Claims
- 1. A semiconductor contactor which holds semiconductors under test on a test board, the contactor comprising:daughter card having a first plurality of electrical contacts; a socket adapted to receive a semiconductor, the socket being attached to the daughter card; a resilient contact pad positioned between the daughter card and the test board, the resilient contact pad electrically connecting the first plurality of electrical contacts on the daughter card to a second plurality of electrical contacts on the test board; and a plurality of floating assemblies which movably connect the daughter card to the test board and permit movement of the daughter card within a predefined range in relation to the test board, the resilient contact pad maintaining electrical connection between the first plurality of electrical contacts on the daughter card and the second plurality of electrical contacts on the test board throughout the predefined range of movement of the daughter card.
- 2. The semiconductor contactor of claim 1, wherein the daughter card is movable in any of the x-axis, the y-axis, or the z-axis in relation to the test board.
- 3. The semiconductor contactor of claim 1, wherein the resilient contact pad has a plurality of electrical conductors for each of the electrical contacts of the daughter card.
- 4. The semiconductor contactor of claim 1, wherein the resilient contact pad is an elastomeric connector.
- 5. The semiconductor contactor of claim 1, further comprising an adaptor which electrically connects the socket to the daughter card.
- 6. A method of holding a semiconductor device under test to a test board, the method comprising:movably attaching a daughter board to the test board, wherein the daughter board is movable with respect to the test board within a predefined range in three dimensions; connecting a socket to the daughter board, the socket being adapted to receive the semiconductor device; and positioning a compressible resilient contact pad between the daughter card and the test board, the resilient contact pad providing electrical connection from the daughter card to the test board throughout the predefined range of movement of the daughter card.
- 7. The method of claim 6, wherein the resilient contact pad is an elastomeric connector.
- 8. The method of claim 6, wherein the resilient contact pad is compressible.
- 9. The method of claim 6, further comprising compressing the resilient contact pad by movement of the daughter card toward the test board.
- 10. A semiconductor contactor which holds semiconductors under test on a test board, the contactor comprising:a daughter card having a first plurality of electrical contacts; a socket adapted to receive a semiconductor, the socket being attached to the daughter card; means for electrically connecting the first plurality of electrical contacts on the daughter card to a second plurality of electrical contacts on the test board; means for movably connecting the daughter card to the test board, the daughter card being movable within a predefined range with respect to the test board; and means for maintaining electrical connection between the first plurality of electrical contacts on the daughter card and the second plurality of electrical contacts on the test board throughout the predefined range of movement of the daughter card.
- 11. The semiconductor contactor of claim 10, wherein the means for maintaining electrical connection between the first plurality of electrical contacts on the daughter card and the second plurality of electrical contacts on the test board is an elastomeric connector.
RELATED APPLICATION
This application is a continuation of U.S. patent application Ser. No. 09/330,331, U.S. Pat. No. 6,259,263 B1 issued on Jul. 19, 2001, filed on Jun. 11, 1999, which is incorporated by reference herein.
US Referenced Citations (15)
Continuations (1)
|
Number |
Date |
Country |
Parent |
09/330331 |
Jun 1999 |
US |
Child |
09/877950 |
|
US |