The present invention relates to a common mode noise filter for use in digital equipment, AV equipment, and various kinds of electronic equipment such as an information communication terminal, and a method for manufacturing the common mode noise filter.
A conventional common mode noise filter includes laminated body 1, two coil conductors 2 and 3 that are formed inside laminated body 1 and face each other, and leading conductors 4 and 5 that are connected to coil conductors 2 and 3, respectively, as shown in
PTL 1, for example, has been known as conventional art literature information regarding the invention of this application.
PTL 1: Unexamined Japanese Patent Publication No. 2012-89543
A common mode noise filter according to the present invention includes: a laminated body; and a first coil conductor and a second coil conductor that are formed inside the laminated body and face each other in a first direction, wherein the first coil conductor has a first surface facing the second coil conductor; the second coil conductor has a second surface facing the first surface; a distance between an end of the first surface and an end of the second surface in the first direction is longer than a distance between a center of the first surface and a center of the second surface in the first direction; the first surface and the second surface have corners each formed into an arcuate shape in a cross section; and a relationship between a height h in the first direction and a width w in a second direction perpendicular to the first direction is h≧w in a cross section of each of the first and second coil conductors.
In a method for manufacturing a common mode noise filter according to the present invention, a common mode noise filter includes a laminated body having a non-magnetic member containing glass therein. The method includes: a first step of forming first and second coil conductors that face each other and are made of mainly silver, inside the non-magnetic member; and a second step of baking the laminated body, wherein a temperature at which the laminated body is baked is higher than a transition temperature of the glass and higher than a softening temperature of silver in the second step.
The common mode noise filter and the method for manufacturing a common mode noise filter according to the present invention enable degradation of a differential signal to be prevented.
Prior to the description of exemplary embodiments of the present invention, a description will be given below of a problem to be solved experienced by the conventional common mode noise filter explained with reference to
If the conventional common mode noise filter is reduced in thickness, a distance between coil conductors 2 and 3 that face each other is short. If the distance between coil conductors 2 and 3 that face each other is short, a capacity generated between coil conductors 2 and 3 is increased, so that a characteristic impedance is reduced. If the characteristic impedance is reduced, a defined characteristic impedance in accordance with each of communication standards cannot be achieved, thereby possibly degrading a differential signal.
A description will be given below of a common mode noise filter capable of preventing a differential signal from being degraded and a method for manufacturing the common mode noise filter.
The same constituent elements in exemplary embodiments are designated by the same reference numerals, and therefore, their detailed description thereof will be omitted.
A description will be given of a first exemplary embodiment with reference to
As shown in
As shown in
As shown in
First coil conductor 12 is connected to outside electrode 16a; second coil conductor 13, to outside electrode 16c; first leading conductor 14, to outside electrode 16b; and second leading conductor 15, to outside electrode 16d.
First coil conductor 12 is connected to first leading conductor 14 via first via electrode 17a, thus constituting one coil. In the meantime, second coil conductor 13 is connected to second leading conductor 15 via second via electrode 17b, thus constituting another coil.
Although each of first leading conductor 14 and second leading conductor 15 has the combination of linear shapes in
Moreover, although first leading conductor 14 and second leading conductor 15 are formed on different insulating layers 11b and 11e, respectively, in
First to seventh insulating layers 11a to 11g are formed into a sheet-like shape, and are laminated from bottom in sequence in the first direction. Second to sixth insulating layers 11b to 11f are made of a nonmagnetic material containing glass such as glass ceramic. In contrast, first and seventh insulating layers 11a and 11g are made of a magnetic material such as Cu—Ni—Zn ferrite. First and second coil conductors 12 and 13 are disposed inside nonmagnetic member 18 consisting of second to sixth insulating layers 11b to 11f.
Here, the number of first to seventh insulating layers 11a to 11g is not limited to that shown in
First and second coil conductors 12 and 13 are formed by spirally plating or printing a silver conductive material on insulating layers 11c and 11d, respectively. Furthermore, first and second coil conductors 12 and 13 face each other in the first direction while holding fourth insulating layer 11d therebetween. Specifically, first and second coil conductors 12 and 13 are disposed in such a manner as to overlap except for both ends thereof, as viewed from the top. First and second coil conductors 12 and 13 are magnetically coupled to each other in the same winding direction.
First and second coil conductors 12 and 13 may be formed into not a spiral shape but other shapes such as a helical shape. Additionally, first and second coil conductors 12 and 13 may be made of not silver but an alloy containing mainly silver such as silver palladium or silver containing glass.
As shown in
Incidentally, corners 12b and 13b of first and second coil conductors 12 and 13 are arcuate except for first and second leading conductors 14 and 15 and portions to be connected to outside electrodes 16a to 16d.
A description will be given below of a capacity generated in the common mode noise filter in the first exemplary embodiment such configured as described above.
The cross sections of respective corners 12b and 13b of first and second coil conductors 12 and 13 shown in
Subsequently, explanation will be made on the capacity generated between first and second coil conductors 13 in more detail.
As shown in
Thus, it is possible to prevent a signal from being degraded without any reflection or loss of the signal as long as a characteristic impedance falls within a defined range in accordance with each of communication standards in a common mode noise filter disposed on a transmission line (e.g., a characteristic impedance on a transmission line is 90 Ω±15% in the case of USB 2.0). Since the characteristic impedance is proportional to √(L/C) (wherein L designates an inductance value of a coil per unit length of a transmission line and C designates a capacity generated between coils per unit length), in a case where the thickness of insulating layer 11d (i.e., the distance between first and second coil conductors 12 and 13) is, for example, 1 μm to 10 μm because the height of a product is low, the common mode noise filter which is shown in
In contrast, the long distance between first and second coil conductors 12 and 13 at corners 12b and 13b in the present exemplary embodiment shown in
Additionally, in the present exemplary embodiment, the capacity generated between first and second coil conductors 12 and 13 can be reduced, and therefore, a common mode noise can be removed even in a high frequency band.
Incidentally, a method for reducing a thickness of a coil conductor so as to increase a self impedance or reducing the width of a coil conductor so as to reduce a capacity generated between coil conductors may be conceived in order to increase the characteristic impedance. However, the method unfavorably increases a DC resistance. In the common mode noise filter in the present exemplary embodiment, the thickness or width of the coil conductor is hardly changed, and therefore, a DC resistance cannot be increased.
In addition, in the common mode noise filter in the present exemplary embodiment, the arcuate portions of corners 12b and 13b can release a stress that is applied to first and second coil conductors 12 and 13 during lamination, thus preventing inter-layer peeling even if each of first and second coil conductors 12 and 13 is thick. Thus, even if a pitch between first and second coil conductors 12 and 13 is reduced, delamination or short-circuiting can be prevented.
Moreover, in the common mode noise filter in the present exemplary embodiment, the capacity generated between first and second coil conductors 12 and 13 can be reduced, and therefore, the frequency of a passing band due to the capacity can be prevented from being reduced.
Next, a common mode noise filter in a second exemplary embodiment will be described with reference to
Incidentally, the same constituent elements in the second exemplary embodiment of the present invention as those in the above-described first exemplary embodiment are designated by the same reference numerals, and therefore, detailed description thereof will be omitted.
A difference between the second exemplary embodiment shown in
Incidentally, although in the present exemplary embodiment, the cross-sectional shape of each of surfaces 12a and 13a is semi-circular, the cross-sectional shape of each of surfaces 12a and 13a may be circular or elliptical. In the case of a circle, the diameter of an arcuate portion is equal to or greater than width w of each of first and second coil conductors 12 and 13.
With a configuration in the present exemplary embodiment shown in
Moreover, in the present exemplary embodiment, distance X3 between first coil conductor 12 and second coil conductor 13 at corners 12b and 13b can be further increased in comparison with the first exemplary embodiment shown in
In this manner, a capacity generated between first coil conductor 12 and second coil conductor 13 can be further reduced, and therefore, a characteristic impedance can be further increased. As a consequence, the characteristic impedance can be adjusted to a defined characteristic impedance in accordance with each of communication standards, thus securely preventing the degradation of a differential signal.
A description will be given of a third exemplary embodiment according to the present invention with reference to
In the third exemplary embodiment shown in
As shown in
In the exemplary embodiments shown in
Thus, it is possible to satisfactorily alleviate a stress to be applied to first and second coil conductors 12 and 13 during lamination, so as to effectively prevent inter-layer peeling.
Incidentally, like the first exemplary embodiment, the same cross-sectional area as that of each of first and second rectangular coil conductors 2 and 3 shown in
Next, explanation will be made on a method for manufacturing a common mode noise filter in the first to third exemplary embodiments of the present invention.
First, as shown in
In forming laminated body 11, first and second coil conductors 12 and 13 that face each other in the vertical direction (i.e., the first direction) and are made of silver are formed inside non-magnetic member 18. At this time, the cross-sectional shape of each of first and second coil conductors 12 and 13 is a substantial rectangle elongated in the vertical direction such that the relationship between width w and height h is h>w.
Next, laminated body 11 is baked.
Laminated body 11 is baked at about 970° C. to 1000° C. This temperature is higher than a glass transition temperature (about 800° C.) and higher than a softening point of silver (about 960° C.).
Finally, outside electrodes 16a to 16d are formed at both ends of the laminated body.
In the above-described method, the temperature at which laminated body 11 is baked is higher than the glass transition temperature, and therefore, the fluidity of non-magnetic member 18 containing glass is increased. Thus, the shape of each of first and second coil conductors 12 and 13 inside laminated body 11 can be easily fluctuated. Moreover, the temperature at which laminated body 11 is baked is higher than the softening temperature of silver, and therefore, first and second coil conductors 12 and 13 made of silver are deformed in such a manner that their surface areas are reduced, so that the cross-sectional shape of each of first and second coil conductors 12 and 13 is deformed into an arcuate shape.
Incidentally, even if first and second coil conductors 12 and 13 are made of not silver but an alloy such as silver palladium containing mainly silver or silver containing glass, the same effect can be produced.
In the method in the present exemplary embodiment, the cross section of each of first and second coil conductors 12 and 13 is the shape described by way of the first to third exemplary embodiments.
In the method in the present exemplary embodiment, it is unnecessary to prepare a coil conductor having a special cross section such as an arcuate shape in advance. In the method for the common mode noise filter in the present exemplary embodiment, the cross section of the coil conductor can be easily formed into an arcuate shape after laminating and baking.
Next, referring to
In a case where first and second coil conductors 12 and 13 are formed into a vertically elongated shape in the thickness direction, a stress to be applied to each of first and second coil conductors 12 and 13 during the lamination can be alleviated even at surfaces 12c and 13c at which first and second coil conductors 12 and 13 do not face each other. Thus, it is possible to prevent inter-later peeling in the present exemplary embodiment.
Furthermore, as shown in, for example,
Here, the relationship between width w and height h in cross-sectional shape of each of first and second coil conductors 12 and 13 may be h<w in terms of the reduction of a capacity generated between first coil conductor 12 and second coil conductor 13 owing to the longer distance between first coil conductor 12 and second coil conductor 13 or the prevention of generation of delamination. In this case, there is a fear that a line-to-line distance between first and second coil conductors 12 and 13 is reduced to induce short-circuiting. In view of this, it is preferable that h≧w.
Additionally, although only one pair of first and second coil conductors 12 and 13 is provided in the first to third exemplary embodiments, two or more pairs may be provided in an array manner.
The common mode noise filter and the method for manufacturing a common mode noise filter according to the present invention can prevent a differential signal from being degraded. In particular, the common mode noise filter and the method for manufacturing a common mode noise filter according to the present invention are useful for a common mode noise filter or the like used for noise measures in digital equipment, AV equipment, and various kinds of electronic equipment such as an information communication terminal.
Number | Date | Country | Kind |
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2013-087157 | Apr 2013 | JP | national |
Filing Document | Filing Date | Country | Kind |
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PCT/JP2014/002162 | 4/16/2014 | WO | 00 |