturing Co., Ltd.
    • Shoto KAWAMURA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTILAYER INDUCTOR COMPONENT
    • Publication number 20240170201
    • Publication date May 23, 2024
    • Murata Manufacturing Co., Ltd.
    • Shoto Kawamura
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
    • Publication number 20240161957
    • Publication date May 16, 2024
    • PHOENIX PIONEER TECHNOLOGY CO., LTD.
    • Pao-Hung Chou
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20240105761
    • Publication date Mar 28, 2024
    • RENESAS ELECTRONICS CORPORATION
    • Takayuki IGARASHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PASSIVE DEVICES IN BONDING LAYERS
    • Publication number 20240088026
    • Publication date Mar 14, 2024
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Yi Ching Ong
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    STACKED MAGNETIC COMPOUND MOLDED INTEGRATED ISOLATION TRANSFORMER
    • Publication number 20240038429
    • Publication date Feb 1, 2024
    • TEXAS INSTRUMENTS INCORPORATED
    • Yi Yan
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT
    • Publication number 20240021364
    • Publication date Jan 18, 2024
    • Murata Manufacturing Co., Ltd.
    • Keisuke KUNIMORI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE INCLUDING PAD PATTERN
    • Publication number 20240008265
    • Publication date Jan 4, 2024
    • Samsung Electronics Co., Ltd.
    • Jaepil Lee
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT
    • Publication number 20230386733
    • Publication date Nov 30, 2023
    • Murata Manufacturing Co., Ltd.
    • Hiromitsu ITO
    • C03 - GLASS MINERAL OR SLAG WOOL
  • Information Patent Application

    ELECTRONIC COMPONENT, METHOD OF MANUFACTURING ELECTRONIC COMPONENT,...
    • Publication number 20230352227
    • Publication date Nov 2, 2023
    • Murata Manufacturing Co., Ltd.
    • Tomoyoshi HIEI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Broadband Induction
    • Publication number 20230352238
    • Publication date Nov 2, 2023
    • 3D GLASS SOLUTIONS, INC
    • Jeb H. Flemming
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COIL COMPONENT AND MANUFACTURING METHOD THEREFOR
    • Publication number 20230352233
    • Publication date Nov 2, 2023
    • TDK Corporation
    • Masanori SUZUKI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MAGNETIC ELEMENT AND CIRCUIT BOARD INCLUDING SAME
    • Publication number 20230343505
    • Publication date Oct 26, 2023
    • LG Innotek Co., Ltd.
    • Yong Hwan KIM
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COIL WITH NON-UNIFORM TRACE
    • Publication number 20230307166
    • Publication date Sep 28, 2023
    • DSBJ PTE. LTD.
    • Soheil SAADAT
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INDUCTOR DEVICE
    • Publication number 20230298796
    • Publication date Sep 21, 2023
    • REALTEK SEMICONDUCTOR CORPORATION
    • Hsiao-Tsung YEN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Inductor Inlay for a Component Carrier and a Method of Manufacturin...
    • Publication number 20230298808
    • Publication date Sep 21, 2023
    • AT&S Austria Technologie & Systemtechnik AG
    • Gerald Weis
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COMMON MODE FILTER AND TERMINAL DEVICE
    • Publication number 20230298797
    • Publication date Sep 21, 2023
    • Huawei Technologies Co., Ltd
    • Kaikai CHEN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MANUFACTURING METHOD OF INDUCTOR AND MANUFACTURING METHOD OF ELECTR...
    • Publication number 20230253150
    • Publication date Aug 10, 2023
    • FUJIFILM CORPORATION
    • Tatsuo MIKAMI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COIL COMPONENT AND WIRELESS POWER TRANSMISSION DEVICE HAVING THE SAME
    • Publication number 20230253830
    • Publication date Aug 10, 2023
    • TDK Corporation
    • Takuya YOSHIDA
    • H01 - BASIC ELECTRIC ELEMENTS