Features relating to contacting the IC under test

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G01R31/2886

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GPHYSICS G01Measuring instruments G01RMEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES G01R31/00Arrangements for testing electric properties Arrangements for locating electric faults Arrangements for electrical testing characterised by what is being tested not provided for elsewhere

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G01R31/2886Features relating to contacting the IC under test

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor test apparatus and semiconductor test method
- Patent number 12,345,739
- Issue date Jul 1, 2025
- Mitsubishi Electric Corporation
- Yoshiyuki Ueda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Probe card substrate, substrate structure and method of fabricating...
- Patent number 12,345,740
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Yu Chen
- G01 - MEASURING TESTING
Information Patent Grant
Mass-production testing for launcher-in-package with through-board...
- Patent number 12,339,316
- Issue date Jun 24, 2025
- NXP B.V.
- Giorgio Carluccio
- G01 - MEASURING TESTING
Information Patent Grant
Test socket connector having latch with a bottom guiding portion
- Patent number 12,326,461
- Issue date Jun 10, 2025
- FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD.
- Ming-Yue Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for wafer-level testing
- Patent number 12,313,675
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jun He
- G01 - MEASURING TESTING
Information Patent Grant
Controlling alignment during a thermal cycle
- Patent number 12,298,328
- Issue date May 13, 2025
- AEHR Test Systems
- Scott E. Lindsey
- G01 - MEASURING TESTING
Information Patent Grant
Chip socket, testing fixture and chip testing method thereof
- Patent number 12,292,455
- Issue date May 6, 2025
- NANYA TECHNOLOGY CORPORATION
- Shih-Ting Lin
- G11 - INFORMATION STORAGE
Information Patent Grant
Probe card
- Patent number 12,270,828
- Issue date Apr 8, 2025
- POINT ENGINEERING CO., LTD.
- Bum Mo Ahn
- G01 - MEASURING TESTING
Information Patent Grant
Method and system for wafer-level testing
- Patent number 12,270,852
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jun He
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device including through-package debug features
- Patent number 12,272,609
- Issue date Apr 8, 2025
- SanDisk Technologies, Inc.
- Nir Amir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit test structure and method of using
- Patent number 12,253,558
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Fang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lidless BGA socket apparatus for testing semiconductor device
- Patent number 12,248,001
- Issue date Mar 11, 2025
- HICON CO., LTD.
- Dong Weon Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Constant force ultrasound probe handle
- Patent number 12,248,002
- Issue date Mar 11, 2025
- New York Society for the Relief of the Ruptured and Crippled, Maintaining the...
- Daniel R. Sturnick
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Adaptive flexible chip test socket and formation method thereof
- Patent number 12,216,139
- Issue date Feb 4, 2025
- SEMIGHT INSTRUMENTS CO., LTD
- Zhe Lian
- G01 - MEASURING TESTING
Information Patent Grant
Chip test pressing-down apparatus and formation method thereof
- Patent number 12,216,156
- Issue date Feb 4, 2025
- SEMIGHT INSTRUMENTS CO., LTD
- Zhe Lian
- G01 - MEASURING TESTING
Information Patent Grant
Method for accurate reference voltage trimming
- Patent number 12,210,054
- Issue date Jan 28, 2025
- Texas Instruments Incorporated
- Kar Hou Chai
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device with interface structure
- Patent number 12,181,518
- Issue date Dec 31, 2024
- NANYA TECHNOLOGY CORPORATION
- Chun-Huang Yu
- G01 - MEASURING TESTING
Information Patent Grant
Integrated circuit spike check probing apparatus and method
- Patent number 12,169,220
- Issue date Dec 17, 2024
- Texas Instruments Incorporated
- William Joshua Bush
- G01 - MEASURING TESTING
Information Patent Grant
Probe head and probe card comprising same
- Patent number 12,169,212
- Issue date Dec 17, 2024
- POINT ENGINEERING CO., LTD.
- Bum Mo Ahn
- G01 - MEASURING TESTING
Information Patent Grant
Apparatus for testing electronic devices
- Patent number 12,163,999
- Issue date Dec 10, 2024
- AEHR Test Systems
- Donald P. Richmond
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Chip-on-film test board
- Patent number 12,158,496
- Issue date Dec 3, 2024
- LX Semicon Co., Ltd.
- Min Suk Kim
- G01 - MEASURING TESTING
Information Patent Grant
Probe head and probe card comprising same
- Patent number 12,135,338
- Issue date Nov 5, 2024
- POINT ENGINEERING CO., LTD.
- Bum Mo Ahn
- G01 - MEASURING TESTING
Information Patent Grant
Substrate testing with three-dimensional scanning
- Patent number 12,135,348
- Issue date Nov 5, 2024
- Mellanox Technologies, Ltd.
- Barak Freedman
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Indirect acquisition of a signal from a device under test
- Patent number 12,135,353
- Issue date Nov 5, 2024
- Tektronix, Inc.
- Sam J. Strickling
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semi-automatic prober
- Patent number 12,135,335
- Issue date Nov 5, 2024
- QualiTau, Inc.
- Edward McCloud
- G01 - MEASURING TESTING
Information Patent Grant
Dielectric resonating test contactor and method
- Patent number 12,123,897
- Issue date Oct 22, 2024
- Xcerra Corporation
- James Hattis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate yield prediction based on spectra data from...
- Patent number 12,111,355
- Issue date Oct 8, 2024
- Onto Innovation Inc.
- Xin Song
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Structure and method for testing of PIC with an upturned mirror
- Patent number 12,105,141
- Issue date Oct 1, 2024
- Lucas Soldano
- G01 - MEASURING TESTING
Information Patent Grant
Testing devices and method for testing semiconductor devices
- Patent number 12,092,655
- Issue date Sep 17, 2024
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fine pitch probe card
- Patent number 12,085,589
- Issue date Sep 10, 2024
- Xallent Inc.
- Kwame Amponsah
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
TESTING METHOD, DEVICE UNDER TEST, PROBE CARD AND PROBE SYSTEM FOR...
- Publication number 20250231219
- Publication date Jul 17, 2025
- MPI Corporation
- CHIN-TIEN YANG
- G01 - MEASURING TESTING
Information Patent Application
BURN-IN BOARD AND BURN-IN TEST METHOD USING THE SAME
- Publication number 20250224440
- Publication date Jul 10, 2025
- Samsung Electronics Co., Ltd.
- Seonhaeng LEE
- G01 - MEASURING TESTING
Information Patent Application
SYSTEM FOR TESTING AN INTEGRATED CIRCUIT OF A DEVICE AND ITS METHOD...
- Publication number 20250224423
- Publication date Jul 10, 2025
- Aehr Test Systems
- Scott E. Lindsey
- G01 - MEASURING TESTING
Information Patent Application
PROCEDURE FOR MAKING ON-DIE-PARAMETRIC MEASUREMENTS OF CIRCUIT DEVICES
- Publication number 20250216447
- Publication date Jul 3, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Jordan Wenske
- G01 - MEASURING TESTING
Information Patent Application
PROBE HEAD FOR LOOPBACK TESTING AND METHODS OF FORMING THE SAME
- Publication number 20250216419
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Tsai-Ning LU
- G01 - MEASURING TESTING
Information Patent Application
TEST DEVICE FOR OPTOELECTRONIC INTEGRATED CIRCUIT BEFORE BEING CO-P...
- Publication number 20250216450
- Publication date Jul 3, 2025
- CHUNGHWA PRECISION TEST TECH. CO., LTD.
- Jhih-hong CHENG
- G01 - MEASURING TESTING
Information Patent Application
SKELETON ETCH FOR SEMICONDUCTOR CHIPS
- Publication number 20250201707
- Publication date Jun 19, 2025
- Intel Corporation
- Shida TAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP TESTING DEVICE AND METHOD OF OPERATING THEREOF
- Publication number 20250199030
- Publication date Jun 19, 2025
- KINGTIGER TESTING INC.
- Aihua Wang
- G01 - MEASURING TESTING
Information Patent Application
PROBE SYSTEM, PROBE CARD, PROBE HEAD, AND PROBE FOR TESTING ELECTRO...
- Publication number 20250172589
- Publication date May 29, 2025
- MPI CORPORATION
- Chin-Tien YANG
- G01 - MEASURING TESTING
Information Patent Application
METHOD OF USING CIRCUIT TEST STRUCTURE
- Publication number 20250164548
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Fang CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VOLTAGE AND CURRENT PROBE ASSEMBLIES FOR RADIO FREQUENCY CURRENT CA...
- Publication number 20250164526
- Publication date May 22, 2025
- LAM RESEARCH CORPORATION
- John PEASE
- G01 - MEASURING TESTING
Information Patent Application
PROBE CARD PMIC AND SIGNAL SWITCH IC SUPPORTING EFFICIENT CHANNEL C...
- Publication number 20250138051
- Publication date May 1, 2025
- TECHWIDU CO., LTD.
- Hyoung-Suk YOO
- G01 - MEASURING TESTING
Information Patent Application
ELECTRO-OPTICAL PROBING AND MECHANICAL MICROPROBING OF MEMORY DIE U...
- Publication number 20250123305
- Publication date Apr 17, 2025
- Micron Technology, Inc.
- Soeparto Tandjoeng
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR TESTING APPARATUS AND METHOD FOR TESTING SEMICONDUCTO...
- Publication number 20250116698
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hsuan CHANG
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR PACKAGE INSPECTION DEVICE
- Publication number 20250116684
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- Hyun YANG
- G01 - MEASURING TESTING
Information Patent Application
DEVICE VARIATION EXTRACTION CHIP
- Publication number 20250102556
- Publication date Mar 27, 2025
- Shanghai Huali Integrated Circuit Corporation
- Pinhan CHEN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DEVICE INSPECTION APPARATUS AND DEVICE INSPECTION METHOD
- Publication number 20250102566
- Publication date Mar 27, 2025
- Mitsubishi Electric Corporation
- Takayuki ONAKA
- G01 - MEASURING TESTING
Information Patent Application
TESTING APPARATUS FOR POWER MODULE WITH INTEGRATED DC TEST AND WITH...
- Publication number 20250076390
- Publication date Mar 6, 2025
- Hyundai Motor Company
- Tae Woo KWANG
- G01 - MEASURING TESTING
Information Patent Application
PROBE PIN AND PROBE CARD
- Publication number 20250052784
- Publication date Feb 13, 2025
- JAPAN ELECTRONIC MATERIALS CORPORATION
- Koki OKUMA
- G01 - MEASURING TESTING
Information Patent Application
WAFER PROBE STATION AND METHOD FOR ESTABLISHING AN EVALUATION MODEL...
- Publication number 20250044346
- Publication date Feb 6, 2025
- MPI CORPORATION
- ANDREJ RUMIANTSEV
- G01 - MEASURING TESTING
Information Patent Application
CONTACT PROBE AND CONTACTING MEMBER THEREOF, METHOD OF MANUFACTURIN...
- Publication number 20250035671
- Publication date Jan 30, 2025
- MPI Corporation
- CHENG-NIEN SU
- G01 - MEASURING TESTING
Information Patent Application
TEST SOCKET FOR 224GBPS ULTRA-HIGH-SPEED COAXIAL TESTING
- Publication number 20250020688
- Publication date Jan 16, 2025
- SOLARIS NANOFAB LTD.
- Yuanjun Shi
- G01 - MEASURING TESTING
Information Patent Application
ADHERED MULTILAYER DIE UNIT AND PROBE HEAD, PROBE SEAT, PROBE CARD...
- Publication number 20250020692
- Publication date Jan 16, 2025
- MPI Corporation
- SHENG-YU LIN
- G01 - MEASURING TESTING
Information Patent Application
STRUCTURE AND METHOD FOR TESTING OF PIC WITH AN UPTURNED MIRROR
- Publication number 20250020716
- Publication date Jan 16, 2025
- POET Technologies, Inc.
- Lucas Soldano
- G01 - MEASURING TESTING
Information Patent Application
SYSTEM AND METHOD FOR TESTING AN INTEGRITY OF A FACE SEAL IN AN ELE...
- Publication number 20250012856
- Publication date Jan 9, 2025
- HAMILTON SUNDSTRAND CORPORATION
- Rajkumar Sengodan
- G01 - MEASURING TESTING
Information Patent Application
TESTING PADDLE FOR SEMICONDUCTOR DEVICE CHARACTERIZATION
- Publication number 20240426904
- Publication date Dec 26, 2024
- Western Digital Technologies, Inc.
- Lenny Rayzman
- G01 - MEASURING TESTING
Information Patent Application
ADAPTIVE FLEXIBLE CHIP TEST SOCKET AND FORMATION METHOD THEREOF
- Publication number 20240410917
- Publication date Dec 12, 2024
- SEMIGHT INSTRUMENTS CO., LTD
- Zhe LIAN
- G01 - MEASURING TESTING
Information Patent Application
CHIP TEST PRESSING-DOWN APPARATUS AND FORMATION METHOD THEREOF
- Publication number 20240410935
- Publication date Dec 12, 2024
- SEMIGHT INSTRUMENTS CO., LTD
- Zhe LIAN
- G01 - MEASURING TESTING
Information Patent Application
MASS-PRODUCTION TESTING FOR LAUNCHER-IN-PACKAGE WITH THROUGH-BOARD...
- Publication number 20240402244
- Publication date Dec 5, 2024
- NXP B.V.
- Giorgio Carluccio
- G01 - MEASURING TESTING
Information Patent Application
ADJUSTABLE TEST ADAPTER APPARATUS AND SYSTEM FOR MULTIPLE QFN DEVIC...
- Publication number 20240402242
- Publication date Dec 5, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Ian Samuel Vibar
- G01 - MEASURING TESTING

Features relating to contacting the IC under test

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor test apparatus and semiconductor test method

Probe card substrate, substrate structure and method of fabricating...

Mass-production testing for launcher-in-package with through-board...

Test socket connector having latch with a bottom guiding portion

Method and device for wafer-level testing

Controlling alignment during a thermal cycle

Chip socket, testing fixture and chip testing method thereof

Probe card

Method and system for wafer-level testing

Semiconductor device including through-package debug features

Circuit test structure and method of using

Lidless BGA socket apparatus for testing semiconductor device

Constant force ultrasound probe handle

Adaptive flexible chip test socket and formation method thereof

Chip test pressing-down apparatus and formation method thereof

Method for accurate reference voltage trimming

Semiconductor device with interface structure

Integrated circuit spike check probing apparatus and method

Probe head and probe card comprising same

Apparatus for testing electronic devices

Chip-on-film test board

Probe head and probe card comprising same

Substrate testing with three-dimensional scanning

Indirect acquisition of a signal from a device under test

Semi-automatic prober

Dielectric resonating test contactor and method

Semiconductor substrate yield prediction based on spectra data from...

Structure and method for testing of PIC with an upturned mirror

Testing devices and method for testing semiconductor devices

Fine pitch probe card

Patents Applicationslast 30 patents

TESTING METHOD, DEVICE UNDER TEST, PROBE CARD AND PROBE SYSTEM FOR...

BURN-IN BOARD AND BURN-IN TEST METHOD USING THE SAME

SYSTEM FOR TESTING AN INTEGRATED CIRCUIT OF A DEVICE AND ITS METHOD...

PROCEDURE FOR MAKING ON-DIE-PARAMETRIC MEASUREMENTS OF CIRCUIT DEVICES

PROBE HEAD FOR LOOPBACK TESTING AND METHODS OF FORMING THE SAME

TEST DEVICE FOR OPTOELECTRONIC INTEGRATED CIRCUIT BEFORE BEING CO-P...

SKELETON ETCH FOR SEMICONDUCTOR CHIPS

CHIP TESTING DEVICE AND METHOD OF OPERATING THEREOF

PROBE SYSTEM, PROBE CARD, PROBE HEAD, AND PROBE FOR TESTING ELECTRO...

METHOD OF USING CIRCUIT TEST STRUCTURE

VOLTAGE AND CURRENT PROBE ASSEMBLIES FOR RADIO FREQUENCY CURRENT CA...

PROBE CARD PMIC AND SIGNAL SWITCH IC SUPPORTING EFFICIENT CHANNEL C...

ELECTRO-OPTICAL PROBING AND MECHANICAL MICROPROBING OF MEMORY DIE U...

SEMICONDUCTOR TESTING APPARATUS AND METHOD FOR TESTING SEMICONDUCTO...

SEMICONDUCTOR PACKAGE INSPECTION DEVICE

DEVICE VARIATION EXTRACTION CHIP

DEVICE INSPECTION APPARATUS AND DEVICE INSPECTION METHOD

TESTING APPARATUS FOR POWER MODULE WITH INTEGRATED DC TEST AND WITH...

PROBE PIN AND PROBE CARD

WAFER PROBE STATION AND METHOD FOR ESTABLISHING AN EVALUATION MODEL...

CONTACT PROBE AND CONTACTING MEMBER THEREOF, METHOD OF MANUFACTURIN...

TEST SOCKET FOR 224GBPS ULTRA-HIGH-SPEED COAXIAL TESTING

ADHERED MULTILAYER DIE UNIT AND PROBE HEAD, PROBE SEAT, PROBE CARD...

STRUCTURE AND METHOD FOR TESTING OF PIC WITH AN UPTURNED MIRROR

SYSTEM AND METHOD FOR TESTING AN INTEGRITY OF A FACE SEAL IN AN ELE...

TESTING PADDLE FOR SEMICONDUCTOR DEVICE CHARACTERIZATION

ADAPTIVE FLEXIBLE CHIP TEST SOCKET AND FORMATION METHOD THEREOF

CHIP TEST PRESSING-DOWN APPARATUS AND FORMATION METHOD THEREOF

MASS-PRODUCTION TESTING FOR LAUNCHER-IN-PACKAGE WITH THROUGH-BOARD...

ADJUSTABLE TEST ADAPTER APPARATUS AND SYSTEM FOR MULTIPLE QFN DEVIC...