Patent Application
20250207002
The present invention relates to a composition for temporary bonding.
Electronic devices are produced by using a substrate made of an inorganic material such as silicon. A wafer substrate having a thickness of about a few hundred microns obtained by forming an insulating film and a circuit on the surface and applying processing such as thinning by grinding is frequently used. Since most of the materials of the substrate is fragile and easily broken, measures to prevent breaking need to be taken particularly for thinning by grinding. A method has been taken as such measures, in which a protective tape for temporary bonding, which can be released after the completion of the step of processing, is applied to the side opposite to the side to be ground (also referred to as a rear side or back side). An organic resin film is used for the substrate of the tape, and although the tape is flexible, their strength and heat resistance are insufficient, and thus the tape is not suitable for use in steps at high temperature.
Then, systems have been proposed, which provides durability sufficient for conditions in the process for back-grinding and for forming an electrode on the back side by bonding the substrate for an electronic device to a support such as silicon or glass by an adhesive. What is important in the system is the adhesive layer for bonding the substrate and the support. The adhesive layer needs to be capable of bonding the substrate and the support without any gap, and has durability sufficient for withstanding the subsequent steps, and needs to enable the thinned wafer to be easily released from the support, that is, bonding temporarily, in the final step.
In the processing of a such a wafer, a step of spin coating, a step of vacuum bonding and photocuring, a step of thinning by grinding and polishing, a step of high temperature treatment, a step of laser release, and a step of removing a temporary bonding agent are mainly carried out.
In the step of spin coating, the temporary bonding agent is required for having a suitable viscosity and being Newtonian fluid (or shear rate independence of shear viscosity) for the purpose of uniformly forming a film of the temporary bonding agent on the wafer.
In the step of vacuum bonding/UV curing, the temporary bonding agent is required to be capable of being cured by photoirradiation such as ultraviolet light (UV) in a short time on a support such as glass and have low outgas generation (low outgas properties).
In the step of thinning process by grinding and polishing, the temporary bonding agent is required for having an adequate hardness to avoid breaking of a substrate due to local conversion of the load of the grindstone applied to the substrate while dispersing the load in the in-plane direction to prevent local sagging of the substrate to maintain flatness. In addition, the temporary bonding agent is further required for having an adhesive strength to the substrate, a suitable elastic modulus for protecting an edge, and chemical resistance.
In the step of high temperature treatment, the temporary bonding agent is required for having heat resistance withstanding high temperature treatment (for example, 1 hour or more at 300° C. or more) over a long period of time in vacuum.
In the step of laser release, the temporary bonding agent is required for being releasable at a high rate by a laser such as UV laser.
In the step of removing, the temporary bonding agent is required for being easily released which enables the substrate to be easily released from the support, and also properties of aggregation which leave no residue of the adhesive on the substrate after release, and easiness of washing.
Considering these background, for example, Patent Literature 1 discloses a composition for temporary bonding comprising (A-1) a monofunctional (meth)acrylate whose side chain is an alkyl group having 18 or more carbon atoms and homopolymer has a Tg of −100° C. to 60° C., and (A-2) a polyfunctional (meth)acrylate; (B) a polyisobutene homopolymer and/or a polyisobutene copolymer; and (C) a photo radical polymerization initiator and describes such a composition has excellent heat resistance, low outgas properties, and release properties.
As demands for further highly integrated and downsized electronic devices increase, substrates similarly have been further thinned, whereby substrates having a thickness of 70 μm or 50 μm have been used in practice. With such a thin substrate, a tape on the substrate may break when releasing the tape, and an electronic device may also break from the impact, hence problematic. Development from the conventional techniques has been in demand for further improving the tape release properties while satisfying the above requirements, particularly heat resistance.
That is, the present invention may provide the following aspects:
Aspect 1. A composition for temporary bonding, the composition comprising:
Aspect 2. The composition for temporary bonding according to aspect 1, wherein the component (A) comprises:
Aspect 3. The composition for temporary bonding according to aspect 1 or 2, further comprising:
Aspect 4. The composition for temporary bonding according to aspect 3, wherein the component (C) contains an oligomer and/or a polymer.
Aspect 5. The composition for temporary bonding according to aspect 3 or 4, wherein an amount of the component (A) is 50% or more in a mass ratio of the component (A) to the component (C).
Aspect 6. The composition for temporary bonding according to any one of aspects 1 to 5, further comprising:
Aspect 7. The composition for temporary bonding according to any one of aspects 1 to 6, further comprising:
Aspect 8. The composition for temporary bonding according to aspect 7, wherein more than 0% and 50% or less of the component (E) is comprised in a mass ratio of the component (A) to the component (E).
Aspect 9. The composition for temporary bonding according to any one of aspects 1 to 6, excluding monofunctional (meth)acrylate.
Aspect 10. The composition for temporary bonding according to any one of aspects 1 to 9, further comprising:
Aspect 11. The composition for temporary bonding according to aspect 10, wherein more than 0% and 50% or less of the component (F) is comprised in a mass ratio of the component (A) to the component (F).
Aspect 12. A cured body of the composition for temporary bonding according to any one of aspects 1 to 11.
Aspect 13. The cured body according to aspect 12, having a temperature at which mass is reduced by 2% of 300° C. or more under an atmosphere of nitrogen.
The present invention may provide a novel composition for temporary bonding which has excellent heat resistance for the purpose of temporary bonding and is capable of preventing a tape from breaking when releasing the tape.
In the present description, the numerical range includes the upper limit and the lower limit unless otherwise specified. The monofunctional (meth)acrylate herein refers to a compound having one (meth)acryloyl group per molecule. The polyfunctional (meth)acrylate means a compound having two or more (meth)acryloyl groups per a molecule. The n-functional (meth)acrylate means a compound having n number of (meth)acryloyl groups per a molecule. The polyfunctional (meth)acrylate may have an acryloyl group alone or a methacryloyl group alone, or both of the acryloyl group and the methacryloyl group as the polymerizable functional group.
An embodiment of the present invention may provide a composition for temporary bonding (also referred to as “temporary bonding agent”) comprising (A) a bifunctional (meth)acrylate having a cyclic structure, and (B) a photo radical polymerization initiator, and having a storage modulus at 23° C. of 0.66 GPa or less. In the present specification, the cured body used for measuring the storage modulus is prepared by sandwiching the composition for temporary bonding between PET films, pressing out the composition to make a thickness down to 50 μm, and curing the composition in a condition of an integrated light intensity of 5,000 mJ/cm2 using UV-LED (central wavelength: 405 nm; intensity: 100 mW/cm2).
The bifunctional (meth)acrylate having a cyclic structure, the component (A), contained in the present composition plays a role of constituting a rigid structure in the present composition and may provide an effect for suitably improving the viscosity. Examples of the bifunctional (meth)acrylate include (A-1) an aromatic bifunctional (meth)acrylate, and (A-2) an aliphatic bifunctional (meth)acrylate. In a preferable embodiment, the component (A) may contain either component (A-1) or component (A-2) or may contain both components (A-1) and (A-2). The component (A) may preferably be a monomer.
The aromatic bifunctional (meth)acrylate, the component (A-1), is preferred because it may generally constitute a more rigid structure. More preferably, the component (A-1) may further increase the rigidity by having a condensed ring structure.
Examples of the component (A-1) may include 9,9-bis[4-(2-hydroxy C1-C20 alkoxy)phenyl]fluorene di(meth)acrylate, C1-C20 alkoxylated bisphenol A di(meth)acrylate, benzyl di(meth)acrylate, 1,3-bis(2-(meth)acryloyloxy C1-C20 alkyl)benzene, 2,2-bis(4-(meth)acryloxydiethoxyphenyl)propane, and structural isomers thereof. Preferably, the component (A-1) may include di(meth)acrylate having a condensed ring structure such as the structure of fluorene, indene, indecene, anthracene, azulene, or triphenylene. A combination of one or more of these may be the component (A-1).
The aliphatic bifunctional (meth)acrylate, the component (A-2), is the component capable of providing the structure, which generally has lower rigidity than the component (A-1) but generally has more rigid structure than an acyclic molecule (acyclic bifunctional (meth)acrylate and the like). In a preferable embodiment, a combination of the components (A-2) and (A-1) enables the formation of a crosslinked structure, which imparts preferable physical properties as a temporary bonding agent. Preferably, the component (A-2) may have a condensed ring structure thereby further increasing the rigidity. Preferably, the component (A) may contain both of the component (A-2) having a condensed ring structure and the component (A-1) having a condensed ring structure. In another embodiment, the number of rings (including condensed rings) in the component (A-1) or the component (A-2), or both thereof, may be two or more, and preferably two or more and five or less, respectively.
Examples of the component (A-2) may include C1-C20 alkoxylated hydrogenated bisphenol A di(meth)acrylate, 1,3-di(meth)acryloyloxy adamantane, tricyclo C10-C20 alkanemethanol di(meth)acrylate (e.g., tricyclodecanedimethanol di(meth)acrylate and the like), dicyclo C5-C20 di(meth)acrylate, and structural isomers thereof. Among the aliphatic bifunctional (meth)acrylates, aliphatic bifunctional (meth)acrylates having an aliphatic structure with 5 or more carbon atoms are more preferred. The aliphatic bifunctional (meth)acrylate having an aliphatic structure with 5 or more carbon atoms is preferably one or more selected from tricyclodecanedimethanol di(meth)acrylate and 1,3-di(meth)acryloyloxy adamantane.
In the embodiment in which the component (A) contains both components (A-1) and (A-2), a mass ratio of the component (A-1) to the component (A-2) may be in a range preferably from 1:1 to 4:1, and more preferably from 2:1 to 4:1.
The photo radical polymerization initiator, the component (B), contained in the present composition is a substance capable of initiating radical polymerization of the component (A) (and other monomers contained as needed) when irradiated with light and, for example, refers to a compound whose molecules are disconnected and divided into two or more radicals by irradiation of ultraviolet light or visible light (e.g., a wavelength of 350 nm to 700 nm, preferably 365 to 500 nm, and more preferably 385 nm to 450 nm). Examples of the photo radical polymerization initiator include bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide, 2,4,6-trimethylbenzoyldiphenylphosphine oxide, bis(η5-2,4-cyclopentadien-1-yl)-bis(2,6-difluoro-3-(1H-pyrrol-1-yl)-phenyl)titanium, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butan-1-on, 2-dimethylamino-2-(4-methylbenzyl)-1-(4-morpholin-4-ylphenyl)-butan-1-on, 1-[4-(phenylthio)phenyl]-1,2-octanedione 2-O-benzoyloxym, and 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]ethanone 1-(O-acetyloxime). The component (B) may contain a combination of one or more of these.
The component (B) may preferably contain an acylphosphine oxide compound. Examples of preferable acylphosphine oxide compound include bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide and 2,4,6-trimethylbenzoyl diphenylphosphine oxide. The photo radical polymerization initiator, in addition to excellent depth curability due to high sensitivity and photobleaching properties, preferably has an absorption wavelength region for generating radical extending to a comparatively long-wavelength region. The preferable compounds described above have an absorption wavelength range of a wavelength of about 440 nm, which has a significant difference from the absorption wavelength region of the UV absorber used for the UV laser release step to be described later. In other words, the degree of the UV curing inhibition by an UV absorber is small, thereby enabling the radical polymerization to initiate with light having a longer wavelength. For this reason, the effect is achieved whereby the radical polymerization is enabled to initiate and cure at a comparatively high rate and efficiently even in the presence of an UV absorber.
In a preferable embodiment, the photo radical polymerization initiator may be selected from the absorbance. Specifically, the photo radical polymerization initiator may be selected from one or more compounds satisfying any one or more conditions of, when dissolved in a concentration of 0.1% by mass in a solvent having no maximum absorption in a wavelength region from 300 to 500 nm (e.g., acetonitrile and toluene), having an absorbance of 0.5 or more at a wavelength of 365 nm, having an absorbance of 0.5 or more at a wavelength of 385 nm, and having an absorbance of 0.5 or more at a wavelength of 405 nm. Examples of compounds satisfying such conditions include, when dissolved in a concentration of 0.1% by mass in acetonitrile as a solvent, 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]ethanone 1-(O-acetyloxime) having an absorbance of 0.5 or more at a wavelength of 365 nm, 1-[4-(phenylthio)phenyl]-1,2-octanedione 2-O-benzoyloxym having an absorbance of 0.5 or more at wavelengths of 365 nm and 385 nm, and bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide and 2,4,6-trimethylbenzoyl diphenylphosphine oxide having an absorbance of 0.5 or more at wavelengths of 365 nm, 385 nm and 405 nm.
Additionally, from the viewpoint of compatibility of curability by the photo radical polymerization initiator and UV leaser release, bis(η5-2,4-cyclopentadien-1-yl)-bis(2,6-difluoro-3-(1H-pyrrol-1-yl)-phenyl)titanium having an absorption wavelength region ranging from 400 to 500 nm may also be used as the photo radical polymerization initiator.
The photo radical polymerization initiator (B) may preferably be one or more selected from an acylphosphine oxide compound, a titanocene compound, or an α-aminoalkylphenone compound from the viewpoints of reaction speed, heat resistance after curing, low outgas properties and absorption properties in a region different from a wavelength of an UV laser wavelength used for the UV laser release to be described later and an absorption wavelength region of an UV absorber used for the UV laser release. An oxime ester compound, other than the above, may be selected as the photo radical polymerization initiator for a resin composition for the temporary bonding application used to prevent breakage from bonding to heating steps for a support substrate of a substrate to be processed, which is not a layer for the UV laser release, in the composition for temporary bonding having the structure to be described later.
Examples of acylphosphine oxide compounds may include bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide and 2,4,6-trimethylbenzoyldiphenylphosphine oxide. Among them, bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide may particularly be preferred.
Examples of titanocene compounds may include bis(η5-2,4-cyclopentadien-1-yl)-bis(2,6-difluoro-3-(1H-pyrrol-1-yl)-phenyl)titanium.
Examples of α-aminoalkylphenone compounds may include 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butan-1-on, and 2-dimethylamino-2-(4-methylbenzyl)-1-(4-morpholin-4-ylphenyl)-butan-1-on.
Examples of oxime ester compounds may include 1-[4-(phenylthio)phenyl]-1,2-octanedione 2-O-benzoyloxym, and 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]ethanone 1-(O-acetyloxime). Among them, 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]ethanone 1-(O-acetyloxime) is preferred.
The amount of the photo radical polymerization initiator (B) used may preferably be 0.01 to 5 parts by mass, more preferably 0.1 to 1 part by mass based on 100 parts by mass of the component (A) from the viewpoints of reaction speed, heat resistance after curing and low outgas properties. When the amount of the component (B) is 0.01 parts by mass or more, an effect of obtaining sufficient curability may be achieved, whereas the amount is 5 parts by mass or less, an effect of less impairing the low outgas properties and heat resistance may be achieved.
The storage modulus E′ of a cured body of the present composition is 0.66 GPa or less at 23° C. When a storage modulus is more than 0.66 GPa, a problem arises that a tape likely breaks when carrying out the step of releasing the tape for the purpose of temporary bonding at the production of an electric device. The storage modulus is measurable using a known viscoelastic measuring apparatus and may be measured by the method, for example, described in an example to be described later. The storage modulus E′ at 23° C. of a cured body of the present composition may preferably be 0.01 GPa or more and 0.66 GPa or less, 0.02 GPa or more and 0.66 GPa or less, or 0.05 GPa or more and 0.66 GPa or less. In a more preferable embodiment, the storage modulus E′ at 23° C. of a cured body of the present composition may be 0.01 GPa or more and 0.60 GPa or less, or 0.01 GPa or more and 0.55 GPa or less.
Additionally, the storage modulus E′ of the present composition at 23° C. is preferably, from the viewpoint of easily releasing by a laser, 0.01 GPa or more.
The present composition may contain an acyclic aliphatic bifunctional (meth)acrylate as the component (C). The component (C) imparts flexibility to the crosslinked structure.
Examples of the component (C) may include 1,3-butanediol di(meth)acrylate, 1,4-butanediol di(meth)acrylate, 1,6-hexadiol di(meth)acrylate, 1,9-nonanediol di(meth)acrylate, 1,10-decanediol di(meth)acrylate, neopentyl glycol di(meth)acrylate, neopentyl glycol-modified trimethylolpropane di(meth)acrylate, stearic acid-modified pentaerythritol di(meth)acrylate, tripropylene glycol di(meth)acrylate, 2,2-bis(4-(meth)acryloxypropoxyphenyl)propane, 2,2-bis(4-(meth)acryloxytetraethoxyphenyl)propane, isocyanuric acid ethylene oxide-modified di(meth)acrylate, and caprolactone-modified hydroxy pivalic acid neopentyl glycol di(meth)acrylate.
The component (C) may contain either a monomer, or an oligomer or a polymer consisting of the monomer, or any mixture thereof. In an embodiment, the component (C) may not contain any polymer.
In the case that the present composition contains the component (C), the amount of the component (A) in a mass ratio of the component (A) to the component (C) may be 50% by mass or more and 95% by mass or less, preferably 50% by mass or more and 90% by mass or less, and more preferably 50% by mass or more and 85% by mass or less. In an embodiment, the component (A) in a mass ratio of the component (A) to the component (C) may preferably be 50% by mass or more and 95% by mass or less, and the component (C) preferably does not contain a polymer.
The present composition may contain an UV absorber as the component (D). The UV absorber refers to, for example, a compound whose molecules are disconnected, decomposed and vaporized by laser irradiation of ultraviolet light or visible light, and the decomposition and vaporization occurred at the interface between a support substrate (or a support) and a temporary bonding agent cause the adhesive strength between the temporary bonding agent and the support substrate (the support) to disappear that has been maintained until immediately before the release step.
The UV absorber (D) may preferably be one or more selected from a benzotriazole compound and a hydroxyphenyltriazine compound from the viewpoints of the overlapping degree over an UV laser wavelength in the UV absorption wavelength region, UV absorption properties at the same wavelength, low outgas properties and heat resistance.
The benzotriazole compound may particularly preferably be one or more selected from the group consisting of 2-(2H-benzotriazol-2-yl)-4,6-bis(1-methyl-1-phenylethyl)phenol, 2,2′-methylenebis[6-(2H-benzotriazol-2-yl)-4-(1,1,3,3-tetramethylbutyl)phenol], 2-(2H-benzotriazol-2-yl)-6-(1-methyl-1-phenylethyl)-4-(1,1,3,3-tetramethylbutyl)phenol and 2-[2-hydroxy-3-(3,4,5,6-tetrahydrophthalimide-methyl)-5-methylphenyl]benzotriazol from the viewpoints of compatibility with the resin component, UV absorption properties, low outgas properties and heat resistance.
The hydroxyphenyltriazine compound may particularly preferably be one or more selected from the group consisting of 2-[4-[(2-hydroxy-3-(2′-ethyl)hexyl)oxy]-2-hydroxyphenyl]-4,6-bis(2,4-dimethylphenyl)-1,3,5-triazine, 2,4-bis(2-hydroxy-4-butyloxyphenyl)-6-(2,4-bis-butyloxyphenyl)-1,3,5-triazine and 2,4,6-tris(2-hydroxy-4-hexyloxy-3-methylphenyl)-1,3,5-triazine from the viewpoints of compatibility with the component (A), UV absorption properties, low outgas properties and heat resistance.
In a preferable embodiment for the UV laser release step, the most preferable UV absorber is one or more selected from the group consisting of 2,4,6-tris(2-hydroxy-4-hexyloxy-3-methylphenyl)-1,3,5-triazine, 2,4-bis(2-hydroxy-4-butyloxyphenyl)-6-(2,4-bis-butyloxyphenyl)-1,3,5-triazine, and 2,2′-methylenebis[6-(2H-benzotriazol-2-yl)-4-(1,1,3,3-tetramethybutyl)phenol]. These may be selected from a wide range of amounts to be used because of excellent compatibility with the components (A), high melting points, a comparatively low vapor pressure under a temperature condition of about 300° C. or less, and may contribute to the outgas reduction from the composition for temporary bonding after curing under the temperature condition.
The most preferable UV absorber (D) may include the following absorbers selected from the UV transmittance. If the component (D) has such a UV transmittance, the effect for suitably controlling the curing and release of the composition is obtained.
If a UV absorber is dissolved in a concentration of 0.002% by mass in a solvent that does not have the maximum absorption in a wavelength of 290 to 410 nm, a transmittance is 50% or less at a wavelength of 355 nm with an optical path length of 1 cm, and a transmittance of more than 50% at a wavelength of 385 to 420 nm is preferred. Further preferably, a transmittance may be 40% or less at a wavelength of 355 nm, and a transmittance may be 60% or more at a wavelength of 385 to 420 nm.
Examples of the most preferable UV absorber (D) may include the following. 2-(2H-Benzotriazol-2-yl)-4,6-bis(1-methyl-1-phenylethyl)phenol (“Tinuvin 900” made by BASF, “ADK STAB LA-24” made by ADEKA Corporation, “EVERSORB 76/EVERSORB 234” made by Everlight Chemical Industrial Corp., molecular weight 447) having a transmittance of 20% or less at a wavelength of 355 nm with an optical path length of 1 cm, and a transmittance of 60% or more at a wavelength of 385 to 420 nm, when dissolved in a concentration of 0.002% by mass in toluene as a solvent. 2-(2H-Benzotriazol-2-yl)-6-(1-methyl-1-phenylethyl)-4-(1,1,3,3-tetramethylbutyl)phenol (Tinuvin 928 made by BASF, EVERSORB 89/89FD made by Everlight Chemical Industrial Corp., molecular weight 442) having a transmittance of 30% or less at a wavelength of 355 nm with an optical path length of 1 cm, and a transmittance of 70% or more at a wavelength of 385 to 420 nm, when dissolved in a concentration of 0.002% by mass in toluene as solvent.
2-[4-[(2-Hydroxy-3-(2′-ethyl)hexyl)oxy]-2-hydroxyphenyl]-4,6-bis(2,4-dimethylphenyl)-1,3,5-triazine (Tinuvin 405 made by BASF, molecular weight 584) having a transmittance of 40% or less at a wavelength of 355 nm with an optical path length of 1 cm, and a transmittance of 90% or more at a wavelength of 385 to 420 nm, when dissolved in a concentration of 0.002% by mass in tetrahydrofuran as a solvent.
2,4-Bis(2-hydroxy-4-butyloxyphenyl)-6-(2,4-bis-butyloxyphenyl)-1,3,5-triazine (Tinuvin 460 made by BASF, molecular weight 630) having a transmittance of 10% or less at a wave length of 355 nm with an optical path length of 1 cm, and a transmittance of 80% or more at a wavelength of 385 to 420 nm, when dissolved in a concentration of 0.002% by mass in tetrahydrofuran as a solvent.
The UV transmittance of the cured body in the present description is the value obtained by reflectometric spectroscopy. Specifically, a transmittance is obtained in the following conditions using a film of a cured body having a thickness of about 50 μm prepared by being sandwiched between sheets of a PET resin with a reflectometric spectroscopy analyzer (“V-650” made by JASCO Corporation).
The amount of the UV absorber, which is the component (D), used may preferably be 0.01 to 5 parts by mass, and more preferably 0.5 to 2.5 parts by mass, based on 100 parts by mass of the component (A). When the amount is 0.01 parts by mass or more, sufficient UV laser release rate is obtained, whereas when the amount is 5 parts by mass or less, an effect of less impairing the low outgas properties and heat resistance may be achieved.
The present composition may contain a monofunctional (meth)acrylate as the component (E). The component (E) is preferably a monofunctional (meth)acrylate having a molecular weight of 550 or less, and more preferably a monofunctional alkyl (meth)acrylate having an alkyl group.
The alkyl group may preferably be one or more selected from a linear alkyl group, a branched alkyl group and an alicyclic alkyl group. One or more selected from a linear alkyl group, and a branched alkyl group are more preferred. The component (E) may preferably have a long chain branched alkyl group or a cyclic alkyl group, for example, a branched alkyl group or a cycloalkyl group such as an isostearyl group, an isotetracosanyl group (e.g., a 2-decyl-1-tetradecanyl group) and an isotriacontanyl group (e.g., 2-tetradecyl-1-octadecanyl group) having 18 to 40 carbon atoms, more preferably 18 to 32 carbon atoms, from the viewpoint of improvement of compatibility with the component (A). Using such a long chain, high molecular weight and highly aliphatic hydrocarbon component (more preferably increasing aliphatic hydrocarbon properties of the whole system) improves involatility, chemical resistance and heat resistance required for the composition for temporary bonding.
The component (E) may preferably be one or more selected from the group consisting of stearyl (meth)acrylate, isostearyl (meth)acrylate, behenyl (meth)acrylate, 2-decyl-1-tetradecanyl (meth)acrylate, 2-dodecyl-1-hexadecanyl (meth)acrylate and 2-tetradecyl-1-octadecanyl (meth)acrylate. The component (E) is preferably a (meth)acrylate of the following formula 1.
R1 is a hydrogen atom or a methyl group, with a hydrogen atom being more preferred. R2 is an alkyl group preferably having 18 to 32 carbon atoms. One or more of these (meth)acrylates may be used.
Preferred examples of monofunctional alkyl (meth)acrylate in which R2 has an alkyl group having 18 to 32 carbon atoms may include (meth)acrylate having a linear or branched alkyl group, such as stearyl (meth)acrylate, isostearyl (meth)acrylate, nonadecyl (meth)acrylate, eicodecyl (meth)acrylate, behenyl (meth)acrylate, 2-decyl-1-tetradecanyl (meth)acrylate and 2-tetradecyl-1-octadecanyl (meth)acrylate. The number of carbon atoms of R2 is preferably 18 or more and 23 or less, from the viewpoint of unlikely causing failures by separation during production.
In an embodiment containing the component (E), the amount of the component (E) used may preferably be 50 parts by mass or less, more preferably 40 parts by mass or less, and further preferably 20 parts by mass or less, based on 100 parts by mass of the total amount of the components (A) and (E). In another embodiment, the present composition preferably does not contain the component (E), thereby capable of reducing the amount of outgas and improving heat resistance. The amount of the component (E) used may be more than 0% by mass.
The present composition may contain a tri- or more functional (meth)acrylate as the component (F). The molecular weight of the component (F) is preferably 900 or less, more preferably 700 or less, most preferably 500 or less, and particularly preferably 400 or less.
Examples of the trifunctional (meth)acrylate contained in the component (F) include isocyanuric acid ethylene oxide-modified tri(meth)acrylate, pentaerythritol tri(meth)acrylate, trimethylolpropane tri(meth)acrylate and tris[(meth)acryloyloxyethyl]isocyanurate.
Examples of tetra- or more functional (meth)acrylates contained in the component (F) include ditrimethylolpropane tetra(meth)acrylate, dimethylolpropane tetra(meth)acrylate, pentaerythritol tetra(meth)acrylate, pentaerythritolethoxy tetra(meth)acrylate, dipentaerythritol penta(meth)acrylate and dipentaerythritol hexa(meth)acrylate. Examples of trifunctional or more (meth)acrylate contained in the component (F) include a (meth)acrylic copolymer having a (meth)acryloyl group in the side chain.
Of the component (F), a (meth)acrylic copolymer having a (meth)acryloyl group in the side chain is preferred. Examples of the (meth)acrylic copolymer having a (meth)acryloyl group in the side chain include “ART CURE RA-341” made by Negami Chemical Industrial Co., Ltd.
The amount of the component (F) used is preferably 50 parts by mass or less, more preferably 1 to 40 parts by mass, and further preferably 20 to 30 parts by mass, based on 100 parts by mass of the total amount of the components (A) and (F). When the amount of the component (F) is 50 parts by mass or less, the effect is achieved whereby the composition after mixing is unlikely to be phase-separated and heat resistance may not be reduced. The amount of the component (F) used may be more than 0% by mass.
The weight average molecular weight in the present description is measured by gel permeation chromatography (GPC) in terms of standard polystyrene. More specifically, the weight average molecular weight is determined by preparing a calibration curve using tetrahydrofuran as a solvent and using a GPC system (“SC-8010” manufactured by Tosoh Corporation) with a commercially available standard polystyrene under the following conditions.
An embodiment of the present invention can also provide a cured body of the composition described above. The curing may be carried out using a light source to be described later. The cured body, when prepared in the form of a cured film having a thickness of 50 μm, it is preferable that one or more of the following conditions be satisfied, and it is more preferable that all be satisfied. The following conditions may be satisfied by using, for example an UV absorber:
When these conditions are satisfied, the compatibility of sufficiently high curing rate and UV laser release rate for practical use is enabled. Further, in addition to the compatibility of sufficiently high curing rate and UV laser release rate, a mass reduction ratio under heating condition after curing may be reduced (or the amount of outgas under high temperature vacuum may be reduced). The temporary bonding agent having these properties may suitably be used particularly for the ion implantation in the back side step after thinning and for processes including high temperature vacuum process such as electrode formation by annealing and sputtering.
Spin coating process refers to a method in which, for example, a liquid composition is dropped on a substrate and the substrate is rotated at a pre-determined rotational speed to coat the surface of the substrate with the composition. Spin coating enables high quality coating to be produced efficiently.
The present composition may be used as a resin composition for temporary bonding, an adhesive for temporary bonding, an adhesive sheet or an adhesive for temporary bonding for manufacturing an electronic device. In the present description, the composition for temporary bonding, the resin composition for temporary bonding and the adhesive for temporary bonding may collectively be called the temporary bonding agent.
When a substrate to be processed and an optically transparent support substrate (or a support) are bonded using the composition, it is preferable that the substrates be irradiated with visible light or ultraviolet light (wavelength or central wavelength 365 to 405 nm) so that the amount of energy is 1 to 20,000 mJ/cm2. An amount of energy of 1 mJ/cm2 or more provides sufficient adhesiveness, and an amount of energy of 20,000 mJ/cm2 or less provides excellent productivity, generates few decomposition products from photo radical polymerization initiator, and suppresses generation of outgas. The amount of energy is preferably 1 to 10,000 mJ/cm2 from the viewpoints of productivity, adhesiveness, low outgas properties and easy release.
Although the substrate to be bonded using the composition is not particularly limited, it is preferable that at least one substrate be a transparent substrate which transmits light. Examples of transparent substrates include inorganic substrates such as crystal, glass, quartz, calcium fluoride and magnesium fluoride, and organic substrates such as plastic. Of them, inorganic substrates are preferred because they are versatile and provide high effects. Of the inorganic substrates, one or more selected from glass and quartz are preferred.
The present composition may be photo-curable, and the cured body provided by such a composition has excellent heat resistance and releasability. In an embodiment the amount of outgas from the cured body of the composition of the present invention is small even when exposed to high temperature, and thus the cured body is suitable for bonding, encapsulating and coating various optical parts, optical devices and electronic parts. The composition of the present invention is suitable for applications in which wide-ranging durability such as solvent resistance, heat resistance and adhesiveness, is required, and in particular, suitable for processes for manufacturing semiconductors.
The cured body of the composition may be used in a process having a wide temperature range from room temperature to high temperature. The temperature of heating in a process may preferably be 350° C. or less, more preferably 300° C. or less, and most preferably 250° C. or less. In a preferable embodiment, the temperature at which the mass reduction ratio of the cured body by heating reaches 2% by mass may be 250° C. or more. The bonded body bonded using the composition has high shear adhesive strength and may withstand the step for thinning and the like, and may be easily released after the step for heating, such as forming an insulating film. When used at high temperature, the cured body of the composition may be used in a process at a high temperature of, for example, preferably 200° C. or more, and more preferably 250° C. or more.
In an embodiment, a bonded body to which a substrate is bonded using the present composition as an adhesive is also provided. The bonded body may be released by applying an external force. For example, it may be released by inserting a blade, sheet or wire into the bonded part. Alternatively, the substrate may be also released by irradiating the entire surface by scanning with UV laser or IR laser from the side of the optically transparent support of the bonded body.
An embodiment may also provide a method for producing a thin wafer. The production method comprises using the composition for temporary bonding or the adhesive for temporary bonding (hereinafter may be referred to as an adhesive or a temporary bonding agent) described above as an adhesive layer between a wafer with a semiconductor circuit and the like and a support. The method for producing the thin wafer comprises the following steps (a) to (e).
The step (a) is a step in which, when bonding a circuit-bearing surface of a wafer having the circuit-bearing surface on the front and a circuit-free surface on the back to a support with an adhesive, the adhesive is applied to the support or the wafer with the circuit by spin coating to bond another support or wafer with circuit in vacuum.
The wafer having a circuit-bearing surface and a circuit-free surface has the circuit-bearing surface on one side and the circuit-free surface on the other side. Generally the present invention can be applied to semiconductor wafers. Examples of semiconductor wafers include not only silicon wafer but also gallium nitride wafer, lithium tantalate wafer, lithium niobate wafer, silicon carbide wafer, germanium wafer, gallium-arsenide wafer, gallium-phosphorus wafer and gallium-arsenide-aluminum wafer. The thickness of the wafer is not particularly limited, and is preferably 600 to 800 μm, and more preferably 625 to 775 μm. A transparent substrate which transmits light may be used as a support.
The step (b) is for photo-curing the adhesive. It is preferable that after forming the processed wafer (laminated substrate), the wafer be irradiated with light in a region of visible light or ultraviolet light (wavelength or central wavelength is preferably 350 to 405 nm, more preferably 365 to 405 nm, and most preferably 385 to 405 nm) with the amount of energy of 1 to 20,000 mJ/cm2. An amount of energy of 1 mJ/cm2 or more provides sufficient adhesiveness, and an amount of energy of 20,000 mJ/cm2 or less provides excellent productivity, generates few decomposition products from photo radical polymerization initiator, and suppresses generation of outgas. The amount of energy is more preferably 1,000 to 10,000 cm2 from the viewpoints of productivity, adhesiveness, low outgas properties and easy release.
The composition may be cured by using black light, UV-LED and visible light-LED as a light source and, for example, the following light sources may be used. For the black light, light including a component having a wavelength of 385 nm or more is preferably used regardless of the central wavelength thereof. When a wavelength range is described in the present description, it should be decided whether or not the range is included in the range based on whether or not the central wavelength is included in the range.
In a preferable embodiment, UV-LED or visible-LED with a low integrated light intensity (only short irradiation time is required) may be a light source rather than black light with a high integrated light intensity generally due to a broad irradiation wavelength, likely extending the irradiation time. More specifically, the use of a LED light source having a narrow irradiation wavelength band enables the temporary bonding in a short time, thereby consequently providing an effect for saving time required for the manufacturing step.
The step (c) is for grinding and/or polishing the circuit-free surface of the wafer bonded to the support, in other words, the step for grinding the back side of the processed wafer obtained by lamination in the step (a) to reduce the thickness of the wafer. The thinned wafer has a thickness of preferably 10 to 300 μm, and more preferably 30 to 100 μm. The method of grinding/polishing the back side of the wafer is not particularly limited and a known grinding/polishing method may be used. It is preferable that the wafer be ground while pouring water to the wafer and the grindstone (grindstone with a diamond blade and the like) to cool them.
The step (d) is for processing the processed wafer whose circuit-free surface has been ground/polished; in other words, processing the circuit-free surface of the processed wafer which has been thinned by grinding/polishing the back side. The step includes various processes used at the wafer level, such as formation of electrodes, formation of metal wiring and formation of protective film. More specifically, it includes conventionally known processes such as metal sputtering for forming an electrode and the like, wet etching for etching the metal-sputtering layer, formation of patterns by application of resist for preparing mask for forming metal wiring, exposure and development, removal of resist, dry etching, formation of metal plating, silicon etching for forming TSV and formation of oxide film on the surface of silicon.
The step (e) is a release step. In the step, the wafer processed in the step (d) is released from the processed wafer. For example, the step is for releasing the wafer from the processed wafer before dicing after doing various processing on the thinned wafer. At that stage, dicing tape may be attached in prior to the release to the side which has been thinned and processed. The release step is usually carried out in a condition of a relatively low temperature of room temperature to about 60° C. For the release step, any of a known UV laser release step, IR laser release step or mechanical release step may be employed.
The UV laser release step is a step for, for example, irradiating the entire surface of a processed wafer with UV laser so that the wafer is scanned with the laser linearly and reciprocally from the end of an optically transparent support in the direction of a tangent to decompose the adhesive layer with the energy of the laser to release the wafer. Such a release step is disclosed in, for example, Japanese Translation of PCT International Application Publication No. 2019-501790, and Japanese Translation of PCT International Application Publication No. 2016-500918.
The IR laser release step is a step for, for example, irradiating the entire surface of a processed wafer with IR laser so that the wafer is scanned with the laser linearly and reciprocally from the end of an optically transparent support in the direction of a tangent to heat and decompose the adhesive layer with the energy of the laser to release the wafer. Such a release step is disclosed in, for example, Japanese Patent 4565804. To perform the IR laser release step, a light heat converting layer (e.g., “LTHC”; Light-To-Heat-Conversion release coating, manufactured by 3M) which absorbs IR laser light and converts it to energy may be provided between a layer of temporary bonding agent and a glass support. When LTHC made by 3M is used, LTHC is, for example, spin-coated and cured on the glass support. Then, the layer of temporary bonding agent, which is spin-coated on wafer, is laminated on the glass support on which the LTHC layer has been formed, and they may be UV cured. The method for carrying out the IR laser release step using LTHC made by 3M is disclosed, for example, in Japanese Patent No. 4565804 described above.
The mechanical release step includes, for example, horizontally fixing the processed wafer with the wafer facing downward so as to insert a blade into the end of the interface of the processed wafer to make an opening between the wafer and the support and after inserting the blade, applying upward stress to the support and/or the blade on the upper side to extend the opening to release the wafer from the support. Such a release step is disclosed in, for example, Japanese Patent No. 6377956 and Japanese Patent Laid-Open No. 2016-106404.
Any of the above release methods may be used for releasing the composition. It is preferable that in these cases, one end of the wafer of the processed wafer or the support be horizontally fixed and then a blade be inserted thereinto, or the periphery of the adhesive layer be swollen using a solvent (e.g., aliphatic or an aromatic hydrocarbon solvents such as pentane, hexane, heptane, octane, nonane, decane, benzene, toluene, xylene and mesitylene) to cause release, and the other end be lifted at a certain angle in the horizontal direction. Although these methods are usually performed at room temperature, heating at an upper limit of about 90° C. is also preferred. When laser is used, YAG laser or YVO4 laser is preferably used.
When the above step (e) for releasing the processed wafer from a support is a mechanical release step, it is preferable that the step further may include the steps of:
When the release is performed with UV laser or IR laser, the production method may preferably further comprise the steps of:
This facilitates release of the support from the processed wafer and makes it easier to perform the subsequent dicing step.
The step (e) for releasing the processed wafer from the support with UV laser or IR laser may perform a subsequent step of:
The method for removing the temporary bonding agent includes a method in which the thinned side is vacuum sucked on the suction surface, while an adhesive tape such as dicing tape is attached to the entire surface of the other side on which the temporary bonding agent is remaining to peel the temporary bonding agent together with the tape, and a method in which the wafer is immersed in a solvent (e.g., aliphatic or aromatic hydrocarbon solvents such as pentane, hexane, heptane, octane, nonane, decane, benzene, toluene, xylene and mesitylene) and the adhesive layer is swollen to cause release. Of these methods, the tape release method is preferable from the viewpoints of fewer numbers of steps and short time required.
The wafer after the temporary bonding agent is removed may be sent to the subsequent step without washing the surface. It is preferable that when the surface is to be washed, the method may comprise:
a step (1) for washing the wafer from which the support and the temporary bonding agent have been removed using a solvent (e.g., aliphatic or aromatic hydrocarbon solvents such as pentane, hexane, heptane, octane, nonane, decane, benzene, toluene, xylene and mesitylene) be further performed with the circuit-bearing surface facing upward.
A part of the adhesive (temporary bonding agent) may remain on the circuit-bearing surface of the wafer from which the temporary bonding agent has been removed in the step (k). While it is preferable that the support released be washed and reused, residue of adhesive may have been adhered on the surface of the support. Examples of methods for removing these residues of adhesive include a method in which the wafer and the support are immersed in a solvent (e.g., aliphatic or aromatic hydrocarbon solvents such as pentane, hexane, heptane, octane, nonane, decane, benzene, toluene, xylene and mesitylene), and the residual adhesive is swollen to cause release.
In an embodiment, when obtaining a cured body by curing the composition, various techniques as follows may be employed.
In the first technique, a layer of the composition for temporary bonding comprising the components described above is cured, thereby enabling to obtain a single layer cured body.
The second technique is a technique in which a first layer comprising a composition for temporary bonding having at least a component (A) and a component (B), and does not have an UV absorber, which is a component (D), and a second layer comprising a composition for temporary bonding having at least the components (A), (B), and (D) are respectively prepared and cured, thereby obtaining a cured body having an integrated single layer or multilayer (multiple layers). This cured body is preferable in the aspects that a component concentration distribution in the thickness direction varies or a component concentration distribution varies in the upper side and the lower side in the thickness direction of the cured body. The variation in a component concentration distribution may be confirmed by quantitatively determining UV transmittances of the both sides of the cured body by the reflectometric spectroscopy described above. This technique may provide the effect for realizing the optimum curing by combining layers with different light transmission properties. In the curing described above, black light and UV-LED may be used as a light source (the same applies to the following techniques). Examples of black light include “TUV-8271” (central wavelength 365 nm, intensity 10 mW/cm2) made by TOYO ADTEC. Examples of UV-LED include “H-4MLH200-V2-1S19”+specially designed mirror unit (wavelength 385±5 nm, intensity 350 mW/cm2, condition: scan pitch from mirror unit edge 20 mm) made by HOYA CORPORATION, “H-4MLH200-V3-1 S19”+specially designed mirror unit (wavelength 395±5 nm, intensity 375 mW/cm2, condition: work distance from mirror unit edge 20 mm) made by HOYA CORPORATION, and “H-4MLH200-V4-1S19”+specially designed mirror unit (wavelength 405±5 nm, intensity 400 mW/cm2, condition: work distance condition: work distance 20 mm) made by HOYA CORPORATION.
The third technique also enables to obtain a cured body having at least a partially integrated single layer by applying (e.g., application by spin coat) a component (D) on a cured layer comprising a composition for temporary bonding having at least a component (A) and a component (B). In this case, a component concentration distribution varies in the thickness direction of the cured body. The component concentration distribution may quantitatively be determined by reflectometric spectroscopy of each layer to be determined as described above. This technique may provide the effect for precisely controlling UV absorption properties.
As the fourth technique, a multilayer cured body may be obtained by putting a layer of a commercial LTHC agent (light heat converting agent) on a layer comprising a composition for temporary bonding having at least a component (A) and a component (B) and curing. This may provide an effect for easily obtaining a cured body.
The cured body obtained by the techniques described above may be provided as a structure in combination with an adherend.
The method for producing the structure described above include various examples. For example, the first production method may comprise a step for applying a first composition for temporary bonding having at least a component (A) and a component (B), and not having a component (D) on a wafer to cure partially, a step for applying a second composition for temporary bonding comprising at least the components (A), (B), and (D) on the partially cured composition for temporary bonding, and a step for further putting a transparent substrate on the applied second composition for temporary bonding to photo-cure.
The second method for producing the structure may comprise a step for applying a first composition for temporary bonding having at least a component (A) and a component (B), and not having a component (D) on a wafer to cure partially as needed, a step for applying a second composition for temporary bonding comprising at least the components (A), (B), and (D) on a transparent substrate to cure partially as needed, and a step for firmly attaching faces of the wafer and the transparent substrate respectively on which the composition for temporary bonding has been applied and then bonding by photo-curing.
The third method for producing the structure may comprise a step for applying a composition for temporary bonding having at least a component (A) and a component (B), and not having a component (D) on a wafer to cure partially as needed, a step for applying a LTHC layer on a transparent substrate and drying to cure, and a step for firmly attaching the face of the wafer on which the composition for temporary bonding has been applied and the face of the transparent substrate on which the LTHC layer has been applied and then bonding by photo-curing.
Apart from the composition for temporary bonding described above, the same composition as used for the composition for temporary bonding of the present invention may also be used as a raw material of a light heat converting (LTHC) layer which absorbs IR laser light and converts it to energy disclosed in Japanese Patent No. 4565804. Using the present composition as a component for the light heat converting (LTHC) layer may improve heat resistance thereof.
An embodiment provides a method for producing a semiconductor wafer comprising a step for applying a composition for temporary bonding to a semiconductor wafer substrate and/or a support member to bond the semiconductor wafer substrate and the support member, a step for curing the adhesive for temporary bonding by irradiating with light having a wavelength of 350 to 700 nm (preferably 365 to 500 nm, more preferably 385 to 450 nm) to obtain a bonded body, and a step for irradiating the bonded body with leaser light having a wavelength of less than 385 nm (preferably laser light having a wavelength of 200 nm or more and a wavelength of less than 385 nm) to release the semiconductor wafer substrate. The present production methods have both steps for curing and releasing performed at room temperature, do not need to heat or cool a member, generally do not need to use a solvent and the like, and are simple with short takt time (cycle time), hence beneficial.
Further, the cured adhesive for temporary bonding may constitutes a single layer in the bonded body. It may simplify steps and reduce takt time.
In a preferable embodiment, the composition comprises the preferable photo radical polymerization initiator of the component (B) and the UV absorber of the component (D) described above, thereby enabling a fast curing rate and a fast release rate to be compatible even the adhesive for temporary bonding is a single layer. Further, it is possible to notably reduce an uncured UV curable monomer component remaining on the cured body when UV-curing the adhesive for temporary bonding, thereby enabling heat resistance of the cured body to be improved and a volatile matter under an atmosphere of nitrogen to be reduced. More specifically, for example, it is possible to increase the temperature at which the mass reduction by heating reaches 2% when measuring Tg/DTA of the cured body. The adhesive for temporary bonding having a high heat resistance of the cured body and a reduced volatile matter under an atmosphere of nitrogen is extremely useful for the recent semiconductor manufacturing process. The present cured body may preferably have the temperature at which the mass reduction reaches 2% of 300° C. or more, preferably 320° C. or more, and more preferably 326° C. or more, under an atmosphere of nitrogen.
Hereinafter the present invention will be described in more detail with reference to Examples and Comparative Examples, but the present invention is not limited thereto.
Experiments were carried out at 23° C. and a humidity of 50% unless otherwise specified. The curable resin compositions (hereinafter may be referred to as a liquid resin composition) having the composition (unit is the part by mass) shown in Tables below were prepared and evaluated. The following compounds were selected as the components.
The following compounds were used as the component (A-1).
The following compounds were used as the component (A-2).
The following compound was used as the component (B). Bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide (“Irgacure 819” made by BASF)
The following compounds were used as the component (C).
The following compound was used as the component (D). 2,4-Bis(2-hydroxy-4-butyloxyphenyl)-6-(2,4-bis-butyloxyphenyl)-1,3,5-triazine (“Tinuvin 460” made by BASF)
The following compounds were used as the component (E).
The following compound was used as the component (F). RA-341: Polyfunctional methacrylate polymer that is trifunctional or more (“ART CURE RA-341” made by Negami Chemical Industrial Co., Ltd., weight average molecular weight: 80,000)
Materials were mixed while heating at 80° C. to prepare a homogeneous mixture. An example in which separation occurred at this point was excluded from evaluations thereafter. Similarly, an example in which insufficient curing occurred at curing to be described later and an example in which dissolution occurred at 300° C. or less when heating were excluded from the evaluations.
The liquid resin composition homogenized by the above mixing was sandwiched between PET films, pressed out to make the thickness down to 50 μm, and cured in a condition of an integrated light intensity of 5,000 mJ/cm2 to prepare a cured body sample. UV-LED (central wavelength 405 nm, intensity 100 mW/cm2, HLDL-120V0-NWPSC made by CCS Inc.) was used for curing.
The dynamic viscoelasticity of cured body samples was measured using Viscoelastometer RSA-G2 made by TA Instruments Japan. The dynamic viscoelasticity was measured with a distance between chucks of 7 mm, a sample having the width of 5 mm and the thickness of 50 μm, at a strain of 0.1%, a tensile frequency of 1 Hz, a temperature increase rate of 3° C./min, and in a temperature range of −50° C. to 250° C., thereby determining the value of E′ at 23° C.
Measurement of Temperature at which Mass is Reduced by 2%
The liquid resin composition homogenized by the above mixing was sandwiched between PET films, pressed out to make the thickness down to 50 μm, and cured in a condition of an integrated light intensity of 5,000 mJ/cm2 to prepare a cured body sample. For curing, UV-LED (central wavelength 405 nm, intensity 100 mW/cm2, HLDL-120V0-NWPSC made by CCS Inc.) was used.
The cured body sample weighed to 10 mg was increased in temperature from room temperature to 600° C. in a temperature increase rate of 10° C./min, using a simultaneous thermogravimetry/differential thermal analyzer “STA-2500” made by NETZSCH Japan K.K., under a stream of nitrogen at a carrier gas flow rate of 70 ml/min, and then the cured body was weighed. Using the obtained weight, the mass reduction ratio by heating (temperature at which mass is reduced by 2%) under an atmosphere of nitrogen was calculated.
A 4-inch silicon wafer (diameter 10 cm×thickness 50 μmt) was laminated with a 4-inch glass wafer (diameter 10 cm×thickness 0.7 mm) using the liquid resin composition prepared to prepare a 4-inch sample. Similarly, an 8-inch silicon wafer (diameter 10 cm×thickness 50 μmt) was laminated with an 8-inch glass wafer (diameter 20 cm×thickness 70 μmt) using the liquid resin composition to prepare an 8-inch sample. When laminating, the thickness of the resin composition was adjusted by using a mixture of the temporary bonding agent to which 0.1% by mass of silica particles made by UBE Exsymo Co., Ltd. (product name “HIPRESICA TS N3N”, average particle size 50 μm) was added and mixed. After laminating, the composition was cured in a condition of an LED integrated light intensity of 5,000 mJ/cm2 (central wavelength 405 nm, intensity 100 mW/cm2) to prepare a bonded sample. UV-LED (central wavelength 405 nm, intensity 100 mW/cm2, “HLDL-120V0-NWPSC” made by CCS Inc.) was used for curing.
Each bonded sample was put in a vacuum hot plate chamber, heated for 1 hour under a condition of 300° C. and 20 Pa, and then the end of the circumferential side of the bonded sample was visually observed to evaluate based on the criteria below. The evaluation results of the 4-inch samples are shown as “Vacuum heat resistance 4 in 50 μmt” in the tables. The evaluation results of the 8-inch samples are shown as “Vacuum heat resistance 8 in 70 μmt” in the tables.
A tape to be released (“ELEGRIP (registered trademark) TAPE P-Series” made by Denka Company Limited) was laminated on the bonded sample to prepare a release sample. The release test was carried out under the conditions below using a biaxial tensile test system (“Autograph AG-Xplus” made by Shimadzu Corporation).
Whether the tape broke or not when released was visually observed.
The above results revealed that the compositions of the examples of the present invention were excellent in both heat resistance and tape releasability. On the other hand, Comparative Examples 1 to 4, 7, 8, 12 to 16 which did not satisfy the storage modulus condition all had unsatisfying tape releasability. Additionally, Comparative Examples 9 to 11 which did not contain the component (A) all had poor outcome. Comparative Example 5 in which the storage modulus had more than 0.66 GPa had unsatisfying heat resistance. Comparative Example 6 had separation during production and thus had no substantial storage modulus, thereby failing to satisfy the conditions of the present invention.
Using silicon wafer processed bodies obtained by bonding a silicon wafer onto a glass support using the compositions of Examples 3 and 4, an experiment of grinding the circuit-free surface (back surface) thereof (in other words, recreation of the above step (c)) was carried out. The pre-processed glass support with a thickness of about 715 μm and the silicon wafer with a thickness of about 722 μm were used. The thickness was calculated as the average value of five trial results.
The thicknesses of the silicon wafer processed body which used the composition of Example 3 as the temporary bonding adhesion layer
The thicknesses of the silicon wafer processed body which used the composition of Example 4 as the temporary bonding adhesion layer
The above experiment results confirmed that the silicon wafer processed bodies using the compositions of examples of the present application as binding material for temporary bonding are capable of suitably thinning a silicon wafer.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2022-048920 | Mar 2022 | JP | national |
| Filing Document | Filing Date | Country | Kind |
|---|---|---|---|
| PCT/JP2023/002301 | 1/25/2023 | WO |
