Claims
- 1. A cookie dough comprising;
(a) flour; (b) sugar, including a fluid corn syrup/sugar blend; (c) shortening; (d) eggs; (e) emulsifier; (f) leavening; and (g) mold inhibitor, wherein the cookie dough has an Aw of less than about 0.75, a pH greater than 7.0, and is shelf stable at room temperature.
- 2. The cookie dough of claim 1 wherein the flour provides structure to the cookie dough.
- 3. The cookie dough of claim 1 wherein the flour comprises about 20-40 weight percent of the cookie dough.
- 4. The cookie dough of claim 1 wherein the flour includes bleached, enriched wheat flour.
- 5. The cookie dough of claim 1 wherein the flour includes barley flour.
- 6. The cookie dough of claim 1 wherein the flour includes bleached, enriched wheat flour and barley flour.
- 7. The cookie dough of claim 6 wherein the flour includes bleached, enriched wheat flour and barley flour in a ratio of about 10.0:1.0.
- 8. The cookie dough of claim 1 wherein the sugar, including a fluid corn syrup/sugar blend, provides the cookie dough with an Aw of less than about 0.75.
- 9. The cookie dough of claim 1 wherein the sugar, including a fluid corn syrup/sugar blend, comprises about 20-40 weight percent of the cookie dough.
- 10. The cookie dough of claim 1 wherein the sugar includes sucrose.
- 11. The cookie dough of claim 10 wherein the sucrose includes white sugar.
- 12. The cookie dough of claim 10 wherein the sucrose includes brown sugar.
- 13. The cookie dough of claim 10 wherein the sucrose includes white sugar and brown sugar.
- 14. The cookie dough of claim 13 wherein the sucrose includes white sugar and brown sugar in a ratio of about 1.7:10.
- 15. The cookie dough of claim 1 wherein the sugar includes sucrose mixed with the eggs as a preservative thereof.
- 16. The cookie dough of claim 1 wherein the sugar includes a fluid blend of corn syrup, fructose, and liquid sucrose.
- 17. The cookie dough of claim 1 wherein the sugar includes a fluid blend of about 63% corn syrup, about 8% fructose, about 28% liquid sucrose, and about 1% imitation vanillin.
- 18. The cookie dough of claim 1 wherein the sugar includes sucrose and a fluid blend of corn syrup, fructose, and liquid sucrose.
- 19. The cookie dough of claim 18 wherein the sugar includes sucrose and a fluid blend of corn syrup, fructose, and liquid sucrose in a ratio of about 2.5:1.0.
- 20. The cookie dough of claim 1 wherein the sugar includes sucrose and sucrose mixed with the eggs as a preservative thereof.
- 21. The cookie dough of claim 1 wherein the sugar includes sucrose, a fluid blend of corn syrup, fructose, and liquid sucrose and sucrose mixed with the eggs as a preservative thereof.
- 22. The cookie dough of claim 1 wherein the shortening enhances organoleptic properties of the cookie dough.
- 23. The cookie dough of claim 1 wherein the shortening comprises about 10-20 weight percent of the cookie dough.
- 24. The cookie dough of claim 1 wherein the shortening includes solid shortening.
- 25. The cookie dough of claim 24 wherein the solid shortening includes hydrogenated vegetable oil.
- 26. The cookie dough of claim 25 wherein the solid shortening includes hydrogenated soybean oil and cotton seed oil mixture.
- 27. The cookie dough of claim 1 wherein the shortening includes liquid shortening.
- 28. The cookie dough of claim 27 wherein the liquid shortening includes vegetable oil.
- 29. The cookie dough of claim 28 wherein the liquid shortening includes soybean oil.
- 30. The cookie dough of claim 1 wherein the shortening includes solid shortening and liquid shortening.
- 31. The cookie dough of claim 30 wherein the shortening includes solid shortening and liquid shortening in a ratio of about 3.0:1.0
- 32. The cookie dough of claim 30 wherein the solid shortening includes hydrogenated vegetable oil.
- 33. The cookie dough of claim 32 wherein the solid shortening includes hydrogenated soybean oil and cotton seed oil mixture.
- 34. The cookie dough of claim 30 wherein the liquid shortening includes vegetable oil.
- 35. The cookie dough of claim 34 wherein the liquid shortening includes soybean oil.
- 36. The cookie dough of claim 30 wherein the shortening includes hydrogenated vegetable oil and vegetable oil.
- 37. The cookie dough of claim 36 wherein the shortening includes hydrogenated vegetable oil and soybean oil.
- 38. The cookie dough of claim 37 wherein the shortening includes hydrogenated soybean oil and cotton seed oil mixture and soybean oil.
- 39. The cookie dough of claim 1 wherein the eggs provide body to the cookie dough.
- 40. The cookie dough of claim 1 wherein the eggs include a preserved egg material comprising about 8-15 weight percent of the cookie dough.
- 41. The cookie dough of claim 1 wherein the eggs include a preserved egg material comprising whole eggs and sugar in a ratio of about 1.0:1.0.
- 42. The cookie dough of claim 1 wherein the emulsifier prevents component separation of the cookie dough.
- 43. The cookie dough of claim 1 wherein the emulsifier comprises about 2-4 weight percent of the cookie dough.
- 44. The cookie dough of claim 1 wherein the emulsifier includes lactylate hydrate.
- 45. The cookie dough of claim 1 wherein the emulsifier includes lecithin.
- 46. The cookie dough of claim 1 wherein the emulsifier includes lactylate hydrate and lecithin.
- 47. The cookie dough of claim 46 wherein the emulsifier includes lactylate hydrate and lecithin in a ratio of about 3.0:1.0.
- 48. The cookie dough of claim 1 wherein the leavening provides a predetermined density to a baked cookie dough.
- 49. The cookie dough of claim 1 wherein the leavening comprises about 0.5-1.5 weight percent of the cookie dough.
- 50. The cookie dough of claim 1 wherein the leavening includes sodium bicarbonate.
- 51. The cookie dough of claim 50 wherein the sodium bicarbonate is encapsulated.
- 52. The cookie dough of claim 1 wherein the mold inhibitor comprises about 0.7-1.2 weight percent of the cookie dough.
- 53. The cookie dough of claim 1 wherein the mold inhibitor includes a salt of sorbic acid.
- 54. The cookie dough of claim 53 wherein the salt of sorbic acid is potassium sorbate.
- 55. The cookie dough of claim 1 comprising;
(a) about 20-40 weight percent flour; (b) about 20-40 weight percent sugar, including a fluid corn syrup/sugar blend; (c) about 10-20 weight percent shortening; (d) about 8-15 weight percent preserved eggs; (e) about 2-4 weight percent emulsifier; (f) about 0.5-1.5 weight percent leavening; and (g) about 0.07-0.12 weight percent mold inhibitor.
- 56. The cookie dough of claim 1 comprising;
(a) about 30-37 weight percent flour; (b) about 25-36 weight percent sugar, including a fluid corn syrup/sugar blend; (c) about 10-15 weight percent shortening; (d) about 10-14 weight percent preserved eggs; (e) about 2-4 weight percent emulsifier; (f) about 0.9-1.2 weight percent leavening; and (g) about 0.08-0.10 weight percent mold inhibitor.
- 57. The cookie dough of claim 1, further comprising salt to improve taste of the cookie dough.
- 58. The cookie dough of claim 1, further including salt comprising about 0.3-0.6 weight percent of the cookie dough.
- 59. The cookie dough of claim 1, further comprising flavoring to improve taste of the cookie dough.
- 60. The cookie dough of claim 1, further including flavoring comprising about 1.0-1.7 weight percent of the cookie dough.
- 61. The cookie dough of claim 59 wherein the flavoring includes vanillin flavoring.
- 62. The cookie dough of claim 59 wherein the flavoring includes a butter, vanillin, and lemon flavoring.
- 63. The cookie dough of claim 59 wherein the flavoring includes vanillin flavoring and a butter, vanillin, and lemon flavoring.
- 64. The cookie dough of claim 63 wherein the flavoring includes vanillin flavoring and a butter, vanillin, and lemon flavoring in a ratio of about 2.0:1.0.
- 65. The cookie dough of claim 1, further comprising edible particulates.
- 66. The cookie dough of claim 65, wherein the edible particulates comprise about 10-30 weight percent of the cookie dough.
- 67. The cookie dough of claim 65 wherein the edible particulates include chocolate chips.
- 68. The cookie dough of claim 65 wherein the edible particulates include white chocolate chunks and dark chocolate chunks.
- 69. The cookie dough of claim 65 wherein the edible particulates include candy bits.
- 70. The cookie dough of claim 65 wherein the edible particulates include cocoa.
- 71. The cookie dough of claim 65 wherein the edible particulates include raisins.
- 72. The cookie dough of claim 65 wherein the edible particulates include oatmeal.
- 73. A complete cookie dough, shelf stable at room temperature, comprising;
(a) a structure providing amount of flour; (b) a source of sugar in an amount of about 20 to 40 weight percent, including a fluid corn syrup/sugar blend; (c) an amount of shortening effective to enhance the organoleptic properties of the cookie dough; (d) an amount of eggs to provide body to the cookie dough; (e) an effective amount of emulsifier preventing component separation in the cookie dough; (f) an effective amount of an encapsulated leavening system to provide a predetermined density to a baked cookie dough; and (g) an effective amount of a mold inhibiting agent to prevent mold growth in the cookie dough, wherein the cookie dough has an Aw of less than about 0.75, a pH greater than about 7.0, and is shelf stable at room temperature.
- 74. The cookie dough of claim 73 wherein the flour comprises about 20-40 weight percent of the cookie dough.
- 75. The cookie dough of claim 73 wherein the flour includes bleached, enriched wheat flour and barley flour.
- 76. The cookie dough of claim 75 wherein the flour includes bleached, enriched wheat flour and barley flour in a ratio of about 10.0:1.0.
- 77. The cookie dough of claim 73 wherein the sugar includes sucrose.
- 78. The cookie dough of claim 77 wherein the sucrose includes white sugar and brown sugar.
- 79. The cookie dough of claim 78 wherein the sucrose includes white sugar and brown sugar in a ratio of about 1.7-1.0.
- 80. The cookie dough of claim 73 wherein the sugar includes sucrose mixed with the eggs as a preservative thereof.
- 81. The cookie dough of claim 73 wherein the sugar includes a fluid blend of corn syrup, fructose, and liquid sucrose.
- 82. The cookie dough of claim 73 wherein the sugar includes a fluid blend of about 63% corn syrup, about 8% fructose, about 28% liquid sucrose and about 1% imitation vanillin.
- 83. The cookie dough of claim 73 wherein the sugar includes sucrose and a fluid blend of corn syrup, fructose, and liquid sucrose.
- 84. The cookie dough of claim 83 wherein the sugar includes sucrose and a fluid blend of corn syrup, fructose, and liquid sucrose in a ratio of about 2.5:1.0.
- 85. The cookie dough of claim 73 wherein the sugar includes sucrose and sucrose mixed with the eggs as a preservative thereof.
- 86. The cookie dough of claim 73 wherein the sugar includes sucrose, a fluid blend of corn syrup, fructose, and liquid sucrose and sucrose mixed with the eggs as a preservative thereof.
- 87. The cookie dough of claim 73 wherein the shortening comprises about 10-20 weight percent of the cookie dough.
- 88. The cookie dough of claim 73 wherein the shortening includes solid shortening.
- 89. The cookie dough of claim 88 wherein the solid shortening includes hydrogenated soybean oil and cotton seed oil mixture.
- 90. The cookie dough of claim 73 wherein the shortening includes liquid shortening.
- 91. The cookie dough of claim 90 wherein the liquid shortening includes soybean oil.
- 92. The cookie dough of claim 73 wherein the shortening includes solid shortening and liquid shortening.
- 93. The cookie dough of claim 92 wherein the shortening includes solid shortening and liquid shortening in a ratio of about 3.0:1.0
- 94. The cookie dough of claim 92 wherein the solid shortening includes hydrogenated soybean oil and cotton seed oil mixture.
- 95. The cookie dough of claim 92 wherein the liquid shortening includes soybean oil.
- 96. The cookie dough of claim 92 wherein the shortening includes hydrogenated soybean oil and cotton seed oil mixture and soybean oil.
- 97. The cookie dough of claim 73 wherein the eggs include a preserved egg material comprising about 8-15 weight percent of the cookie dough.
- 98. The cookie dough of claim 73 wherein the eggs include a preserved egg material comprising whole eggs and sugar in a ratio of about 1.0:1.0.
- 99. The cookie dough of claim 73 wherein the emulsifier comprises about 2-4 weight percent of the cookie dough.
- 100. The cookie dough of claim 73 wherein the emulsifier includes lactylate hydrate.
- 101. The cookie dough of claim 73 wherein the emulsifier includes lecithin.
- 102. The cookie dough of claim 73 wherein the emulsifier includes lactylate hydrate and lecithin.
- 103. The cookie dough of claim 102 wherein the emulsifier includes lactylate hydrate and lecithin in a ratio of about 3.0:1.0.
- 104. The cookie dough of claim 73 wherein the leavening comprises about 0.5-1.5 weight percent of the cookie dough.
- 105. The cookie dough of claim 73 wherein the leavening includes sodium bicarbonate.
- 106. The cookie dough of claim 105 wherein the sodium bicarbonate is encapsulated.
- 107. The cookie dough of claim 73 wherein the mold inhibitor comprises about 0.07-0.12 weight percent of the cookie dough.
- 108. The cookie dough of claim 73 wherein the mold inhibitor includes a salt of sorbic acid.
- 109. The cookie dough of claim 108 wherein the salt of sorbic acid is potassium sorbate.
- 110. The cookie dough of claim 73 comprising;
(a) about 20-40 weight percent flour; (b) about 20-40 weight percent sugar, including a fluid corn syrup/sugar blend; (c) about 10-20 weight percent shortening; (d) about 8-15 weight percent preserved eggs; (e) about 2-4 weight percent emulsifier; (f) about 0.5-1.5 weight percent leavening; and (g) about 0.07-0.12 weight percent mold inhibitor.
- 111. The cookie dough of claim 73 comprising;
(a) about 30-37 weight percent flour; (b) about 25-36 weight percent sugar, including a fluid corn syrup/sugar blend; (c) about 10-15 weight percent shortening; (d) about 10-14 weight percent preserved eggs; (e) about 2-4 weight percent emulsifier; (f) about 0.9-1.2 weight percent leavening; and (g) about 0.08-0.10 weight percent mold inhibitor.
- 112. The cookie dough of claim 73, further including salt comprising about 0.3-0.6 weight percent of the cookie dough to improve taste thereof.
- 113. The cookie dough of claim 73, further including flavoring comprising about 1.0-1.7 weight percent of the cookie dough to improve taste thereof.
- 114. The cookie dough of claim 113 wherein the flavoring includes vanillin flavoring.
- 115. The cookie dough of claim 113 wherein the flavoring includes a butter, vanillin, and lemon flavoring.
- 116. The cookie dough of claim 113 wherein the flavoring includes vanillin flavoring and a butter, vanillin, and lemon flavoring.
- 117. The cookie dough of claim 116 wherein the flavoring includes vanillin flavoring and a butter, vanillin, lemon flavoring in a ratio of about 2.0:1.0.
- 118. The cookie dough of claim 73, further including edible particulates comprising about 10-30 weight percent of the cookie dough.
- 119. The cookie dough of claim 118 wherein the edible particulates includes chocolate chips.
- 120. The cookie dough of claim 118 wherein the edible particulates includes white chocolate chunks and dark chocolate chunks.
- 121. The cookie dough of claim 118 wherein the edible particulates includes candy bits.
- 122. The cookie dough of claim 118 wherein the edible particulates includes cocoa.
- 123. The cookie dough of claim 118 wherein the edible particulates includes raisins.
- 124. The cookie dough of claim 118 wherein the edible particulates includes oatmeal.
- 125. A complete cookie dough, shelf stable at room temperature, comprising;
(a) structure providing flour of about 30-37 weight percent; (b) sugar, including a fluid corn syrup/sugar blend, the sugar of about 25 to 36 weight percent; (c) shortening of about 10-15 weight percent, effective to enhance the organoleptic properties of the cookie dough; (d) preserved eggs of about 10-14 weight percent, providing body to the cookie dough; (e) emulsifier of about 2-4 weight percent, preventing dough component separation; (f) an encapsulated leavening system of about 0.9-1.2 weight percent, providing a predetermined density to a baked cookie dough; and (g) a mold inhibiting agent of about 0.08-0.10 weight percent, preventing mold growth in the cookie dough, wherein the cookie dough has an Aw of less than about 0.75, a pH greater than about 7.0, and is shelf stable at room temperature.
- 126. The complete cookie dough of claim 125, further including salt comprising about 0.3-0.6 weight percent of the cookie dough.
- 127. The complete cookie dough of claim 125, further including flavoring comprising about 1.0-1.7 weight percent of the cookie dough.
- 128. The complete cookie dough of claim 125, further including edible particulates comprising about 10-30 weight percent of the cookie dough.
- 129. A method for preparing a cookie dough, comprising the steps of;
(a) mixing sugar, a fluid corn syrup/sugar blend, shortening, eggs, emulsifier, flavoring, salt and mold inhibitor to form a creamed slurry; (b) mixing flour with the creamed slurry to produce a first dough mixture; and (c) mixing leavening with the first dough mixture to produce a final cookie dough product with an Aw of less than about 0.75, a pH greater than 7.0, the final cookie dough product being shelf stable at room temperature.
- 130. The method of claim 129, further comprising the step of;
mixing edible particulates with the final cookie dough product to form an edible particulates containing final cookie dough product.
- 131. The method of claim 130 wherein the edible particulates include chocolate chips.
- 132. The method of claim 130 wherein the edible particulates include dark chocolate chunks, white chocolate chunks and cocoa.
- 133. The method of claim 130 wherein sodium carbonate is included in mixing step (a) to form a creamed slurry, and the edible particulates include rolled oats and raisins.
- 134. The method of claim 129 wherein,
(a) flour comprises about 20-40 weight percent of the final cookie dough product; (b) sugar, including a fluid corn syrup/sugar blend, comprises about 20-40 weight percent of the final cookie dough product; (c) shortening comprises about 10-20 weight percent of the final cookie dough product; (d) preserved eggs comprises about 8-15 weight percent of the final cookie dough product; (e) emulsifier comprises about 2-4 weight percent of the final cookie dough product; (f) leavening comprises about 0.5-1.5 weight percent of the final cookie dough product; (g) flavoring comprises about 1.0-1.7 weight percent of the final cookie dough product; (h) salt comprises about 0.3-0.6 weight percent of the final cookie dough product; and (i) mold inhibitor comprises about 0.07-0.12 weight percent of the final cookie dough product.
- 135. The method of claim 130 wherein edible particulates comprise about 10-30 weight percent of the final cookie dough product.
- 136. The method of claim 129 wherein,
(a) flour comprises about 30-37 weight percent of the final cookie dough product; (b) sugar, including a fluid corn syrup/sugar blend, comprises about 25-36 weight percent of the final cookie dough product; (c) shortening comprises about 10-15 weight percent of the final cookie dough product; (d) preserved eggs comprises about 10-14 weight percent of the final cookie dough product; (e) emulsifier comprises about 2-4 weight percent of the final cookie dough product; (f) leavening comprises about 0.9-1.2 weight percent of the final cookie dough product; (g) flavoring comprises about 1.0-1.7 weight percent of the final cookie dough product; (h) salt comprises about 0.3-0.6 weight percent of the final cookie dough product; and (i) mold inhibitor comprises about 0.08-0.10 weight percent of the final cookie dough product.
- 137. A method for preparing a cookie dough comprising the steps of;
(a) mixing together selected amounts of sugar, fluid corn syrup/sugar blend, shortening, eggs, emulsifier, flavoring, salt and mold inhibitor to form a creamed slurry; (b) mixing a selected amount of flour with the creamed slurry to produce a first dough mixture; and (c) mixing a selected amount of leavening with the first dough mixture to produce a final cookie dough product with an Aw of less than about 0.75, a pH greater than 7.0, the final cookie dough product shelf stable at room temperature.
- 138. The method of claim 137, further comprising the step of;
mixing a selected amount of edible particulates with the final cookie dough product to form an edible particulate containing final cookie dough product.
- 139. The method of claim 138 wherein the edible particulates include chocolate chips.
- 140. The method of claim 138 wherein the edible particulates include dark chocolate chunks, white chocolate chunks and cocoa.
- 141. The method of claim 138 wherein sodium carbonate is included in mixing step (a) to form a creamed slurry, and the edible particulates include rolled oats and raisins.
- 142. The method of claim 137 wherein the selected amount of
(a) flour comprises about 30-37 weight percent of the final cookie dough product; (b) sugar, including a fluid corn syrup/sugar blend, comprises about 25-36 weight percent of the final cookie dough product; (c) shortening comprises about 10-15 weight percent of the final cookie dough product; (d) preserved eggs comprises about 10-14 weight percent of the final cookie dough product; (e) emulsifier comprises about 2-4 weight percent of the final cookie dough product; (f) leavening comprises about 0.9-1.2 weight percent of the final cookie dough product; (g) flavoring comprises about 1.0-1.7 weight percent of the final cookie dough product; (h) salt comprises about 0.3-0.6 weight percent of the final cookie dough product; and (i) mold inhibitor comprises about 0.08-0.10 weight percent of the final cookie dough product.
- 143. The method of claim 138 wherein the selected amount of edible particulates comprise about 10-30 weight percent of the edible particulate containing final cookie dough product.
CROSS-REFERENCE TO RELATED APPLICATIONS, IF ANY
[0001] This application claims the benefit under 35 U.S.C. §119 (e) of co-pending provisional application Serial No. 60/290,396, filed May 14, 2001. Application Serial No. 60/290,396 is hereby incorporated by reference.
Provisional Applications (1)
|
Number |
Date |
Country |
|
60290396 |
May 2001 |
US |