1. Field
The present application relates to thermal management, and more particularly, to micro-scale cooling devices that use electrohydrodynamic (EHD, also known as electro-fluid-dynamic, EFD) technology to generate ions and electrical fields to control the movement of fluids, such as air, as part of a thermal management solution to dissipate heat.
2. Related Art
In general, electrohydrodynamic (EHD) technology uses corona discharge principles to move fluids (e.g., air molecules). Basic principles of EHD fluid flow are reasonably well understood by persons of skill in the art. Accordingly, a brief illustration of corona discharge principles in a simple two electrode system sets the stage for the more detailed description that follows.
With reference to the illustration in
Devices built using the principle of the ionic movement of a fluid are variously referred to in the literature as ionic wind machines, electric wind machines, corona wind pumps, electrostatic air accelerators, electro-fluid-dynamics (EFD) devices, electrostatic fluid accelerators (EFA), electrohydrodynamic (EHD) thrusters and EHD gas pumps. Some aspects of the technology have also been exploited in devices referred to as electrostatic air cleaners or electrostatic precipitators.
In the present application, embodiments of the devices illustrated and described herein are referred to as electrohydrodynamic fluid accelerator devices, also referred to in an abbreviated manner herein as “EHD devices”, and are utilized as a component in a thermal management solution to dissipate heat generated by an electronic circuit.
EHD devices may be employed to motivate flow of air in a thermal management system, such as when employed to exhaust heat dissipated by integrated circuits in computing devices and electronics. For example, in devices such as laptop computers, compact scale, flexible form factor and absence of moving parts can provide design and user advantages over conventional forced air cooling technologies that rely exclusively on fans or blowers. EHD device solutions can operate silently (or at least comparatively so) with reduced volume and mass. In some cases, products incorporating EHD device solutions may be thinner and lighter than those employing conventional forced air cooling technologies. Flexible form factors of EHD devices can facilitate compelling product designs and, in some cases, may provide functional benefits.
It has been discovered that, in some EHD device configurations, a fluid-permeable ion collection surface may be provided to promote development of a generally uniform electric field distributed over downstream ion collection surfaces. Accordingly, in some embodiments of the present invention, an apparatus includes an emitter electrode and a collector-radiator assembly including a fluid permeable ion collection surface and an array of heat transfer surfaces extending downstream of the emitter electrode. The fluid permeable ion collection surface spans a major dimension of the heat transfer surface array. The emitter electrode and the collector-radiator assembly are energizable to motivate fluid along a flow path through the fluid permeable ion collection surface and over the heat transfer surfaces of the collector-radiator assembly.
In some embodiments, the fluid permeable ion collection surface is conformal with leading portions of the heat transfer surfaces. In some cases, the fluid permeable ion collection surface is electrically and thermally coupled to the heat transfer surfaces. In some cases, the fluid permeable ion collection surface is electrically isolated from the heat transfer surfaces. In some cases, the fluid permeable ion collection surface is conformal with leading surfaces of a support structure mated with the heat transfer surface array to define the collector-radiator assembly. In some cases, such a support structure includes additional ion collection surfaces downstream of the fluid permeable ion collection surface. In some cases, the fluid permeable ion collection surface presents a curved leading profile displaced from the emitter electrode.
In some embodiments, the fluid permeable ion collection surface includes a mesh or grid, a generally smooth perforated surface, or a spaced apart array of strips or surface portions. In some embodiments, the fluid permeable ion collection surface is at least partially formed of an at least partially conductive material, a metal or a carbon fiber or carbon fiber containing material.
In some embodiments, a fluid permeable ion collection surface presents, at least on surfaces exposed to substantial ion bombardment, a surface comprised of gold (Au) over nickel (Ni), NiPd over Ni or silver (Ag), silver oxide (Ag2O), an oxide of manganese or an ozone catalytic or reactive material. In some embodiments, a fluid permeable ion collection surface includes, at least on surfaces exposed to substantial ion bombardment, a surface coating that includes an electroplate over injection-molded UL94-VO compliant thermoplastic; an electroplate over die-cast zinc (Zn) or zinc alloy; an electroplated, anodized or alodized die-cast aluminum (Al), aluminum alloy or magnesium (Mg) alloy; or an electroplate over powder injection-molded metal.
In some embodiments, the heat transfer surfaces of the collector-radiator assembly include spaced apart, generally planar portions extending in a direction generally parallel to the flow path. In some embodiments, the emitter electrode has a longitudinal extent than spans a major dimension of the collector-radiator assembly and the generally planar portions of the heat transfer surfaces are oriented generally orthogonally to the longitudinal extent of the emitter electrode. In some embodiments, the planar portions of the heat transfer surfaces are oriented such that the leading portions thereof are generally parallel to a longitudinal extent of the emitter electrode.
In some embodiments, the fluid permeable ion collection surface includes at least a portion positioned upstream of the emitter electrode. In some embodiments, the emitter electrode and the collector-radiator assembly are operatively coupled between terminals of a high voltage source to establish a corona discharge therebetween and to thereby motivate the fluid along the flow path. In some embodiments, the apparatus is disposed in a flow path for ventilating an enclosure and thereby cooling one or more devices within the enclosure, wherein at least the heat transfer surfaces of the collector-radiator assembly are thermally coupled into a heat transfer path from the devices.
It has been further discovered that, in some EHD device configurations, ion collection surfaces may extend upstream of an emitter electrode so as to at least partially surround the emitter. In some cases, such a configuration may protect the emitter from mechanical intrusions and/or human contact with a high voltage emitter. In some cases, such a configuration may tend to shield other electrical components from unwanted electric fields and ion bombardment. In some cases, surface conditioning or coating of upstream surfaces may facilitate accumulation and retention of a surface charge that tends to repel ions from the upstream surfaces.
Accordingly, in some embodiments of the present invention, an apparatus includes an array of generally planar collector electrodes wherein at least a substantial subset thereof include respective hollows defined therein. The apparatus further includes an emitter electrode having a longitudinal extent spanning a major dimension of the collector electrode array and positioned relative to individual ones of the collector electrodes such that the emitter electrode passes through the respective hollows and such that, when the emitter and collector electrodes are energized, generated ions motivate fluid flow in a generally downstream direction toward and past dominant ion collecting surfaces of the collector electrodes that are nearest the emitter electrode. For at least the substantial subset of collector electrodes that include respective hollows, at least some ion collecting surfaces extend upstream of the emitter electrode.
In some embodiments, at least some of the hollows are holes defining ion collecting surfaces that fully surround the emitter electrode. In some embodiments, the hollows define at least a partial Faraday cage around the emitter electrode. In some embodiments, the apparatus is configured as a thermal management assembly wherein collector electrodes constitute convective heat transfer surfaces. In some embodiments, the apparatus is configured as a thermal management assembly, wherein the motivated fluid flow is over at least some convective heat transfer surfaces distinct from the collector electrodes. In some embodiments, the emitter electrode and the collector electrodes operatively coupled between terminals of a high voltage source to establish a corona discharge therebetween and to thereby motivate the fluid in the downstream direction.
In some embodiments, the apparatus further includes at least one additional emitter electrode that also passes through the respective hollows. In some embodiments, the apparatus further includes an additional hollow defined in the respective ones of the collector electrodes and an additional emitter electrode that passes through the additional hollows.
In some embodiments, dominant ion collecting surfaces of the collector electrodes present the emitter electrode with generally curved profiles proximate thereto. In some embodiments, at least the dominant ion collecting surfaces present a surface comprised of gold (Au) over nickel (Ni), NiPd over Ni or silver (Ag), silver oxide (Ag2O), an oxide of manganese or an ozone catalytic or reactive material. In some embodiments, at least some portions of the collector electrodes other than the dominant ion collecting surfaces are coated with MnO2 or another ozone catalytic or reactive material. In some embodiments, the collector electrodes are formed as an electroplate over injection-molded UL94-VO compliant thermoplastic, an electroplate over die-cast zinc (Zn) or zinc alloy, an electroplated, anodized or alodized die-cast aluminum (Al), aluminum alloy or magnesium (Mg) alloy; or an electroplate over powder injection-molded metal.
In some embodiments, the apparatus is disposed in a flow path for ventilating an enclosure and thereby cooling one or more devices within the enclosure, wherein convective heat transfer surfaces are thermally coupled into a heat transfer path from the devices and wherein the motivated fluid flow is over the convective heat transfer surfaces. In some cases, the convective heat transfer surfaces include surfaces of the collector electrodes.
It has been further discovered that, in some EHD device configurations, ion collection surfaces most closely proximate to an emitter electrode may be preferentially conditioned or coated with a highly-resistive surface. In this way, electrical fields may be advantageously shaped and spark limiting or quenching mechanisms may be provided while still facilitating efficient heat transfer at other downstream surfaces. In some cases, surface conditioning or coating of upstream surfaces may be insulative so as to facilitate accumulation and retention of a surface charge that tends to repel ions from the upstream surfaces.
Accordingly, in some embodiments of the present invention, an apparatus includes an array of collector electrodes and an emitter electrode having a longitudinal extent spanning a major dimension of the collector electrode array and positioned relative to the collector electrodes such that, when the emitter and collector electrodes are energized, generated ions motivate fluid flow in a generally downstream direction toward and past leading surfaces of the collector electrodes that are proximate the emitter electrode. Leading surfaces of the collector electrodes, but not further surfaces downstream of the leading surfaces, are conditioned with a resistive material. In some cases, the resistive material conditioning includes a coating applied to the leading surfaces of the collector electrodes.
In some embodiments, the collector electrodes include spaced apart, generally planar portions that include the downstream surfaces not conditioned with the resistive material, the generally planar portions extending in the downstream direction. In some embodiments, the generally planar portions are oriented such that the leading surfaces thereof are generally parallel to the longitudinal extent of the emitter electrode. In some embodiments, the resistive material conditioned leading surfaces of respective of the collector electrodes are positioned, relative to one another, to present the emitter electrode with a generally curved array of the leading surfaces. In some embodiments, the generally planar portions are oriented generally orthogonally to the longitudinal extent of the emitter electrode. In some embodiments, the resistive material conditioned leading surfaces of individual ones of the collector electrodes present the emitter electrode with a generally curved profile.
In some embodiments, individual ones of the collector electrodes include respective hollows defined in the generally planar portions thereof and the emitter electrode passes through the respective hollows such that, when the emitter and collector electrodes are energized, a dominant portion of ion flow is toward downstream portions of the resistive material conditioned leading surfaces that are closest the emitter electrode. In some cases, the resistive material conditioned leading surfaces of individual ones of the collector electrodes substantially surround the emitter electrode. In some cases, the apparatus includes an additional emitter electrode that also passes through the respective hollows. In some cases, the apparatus includes an additional hollow defined in the generally planar portions of the collector electrodes and an additional emitter electrode that passes through the additional hollows.
In some embodiments, the apparatus is configured as a thermal management assembly, wherein the collector electrodes constitute convective heat transfer surfaces. In some embodiments, the apparatus is configured as a thermal management assembly, wherein the motivated fluid flow is over at least some convective heat transfer surfaces distinct from the collector electrodes. In some embodiments, the emitter electrode and the collector electrodes are operatively coupled between terminals of a high voltage source to establish a corona discharge therebetween and to thereby motivate the fluid in the downstream direction.
In some embodiments, the apparatus is disposed in a flow path for ventilating an enclosure and thereby cooling one or more devices within the enclosure, wherein convective heat transfer surfaces are thermally coupled into a heat transfer path from the devices, and wherein the motivated fluid flow is over the convective heat transfer surfaces. In some embodiments, the convective heat transfer surfaces include surfaces of the collector electrodes downstream from the resistive material conditioned leading surfaces thereof.
Building on the foregoing, we present a variety of embodiments. In some embodiments, collector electrodes of the EHD device are themselves thermally coupled to a heat source such that at least some surfaces thereof act as fins of a heat exchanger. In some embodiments, the EHD device motivates flow of a fluid (typically air) past a heat exchanger that is thermally integrated with the collector electrodes. In some embodiments, multiple EHD device instances are ganged and/or staged so as to increase volume of flow, pressure or both. These and other embodiments will be understood with reference to the description that follows and with respect to the appended claims.
The description of illustrative embodiments will be understood when read in connection with the accompanying drawings. Drawings are not necessarily to scale; emphasis has instead been placed upon illustrating the structural and fabrication principles of the described embodiments.
Use of the same reference symbols in different drawings indicates similar or identical items.
Some embodiments of thermal management systems described herein employ EHD devices to motivate flow of a fluid, typically air, based on acceleration of ions generated as a result of corona discharge. Other embodiments may employ other ion generation techniques and will nonetheless be understood in the descriptive context provided herein. Using heat transfer surfaces that may or may not be monolithic or integrated with collector electrodes, heat dissipated by electronics (e.g., microprocessors, graphics units, etc.) and/or other components can be transferred to the fluid flow and exhausted. Typically, when a thermal management system is integrated into an operational environment, heat transfer paths (often implemented as heat pipes or using other technologies) are provided to transfer heat from where it is dissipated (or generated) to a location (or locations) within the enclosure where air flow motivated by an EHD device (or devices) flows over heat transfer surfaces. Of course, while some embodiments may be fully integrated in an operational system such as a laptop or desktop computer, a projector or video display device, etc., other embodiments may take the form of subassemblies.
Often, heat transfer surfaces and dominant ion collecting surfaces of a collector electrode can present differing design challenges and, relative to some embodiments, may be provided using different structures or with different surface conditioning. In some embodiments, a monolithic structure may act as a collector electrode and provide heat transfer surfaces. In some embodiments, collector electrodes and dominant heat transfer surfaces are provided (or at least fabricated) as separate structures that may be mated, integrate or more generally proximate each other in operational configurations. These and other variations will be understood even with respect to embodiments described, for simplicity, with collector electrode assemblies that include portions that operate as ion collection surfaces and as heat transfer surfaces.
In general, a variety of scales, geometries and other design variations are envisioned for collector electrodes and/or the dominant ion collection surfaces that functionally constitute a collector electrode, together with a variety of positional interrelationships between corona discharge and collector electrodes of a given EHD device. For concreteness of description, we focus on certain illustrative embodiments and certain illustrative surface profiles and positional interrelationships with other components. For example, in much of the description herein, plural planar collector electrodes are arranged in a parallel, spaced-apart array proximate to a corona discharge wire that is displaced from leading surfaces of the respective collector electrodes. In some embodiments, planar portions of the collector electrodes are oriented generally orthogonally to the longitudinal extent of a corona discharge wire. In other embodiments, orientation of collector electrodes is such that leading surfaces thereof are generally parallel to the longitudinal extent of a corona discharge wire.
In some embodiments, a fluid permeable ion collection surface is provided that is conformal with and electrically coupled to leading surfaces of an array of collector electrodes. In some embodiments, such a fluid permeable ion collection surface is conformal with leading surfaces of support structure that need not participate substantially in ion collection. In some embodiments, such a fluid permeable ion collection surface may be electrically isolated from downstream heat transfer surfaces.
In some embodiments, leading surfaces (whether of collector electrodes of an array or fluid permeable ion collection surfaces) present a curved arrangement or profile to a corona discharge electrode (or electrodes). In some embodiments, leading surfaces present other (e.g., non-curved) arrangements or profiles to a corona discharge electrode (or electrodes). In some thermal management system embodiments, collector electrodes provide significant heat transfer to fluid flows motivated therethrough or thereover. In some thermal management system embodiments, heat transfer surfaces that do not participate substantially in EHD fluid acceleration may provide substantial, even dominant, heat transfer.
It will be understood that particular EHD design variations are included for purposes of illustration and, persons of ordinary skill in the art will appreciate a broad range of design variations consistent with the description herein. In some cases, and particularly in the illustration of flow paths, EHD designs are illustrated simply as a corona discharge electrode assembly and a collector electrode assembly proximate each other; nonetheless, such illustrations within the broad context of a full range of EHD design variations are described herein.
Although embodiments of the present invention are not limited thereto, much of the description herein is consistent with geometries, air flows, and heat transfer paths typical of laptop-type computer electronics and will be understood in view of that descriptive context. Of course, the described embodiments are merely illustrative and, notwithstanding the particular context in which any particular embodiment is introduced, persons of ordinary skill in the art having benefit of the present description will appreciate a wide range of design variations and exploitations for the developed techniques and configurations. Indeed, EHD device technologies present significant opportunities for adapting structures, geometries, scale, flow paths, controls and placement to meet thermal management challenges in a wide range of applications and systems. Moreover, reference to particular materials, dimensions, electrical field strengths, exciting voltages, currents and/or waveforms, packaging or form factors, thermal conditions, loads or heat transfer conditions and/or system designs or applications is merely illustrative. In view of the foregoing and without limitation on the range of designs encompassed within the scope of the appended claims, we now describe certain illustrative embodiments.
Basic principals of electrohydrodynamic (EHD) fluid flow are well understood in the art and, in this regard, an article by Jewell-Larsen, N. et al., entitled “Modeling of corona-induced electrohydrodynamic flow with COMSOL multiphysics” (in the Proceedings of the ESA Annual Meeting on Electrostatics 2008) (hereafter, “the Jewell-Larsen Modeling article”), provides a useful summary. Likewise, U.S. Pat. No. 6,504,308, filed Oct. 14, 1999, naming Krichtafovitch et al. and entitled “Electrostatic Fluid Accelerator” describes certain electrode and high voltage power supply configurations useful in some EHD devices. U.S. Pat. No. 6,504,308, together with sections I (Introduction), II (Background), and III (Numerical Modeling) of the Jewell-Larsen Modeling article are hereby incorporated by reference herein for all that they teach.
Note that the simple illustration of corona-induced electrohydrodynamic fluid flow shown in
EHD device embodiments described herein include one or more corona discharge electrodes. In general, such corona discharge electrodes include a portion that exhibits a small radius of curvature and may take the form of a wire or rod or edge. Other shapes for the corona discharge electrode are also possible; for example, the corona discharge electrode may take the shape of barbed wire, wide metallic strips, and serrated plates or non-serrated plates having sharp or thin parts that facilitate ion production at the portion of the electrode with the small radius of curvature when high voltage is applied. In general, corona discharge electrodes may be fabricated in a wide range of materials. For example, in some embodiments, compositions such as described in U.S. Pat. No. 7,157,704, filed Dec. 2, 2003, entitled “Corona Discharge Electrode and Method of Operating the Same” and naming Krichtafovitch et al. as inventors may be employed. U.S. Pat. No. 7,157,704 is incorporated herein for the limited purpose of describing materials for some corona discharge electrodes that may be employed in some embodiments. In general, a high voltage power supply creates the electric field between corona discharge electrodes and collector electrodes.
EHD device embodiments described herein include ion collection surfaces positioned downstream of one or more corona discharge electrodes. Often such ion collection surfaces include leading surfaces of generally planar collector electrodes extending downstream of the corona discharge electrode(s). In some cases, a fluid permeable ion collection surface is provided. In some cases, such a fluid permeable ion collection surface is disposed at leading edges of, and electrically connected to, generally planar collector electrodes that extend downstream of the corona discharge electrode. In general, a collector electrode (and/or fluid permeable ion collection surfaces described herein) may be fabricated of any suitable metal material, such as aluminum or copper.
As disclosed in U.S. Pat. No. 6,919,698 to Krichtafovitch, collector electrodes (referred to therein as “accelerating” electrodes) may be formed in aerodynamically “friendly” shapes that provide a low coefficient of drag for the fluid (air). As further disclosed in the '698 patent, collector electrodes may be made of a body of high resistivity material that readily conducts a corona current, but for which a result voltage drop along current paths through the body of high resistivity collector electrode material provides a reduction of surface potential, thereby damping or limiting an incipient sparking event. Examples of such relatively high resistance materials include carbon filled plastic, silicon, gallium arsenide, indium phosphide, boron nitride, silicon carbide, and cadmium selenide. U.S. Pat. No. 6,919,698 is incorporated herein for the limited purpose of describing materials for some collector electrodes that may be employed in some embodiments. Note that in some embodiments described herein, a surface conditioning or coating of high resistivity material (as contrasted with bulk high resistivity) may be employed.
Typically, configurations described and illustrated herein include an array of collector electrodes (and/or fluid permeable surfaces) that constitute the dominant ion collection surfaces during EHD device operations. The number of, and distances between, such collector electrodes and surfaces shown (as shown in the Figures) is merely exemplary and generally not to scale. Indeed, numbers and distances may vary from what is shown according to device specifications and the type of fluid being moved. The distance between a corona discharge electrode and a collector electrode is referred to as the “gap” or “air gap” (see, e.g., gap 102 in
Although not shown in the Figures that illustrate the embodiments herein, a high voltage power supply is electrically connected to, and creates the electric field between, the corona discharge electrode and the collector electrode, generating an ion stream that moves ambient fluid toward the collector electrode.
EHD device embodiments described herein may be implemented in a repeated adjacent plural configuration in order, for example, to improve fluid flow efficiency, or to fit into a specific space within an enclosure. Likewise, embodiments of EHD devices described herein may also be implemented in combination with a different embodiment of an EHD device in a plural adjacent configuration. In addition, while not illustrated and described herein, it is understood that any one of the embodiments of the EHD devices described herein may also be implemented in a plural configuration in which two or more individual EHD devices of the type described herein are sequentially disposed along a desired fluid flow direction. Each individual EHD device may then be referred to as a stage, and the entire configuration is referred to as a multi-stage EHD device. In operation, each individual EHD device stage may be operated simultaneously and synchronously with the others in order to produce increased volume and pressure of fluid flow in the desired direction, thereby sequentially accelerating a fluid through the multiple stages. Synchronous operation of a multi-stage EHD device is defined herein to mean that a single power supply, or multiple synchronized and phase-controlled power supplies, provide high voltage power to each EHD device stage such that both the phase and amplitude of the electric power applied to the same type of electrodes in each stage (i.e., the corona discharge electrodes or the collector electrodes) are aligned in time. U.S. Pat. No. 6,727,657, entitled “Electrostatic Fluid Accelerator for and a Method of Controlling a Fluid Flow” provides a discussion of the configuration and operation of several embodiments of a multi-stage EHD device, including computing an effective inter-stage distance and exemplary designs for a high voltage power supply for powering neighboring EHD device stages with respective synchronous and syn-phased voltages. U.S. Pat. No. 6,727,657 is incorporated by reference herein in its entirety for all that it teaches.
Embodiments of EHD devices illustrated herein may be used to dissipate heat from a thermal source housed in an enclosure, as part of a thermal management system. The thermal management system may further comprise one or more additional elements that efficiently transports heat generated by the thermal source to the collector electrode component of the EHD device, thereby heating the collector electrode component. The operational EHD device causes a substantial amount of the fluid entering the enclosure that houses the thermal source to generally follow along a fluid flow path through or over the heated collector electrode component and then exit the enclosure, thereby dissipating heat accumulating in the air above and in the vicinity of the EHD device, and in particular, the collector electrode component.
As a preliminary matter, the front perspective views of the embodiments of EHD devices and collector electrode arrays illustrated herein are situated in a three-dimensional coordinate system 101 (
When EHD device 200 is operational, the EHD forces generated between corona discharge electrode 110 and collector electrode array 120 force fluid in the direction of arrow 130, through fluid-permeable element 240 and between the collector electrodes. The presence of fluid-permeable element 240 promotes the development of a uniform electric field at the forward leading edges 215 of the collector electrode structure, which in turn reduces the electric field strength at these leading edges 215. The reduced electric field strength in this portion of the collector electrode structure may reduce the probability of back corona or arcing originating from leading edges 215. The presence of a uniform electric field at the collector electrodes may in turn cause a more uniform discharge of ions from all portions of corona discharge electrode 110 resulting in improved fluid flow in the direction of arrow 130.
In addition to ganged collector electrode arrays that together form a collector electrode array such as that shown in
By way of another example,
The presence of the resistive coating on the leading edges of the collector electrodes is one mechanism for managing the electric field strength of the portion of the collector electrodes closest to the corona discharge electrode. The presence of the resistive coating serves to physically dull the edges of the collector electrodes that are proximate to the corona discharge electrode and eliminate sharp edges at the collector electrode ends that could cause ions attracted to the collector electrodes to tend to collect only at the collector electrode ends which would adversely affect the performance of the fluid movement through the collector electrode array. One benefit of having ions and fluid move through collector electrode array 120 is that charged particles, such as dust, in the fluid may accumulate in areas of the collector electrodes that are more distant from the corona discharge electrode. The presence of the resistive coating in certain areas of the collector electrodes thus reduces the electric field strength in these areas. The presence of the resistive coating may also prevent arcing between the corona discharge electrode and the ends of the collector electrodes.
While many of the collector electrode structures illustrated in the Figures herein are illustrated as having substantially smooth and uniformly even surfaces, a person of skill in the art will recognize that they need not be so limited. It may be advantageous in some implementations of EHD devices for the sides of the collector electrodes that are parallel to the fluid flow direction to have non-planar, bumpy or uneven surfaces. By way of one example,
The EHD devices illustrated herein are suitable for dissipating heat generated by a thermal source, as a component in a thermal management system for an electronic circuit in an electronic apparatus. As defined herein, an electronic circuit is defined as one or more electronic components. When there is more than one electronic component, the electronic components are in mutual electromechanical contact, usually by being soldered to a printed circuit board (PCB). An electronic component is any physical entity in an electronic system whose intention is to affect the electrons or their associated fields in a desired manner consistent with the intended function of the electronic system. Electronic components may be packaged singly or in more complex groups as integrated circuits. Some common electronic components are capacitors, resistors, diodes and transistors. As used herein, an “electronic apparatus” is an apparatus that comprises one or more electronic circuits.
The EHD devices illustrated herein may be constructed in a wide range of sizes in order to meet the requirements of a particular thermal heat management solution. By way of one example, when EHD device 100 of
The various embodiments of EHD devices illustrated herein, when used as a component in a thermal management system, may be designed to achieve a target fluid flow rate that is sufficient to dissipate a target heat quantity generated by a particular one or more thermal sources contained within an enclosure, while operating the EHD device under the constraint of a given pressure head range. Once the target fluid flow rate and target heat quantity are known, the design of such an EHD device begins with determining the geometry and fluid flow resistance of the device that will permit the operation of the EHD device within the desired pressure head range. In one embodiment, the EHD device may be configured to operate with a pressure head in the range of 1-50 Pa. For some thermal management applications, the desired, or target, pressure head range may be a range of 3-20 Pa.
Each of the various embodiments of EHD devices illustrated herein may be configured to have a high aspect ratio and positioned within an enclosure proximate to one or more ventilated surface boundaries in order to minimize resistance along the fluid flow path. With reference to
5<L/H<300 Equation (1), or
5<L/D<150 Equation (2),
where L is the length of the device, H is the height of the device, and D is the depth of the device, where the depth of the device is along the fluid flow path. In some embodiments of an EHD device, these relationships may preferably be stated as:
10<L/H<40 Equation (3), or
10<L/D<30 Equation (4).
When the EHD device is configured according to the relationships of any one of Equations (1)-(4), and the EHD device is positioned proximate to one or more ventilated boundary surfaces in an enclosure, as illustrated, for example, in
In addition, in some configurations of an EHD device according to these designs, the device operation will maximize the dissipation of heat from the thermal source while maintaining a substantial equilibrium of the fluid flow velocity through the enclosure within which the EHD device operates. That is, the device will maintain a fluid flow velocity at an intake ventilated boundary surface that is substantially equal to the fluid flow velocity at an outgoing ventilated boundary surface. Note that EHD device 1100 of
The discussion above in conjunction with
Designing an EHD device using the dimensions referenced in Table 1 and illustrated in
L/d3<20 Equation (5),
0.1<T/d3<0.5 Equation (6), and
1.25<d2/d3<10 Equation (7).
The ratio of the length, L, of the collector electrode to the pitch, d3, should preferably be less than 20. The ratio of the thickness, T, of each collector electrode to the pitch, d3, should preferably be between 0.1 and 0.5. The ratio of the air gap distance, d2, to the pitch, d3, should preferably be between 1.25 and 10. In addition, as a general principle, an EHD device will achieve efficient fluid flow performance in a thermal management system when the pitch of the collector electrodes is greater than or equal to 0.5 mm and less than or equal to 2 mm. Boundary layer disruption is another characteristic to be considered. More significant boundary layer disruption along the side surface of collector electrode is likely to be achieved in the distance d4 of the electrode (i.e., the portion of the length, L, of the collector electrode closest to the corona discharge electrode, referred to as the leading edge length). The extent of distance d4 is affected by the length, L, of a collector electrode as well as the pitch, d3. Decreasing the pitch of the collector electrodes may affect the electric field strength at the leading edges of the collector electrodes.
Some of the embodiments of electrohydrodynamic fluid accelerator devices illustrated and described herein are discussed in the context of a thermal management solution to dissipate heat generated by a thermal source. However, the devices are not limited in their use to that context. Embodiments of the devices illustrated and described herein may be suitable for use in any type of device that requires the movement of a fluid, such as, for example, electrostatic precipitators, and electrostatic air cleaners and purifiers.
While the techniques and implementations of the EHD devices discussed herein have been described with reference to exemplary embodiments, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the scope of the appended claims. In addition, many modifications may be made to adapt a particular situation or material to the teachings without departing from the essential scope thereof. Therefore, the particular embodiments, implementations and techniques disclosed herein, some of which indicate the best mode contemplated for carrying out these embodiments, implementations and techniques, are not intended to limit the scope of the appended claims.
The present application claims the benefit of U.S. Provisional Application No. 61/139,518, filed Dec. 19, 2008.
Number | Date | Country | |
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61139518 | Dec 2008 | US |