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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

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H01L23/467by flowing gases

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Patents Grantslast 30 patents

Information Patent Grant
Systems and methods for power module for inverter for electric vehicle
- Patent number 12,368,391
- Issue date Jul 22, 2025
- BorgWarner US Technologies LLC
- David Paul Buehler
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Computer system with external bypass air plenum
- Patent number 12,369,281
- Issue date Jul 22, 2025
- Amazon Technologies, Inc.
- David Edward Bryan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Management of heat on a semiconductor device and methods for produc...
- Patent number 12,362,259
- Issue date Jul 15, 2025
- Micron Technology, Inc.
- James S. Rehmeyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for power module for inverter for electric vehicle
- Patent number 12,348,157
- Issue date Jul 1, 2025
- BorgWarner US Technologies LLC
- David Paul Buehler
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Computing system with cooling for controlling temperature of electr...
- Patent number 12,342,454
- Issue date Jun 24, 2025
- Microsoft Technology Licensing, LLC
- Unnikrishnan Vadakkanmaru Veedu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for multiple output integrated gate driver for...
- Patent number 12,341,454
- Issue date Jun 24, 2025
- BorgWarner US Technologies LLC
- Mark Wendell Gose
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Systems and methods for galvanic isolation for inverter for electri...
- Patent number 12,328,083
- Issue date Jun 10, 2025
- BorgWarner US Technologies LLC
- Srikanth Vijaykumar
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Semiconductor package including stress-reduction structures and met...
- Patent number 12,327,772
- Issue date Jun 10, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for data recorder for inverter for electric veh...
- Patent number 12,323,080
- Issue date Jun 3, 2025
- BorgWarner US Technologies LLC
- Marc R. Engelhardt
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Systems and methods for an interlocking feature on a power module
- Patent number 12,316,257
- Issue date May 27, 2025
- BorgWarner US Technologies LLC
- Edward Choi
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Power module package for direct cooling multiple power modules
- Patent number 12,308,364
- Issue date May 20, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jerome Teysseyre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aluminum nitride multilayer power module interposer and method
- Patent number 12,300,578
- Issue date May 13, 2025
- TriPent Power LLC
- Stephen P. Nootens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optimization of the thermal performance of the 3D ICs utilizing the...
- Patent number 12,293,957
- Issue date May 6, 2025
- Kambix Innovations II, LLC
- Kambiz Vafai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-fractal heatsink system and method
- Patent number 12,288,731
- Issue date Apr 29, 2025
- FRACTAL HEATSINK TECHNOLOGIES LLC
- Alexander Poltorak
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Systems and methods for cooling system and power module for inverte...
- Patent number 12,284,791
- Issue date Apr 22, 2025
- BorgWarner US Technologies LLC
- Bryan Rohl
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Integrated cooling assemblies for advanced device packaging and met...
- Patent number 12,283,490
- Issue date Apr 22, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for parameter drift correction for inverter for...
- Patent number 12,279,402
- Issue date Apr 15, 2025
- BorgWarner US Technologies LLC
- Seyed R. Zarabadi
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Exhaust blending for piezoelectric cooling systems
- Patent number 12,274,020
- Issue date Apr 8, 2025
- Frore Systems Inc.
- Prabhu Sathyamurthy
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Choked flow cooling
- Patent number 12,266,591
- Issue date Apr 1, 2025
- SK Hynix NAND Product Solutions Corp.
- Mark Forsnes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for cooling system and power module for inverte...
- Patent number 12,261,558
- Issue date Mar 25, 2025
- BorgWarner US Technologies LLC
- Bryan Rohl
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Secure semiconductor integration and method for making thereof
- Patent number 12,255,189
- Issue date Mar 18, 2025
- BroadPak Corporation
- Farhang Yazdani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink with turbulent structures
- Patent number 12,255,117
- Issue date Mar 18, 2025
- Google LLC
- Xu Zuo
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Cooling heatshield for clamshell BGA rework
- Patent number 12,243,804
- Issue date Mar 4, 2025
- Google LLC
- Sue Yun Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for low inductance phase switch for inverter fo...
- Patent number 12,225,696
- Issue date Feb 11, 2025
- BorgWarner US Technologies LLC
- Mark Wendell Gose
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Systems and methods for adaptive gate driver for inverter for elect...
- Patent number 12,220,992
- Issue date Feb 11, 2025
- BorgWarner US Technologies LLC
- Seyed R. Zarabadi
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Venturi-effect heat-transfer device
- Patent number 12,218,028
- Issue date Feb 4, 2025
- SAFRAN
- Toni Youssef
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Electrical device and electronic control device with housings havin...
- Patent number 12,218,027
- Issue date Feb 4, 2025
- Hitachi Astemo, Ltd.
- Minami Teranishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for integrated gate driver for inverter for ele...
- Patent number 12,214,677
- Issue date Feb 4, 2025
- BorgWarner US Technologies LLC
- Mark Wendell Gose
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Low-noise heat exchanger
- Patent number 12,207,443
- Issue date Jan 21, 2025
- Dell Products L.P.
- Qinghong He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling device
- Patent number 12,207,434
- Issue date Jan 21, 2025
- Nissan Motor Co., Ltd.
- Kenta Emori
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
EMBEDDED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND METHO...
- Publication number 20250239504
- Publication date Jul 24, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR COOLING AND HEATING DEVICE
- Publication number 20250235347
- Publication date Jul 24, 2025
- Xiamen Ubest Electronic Technology Co., Ltd.
- Kunlin CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND MET...
- Publication number 20250233053
- Publication date Jul 17, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND AIRFLOW GENERATING PACKAGE
- Publication number 20250223151
- Publication date Jul 10, 2025
- xMEMS Labs, Inc.
- Jemm Yue Liang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
EMBEDDED COOLING SYSTEMS AND METHODS OF MANUFACTURING EMBEDDED COOL...
- Publication number 20250226290
- Publication date Jul 10, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR COOLING SYSTEM AND POWER MODULE FOR INVERTE...
- Publication number 20250219554
- Publication date Jul 3, 2025
- BorgWarner US Technologies LLC
- Bryan Rohl
- B60 - VEHICLES IN GENERAL
Information Patent Application
Active Cooling for Heterogenous Packages
- Publication number 20250210456
- Publication date Jun 26, 2025
- Intel Corporation
- Eduardo De Mesa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL STRUCTURE FOR SEMICONDUCTOR PACKAGE
- Publication number 20250210458
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Chang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Module For An Electronic Computing Device
- Publication number 20250201666
- Publication date Jun 19, 2025
- SIEMENS AKTIENGESELLSCHAFT
- Jörg Strogies
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND FORMATION METHOD OF PACKAGE WITH HEAT-SPREADING LID
- Publication number 20250201668
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGES FORMED USING RDL-LAST PROCESS
- Publication number 20250167173
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR COOLING AN INTEGRATED CIRCUIT
- Publication number 20250157882
- Publication date May 15, 2025
- ADVANCED MICRO DEVICES, INC.
- ZhiXin Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURE WITH THERMAL ENHANCEMENTS FOR VERTICALLY ORIEN...
- Publication number 20250140741
- Publication date May 1, 2025
- Intel Corporation
- Rajiv Mongia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR ADAPTIVE GATE DRIVER FOR INVERTER FOR ELECT...
- Publication number 20250133708
- Publication date Apr 24, 2025
- BorgWarner US Technologies LLC
- Seyed R. Zarabadi
- B60 - VEHICLES IN GENERAL
Information Patent Application
SYSTEMS AND METHODS FOR INTEGRATED GATE DRIVER FOR INVERTER FOR ELE...
- Publication number 20250126762
- Publication date Apr 17, 2025
- BorgWarner US Technologies LLC
- Mark Wendell Gose
- B60 - VEHICLES IN GENERAL
Information Patent Application
SYSTEMS AND METHODS FOR NON-OVERLAP ENFORCEMENT FOR INVERTER FOR EL...
- Publication number 20250089224
- Publication date Mar 13, 2025
- BorgWarner US Technologies LLC
- Jack Lavern Glenn
- B60 - VEHICLES IN GENERAL
Information Patent Application
THERMAL APPARATUS FOR AN INTEGRATED CIRCUIT AND METHODS OF OPERATION
- Publication number 20250087554
- Publication date Mar 13, 2025
- NXP USA, Inc.
- Chetan Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTIMIZATION OF THE THERMAL PERFORMANCE OF THE 3D ICS UTILIZING THE...
- Publication number 20250087556
- Publication date Mar 13, 2025
- Kambix Innovations, LLC
- Kambiz Vafai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MANAGEMENT MODULE
- Publication number 20250079571
- Publication date Mar 6, 2025
- C-TECH UNITED CORPORATION
- CHIH-KUN YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR PHASE SWITCH TIMING CONTROLLER FOR INVERTER...
- Publication number 20250056773
- Publication date Feb 13, 2025
- BorgWarner US Technologies LLC
- Jack Lavern Glenn
- B60 - VEHICLES IN GENERAL
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250038067
- Publication date Jan 30, 2025
- nD-HI Technologies Lab, Inc.
- Ho-Ming Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250029909
- Publication date Jan 23, 2025
- Mitsubishi Electric Corporation
- Takuma NISHIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-FREQUENCY HIGH-POWER PACKAGING MODULE, MANUFACTURING METHOD FO...
- Publication number 20250015021
- Publication date Jan 9, 2025
- SHANGHAI METAPWR ELECTRONICS CO., LTD
- Jianhong ZENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FRACTAL HEAT TRANSFER DEVICE
- Publication number 20240426563
- Publication date Dec 26, 2024
- Fractal Heatsink Technologies LLC
- Alexander Poltorak
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
HOOD FOR MEMS-BASED COOLING SYSTEMS
- Publication number 20240431068
- Publication date Dec 26, 2024
- Frore Systems Inc.
- Prabhu Sathyamurthy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES WITH FLUID SPACERS TO IMPROVE PIN LOAD...
- Publication number 20240413054
- Publication date Dec 12, 2024
- Intel Corporation
- Min Pei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR INTEGRATED GATE DRIVER FOR INVERTER FOR ELE...
- Publication number 20240399895
- Publication date Dec 5, 2024
- DELPHI TECHNOLOGIES IP LIMITED
- Mark Wendell Gose
- B60 - VEHICLES IN GENERAL
Information Patent Application
EMITTERS FOR INTEGRATED POWER CARD COOLING
- Publication number 20240395657
- Publication date Nov 28, 2024
- DENSO International America, Inc.
- Sean Schoneboom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND MET...
- Publication number 20240387322
- Publication date Nov 21, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORIES AND FABRICATION METHODS THEREOF, MEMORY SYSTEMS, AND ELECT...
- Publication number 20240379497
- Publication date Nov 14, 2024
- Yangtze Memory Technologies Co., Ltd.
- Hao Zheng
- H01 - BASIC ELECTRIC ELEMENTS

by flowing gases

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Systems and methods for power module for inverter for electric vehicle

Computer system with external bypass air plenum

Management of heat on a semiconductor device and methods for produc...

Systems and methods for power module for inverter for electric vehicle

Computing system with cooling for controlling temperature of electr...

Systems and methods for multiple output integrated gate driver for...

Systems and methods for galvanic isolation for inverter for electri...

Semiconductor package including stress-reduction structures and met...

Systems and methods for data recorder for inverter for electric veh...

Systems and methods for an interlocking feature on a power module

Power module package for direct cooling multiple power modules

Aluminum nitride multilayer power module interposer and method

Optimization of the thermal performance of the 3D ICs utilizing the...

Multi-fractal heatsink system and method

Systems and methods for cooling system and power module for inverte...

Integrated cooling assemblies for advanced device packaging and met...

Systems and methods for parameter drift correction for inverter for...

Exhaust blending for piezoelectric cooling systems

Choked flow cooling

Systems and methods for cooling system and power module for inverte...

Secure semiconductor integration and method for making thereof

Heat sink with turbulent structures

Cooling heatshield for clamshell BGA rework

Systems and methods for low inductance phase switch for inverter fo...

Systems and methods for adaptive gate driver for inverter for elect...

Venturi-effect heat-transfer device

Electrical device and electronic control device with housings havin...

Systems and methods for integrated gate driver for inverter for ele...

Low-noise heat exchanger

Cooling device

Patents Applicationslast 30 patents

EMBEDDED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND METHO...

SEMICONDUCTOR COOLING AND HEATING DEVICE

INTEGRATED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND MET...

SEMICONDUCTOR DEVICE AND AIRFLOW GENERATING PACKAGE

EMBEDDED COOLING SYSTEMS AND METHODS OF MANUFACTURING EMBEDDED COOL...

SYSTEMS AND METHODS FOR COOLING SYSTEM AND POWER MODULE FOR INVERTE...

Active Cooling for Heterogenous Packages

THERMAL STRUCTURE FOR SEMICONDUCTOR PACKAGE

Power Module For An Electronic Computing Device

STRUCTURE AND FORMATION METHOD OF PACKAGE WITH HEAT-SPREADING LID

PACKAGES FORMED USING RDL-LAST PROCESS

SYSTEMS AND METHODS FOR COOLING AN INTEGRATED CIRCUIT

PACKAGE ARCHITECTURE WITH THERMAL ENHANCEMENTS FOR VERTICALLY ORIEN...

SYSTEMS AND METHODS FOR ADAPTIVE GATE DRIVER FOR INVERTER FOR ELECT...

SYSTEMS AND METHODS FOR INTEGRATED GATE DRIVER FOR INVERTER FOR ELE...

SYSTEMS AND METHODS FOR NON-OVERLAP ENFORCEMENT FOR INVERTER FOR EL...

THERMAL APPARATUS FOR AN INTEGRATED CIRCUIT AND METHODS OF OPERATION

OPTIMIZATION OF THE THERMAL PERFORMANCE OF THE 3D ICS UTILIZING THE...

THERMAL MANAGEMENT MODULE

SYSTEMS AND METHODS FOR PHASE SWITCH TIMING CONTROLLER FOR INVERTER...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

HIGH-FREQUENCY HIGH-POWER PACKAGING MODULE, MANUFACTURING METHOD FO...

FRACTAL HEAT TRANSFER DEVICE

HOOD FOR MEMS-BASED COOLING SYSTEMS

INTEGRATED CIRCUIT PACKAGES WITH FLUID SPACERS TO IMPROVE PIN LOAD...

SYSTEMS AND METHODS FOR INTEGRATED GATE DRIVER FOR INVERTER FOR ELE...

EMITTERS FOR INTEGRATED POWER CARD COOLING

INTEGRATED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND MET...

MEMORIES AND FABRICATION METHODS THEREOF, MEMORY SYSTEMS, AND ELECT...