The present disclosure relates to a composite sheet for use as a heat-insulating device of various electronic apparatuses, and to a method of manufacturing the sheet.
In recent years, rapid progress in various functions and processing abilities of electronic apparatuses has brought about a tendency for their electronic components, most notably semiconductor devices, to generate increased amounts of heat. Such an increased heat generation from the electronic components poses problems that, for example, the shell of a smartphone is partially heated to high temperatures, leading to possible uncomfortable feeling of a user of the phone.
A solution to the above problem attributed to the heat generation of such electronic components includes mainly diffusing the generated heat with a heat-conducting sheet, and mainly insulating the generated heat with a heat-insulating sheet.
Such a heat-insulating sheet includes a silica xerogel held in a sheet made of a fiber aggregate.
A technology associated with the above heat-insulating sheet is disclosed in PTL 1.
PTL 1: Japanese Patent Laid-Open Publication No. 2011-136859
A composite sheet according to the present disclosure includes a heat-insulating sheet which includes a fiber sheet made of fibers and a xerogel held between the fibers. The composite sheet further includes a first electrical-insulation film disposed on a first surface of the heat-insulating sheet. The fiber sheet is fusion-bonded to the first surface of the first electrical-insulation film.
Embodiment 1.
A heat-insulating sheet disclosed in Patent Literature 1 uses a silica xerogel that exhibits low bonding strength among particles of the silica xerogel. When another member is bonded to the silica xerogel with an adhesive, the member may be peeled from between the particles of the silica xerogel.
Hereinafter, descriptions will be made regarding a heat-insulating sheet which can solve the problems described above, with reference to the accompanying drawings. It is noted, however, that each of exemplary embodiments described below is nothing more than a specific example. Numerical values, shapes, materials, constituent elements, arrangements and connections of the constituent elements, steps, processing orders of the steps, etc. shown in the following exemplary embodiments are mere examples, and therefore are not intended to limit the present invention. Moreover, of the constituent elements in the following exemplary embodiments, constituent elements not recited in any one of the independent claims which define the most generic concept are described as optional constituent elements. Note that, hereinafter, the same or functionally equivalent elements are designated by the same numerals and symbols throughout the figures, and their duplicate explanations are omitted.
As shown in
As shown in
Silica xerogel 12 is an aggregate of silica particles. The size of each silica particle is about several nanometers. Silica xerogel 12 has fine pores between the silica particles. The size of each pore is so small that no convection of air occurs through the pore. This results in a very small amount of gas-phase thermal conduction. Moreover, about 90% of the volume of silica xerogel 12 is occupied with air, resulting in a very small amount of solid-phase thermal conduction. For this reason, the thermal conductivity of sheet 13 is so small, i.e. ranging from about 0.018 to about 0.024 W/m•K, that the sheet is useful as a heat-insulating material.
Composite sheet 15 includes electrical-insulation film 14 and fiber sheet 11 bonded to electrical-insulation film 14. This bonding is made by thermal fusion-bonding such that surface 41 of the electrical-insulation film is bonded to portions of fibers 11a of the fiber sheet of heat-insulating sheet 13 exposed on surface 31 of heat-insulating sheet 13. Electrical-insulation film 14 and fiber sheet 11 are bonded by thermal fusion-bonding into a one-piece body, providing strong bonding between electrical-insulation film 14 and fiber sheet 11. Temperature characteristics, such as a melting temperature and a curing temperature, of the material configuring fiber sheet 11 are preferably close to those of the material of electrical-insulation film 14. The closer the temperature characteristics of the materials of fiber sheet 11 and electrical-insulation film 14 are, the more easily the thermal fusion-bonding between fiber sheet 11 and electrical-insulation film 14 can be carried out, providing a strong bonding. For this reason, both fiber sheet 11 and electrical-insulation film 14 are preferably made of the same material.
The thickness of a portion at which fiber sheet 11 and electrical-insulation film 14 are fusion-bonded to each other by thermal fusion-bonding is, e.g. about 20 μm. The portion at which fiber sheet 11 and electrical-insulation film 14 are bonded is a portion that is formed by once fusing a part of fiber sheet 11 together with a part of electrical-insulation film 14 and then solidifying the parts.
The thickness of the portion at which fiber sheet 11 and electrical-insulation film 14 are fusion-bonded to each other by thermal fusion-bonding is preferably not larger than an average diameter of fibers 11a of fiber sheet 11. The thickness of the portion not larger than the average diameter of fiber sheet 11 provides a strong bonding between fiber sheet 11 and electrical-insulation film 14 while the portion formed by fusion bonding electrical-insulation film 14 to fiber sheet 11 by thermal fusion-bonding. This configuration prevents interstices between fiber sheet 11 and electrical-insulation film 14, decreasing degradation of the heat insulation performance. Moreover, the average diameter of fibers 11a of fiber sheet 11 is preferably equal to or larger than 20 μm and is equal to or smaller than 30 μm. The average diameter of fibers 11a of fiber sheet 11 not smaller than 20 μm and not larger than 30 μm provides a strong bonding of electrical-insulation film 14 to fiber sheet 11.
The material of fiber sheet 11 may include a polyester fiber, polyimide fiber, or aramid fiber, other than the PET fiber.
A configuration in which graphite sheet 16 is bonded to composite sheet 15 will be described below.
Graphite sheet 16 bonded to heat-insulating sheet 13 allows composite sheet 17 to exhibit both the high heat insulation performance and the high heat conduction performance. Graphite sheet 16 prevents the occurrence of a heat spot caused by local heating in the shell of an electronic apparatus.
A method of manufacturing composite sheet 15 according to Embodiment 1 will be described below with reference to the drawings.
In the method of manufacturing composite sheet 15, fiber sheet 11 having a thickness of about 0.5 mm is thermally fusion-bonded to electrical-insulation film 14 having a thickness of about 0.03 mm, thereby providing substrate 21. The thickness of a portion at which fiber sheet 11 is thermally fusion bonded to electrical-insulation film 14 is about 20 μm. Fiber sheet 11 can be thermally fusion-bonded to electrical-insulation film 14 by pressing a hot-iron on electrical-insulation film 14 or by irradiation with infrared light. The material of both fiber sheet 11 and electrical-insulation film 14 is a thermoplastic resin of PET. Fiber sheet 11 is a nonwoven fabric made of the PET. The thickness of fiber sheet 11 is preferably not smaller than 0.03 mm and not larger than 2.0 mm. This thickness of fiber sheet 11 not smaller than 0.03 mm and not larger than 2.0 mm allows composite sheet 15 to exhibit the advantages according to the present disclosure.
Next, as shown in
Then, the sol solution is held at a predetermined temperature for a predetermined period of time to be gel while substrate 21 is immersed in the sol solution.
Next, a silylation agent is added to the resulting gel solution, thereby substituting silicon for active hydrogen of groups of organic compounds contained in the gel solution, with the groups including: a hydroxyl group, amino group, carboxyl group, amide group, and mercapto group.
Then, the gel solution including the active hydrogen substituted with silicon is held at a predetermined temperature for a predetermined period of time, thereby causing the solvent to volatilize. This provides composite sheet 15 in which the silica xerogel is held between fibers 11a, as shown in
Next, a method of manufacturing composite sheet 17 shown in
Substrate 21 is immersed in material solution 20 of the silica xerogel to cause silica xerogel 12 to adhere to surface 42 of electrical-insulation film 14. Silica xerogel 12 adhering to surface 42 can be easily removed. After silica xerogel 12 adhering to surface 42 is removed, graphite sheet 16 is bonded to surface 42.
Silica xerogel 12 is exposed from surface 32 of heat-insulating sheet 13. If graphite sheet 16 is bonded to the surface, the graphite sheet can be peeled off from the silica particles.
Electrical-insulation film 14 may be boded to fiber sheet 11 by a method, other than the thermal fusion-bonding, e.g., with a double-sided adhesive tape or an adhesive. An acid solution, such as hydrochloric acid, which is used in preparing the silica xerogel can unfavorably deteriorate the double-sided adhesive tape or the adhesive, decreasing adhesive strength.
The surface roughness of surface 41 of electrical-insulation film 14 is preferably larger than that of surface 42 of electrical-insulation film 14. The surface roughness of surface 41 is larger than that of surface 42, thereby providing a large amount of the silica xerogel on surface 41. As a result, composite sheet 15 is improved in heat insulation performance and also allows the graphite sheet to be easily bonded to surface 42.
The same configurations as composite sheet 15 according to Embodiment 1 will not be described. In composite sheet 19 according to the embodiment, surface 51 of electrical-insulation film 18 is thermally fusion-bonded to fibers 11a of fiber sheet 11 while the fibers are exposed from surface 32. Electrical-insulation film 18 and fiber sheet 11 are bonded by thermal fusion-bonding into a one-piece body, providing strong bonding between electrical-insulation film 18 and fiber sheet 11.
Electrical-insulation film 14 and electrical-insulation film 18 disposed on surface 31 and surface 32 at both sides of heat-insulating sheet 13, respectively, protect the heat-insulating sheet from external impacts.
As described above, according to the embodiment, the electrical-insulation film is fusion-bonded to the fiber sheet, so that the electrical-insulation film can hardly be peeled off from the fiber sheet, providing the composite sheet with the high heat insulation performance.
A composite sheet according to the present disclosure includes the silica xerogel having a high heat insulation performance and is formed by fusion-bonding the electrical-insulation film to the fiber sheet, hence preventing the electrical-insulation film from being peeled off from the fiber sheet. The composite sheet is highly useful in industrial applications.
11 fiber sheet
12 silica xerogel
13 heat-insulating sheet
14 electrical-insulation film
15 composite sheet
16 graphite sheet
17 composite sheet
18 electrical-insulation film
19 composite sheet
20 material solution of silica xerogel
21 substrate
31 surface
32 surface
41 surface
42 surface
51 surface
Number | Date | Country | Kind |
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2014-225744 | Nov 2014 | JP | national |
Filing Document | Filing Date | Country | Kind |
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PCT/JP2015/005547 | 11/5/2015 | WO | 00 |