by flowing gases

Industry

CPC
H01L23/467

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/467by flowing gases

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Systems and methods for low inductance phase switch for inverter fo...
- Patent number 12,225,696
- Issue date Feb 11, 2025
- BorgWarner US Technologies LLC
- Mark Wendell Gose
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Systems and methods for adaptive gate driver for inverter for elect...
- Patent number 12,220,992
- Issue date Feb 11, 2025
- BorgWarner US Technologies LLC
- Seyed R. Zarabadi
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Venturi-effect heat-transfer device
- Patent number 12,218,028
- Issue date Feb 4, 2025
- SAFRAN
- Toni Youssef
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Electrical device and electronic control device with housings havin...
- Patent number 12,218,027
- Issue date Feb 4, 2025
- Hitachi Astemo, Ltd.
- Minami Teranishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for integrated gate driver for inverter for ele...
- Patent number 12,214,677
- Issue date Feb 4, 2025
- BorgWarner US Technologies LLC
- Mark Wendell Gose
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Low-noise heat exchanger
- Patent number 12,207,443
- Issue date Jan 21, 2025
- Dell Products L.P.
- Qinghong He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling device
- Patent number 12,207,434
- Issue date Jan 21, 2025
- Nissan Motor Co., Ltd.
- Kenta Emori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for non-overlap enforcement for inverter for el...
- Patent number 12,194,870
- Issue date Jan 14, 2025
- Borg Warner US Technologies LLC
- Jack Lavern Glenn
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Modular microchannel thermal solutions for integrated circuit devices
- Patent number 12,199,012
- Issue date Jan 14, 2025
- Intel Corporation
- Adel Elsherbini
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Rotary machine with electric motor and impeller
- Patent number 12,191,231
- Issue date Jan 7, 2025
- Shun Nakayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded cooling systems and methods of manufacturing embedded cool...
- Patent number 12,191,233
- Issue date Jan 7, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Data storage structure or data infrastructure including a plurality...
- Patent number 12,191,232
- Issue date Jan 7, 2025
- SK hynix Inc.
- Ho Sung Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated cooling assemblies for advanced device packaging and met...
- Patent number 12,191,234
- Issue date Jan 7, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for single channel fault encoding for inverter...
- Patent number 12,179,610
- Issue date Dec 31, 2024
- Borg Warner US Technologies LLC
- Marc R. Engelhardt
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Embedded cooling assemblies for advanced device packaging and metho...
- Patent number 12,183,659
- Issue date Dec 31, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heatsink and cooling device
- Patent number 12,163,746
- Issue date Dec 10, 2024
- Nidec Corporation
- Hidehiko Hidaka
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Systems and methods for phase switch timing controller for inverter...
- Patent number 12,162,366
- Issue date Dec 10, 2024
- BorgWarner US Technologies LLC
- Jack Lavern Glenn
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Heatsink and cooling device
- Patent number 12,165,953
- Issue date Dec 10, 2024
- Nidec Corporation
- Hidehiko Hidaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems for cooling a heating element
- Patent number 12,158,305
- Issue date Dec 3, 2024
- Kanthal GmbH
- Ralph Miethe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processors and integrated circuits including a microelectromechanic...
- Patent number 12,154,843
- Issue date Nov 26, 2024
- Honeywell International Inc.
- Sridhar Vanka
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Alignment mechanism
- Patent number 12,140,625
- Issue date Nov 12, 2024
- Delta Design, Inc.
- Jerry Ihor Tustaniwskyj
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Convectors
- Patent number 12,129,868
- Issue date Oct 29, 2024
- Pedro Arnulfo Sarmiento
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Systems and methods for bidirectional message architecture for inve...
- Patent number 12,122,251
- Issue date Oct 22, 2024
- BorgWarner US Technologies LLC
- Jack Lavern Glenn
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Hood for MEMS-based cooling systems
- Patent number 12,127,369
- Issue date Oct 22, 2024
- Frore Systems Inc.
- Prabhu Sathyamurthy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heatsink with increased air flow
- Patent number 12,114,467
- Issue date Oct 8, 2024
- Huawei Technologies Co., Ltd.
- Magnus Kallmark
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Thermal control system
- Patent number 12,110,881
- Issue date Oct 8, 2024
- APR Technologies AB
- Robert Thorslund
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Cooling structure and electrical apparatus
- Patent number 12,107,033
- Issue date Oct 1, 2024
- Kabushiki Kaisha Toyota Jidoshokki
- Toshiaki Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for integrated gate driver for inverter for ele...
- Patent number 12,103,406
- Issue date Oct 1, 2024
- DELPHI TECHNOLOGIES IP LIMITED
- Mark Wendell Gose
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Solid state drive apparatus and data storage apparatus including th...
- Patent number 12,094,803
- Issue date Sep 17, 2024
- Samsung Electronics Co., Ltd.
- Sungchul Hur
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optimization of the thermal performance of the 3D ICs utilizing the...
- Patent number 12,087,663
- Issue date Sep 10, 2024
- Kambix Innovations, LLC
- Kambiz Vafai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SYSTEMS AND METHODS FOR PHASE SWITCH TIMING CONTROLLER FOR INVERTER...
- Publication number 20250056773
- Publication date Feb 13, 2025
- BorgWarner US Technologies LLC
- Jack Lavern Glenn
- B60 - VEHICLES IN GENERAL
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250038067
- Publication date Jan 30, 2025
- nD-HI Technologies Lab, Inc.
- Ho-Ming Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250029909
- Publication date Jan 23, 2025
- Mitsubishi Electric Corporation
- Takuma NISHIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-FREQUENCY HIGH-POWER PACKAGING MODULE, MANUFACTURING METHOD FO...
- Publication number 20250015021
- Publication date Jan 9, 2025
- SHANGHAI METAPWR ELECTRONICS CO., LTD
- Jianhong ZENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FRACTAL HEAT TRANSFER DEVICE
- Publication number 20240426563
- Publication date Dec 26, 2024
- Fractal Heatsink Technologies LLC
- Alexander Poltorak
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
HOOD FOR MEMS-BASED COOLING SYSTEMS
- Publication number 20240431068
- Publication date Dec 26, 2024
- Frore Systems Inc.
- Prabhu Sathyamurthy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES WITH FLUID SPACERS TO IMPROVE PIN LOAD...
- Publication number 20240413054
- Publication date Dec 12, 2024
- Intel Corporation
- Min Pei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR INTEGRATED GATE DRIVER FOR INVERTER FOR ELE...
- Publication number 20240399895
- Publication date Dec 5, 2024
- DELPHI TECHNOLOGIES IP LIMITED
- Mark Wendell Gose
- B60 - VEHICLES IN GENERAL
Information Patent Application
EMITTERS FOR INTEGRATED POWER CARD COOLING
- Publication number 20240395657
- Publication date Nov 28, 2024
- DENSO International America, Inc.
- Sean Schoneboom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND MET...
- Publication number 20240387322
- Publication date Nov 21, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORIES AND FABRICATION METHODS THEREOF, MEMORY SYSTEMS, AND ELECT...
- Publication number 20240379497
- Publication date Nov 14, 2024
- Yangtze Memory Technologies Co., Ltd.
- Hao Zheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONICS ARRANGEMENT AND SEMICONDUCTOR SWITCHING DEVICE HAVING T...
- Publication number 20240334641
- Publication date Oct 3, 2024
- SIEMENS AKTIENGESELLSCHAFT
- Matthias Eisner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS INCLUDING COOLING STRUCTURE
- Publication number 20240312872
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tung-Liang Shao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLING DEVICE
- Publication number 20240268058
- Publication date Aug 8, 2024
- NISSAN MOTOR CO., LTD.
- Kenta EMORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND METHO...
- Publication number 20240222226
- Publication date Jul 4, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO COOL IN...
- Publication number 20240213116
- Publication date Jun 27, 2024
- Intel Corporation
- Kyle Arrington
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS, AND MANUFACTURING METHOD THEREFOR
- Publication number 20240203817
- Publication date Jun 20, 2024
- ROHM CO., LTD.
- Natsuya YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK CHIP AIR GAP HEAT INSULATOR
- Publication number 20240178260
- Publication date May 30, 2024
- OMNIVISION TECHNOLOGIES, INC.
- Sing-Chung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED JET IMPINGEMENT LEAK PREVENTION FOR INTEGRATED CIRCUIT
- Publication number 20240175917
- Publication date May 30, 2024
- Intel Corporation
- Ruben NUNEZ BLANCO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXHAUST BLENDING FOR PIEZOELECTRIC COOLING SYSTEMS
- Publication number 20240172389
- Publication date May 23, 2024
- Frore Systems Inc.
- Prabhu Sathyamurthy
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CHOKED FLOW COOLING
- Publication number 20240170368
- Publication date May 23, 2024
- SK hynix NAND Product Solutions Corp.
- Mark Forsnes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE INCLUDING THE SAME
- Publication number 20240162115
- Publication date May 16, 2024
- Samsung Electronics Co., Ltd.
- Youngdeuk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURE WITH MICROFLUIDIC CHANNELS IN GLASS SUBSTRATES
- Publication number 20240162158
- Publication date May 16, 2024
- Intel Corporation
- Brandon C. Marin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MANAGEMENT OF HEAT ON A SEMICONDUCTOR DEVICE AND METHODS FOR PRODUC...
- Publication number 20240145341
- Publication date May 2, 2024
- Micron Technology, Inc.
- James S. Rehmeyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microfluidic Channels for Cooling Hybrid Bonded Interfaces
- Publication number 20240128156
- Publication date Apr 18, 2024
- Avago Technologies International Sales Pte. Limited
- Sam Karikalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE PACKAGE FOR DIRECT COOLING MULTIPLE POWER MODULES
- Publication number 20240120328
- Publication date Apr 11, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jerome TEYSSEYRE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COUPLING A THERMALLY CONDUCTIVE PLATE TO A SEMICONDUCTOR DEVICE FOR...
- Publication number 20240103073
- Publication date Mar 28, 2024
- Intel Corporation
- Patrick PARDY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR ACTIVE AND PASSIVE COOLING OF ELECTRICAL CO...
- Publication number 20240105553
- Publication date Mar 28, 2024
- DELPHI TECHNOLOGIES IP LIMITED
- Kevin M. Gertiser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR ACTIVE AND PASSIVE COOLING OF ELECTRICAL CO...
- Publication number 20240105552
- Publication date Mar 28, 2024
- DELPHI TECHNOLOGIES IP LIMITED
- Kevin M. Gertiser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DATA STORAGE STRUCTURE OR DATA INFRASTRUCTURE INCLDUING A PLURALITY...
- Publication number 20240071867
- Publication date Feb 29, 2024
- SK HYNIX INC.
- Ho Sung KANG
- H01 - BASIC ELECTRIC ELEMENTS

by flowing gases

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Systems and methods for low inductance phase switch for inverter fo...

Systems and methods for adaptive gate driver for inverter for elect...

Venturi-effect heat-transfer device

Electrical device and electronic control device with housings havin...

Systems and methods for integrated gate driver for inverter for ele...

Low-noise heat exchanger

Cooling device

Systems and methods for non-overlap enforcement for inverter for el...

Modular microchannel thermal solutions for integrated circuit devices

Rotary machine with electric motor and impeller

Embedded cooling systems and methods of manufacturing embedded cool...

Data storage structure or data infrastructure including a plurality...

Integrated cooling assemblies for advanced device packaging and met...

Systems and methods for single channel fault encoding for inverter...

Embedded cooling assemblies for advanced device packaging and metho...

Heatsink and cooling device

Systems and methods for phase switch timing controller for inverter...

Heatsink and cooling device

Methods and systems for cooling a heating element

Processors and integrated circuits including a microelectromechanic...

Alignment mechanism

Convectors

Systems and methods for bidirectional message architecture for inve...

Hood for MEMS-based cooling systems

Heatsink with increased air flow

Thermal control system

Cooling structure and electrical apparatus

Systems and methods for integrated gate driver for inverter for ele...

Solid state drive apparatus and data storage apparatus including th...

Optimization of the thermal performance of the 3D ICs utilizing the...

Patents Applicationslast 30 patents

SYSTEMS AND METHODS FOR PHASE SWITCH TIMING CONTROLLER FOR INVERTER...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

HIGH-FREQUENCY HIGH-POWER PACKAGING MODULE, MANUFACTURING METHOD FO...

FRACTAL HEAT TRANSFER DEVICE

HOOD FOR MEMS-BASED COOLING SYSTEMS

INTEGRATED CIRCUIT PACKAGES WITH FLUID SPACERS TO IMPROVE PIN LOAD...

SYSTEMS AND METHODS FOR INTEGRATED GATE DRIVER FOR INVERTER FOR ELE...

EMITTERS FOR INTEGRATED POWER CARD COOLING

INTEGRATED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND MET...

MEMORIES AND FABRICATION METHODS THEREOF, MEMORY SYSTEMS, AND ELECT...

ELECTRONICS ARRANGEMENT AND SEMICONDUCTOR SWITCHING DEVICE HAVING T...

APPARATUS INCLUDING COOLING STRUCTURE

COOLING DEVICE

EMBEDDED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND METHO...

METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO COOL IN...

SEMICONDUCTOR APPARATUS, AND MANUFACTURING METHOD THEREFOR

STACK CHIP AIR GAP HEAT INSULATOR

ENHANCED JET IMPINGEMENT LEAK PREVENTION FOR INTEGRATED CIRCUIT

EXHAUST BLENDING FOR PIEZOELECTRIC COOLING SYSTEMS

CHOKED FLOW COOLING

SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE INCLUDING THE SAME

PACKAGE ARCHITECTURE WITH MICROFLUIDIC CHANNELS IN GLASS SUBSTRATES

MANAGEMENT OF HEAT ON A SEMICONDUCTOR DEVICE AND METHODS FOR PRODUC...

Microfluidic Channels for Cooling Hybrid Bonded Interfaces

POWER MODULE PACKAGE FOR DIRECT COOLING MULTIPLE POWER MODULES

COUPLING A THERMALLY CONDUCTIVE PLATE TO A SEMICONDUCTOR DEVICE FOR...

SYSTEMS AND METHODS FOR ACTIVE AND PASSIVE COOLING OF ELECTRICAL CO...

SYSTEMS AND METHODS FOR ACTIVE AND PASSIVE COOLING OF ELECTRICAL CO...

DATA STORAGE STRUCTURE OR DATA INFRASTRUCTURE INCLDUING A PLURALITY...