characterised by the material composition exhibiting specific thermal properties

Industry

CPC
H05K7/20481

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K7/00Constructional details common to different types of electric apparatus

Current Industry

H05K7/20481characterised by the material composition exhibiting specific thermal properties

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Thermal interface materials
- Patent number 12,130,095
- Issue date Oct 29, 2024
- Henkel AG & Co. KGaA
- Yong Joon Lee
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Composite material and heat dissipation part
- Patent number 12,120,852
- Issue date Oct 15, 2024
- THE GOODSYSTEM CORP.
- Meoung-whan Cho
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Antenna assembly for a vehicle
- Patent number 12,113,267
- Issue date Oct 8, 2024
- Airgain, Inc.
- Larry Greenstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing heat dissipation sheet
- Patent number 12,101,912
- Issue date Sep 24, 2024
- AMOGREENTECH CO., LTD.
- Seung Jae Hwang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Passive thermal-control structure for speakers and associated appar...
- Patent number 12,082,377
- Issue date Sep 3, 2024
- Google LLC
- Emil Rahim
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Indium-based interface structures, apparatus, and methods for formi...
- Patent number 11,985,758
- Issue date May 14, 2024
- L3 Technologies, Inc.
- Matthew J. Spitzner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Film-like heat dissipation member, bendable display apparatus, and...
- Patent number 11,963,336
- Issue date Apr 16, 2024
- Huawei Technologies Co., Ltd.
- Huipeng Wu
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Composite thermal interface materials and associated devices, syste...
- Patent number 11,943,899
- Issue date Mar 26, 2024
- Deeia Inc.
- Himanshu Pokharna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Support plate thin cladding
- Patent number 11,898,808
- Issue date Feb 13, 2024
- Apple Inc.
- Robert F. Meyer
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Flexible display screen and flexible display apparatus
- Patent number 11,882,679
- Issue date Jan 23, 2024
- Kunshan Go-Visionox Opto-Electronics Co., Ltd.
- Tan Zhang
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Thermal-control system of a video-recording doorbell and associated...
- Patent number 11,839,060
- Issue date Dec 5, 2023
- Google LLC
- Arun Prakash Raghupathy
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Thermal conduction sheet and heat dissipating device including ther...
- Patent number 11,810,834
- Issue date Nov 7, 2023
- Resonac Corporation
- Mika Kobune
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Heat transfer assembly
- Patent number 11,800,687
- Issue date Oct 24, 2023
- DISH Network L.L.C.
- SvitLana Trygubova
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermalization arrangement at cryogenic temperatures
- Patent number 11,800,689
- Issue date Oct 24, 2023
- Teknologian tutkimuskeskus VTT Oy
- Mika Prunnila
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Multilayer graphite sheet with excellent electromagnetic shielding...
- Patent number 11,745,463
- Issue date Sep 5, 2023
- SKC Co., Ltd.
- Jung Doo Seo
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method for producing thermally conductive thin film using synthetic...
- Patent number 11,737,243
- Issue date Aug 22, 2023
- INDONG ADVANCED MATERIALS INC.
- Dong Ha Kim
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Thermal interface material structures for directing heat in a three...
- Patent number 11,703,922
- Issue date Jul 18, 2023
- International Business Machines Corporation
- Mark K. Hoffmeyer
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Antenna assembly for a vehicle
- Patent number 11,664,573
- Issue date May 30, 2023
- Airgain, Inc.
- Larry Greenstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooler and cooler body
- Patent number 11,644,253
- Issue date May 9, 2023
- BRUSA Elektronik AG
- Ueli Wendelspiess
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Electrical connection apparatus
- Patent number 11,622,473
- Issue date Apr 4, 2023
- Molex, LLC
- Chun-Hsiang Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat-conductive sheet
- Patent number 11,610,829
- Issue date Mar 21, 2023
- SEKISUI POLYMATECH CO., LTD.
- Shigeru Koyano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Information handling system thermal management for dense structures
- Patent number 11,592,883
- Issue date Feb 28, 2023
- Dell Products L.P.
- Pomin Shih
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Thermal nanoparticles encapsulation for heat transfer
- Patent number 11,558,981
- Issue date Jan 17, 2023
- Mercury Mission Systems, LLC
- Kang S. Lee
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Thermal conduction sheet and heat dissipating device including ther...
- Patent number 11,545,413
- Issue date Jan 3, 2023
- SHOWA DENKO MATERIALS CO., LTD.
- Mika Kobune
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Talc-filled polycarbonate compositions
- Patent number 11,535,747
- Issue date Dec 27, 2022
- Covestro Deutschland AG
- Tim Hungerland
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Passive thermal-control system of an electronic speaker device and...
- Patent number 11,521,909
- Issue date Dec 6, 2022
- Google LLC
- Ihab A. Ali
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Immersion heat dissipation structure
- Patent number 11,510,342
- Issue date Nov 22, 2022
- AMULAIRE THERMAL TECHNOLOGY, INC.
- Ching-Ming Yang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Method for applying thermally conductive composition on electronic...
- Patent number 11,485,861
- Issue date Nov 1, 2022
- Dow Silicones Corporation
- Peng Wei
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal interface materials
- Patent number 11,441,855
- Issue date Sep 13, 2022
- Fastcap Systems Corporation
- Yong Joon Lee
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Hot spot cooling for data storage system
- Patent number 11,429,163
- Issue date Aug 30, 2022
- Western Digital Technologies, Inc.
- Shaomin Xiong
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
POLYMERIC COLD PLATE FOR THERMAL MANAGEMENT OF POWER ELECTRONICS
- Publication number 20240422950
- Publication date Dec 19, 2024
- Rolls-Royce North American Technologies Inc.
- Timothy Unton
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PASSIVE THERMAL-CONTROL STRUCTURE FOR SPEAKERS AND ASSOCIATED APPAR...
- Publication number 20240397669
- Publication date Nov 28, 2024
- Google LLC
- Emil Rahim
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240397671
- Publication date Nov 28, 2024
- SAMSUNG DISPLAY CO., LTD.
- Jeongweon SEO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HEAT DISSIPATION STRUCTURE AND ELECTRONIC DEVICE USING SAME
- Publication number 20240397670
- Publication date Nov 28, 2024
- Alpha Networks Inc.
- FU-HUNG HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE THERMAL INTERFACE MATERIALS AND ASSOCIATED DEVICES, SYSTE...
- Publication number 20240389274
- Publication date Nov 21, 2024
- Deeia Inc.
- Himanshu Pokharna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUS BAR HEAT DISSIPATION STRUCTURE AND INVERTER DEVICE
- Publication number 20240276684
- Publication date Aug 15, 2024
- MEIDENSHA CORPORATION
- Shota SUZUKI
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
COOLING SYSTEM FOR A WIRELESS POWER TRANSMITTER AND RECEIVER AND ME...
- Publication number 20240268080
- Publication date Aug 8, 2024
- Aptiv Technologies AG
- John Mecca
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
THERMAL MANAGEMENT FOR HEAD MOUNTED WEARABLE DEVICE
- Publication number 20240244798
- Publication date Jul 18, 2024
- Google LLC
- Joshua Moore
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRONIC APPARATUS
- Publication number 20240237292
- Publication date Jul 11, 2024
- LENOVO (SINGAPORE) PTE. LTD.
- Atsushi Ohyama
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240237293
- Publication date Jul 11, 2024
- InnoLux Corporation
- Ker-Yih KAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ENDOSCOPE
- Publication number 20240192480
- Publication date Jun 13, 2024
- HOYA CORPORATION
- Hisanori BESSHO
- G02 - OPTICS
Information Patent Application
ELECTRONIC APPARATUS
- Publication number 20240138116
- Publication date Apr 25, 2024
- LENOVO (SINGAPORE) PTE. LTD.
- Atsushi Ohyama
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
TERMINAL DEVICE
- Publication number 20240081026
- Publication date Mar 7, 2024
- Huawei Technologies Co., Ltd
- Yongwang Xiao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HEAT DISSIPATION STRUCTURE AND ELECTRONIC DEVICE
- Publication number 20240057295
- Publication date Feb 15, 2024
- Getac Technology Corporation
- HAO-WEI CHAN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
IMMERSION COOLING UNIT AND ELECTRONIC APPARATUS
- Publication number 20240049424
- Publication date Feb 8, 2024
- Wistron Corporation
- Cheng Han Chiang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMAGING APPARATUS
- Publication number 20240048828
- Publication date Feb 8, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- Tatsuya SATO
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
HEAT DISSIPATION SHEET, FABRICATION METHOD THEREOF, AND ELECTRONIC...
- Publication number 20240032253
- Publication date Jan 25, 2024
- Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
- Zhenyu YANG
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
THERMALIZATION ARRANGEMENT AT CRYOGENIC TEMPERATURES
- Publication number 20240015936
- Publication date Jan 11, 2024
- Teknologian Tutkimuskeskus VTT Oy
- Mika PRUNNILA
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Heat management structure with graphene and copper, and a formation...
- Publication number 20240008228
- Publication date Jan 4, 2024
- Chang Gung University
- Cher-Ming TAN
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
CARBON NANOTUBES AS THERMAL INTERFACE MATERIAL
- Publication number 20240008229
- Publication date Jan 4, 2024
- NTHERMA CORPORATION
- Cattien V. Nguyen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL DISSIPATION DEVICE AND CONTROL METHOD THEREOF
- Publication number 20240008217
- Publication date Jan 4, 2024
- ASUSTEK COMPUTER INC.
- Jyun-Miao HONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FOLDABLE ELECTRONIC DEVICE COMPRISING HEAT-DISSIPATING STRUCTURE
- Publication number 20230422448
- Publication date Dec 28, 2023
- Samsung Electronics Co., LTD
- Jaeyoung HUH
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
BACK COVER HEAT DISSIPATION STRUCTURE OF LAPTOP
- Publication number 20230400898
- Publication date Dec 14, 2023
- GETAC TECHNOLOGY CORPORATION
- Yin-Cheng Tsai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HEAT DISSIPATION SHEET FOR ELECTRONIC DEVICE AND MANUFACTURING METH...
- Publication number 20230365412
- Publication date Nov 16, 2023
- Samsung Electronics Co., Ltd.
- Youngdo KIM
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
THERMALLY CONDUCTIVE SHEET AND DEVICE PROVIDED WITH THERMALLY CONDU...
- Publication number 20230295398
- Publication date Sep 21, 2023
- Showa Denko Materials Co., Ltd.
- Mika KOBUNE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Antenna Assembly For A Vehicle
- Publication number 20230299457
- Publication date Sep 21, 2023
- Airgain, Inc.
- Larry Greenstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC APPARATUS
- Publication number 20230266803
- Publication date Aug 24, 2023
- LENOVO (SINGAPORE) PTE. LTD.
- Daisuke Takahashi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HEAT DISSIPATION STRUCTURE AND ELECTRONIC DEVICE INCLUDING SAME
- Publication number 20230262940
- Publication date Aug 17, 2023
- Samsung Electronics Co., Ltd.
- Taewook HAM
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
RADIATIVE HEATSINK
- Publication number 20230221083
- Publication date Jul 13, 2023
- Maxwell Labs Inc
- Jacob A. Balma
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
HANDHELD ELECTRONIC DEVICE
- Publication number 20230221782
- Publication date Jul 13, 2023
- Apple Inc.
- David A. Hurrell
- G06 - COMPUTING CALCULATING COUNTING

characterised by the material composition exhibiting specific thermal properties

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Thermal interface materials

Composite material and heat dissipation part

Antenna assembly for a vehicle

Method for manufacturing heat dissipation sheet

Passive thermal-control structure for speakers and associated appar...

Indium-based interface structures, apparatus, and methods for formi...

Film-like heat dissipation member, bendable display apparatus, and...

Composite thermal interface materials and associated devices, syste...

Support plate thin cladding

Flexible display screen and flexible display apparatus

Thermal-control system of a video-recording doorbell and associated...

Thermal conduction sheet and heat dissipating device including ther...

Heat transfer assembly

Thermalization arrangement at cryogenic temperatures

Multilayer graphite sheet with excellent electromagnetic shielding...

Method for producing thermally conductive thin film using synthetic...

Thermal interface material structures for directing heat in a three...

Antenna assembly for a vehicle

Cooler and cooler body

Electrical connection apparatus

Heat-conductive sheet

Information handling system thermal management for dense structures

Thermal nanoparticles encapsulation for heat transfer

Thermal conduction sheet and heat dissipating device including ther...

Talc-filled polycarbonate compositions

Passive thermal-control system of an electronic speaker device and...

Immersion heat dissipation structure

Method for applying thermally conductive composition on electronic...

Thermal interface materials

Hot spot cooling for data storage system

Patents Applicationslast 30 patents

POLYMERIC COLD PLATE FOR THERMAL MANAGEMENT OF POWER ELECTRONICS

PASSIVE THERMAL-CONTROL STRUCTURE FOR SPEAKERS AND ASSOCIATED APPAR...

DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME

HEAT DISSIPATION STRUCTURE AND ELECTRONIC DEVICE USING SAME

COMPOSITE THERMAL INTERFACE MATERIALS AND ASSOCIATED DEVICES, SYSTE...

BUS BAR HEAT DISSIPATION STRUCTURE AND INVERTER DEVICE

COOLING SYSTEM FOR A WIRELESS POWER TRANSMITTER AND RECEIVER AND ME...

THERMAL MANAGEMENT FOR HEAD MOUNTED WEARABLE DEVICE

ELECTRONIC APPARATUS

ELECTRONIC DEVICE

ENDOSCOPE

ELECTRONIC APPARATUS

TERMINAL DEVICE

HEAT DISSIPATION STRUCTURE AND ELECTRONIC DEVICE

IMMERSION COOLING UNIT AND ELECTRONIC APPARATUS

IMAGING APPARATUS

HEAT DISSIPATION SHEET, FABRICATION METHOD THEREOF, AND ELECTRONIC...

THERMALIZATION ARRANGEMENT AT CRYOGENIC TEMPERATURES

Heat management structure with graphene and copper, and a formation...

CARBON NANOTUBES AS THERMAL INTERFACE MATERIAL

THERMAL DISSIPATION DEVICE AND CONTROL METHOD THEREOF

FOLDABLE ELECTRONIC DEVICE COMPRISING HEAT-DISSIPATING STRUCTURE

BACK COVER HEAT DISSIPATION STRUCTURE OF LAPTOP

HEAT DISSIPATION SHEET FOR ELECTRONIC DEVICE AND MANUFACTURING METH...

THERMALLY CONDUCTIVE SHEET AND DEVICE PROVIDED WITH THERMALLY CONDU...

Antenna Assembly For A Vehicle

ELECTRONIC APPARATUS

HEAT DISSIPATION STRUCTURE AND ELECTRONIC DEVICE INCLUDING SAME

RADIATIVE HEATSINK

HANDHELD ELECTRONIC DEVICE