Claims
- 1. A method for preparing an EL device including a composite substrate, comprising the steps of:successively applying an electrode paste and an insulator paste onto an electrically insulating substrate as thick films to form a composite substrate precursor having a green electrode layer and a green insulator layer; subjecting the composite substrate precursor to a pressing treatment using a die press or roll, for smoothing a surface of the green insulator layer to have a surface roughness Ra of up to 0.1 μm; and firing to complete the composite substrate.
- 2. The method according to claim 1, wherein during the pressing treatment, the die or roll used for pressing is held at a temperature in the range of 50 to 200° C.
- 3. The method according to claim 1, wherein at least one of said electrode paste and said insulator paste uses a thermoplastic resin as a binder.
- 4. The method according to claim 1, wherein during the pressing treatment, a resin film having a parting agent thereon is interposed between the die or roll and the green insulating layer.
Priority Claims (3)
Number |
Date |
Country |
Kind |
2000-029465 |
Feb 2000 |
JP |
|
2000-059521 |
Mar 2000 |
JP |
|
2000-059522 |
Mar 2000 |
JP |
|
CROSS-REFERENCE TO RELATED APPLICATION
This application claims priority to International Application No. PCT/JP01/00815 filed Feb. 6, 2001 and Japanese Application Nos. 2000-029465 filed Feb. 7, 2000, 2000-059521 filed Mar. 3, 2000 and 2000-059522 filed Mar. 3, 2000, and the entire content of both applications is hereby incorporated by reference.
US Referenced Citations (1)
Number |
Name |
Date |
Kind |
5830028 |
Zovko et al. |
Nov 1998 |
A |
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Continuations (1)
|
Number |
Date |
Country |
Parent |
PCT/JP01/00815 |
Feb 2001 |
US |
Child |
09/970803 |
|
US |