Features relating to contacting the IC under test

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G01R31/2886

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GPHYSICS G01Measuring instruments G01RMEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES G01R31/00Arrangements for testing electric properties Arrangements for locating electric faults Arrangements for electrical testing characterised by what is being tested not provided for elsewhere

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G01R31/2886Features relating to contacting the IC under test

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with interface structure
- Patent number 12,181,518
- Issue date Dec 31, 2024
- NANYA TECHNOLOGY CORPORATION
- Chun-Huang Yu
- G01 - MEASURING TESTING
Information Patent Grant
Integrated circuit spike check probing apparatus and method
- Patent number 12,169,220
- Issue date Dec 17, 2024
- Texas Instruments Incorporated
- William Joshua Bush
- G01 - MEASURING TESTING
Information Patent Grant
Probe head and probe card comprising same
- Patent number 12,169,212
- Issue date Dec 17, 2024
- POINT ENGINEERING CO., LTD.
- Bum Mo Ahn
- G01 - MEASURING TESTING
Information Patent Grant
Apparatus for testing electronic devices
- Patent number 12,163,999
- Issue date Dec 10, 2024
- AEHR Test Systems
- Donald P. Richmond
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Chip-on-film test board
- Patent number 12,158,496
- Issue date Dec 3, 2024
- LX Semicon Co., Ltd.
- Min Suk Kim
- G01 - MEASURING TESTING
Information Patent Grant
Probe head and probe card comprising same
- Patent number 12,135,338
- Issue date Nov 5, 2024
- POINT ENGINEERING CO., LTD.
- Bum Mo Ahn
- G01 - MEASURING TESTING
Information Patent Grant
Semi-automatic prober
- Patent number 12,135,335
- Issue date Nov 5, 2024
- QualiTau, Inc.
- Edward McCloud
- G01 - MEASURING TESTING
Information Patent Grant
Substrate testing with three-dimensional scanning
- Patent number 12,135,348
- Issue date Nov 5, 2024
- Mellanox Technologies, Ltd.
- Barak Freedman
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Indirect acquisition of a signal from a device under test
- Patent number 12,135,353
- Issue date Nov 5, 2024
- Tektronix, Inc.
- Sam J. Strickling
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Dielectric resonating test contactor and method
- Patent number 12,123,897
- Issue date Oct 22, 2024
- Xcerra Corporation
- James Hattis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate yield prediction based on spectra data from...
- Patent number 12,111,355
- Issue date Oct 8, 2024
- Onto Innovation Inc.
- Xin Song
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Structure and method for testing of PIC with an upturned mirror
- Patent number 12,105,141
- Issue date Oct 1, 2024
- Lucas Soldano
- G01 - MEASURING TESTING
Information Patent Grant
Testing devices and method for testing semiconductor devices
- Patent number 12,092,655
- Issue date Sep 17, 2024
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fine pitch probe card
- Patent number 12,085,589
- Issue date Sep 10, 2024
- Xallent Inc.
- Kwame Amponsah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods to monitor leakage current
- Patent number 12,085,601
- Issue date Sep 10, 2024
- STMicroelectronics S.r.l.
- Romeo Letor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Managing photonic integrated circuit optical coupling
- Patent number 12,078,674
- Issue date Sep 3, 2024
- Ciena Corporation
- Jérôme Leclerc-Perron
- G01 - MEASURING TESTING
Information Patent Grant
Method and device for wafer-level testing
- Patent number 12,066,484
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jun He
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor wafer and multi-chip parallel testing method
- Patent number 12,066,486
- Issue date Aug 20, 2024
- Winbond Electronics Corp.
- Chih-Chiang Lai
- G01 - MEASURING TESTING
Information Patent Grant
Spring contact and socket having spring contact embedded therein
- Patent number 12,061,212
- Issue date Aug 13, 2024
- HICON CO., LTD.
- Dong Weon Hwang
- G01 - MEASURING TESTING
Information Patent Grant
Method of centering probe head in mounting frame
- Patent number 12,044,704
- Issue date Jul 23, 2024
- FormFactor, Inc.
- Kalyanjit Ghosh
- G01 - MEASURING TESTING
Information Patent Grant
Methods and systems for remote access hardware testing
- Patent number 12,044,728
- Issue date Jul 23, 2024
- DISH Network L.L.C.
- Mansoor Ahmed
- G01 - MEASURING TESTING
Information Patent Grant
Test system for memory card
- Patent number 12,038,470
- Issue date Jul 16, 2024
- Huawei Technologies Co., Ltd.
- Weiwen Pang
- G01 - MEASURING TESTING
Information Patent Grant
Flexible input/output (I/O) allocation for integrated circuit scan...
- Patent number 12,032,015
- Issue date Jul 9, 2024
- Amazon Technologies, Inc.
- Ilan Strulovici
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for wafer-level testing
- Patent number 12,025,655
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jun He
- G01 - MEASURING TESTING
Information Patent Grant
Maintenance apparatus, maintenance method, and recording medium hav...
- Patent number 12,014,335
- Issue date Jun 18, 2024
- Advantest Corporation
- Hajime Sugimura
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and testing apparatus related to wafer testing
- Patent number 12,013,431
- Issue date Jun 18, 2024
- NANYA TECHNOLOGY CORPORATION
- Ting Wei Yu
- G01 - MEASURING TESTING
Information Patent Grant
Manufacturing method of integrated substrate
- Patent number 12,009,329
- Issue date Jun 11, 2024
- Dyi-Chung Hu
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor test apparatus and semiconductor test method
- Patent number 12,007,414
- Issue date Jun 11, 2024
- Mitsubishi Electric Corporation
- Yoshiyuki Ueda
- G01 - MEASURING TESTING
Information Patent Grant
Detection unit, semiconductor film layer inspection apparatus inclu...
- Patent number 12,000,866
- Issue date Jun 4, 2024
- EnVigth Co., Ltd.
- Hyoung Sik Kim
- G01 - MEASURING TESTING
Information Patent Grant
Resonant-coupled transmission line
- Patent number 12,004,288
- Issue date Jun 4, 2024
- Teradyne, Inc.
- Andrew Westwood
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
TEST SOCKET FOR 224GBPS ULTRA-HIGH-SPEED COAXIAL TESTING
- Publication number 20250020688
- Publication date Jan 16, 2025
- SOLARIS NANOFAB LTD.
- Yuanjun Shi
- G01 - MEASURING TESTING
Information Patent Application
ADHERED MULTILAYER DIE UNIT AND PROBE HEAD, PROBE SEAT, PROBE CARD...
- Publication number 20250020692
- Publication date Jan 16, 2025
- MPI Corporation
- SHENG-YU LIN
- G01 - MEASURING TESTING
Information Patent Application
STRUCTURE AND METHOD FOR TESTING OF PIC WITH AN UPTURNED MIRROR
- Publication number 20250020716
- Publication date Jan 16, 2025
- POET Technologies, Inc.
- Lucas Soldano
- G01 - MEASURING TESTING
Information Patent Application
SYSTEM AND METHOD FOR TESTING AN INTEGRITY OF A FACE SEAL IN AN ELE...
- Publication number 20250012856
- Publication date Jan 9, 2025
- HAMILTON SUNDSTRAND CORPORATION
- Rajkumar Sengodan
- G01 - MEASURING TESTING
Information Patent Application
TESTING PADDLE FOR SEMICONDUCTOR DEVICE CHARACTERIZATION
- Publication number 20240426904
- Publication date Dec 26, 2024
- Western Digital Technologies, Inc.
- Lenny Rayzman
- G01 - MEASURING TESTING
Information Patent Application
ADAPTIVE FLEXIBLE CHIP TEST SOCKET AND FORMATION METHOD THEREOF
- Publication number 20240410917
- Publication date Dec 12, 2024
- SEMIGHT INSTRUMENTS CO., LTD
- Zhe LIAN
- G01 - MEASURING TESTING
Information Patent Application
CHIP TEST PRESSING-DOWN APPARATUS AND FORMATION METHOD THEREOF
- Publication number 20240410935
- Publication date Dec 12, 2024
- SEMIGHT INSTRUMENTS CO., LTD
- Zhe LIAN
- G01 - MEASURING TESTING
Information Patent Application
MASS-PRODUCTION TESTING FOR LAUNCHER-IN-PACKAGE WITH THROUGH-BOARD...
- Publication number 20240402244
- Publication date Dec 5, 2024
- NXP B.V.
- Giorgio Carluccio
- G01 - MEASURING TESTING
Information Patent Application
ADJUSTABLE TEST ADAPTER APPARATUS AND SYSTEM FOR MULTIPLE QFN DEVIC...
- Publication number 20240402242
- Publication date Dec 5, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Ian Samuel Vibar
- G01 - MEASURING TESTING
Information Patent Application
TEST PIN STRUCTURE
- Publication number 20240393366
- Publication date Nov 28, 2024
- Cheong Kheng OOI
- G01 - MEASURING TESTING
Information Patent Application
CANTILEVER PROBE CARD DEVICE AND SOLDER RECEIVING PROBE
- Publication number 20240385223
- Publication date Nov 21, 2024
- CHUNGHWA PRECISION TEST TECH. CO., LTD.
- HAO-YEN CHENG
- G01 - MEASURING TESTING
Information Patent Application
CONTACTOR FOR MULTI DEVICE SOCKETS AND RELATED
- Publication number 20240377454
- Publication date Nov 14, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Raffy CELIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROBE CARD DEVICE
- Publication number 20240369599
- Publication date Nov 7, 2024
- Silicon Future Manufacturing Company Ltd.
- TIEN-CHIA LEE
- G01 - MEASURING TESTING
Information Patent Application
METHOD AND DEVICE FOR WAFER-LEVEL TESTING
- Publication number 20240361380
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- JUN HE
- G01 - MEASURING TESTING
Information Patent Application
METHODS AND SYSTEMS FOR REMOTE ACCESS HARDWARE TESTING
- Publication number 20240345158
- Publication date Oct 17, 2024
- Dish Network L.L.C.
- Mansoor Ahmed
- G01 - MEASURING TESTING
Information Patent Application
TEST APPARATUS FOR SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING...
- Publication number 20240345156
- Publication date Oct 17, 2024
- Mitsubishi Electric Corporation
- Takuya YOSHIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROBE CARD AND CALIBRATION METHOD FOR PROBER
- Publication number 20240337678
- Publication date Oct 10, 2024
- United Microelectronics Corp.
- Huan-Chen Peng
- G01 - MEASURING TESTING
Information Patent Application
APPARATUS FOR TESTING SEMICONDUCTOR PACKAGE
- Publication number 20240337688
- Publication date Oct 10, 2024
- TSE CO., LTD.
- Dae Hyun ROH
- G01 - MEASURING TESTING
Information Patent Application
Apparatus and Method for Testing Semiconductor Devices
- Publication number 20240329134
- Publication date Oct 3, 2024
- Testmetrix, Inc.
- Christian O. Cojocneanu
- G01 - MEASURING TESTING
Information Patent Application
METHOD AND SYSTEM FOR WAFER-LEVEL TESTING
- Publication number 20240310434
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- JUN HE
- G01 - MEASURING TESTING
Information Patent Application
ELECTRICAL TEST CONTACT TERMINAL FOR A PIN-TYPE DEVICE LEAD
- Publication number 20240280607
- Publication date Aug 22, 2024
- JF Microtechnology Sdn. Bhd.
- Wei Kuong Foong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GROUND-SIGNAL-GROUND DEVICE STRUCTURE
- Publication number 20240264224
- Publication date Aug 8, 2024
- UNITED MICROELECTRONICS CORP.
- Ching-Wen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROBE CARD
- Publication number 20240264038
- Publication date Aug 8, 2024
- SK HYNIX INC.
- Sung Wook CHO
- G01 - MEASURING TESTING
Information Patent Application
SOCKET, JIG, SOCKET MAINTENANCE SET, AND DISASSEMBLY METHOD
- Publication number 20240241172
- Publication date Jul 18, 2024
- YOKOWO CO., LTD.
- Kohei AMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROLLING ALIGNMENT DURING A THERMAL CYCLE
- Publication number 20240230714
- Publication date Jul 11, 2024
- Aehr Test Systems
- Scott E. Lindsey
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR TEST APPARATUS AND SEMICONDUCTOR TEST METHOD
- Publication number 20240219426
- Publication date Jul 4, 2024
- Mitsubishi Electric Corporation
- Yoshiyuki Ueda
- G01 - MEASURING TESTING
Information Patent Application
CHIP SOCKET, TESTING FIXTURE AND CHIP TESTING METHOD THEREOF
- Publication number 20240192252
- Publication date Jun 13, 2024
- NANYA TECHNOLOGY CORPORATION
- SHIH-TING LIN
- G01 - MEASURING TESTING
Information Patent Application
TEST SYSTEM FOR TESTING SEMICONDUCTOR DEVICES
- Publication number 20240183878
- Publication date Jun 6, 2024
- TAIWAN MASK CORPORATION
- Chih-Ming CHEN
- G01 - MEASURING TESTING
Information Patent Application
Probe head for wafer-level burn-in test (WLBI) and probe card compr...
- Publication number 20240183882
- Publication date Jun 6, 2024
- Microsoft S.p.A
- Giuseppe AMELIO
- G01 - MEASURING TESTING
Information Patent Application
METHOD FOR ACCURATE REFERENCE VOLTAGE TRIMMING
- Publication number 20240175913
- Publication date May 30, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Kar Hou Chai
- G01 - MEASURING TESTING

Features relating to contacting the IC under test

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device with interface structure

Integrated circuit spike check probing apparatus and method

Probe head and probe card comprising same

Apparatus for testing electronic devices

Chip-on-film test board

Probe head and probe card comprising same

Semi-automatic prober

Substrate testing with three-dimensional scanning

Indirect acquisition of a signal from a device under test

Dielectric resonating test contactor and method

Semiconductor substrate yield prediction based on spectra data from...

Structure and method for testing of PIC with an upturned mirror

Testing devices and method for testing semiconductor devices

Fine pitch probe card

Systems and methods to monitor leakage current

Managing photonic integrated circuit optical coupling

Method and device for wafer-level testing

Semiconductor wafer and multi-chip parallel testing method

Spring contact and socket having spring contact embedded therein

Method of centering probe head in mounting frame

Methods and systems for remote access hardware testing

Test system for memory card

Flexible input/output (I/O) allocation for integrated circuit scan...

Method and system for wafer-level testing

Maintenance apparatus, maintenance method, and recording medium hav...

Method and testing apparatus related to wafer testing

Manufacturing method of integrated substrate

Semiconductor test apparatus and semiconductor test method

Detection unit, semiconductor film layer inspection apparatus inclu...

Resonant-coupled transmission line

Patents Applicationslast 30 patents

TEST SOCKET FOR 224GBPS ULTRA-HIGH-SPEED COAXIAL TESTING

ADHERED MULTILAYER DIE UNIT AND PROBE HEAD, PROBE SEAT, PROBE CARD...

STRUCTURE AND METHOD FOR TESTING OF PIC WITH AN UPTURNED MIRROR

SYSTEM AND METHOD FOR TESTING AN INTEGRITY OF A FACE SEAL IN AN ELE...

TESTING PADDLE FOR SEMICONDUCTOR DEVICE CHARACTERIZATION

ADAPTIVE FLEXIBLE CHIP TEST SOCKET AND FORMATION METHOD THEREOF

CHIP TEST PRESSING-DOWN APPARATUS AND FORMATION METHOD THEREOF

MASS-PRODUCTION TESTING FOR LAUNCHER-IN-PACKAGE WITH THROUGH-BOARD...

ADJUSTABLE TEST ADAPTER APPARATUS AND SYSTEM FOR MULTIPLE QFN DEVIC...

TEST PIN STRUCTURE

CANTILEVER PROBE CARD DEVICE AND SOLDER RECEIVING PROBE

CONTACTOR FOR MULTI DEVICE SOCKETS AND RELATED

PROBE CARD DEVICE

METHOD AND DEVICE FOR WAFER-LEVEL TESTING

METHODS AND SYSTEMS FOR REMOTE ACCESS HARDWARE TESTING

TEST APPARATUS FOR SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING...

PROBE CARD AND CALIBRATION METHOD FOR PROBER

APPARATUS FOR TESTING SEMICONDUCTOR PACKAGE

Apparatus and Method for Testing Semiconductor Devices

METHOD AND SYSTEM FOR WAFER-LEVEL TESTING

ELECTRICAL TEST CONTACT TERMINAL FOR A PIN-TYPE DEVICE LEAD

GROUND-SIGNAL-GROUND DEVICE STRUCTURE

PROBE CARD

SOCKET, JIG, SOCKET MAINTENANCE SET, AND DISASSEMBLY METHOD

CONTROLLING ALIGNMENT DURING A THERMAL CYCLE

SEMICONDUCTOR TEST APPARATUS AND SEMICONDUCTOR TEST METHOD

CHIP SOCKET, TESTING FIXTURE AND CHIP TESTING METHOD THEREOF

TEST SYSTEM FOR TESTING SEMICONDUCTOR DEVICES

Probe head for wafer-level burn-in test (WLBI) and probe card compr...

METHOD FOR ACCURATE REFERENCE VOLTAGE TRIMMING