COIL ELEMENT ASSEMBLY, COIL MODULE, AND METHOD FOR MANUFACTURING THE SAME

Abstract

A coil module includes a coil conductor including a plurality of coil elements and a plurality of wire electrodes disposed on a circuit board, each of the plurality of coil elements including a pair of leg portions and a bridge portion connecting one end portions of the pair of leg portions together, the plurality of coil elements being disposed to cross a winding axis. A method for manufacturing the coil module includes an assembly forming step of integrating the plurality of coil elements with resin to form a coil element assembly, and a conductor forming step of mounting the coil element assembly on the circuit board to complete the coil conductor wound about the winding axis. In the conductor forming step, the resin is introduced into a die set in which the plurality of coil elements are arranged to form a block, to thus form the coil element assembly.

Description

BACKGROUND OF THE DISCLOSURE

Field of the Disclosure

The present disclosure relates to a method for manufacturing a coil element assembly that is mounted on a circuit board to form a coil conductor, and a method for manufacturing a coil module including the coil element assembly, and a coil element assembly and a coil module manufactured by these methods.

Description of the Related Art

A coil module including a circuit board and coils as illustrated in FIG. 5 is known thus far. This coil module 100 includes a circuit board 101, an annular coil core 102 mounted on an upper surface 101a of the circuit board 101, and coil conductors 103, which are helically wound around the coil core 102. Each coil conductor 103 includes multiple coil pins 103a disposed across the coil core 102 and having a substantially letter-U shape, and multiple wire electrodes (not illustrated) on a lower surface 101b of the circuit board 101. Support bodies 104 are disposed at positions where the coil pins 103a cross the coil core 102. Each support body 104 has a recess 104a that allows the coil core 102 to be fitted therein and multiple through-holes 104b for positioning the coil pins 103a. The circuit board 101 has through-holes 105 into which the tips of leg portions of the coil pins 103a are insertable. In this coil module 100, the tip of each coil pin 103a is inserted into the corresponding one of the through-holes 105 to protrude from the lower surface 101b of the circuit board 101, and the tip of each coil pin 103a is bonded with solder to an end portion of the corresponding one of the wire electrodes to form the coil conductor 103 that is helically wound around the coil core 102.

• PTL 1: Japanese Unexamined Patent Application Publication No. 1-302809

BRIEF SUMMARY OF THE DISCLOSURE

However, the existing coil module 100 involves forming of the through-holes 104b in the support bodies 104 and forming of the through-holes 105 in the circuit board 101, and thus costs for manufacturing a coil module increase. Inserting the coil pins 103a into the through-holes 104b involves many processes, including alignment of the coil pins 103a, and thus causes an increase of the manufacturing costs.

The through-holes 104b are generally formed by laser processing or drilling. To form separate through-holes 104b, the through-holes 104b adjacent to each other need to be spaced at a pitch of a predetermined size or larger. This structure prevents the arrangement of the coil pins 103a at a narrower pitch or the size reduction of the coil module 100. To stably insert the coil pins 103a into the through-holes 104b, the through-holes 104b need to have a larger diameter than the coil pin 103a, that is, the through-holes 104b need to have play. This play may degrade the positioning accuracy of the coil pins 103a, such as tilting of the coil pins 103a, and degrade the coil characteristics such as frequency characteristics. The degradation of the positioning accuracy of the coil pins 103a may reduce the yield when the coil pins 103a are mounted on the circuit board 101 with solder.

The present disclosure has been made to address the above problem, and aims to provide a coil element assembly and a coil module that are inexpensive and have preferable characteristics, and a method for manufacturing the same.

To achieve the above, the present disclosure provides a method for manufacturing a coil element assembly that includes a coil conductor including a plurality of coil elements, each of the coil elements including a pair of leg portions and a bridge portion connecting end portions of the pair of leg portions together. The method includes an assembly forming step of forming the coil element assembly by integrating the plurality of coil elements together with resin. In the assembly forming step, the coil element assembly is formed by introducing resin into a die set, in which the plurality of coil elements are arranged, to form a block.

In this structure, an assembly (coil element assembly) of coil elements constituting a part of a coil conductor is formed by introducing resin into a die set, in which multiple coil elements are arranged, to form a block. Unlike an existing structure, this structure does not involve forming of through-holes in the block to arrange and fix the coil elements, so that the coil element assembly can be manufactured at low costs. In addition, the block having no through-holes allows the coil elements to be arranged at a narrower pitch. In addition, this structure does not degrade the positioning accuracy due to the play of the through-holes, such as tilting of the coil elements. The coil elements that do not tilt improve the mount yield of the coil element assembly.

To achieve the above, the present disclosure provides a method for manufacturing a coil module that includes a coil conductor including a plurality of coil elements and a plurality of wire electrodes formed on a circuit board, each of the coil elements including a pair of leg portions and a bridge portion connecting end portions of the pair of leg portions together. The method includes an assembly forming step of forming the coil element assembly by integrating the plurality of coil elements together with resin, and a conductor forming step of mounting the coil element assembly on the circuit board to complete the coil conductor wound about a predetermined winding axis. In the assembly forming step, the coil element assembly is formed by introducing resin into a die set, in which the plurality of coil elements are arranged, to form a block.

This structure does not involve forming of through-holes in the block to arrange and fix the coil elements, so that the coil module can be manufactured at low costs. In addition, this structure does not degrade the positioning accuracy due to the play of the through-holes, such as tilting of the coil elements. Thus, a coil module having preferable coil characteristics can be manufactured.

To achieve the above, the present disclosure provides a coil element assembly that includes a plurality of coil elements each including a pair of leg portions and a bridge portion connecting first end portions of the pair of leg portions together, the coil elements being disposed to cross a predetermined winding axis, and a block made of resin and fixing the plurality of coil elements arranged along the winding axis. The resin of the block is disposed between the pairs of leg portions of the plurality of coil elements. Second end portions of the pair of leg portions of each of the plurality of coil elements are connected to predetermined wire electrodes disposed on a circuit board to form a coil conductor that is wound about the predetermined winding axis.

In this structure, multiple coil elements constituting a part of a coil conductor is fixed in the block, and thus are prevented from being short-circuited with each other. Resin is filled in a space between both leg portions and the bridge portion of the block, and thus the coil element assembly can enhance its strength.

Part of the pair of leg portions of each of the plurality of coil elements may be exposed through the block.

In this structure, the arrangement of coil elements in a coil element assembly can be easily inspected.

The pair of leg portions of each of the plurality of coil elements may have the second end portions bent in a direction parallel to the main surface of the circuit board.

In this structure, a connection area between the coil elements and the circuit board can be easily increased to mount the coil element assembly on the circuit board. Thus, the element assembly can enhance its connection reliability, and the coil element assembly can improve its mount yield.

To achieve the above, the present disclosure provides a coil module that includes a circuit board and a coil conductor wound about a predetermined winding axis. The coil conductor includes a plurality of coil elements, each of which includes a pair of leg portions and a bridge portion that connects end portions of the pair of leg portions, the plurality of coil elements being disposed to cross the predetermined winding axis, and a plurality of wire electrodes disposed on the circuit board. The plurality of coil elements are fixed with a resin-made block while being arranged along the winding axis to form a coil element assembly. Resin of the block is disposed between the pair of leg portions of each of the plurality of coil elements.

In this structure, multiple coil elements constituting a part of the coil conductor are fixed in the block, and thus can be prevented from being short-circuited with each other. Thus, a coil module having high coil characteristics can be provided.

According to the present disclosure, to form a coil element assembly constituting a part of a coil conductor, resin is introduced in a die set, in which multiple coil elements are arranged, to form a block. This procedure does not involve forming of through-holes in a block to allow the coil elements to be arranged or fixed thereto, unlike in the existing procedure. Thus, the coil module can be manufactured at low costs. In addition, the block having no through-holes allows the coil elements to be arranged at a narrower pitch. In addition, this procedure does not degrade the positioning accuracy due to the play of the through-holes, such as tilting of the coil elements. Thus, a coil module having preferable coil characteristics can be manufactured. The coil elements that do not tilt improve the mount yield of the coil element assembly.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

FIG. 1 illustrates a coil module according to an embodiment of the present disclosure.

FIG. 2 is a cross-sectional view of a coil element of FIG. 1.

FIG. 3 is a perspective view of a coil element assembly of FIG. 1.

Each of FIGS. 4A and 4B illustrates a layout of a wire electrode of FIG. 1.

FIG. 5 is an exploded perspective view of an existing coil module.

DETAILED DESCRIPTION OF THE DISCLOSURE

A coil module 1 according to an embodiment of the present disclosure will be described with reference to FIG. 1 to FIGS. 4A and 4B. FIG. 1 is a perspective view of a coil module 1, FIG. 2 is a cross-sectional view of a coil element, FIG. 3 is a perspective view of a coil element assembly, and FIGS. 4A and 4B illustrate layouts of wire electrodes on the top surface and the back surface of a circuit board.

As illustrated in FIG. 1, a coil module 1 according to the present embodiment includes a circuit board 2, multiple coil element assemblies 3 and a component 4 mounted on an upper surface 2a of the circuit board 2, and a sealing resin layer 5 that seals the coil element assembly 3 and the component 4. Together with multiple coil elements 6a and multiple wire electrodes 7a (refer to FIG. 4A) disposed on the upper surface 2a of the circuit board 2, the coil module 1 according to the present embodiment forms a coil conductor 6 that is wound about a winding axis WA. This coil conductor 6 functions as an antenna and is used as an antenna module for radio-frequency identification (RFID).

The circuit board 2 is formed from, for example, a glass epoxy substrate or a ceramic substrate (for example, low temperature co-fired ceramic substrate, or LTCC substrate), and multiple wire electrodes 7a and 7b are laid out as illustrated in FIGS. 4A and 4B on an upper surface 2a and a lower surface 2b of the circuit board 2. The wire electrodes 7a and 7b are made of a material typically used for wire electrodes, such as Cu, Al, or Au.

The component 4 is formed from a semiconductor device made of a semiconductor such as Si or GaAs, or a chip component such as a chip inductor, a chip capacitor, or a chip resistor. The component 4 is mounted on the circuit board 2 by a typical surface mount technology such as soldering.

The coil conductor 6 includes multiple wire electrodes 7a disposed on the upper surface 2a of the circuit board 2, and the multiple coil elements 6a, constituting a part of the coil element assembly 3. Specifically, when the coil element assemblies 3 are mounted on the upper surface 2a of the circuit board 2, the wire electrodes 7a and substrate connection portions 6a3 (described later) of the respective coil elements 6a are connected together to form the coil conductor 6 that is helically wound about the winding axis WA. In the coil element assembly 3, the multiple coil elements 6a are integrated together with a resin-made block 8.

The coil elements 6a have the same shape. Specifically, as illustrated in FIG. 2, each coil element 6a has a pair of leg portions 6al, disposed substantially parallel to each other, and a bridge portion 6a2, which connects first end portions of both leg portions 6al, and substrate connection portions 6a3, formed by bending the tips of second end portions of both leg portions 6al substantially 90°.

The block 8 functions as a medium for fixing the coil elements 6a into an array. As illustrated in FIG. 3, a portion of the block 8 surrounded by both leg portions 6al and the bridge portion 6a2 of each coil element 6a is formed by being filled with resin. Specifically, the block 8 has no recess for accommodating the coil core, and has a portion surrounded by both leg portions 6al and the bridge portion 6a2 filled with resin. Both leg portions 6al of each coil element 6a are exposed from side surfaces 8a of the block 8 (refer to FIG. 3). The block 8 can be formed by, for example, thermoplastic resin such as a liquid crystal polymer, or thermosetting resin.

The coil elements 6a are fixed to the block 8 with both leg portions 6al and the bridge portion 6a2 disposed at such positions as to cross the winding axis WA. Specifically, in the state where the coil element assemblies 3 are mounted on the circuit board 2, the coil elements 6a are arranged in the direction parallel to the winding axis WA and fixed while each having one of the leg portions 6al disposed on one side of the winding axis WA of the coil conductor 6 and the other leg portion 6al disposed on the other side of the winding axis WA (refer to FIG. 1 and FIG. 3). The substrate connection portions 6a3 of the coil elements 6a are left without being covered with the block 8, and serve as connection portions when the coil element assemblies 3 are mounted on the circuit board 2.

Each wire electrode 7a disposed on the upper surface 2a of the circuit board 2 is paired with the corresponding one of the coil elements 6a. Each wire electrode 7a connects the substrate connection portion 6a3 connected to a first one of the leg portions 6al of the paired coil element 6a, and the substrate connection portion 6a3 connected to a second one of the leg portions 6al of a coil element 6a adjacent to the paired coil element 6a. This connection structure between the coil elements 6a and the wire electrodes 7a forms a coil conductor 6 that is wound about the winding axis WA.

The sealing resin layer 5 seals the coil element assemblies 3 and the component 4, and is stacked on the upper surface 2a of the circuit board 2. The sealing resin layer 5 is made of general sealing resin such as epoxy resin.

(Method for Manufacturing Coil Module)

A method for manufacturing a coil module 1 will be described below. Each coil element 6a is formed by subjecting one metal plate (such as a Cu plate) to a cutting process and a bending process. Specifically, one metal plate is cut into a shape where the coil elements 6a (before being bent) are arranged equidistantly and parallel to each other.

Then, each coil element 6a subjecting to the cutting process is bent to form the pair of leg portions 6al, the bridge portion 6a2, and the substrate connection portions 6a3.

Subsequently, while the coil elements 6a subjected to the bending process are arranged in a die set having the shape corresponding to the shape of the block 8, resin is introduced into the die set to form the block 8, and to thus form the coil element assembly 3. At this time, a part of the leg portions 6a1, a part of the bridge portion 6a2, and the substrate connection portions 6a3 of each coil element 6a are exposed without being covered with the block 8 (refer to FIG. 3). Resin is filled in a space surrounded by the leg portions 6al and the bridge portions 6a2 to form the block 8.

Subsequently, the coil element assemblies 3 are mounted on the upper surface 2a of the circuit board 2 to complete the coil module 1. At this time, the substrate connection portions 6a3 of each coil element 6a are connected with solder to the end portions of the corresponding wire electrodes 7a to form the coil conductor 6 helically wound about the winding axis WA. The circuit board 2 can be formed by a general method for forming a circuit board. The procedure of mounting the coil element assemblies 3 and the component 4 on the circuit board 2 may be performed in any order; the coil element assembly 3 may be mounted after the component 4 is mounted, or the component 4 may be mounted after the coil element assemblies 3 are mounted.

Thus, in the above embodiment, to form an assembly (coil element assembly 3) of the coil elements 6a constituting a part of the coil conductor 6, resin is introduced into the die set, in which the multiple coil elements 6a are arranged, to form the block 8. This procedure can omit forming of through-holes in the block to allow the coil elements to be arranged or fixed thereto, unlike in the existing procedure, and thus the coil module 1 can be manufactured at lower costs. In a structure where the support body 104 has the through-holes 104b, as in the existing coil module 100 (refer to FIG. 5), the through-holes 104b need to be spaced apart at a predetermined distance or longer to prevent adjacent through-holes 104b from connecting to each other. Thus, the pitch between the through-holes 104b cannot be narrowed beyond a certain limit. In the coil module 1 according to the present embodiment, on the other hand, the coil elements 6a can be arranged at a narrower pitch since the block 8 (corresponding to “the support body 104” in an existing technology) has no through-holes. In addition, unlike the existing coil module 100 (refer to FIG. 5), the coil module 1 according to the present embodiment does not degrade the positioning accuracy due to the play of the through-holes 104b, such as tilting of the coil elements 6a. Thus, the coil module 1 having preferable coil characteristics can be manufactured. The coil elements 6a that stand without being tilted improve the mount yield of the coil element assembly 3.

Each of the coil elements 6a has the substrate connection portions 6a3 formed by bending the tips of the second end portions of both leg portions 6al by 90°. Compared to a structure where the coil elements 6a are connected to the circuit board 2 without having the tips of the second end portions of both leg portions 6al bent, the contact area between themselves and the circuit board 2 increases. This structure can thus improve the reliability in connection between the coil element assembly 3 and the circuit board 2, and improve the mount yield of the coil element assembly 3.

The present disclosure is not limited to the above-described embodiments, and can be changed in various different manners other than the above without departing from the gist of the disclosure.

For example, each coil element 6a may have any shape, such as a letter-U shape, that can form a helical coil conductor.

The present disclosure is widely applicable to various types of coil modules including a coil conductor partially formed from a wire electrode of a circuit board.

• • 1 coil module
  • 2 circuit board
  • 3 coil element assembly
  • 4 component
  • 6 coil conductor
  • 6a coil element
  • 6a1 leg portion
  • 6a2 bridge portion
  • 7a, 7b wire electrode
  • 8 block

Claims

1. A radio-frequency identification (RFID) module comprising: a circuit board, anda semiconductor device mounted on the circuit board, anda coil conductor including a coil element assembly and a plurality of wire electrodes disposed on the circuit board, whereinthe coil element assembly includes: a plurality of coil elements each including a pair of leg portions and a bridge portion connecting first end portions of the pair of leg portions together, the coil elements being disposed to cross a predetermined winding axis; anda block comprising a resin and fixing the plurality of coil elements arranged along the winding axis,wherein the resin of the block is disposed between the pairs of leg portions of the plurality of coil elements,wherein second end portions of the pair of leg portions of each of the plurality of coil elements are connected to predetermined wire electrodes disposed on a circuit board to form a coil conductor wound about the predetermined winding axis, andthe coil conductor functions as an antenna for radio-frequency identification.

2. The RFID module according to claim 1, wherein a part of the pair of leg portions of each of the plurality of coil elements is exposed through the block.

3. The RFID module according to claim 1, wherein the second end portions of the pair of leg portions of each of the plurality of coil elements are bent in a direction parallel to the bridge portion.

4. The RFID module according to claim 1, wherein an entire space surrounded by the pair of leg portions and the bridge portion except for the second end portions is filled with the resin of the block.

5. The RFID module according to claim 1, further comprising a sealing resin layer sealing the coil element assembly and the semiconductor device.