Wafer tapes

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CPC
H01L21/6836

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/6836Wafer tapes

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Wafer taping apparatus and method
- Patent number 12,368,063
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chien-Yi Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Tape affixing apparatus
- Patent number 12,368,064
- Issue date Jul 22, 2025
- Tokyo Seimitsu Co., Ltd.
- Kiyotaka Kizaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 12,368,068
- Issue date Jul 22, 2025
- Fuji Electric Co., Ltd.
- Yuya Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of selectively transferring semiconductor device
- Patent number 12,369,431
- Issue date Jul 22, 2025
- Epistar Corporation
- Hao-Min Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 12,368,084
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of packaging semiconductor devices and packaged semiconduct...
- Patent number 12,362,260
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Hui Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing electronic device
- Patent number 12,362,221
- Issue date Jul 15, 2025
- MITSUI CHEMICALS ICT MATERIA, INC.
- Toru Miura
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Wafer processing method
- Patent number 12,354,902
- Issue date Jul 8, 2025
- Disco Corporation
- Jinyan Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Singulation systems and related methods
- Patent number 12,354,917
- Issue date Jul 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor device and method of separating...
- Patent number 12,354,879
- Issue date Jul 8, 2025
- Samsung Electronics Co., Ltd.
- Cheonil Park
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor components having conductive vias with aligned back s...
- Patent number 12,347,731
- Issue date Jul 1, 2025
- Micron Technology, Inc.
- Jin Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing chips
- Patent number 12,341,068
- Issue date Jun 24, 2025
- Disco Corporation
- Hideyuki Sandoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for separating semiconductor chip and method for separati...
- Patent number 12,341,033
- Issue date Jun 24, 2025
- LG Chem, Ltd.
- Eun Bum Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer cleaning apparatus
- Patent number 12,341,052
- Issue date Jun 24, 2025
- ZEUS CO., LTD.
- Seung Dae Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device including resin layers
- Patent number 12,341,024
- Issue date Jun 24, 2025
- Kioxia Corporation
- Eiji Takano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sheet pasting device and sheet pasting method
- Patent number 12,341,034
- Issue date Jun 24, 2025
- Lintec Corporation
- Yoshiaki Sugishita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with discrete blocks
- Patent number 12,334,476
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Wen Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lthc as charging barrier in info package formation
- Patent number 12,334,489
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Jen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Massive parallel assembly method
- Patent number 12,327,751
- Issue date Jun 10, 2025
- Fraunhofer-Gesellschaft zur Forderung der Angewandten Forschung E.V.
- Hans-Hermann Oppermann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bond method for fixing dies
- Patent number 12,322,639
- Issue date Jun 3, 2025
- Yen Hao Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processing apparatus
- Patent number 12,322,638
- Issue date Jun 3, 2025
- Disco Corporation
- Yoshinori Kakinuma
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,322,640
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Chieh Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer processing laminate, temporary adhesive material for wafer pr...
- Patent number 12,322,637
- Issue date Jun 3, 2025
- Shin-Etsu Chemical Co., Ltd.
- Mitsuo Muto
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor manufacturing device and method of using the same
- Patent number 12,322,611
- Issue date Jun 3, 2025
- Kabushiki Kaisha Toshiba
- Keiji Nakagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer expander for uniformly expanding gap between dies, and die su...
- Patent number 12,322,614
- Issue date Jun 3, 2025
- Semes Co., Ltd.
- Do Youn Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive sheet for backgrinding and production method for semicondu...
- Patent number 12,312,512
- Issue date May 27, 2025
- Disco Corporation
- Karl Heinz Priewasser
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Wafer processing method
- Patent number 12,315,716
- Issue date May 27, 2025
- Disco Corporation
- Shunichiro Hirosawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tape pressure bonding apparatus
- Patent number 12,308,276
- Issue date May 20, 2025
- Disco Corporation
- Takashi Uchiho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,308,336
- Issue date May 20, 2025
- Samsung Electronics Co., Ltd.
- Jungho Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
DBI to SI bonding for simplified handle wafer
- Patent number 12,300,662
- Issue date May 13, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Chandrasekhar Mandalapu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ULTRA-THIN PACKAGED COMPONENT
- Publication number 20250239499
- Publication date Jul 24, 2025
- PANJIT INTERNATIONAL INC.
- CHUNG-HSIUNG HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE CHIP MANUFACTURING METHOD AND WORKPIECE PROCESSING APPARATUS
- Publication number 20250239493
- Publication date Jul 24, 2025
- Disco Corporation
- Kazuma Sekiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250239501
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MATERIAL FOR POSITIONAL ERROR COMPENSATION IN ASSEMBLY OF DISCRETE...
- Publication number 20250233002
- Publication date Jul 17, 2025
- KULICKE & SOFFA NETHERLANDS B.V.
- Matthew R. Semler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE CLEANING SYSTEMS AND RELATED METHODS
- Publication number 20250233021
- Publication date Jul 17, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. SEDDON
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Workpiece Processing Method
- Publication number 20250226229
- Publication date Jul 10, 2025
- LINTEC CORPORATION
- Hayato Nakanishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE FILM FOR SEMICONDUCTORS, DICING DIE BONDING FILM, AND METH...
- Publication number 20250226347
- Publication date Jul 10, 2025
- Resonac Corporation
- Takaaki NIWA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ADHESIVE FILM FOR SEMICONDUCTORS, DICING/DIE-BONDING FILM, AND METH...
- Publication number 20250226348
- Publication date Jul 10, 2025
- Resonac Corporation
- Takahiro KURODA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
FAN-OUT WAFER LEVEL PACKAGING OF SEMICONDUCTOR DEVICES
- Publication number 20250226264
- Publication date Jul 10, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- George CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRESSURE SENSITIVE ADHESIVE SHEET AND METHOD FOR PRODUCING ELECTRON...
- Publication number 20250215283
- Publication date Jul 3, 2025
- LINTEC CORPORATION
- Tomofumi KATO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
COMPOSITION FOR TEMPORARY FIXATION
- Publication number 20250215289
- Publication date Jul 3, 2025
- DENKA COMPANY LIMITED
- Takako HOSHINO TANIGAWA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CHIP EJECTOR
- Publication number 20250218853
- Publication date Jul 3, 2025
- Samsung Electronics Co., Ltd.
- Sangjin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXPANDING DEVICE, SEMICONDUCTOR CHIP MANUFACTURING METHOD, AND SEMI...
- Publication number 20250218871
- Publication date Jul 3, 2025
- YAMAHA HATSUDOKI KABUSHIKI KAISHA
- Yoshikuni SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE SHEET FOR SEMICONDUCTOR DEVICE
- Publication number 20250218851
- Publication date Jul 3, 2025
- INNOX ADVANCED MATERIALS CO., LTD.
- Keun-Young Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE FILM FOR SEMICONDUCTORS, INTEGRATED DICING/DIE BONDING FIL...
- Publication number 20250210572
- Publication date Jun 26, 2025
- Resonac Corporation
- Yui KUNITO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PROTECTIVE SHEET FOR SEMICONDUCTOR PROCESSING, AND METHOD FOR MANUF...
- Publication number 20250210403
- Publication date Jun 26, 2025
- Resonac Corporation
- Koji NAODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE SUBSTRATE DICING AND EDGE PASSIVATION
- Publication number 20250210586
- Publication date Jun 26, 2025
- Intel Corporation
- Praveen SREERAMAGIRI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITION FOR TEMPORARY FIXATION
- Publication number 20250207002
- Publication date Jun 26, 2025
- DENKA COMPANY LIMITED
- Shota YAMAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARRIER LAYER REMOVAL DEVICE AND BARRIER LAYER REMOVAL METHOD
- Publication number 20250210380
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- Tae Oh HA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR DISAGGREGATION OF SEMICONDUCTOR DIES IN A...
- Publication number 20250210402
- Publication date Jun 26, 2025
- Intel Corporation
- Marek Patyra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE TAPES FOR RECEIVING DISCRETE COMPONENTS
- Publication number 20250210404
- Publication date Jun 26, 2025
- KULICKE & SOFFA NETHERLANDS B.V.
- Val Marinov
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ADHESIVE FILM FOR SEMICONDUCTORS, DICING DIE BONDING FILM, AND METH...
- Publication number 20250197687
- Publication date Jun 19, 2025
- Resonac Corporation
- Yui KUNITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DICING/DIE-BONDING FILM AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20250201618
- Publication date Jun 19, 2025
- Resonac Corporation
- Tsuyoshi TAZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHEET FOR WORKPIECE PROCESSING AND MANUFACTURING METHOD OF PROCESSE...
- Publication number 20250201619
- Publication date Jun 19, 2025
- LINTEC CORPORATION
- Akio FUKUMOTO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PARALLEL ASSEMBLY OF DISCRETE COMPONENTS ONTO A SUBSTRATE
- Publication number 20250201620
- Publication date Jun 19, 2025
- KULICKE & SOFFA NETHERLANDS B.V.
- Val Marinov
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WORKPIECE HOLDER, WAFER CHUCK, WAFER HOLDING METHOD
- Publication number 20250201621
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Shiuan Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATING DEVICE AND METHOD OF FABRICATING SEMICONDUCTOR CHIP USIN...
- Publication number 20250201597
- Publication date Jun 19, 2025
- Samsung Electronics Co., Ltd.
- YEONG JUN JO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250201632
- Publication date Jun 19, 2025
- DENSO CORPORATION
- Yuji NAGUMO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER
- Publication number 20250201753
- Publication date Jun 19, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Devices in Semiconductor Packages and Methods of Forming...
- Publication number 20250192080
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS

Wafer tapes

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Wafer taping apparatus and method

Tape affixing apparatus

Method of manufacturing semiconductor device

Method of selectively transferring semiconductor device

Package structure and manufacturing method thereof

Methods of packaging semiconductor devices and packaged semiconduct...

Method for manufacturing electronic device

Wafer processing method

Singulation systems and related methods

Method of fabricating semiconductor device and method of separating...

Semiconductor components having conductive vias with aligned back s...

Method of manufacturing chips

Apparatus for separating semiconductor chip and method for separati...

Wafer cleaning apparatus

Method for manufacturing semiconductor device including resin layers

Sheet pasting device and sheet pasting method

Semiconductor device with discrete blocks

Lthc as charging barrier in info package formation

Massive parallel assembly method

Hybrid bond method for fixing dies

Processing apparatus

Semiconductor package and manufacturing method thereof

Wafer processing laminate, temporary adhesive material for wafer pr...

Semiconductor manufacturing device and method of using the same

Wafer expander for uniformly expanding gap between dies, and die su...

Adhesive sheet for backgrinding and production method for semicondu...

Wafer processing method

Tape pressure bonding apparatus

Semiconductor package

DBI to SI bonding for simplified handle wafer

Patents Applicationslast 30 patents

ULTRA-THIN PACKAGED COMPONENT

DEVICE CHIP MANUFACTURING METHOD AND WORKPIECE PROCESSING APPARATUS

SEMICONDUCTOR PACKAGE

MATERIAL FOR POSITIONAL ERROR COMPENSATION IN ASSEMBLY OF DISCRETE...

DIE CLEANING SYSTEMS AND RELATED METHODS

Workpiece Processing Method

ADHESIVE FILM FOR SEMICONDUCTORS, DICING DIE BONDING FILM, AND METH...

ADHESIVE FILM FOR SEMICONDUCTORS, DICING/DIE-BONDING FILM, AND METH...

FAN-OUT WAFER LEVEL PACKAGING OF SEMICONDUCTOR DEVICES

PRESSURE SENSITIVE ADHESIVE SHEET AND METHOD FOR PRODUCING ELECTRON...

COMPOSITION FOR TEMPORARY FIXATION

CHIP EJECTOR

EXPANDING DEVICE, SEMICONDUCTOR CHIP MANUFACTURING METHOD, AND SEMI...

ADHESIVE SHEET FOR SEMICONDUCTOR DEVICE

ADHESIVE FILM FOR SEMICONDUCTORS, INTEGRATED DICING/DIE BONDING FIL...

PROTECTIVE SHEET FOR SEMICONDUCTOR PROCESSING, AND METHOD FOR MANUF...

SEMICONDUCTOR PACKAGE SUBSTRATE DICING AND EDGE PASSIVATION

COMPOSITION FOR TEMPORARY FIXATION

BARRIER LAYER REMOVAL DEVICE AND BARRIER LAYER REMOVAL METHOD

METHODS AND APPARATUS FOR DISAGGREGATION OF SEMICONDUCTOR DIES IN A...

ADHESIVE TAPES FOR RECEIVING DISCRETE COMPONENTS

ADHESIVE FILM FOR SEMICONDUCTORS, DICING DIE BONDING FILM, AND METH...

DICING/DIE-BONDING FILM AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

SHEET FOR WORKPIECE PROCESSING AND MANUFACTURING METHOD OF PROCESSE...

PARALLEL ASSEMBLY OF DISCRETE COMPONENTS ONTO A SUBSTRATE

WORKPIECE HOLDER, WAFER CHUCK, WAFER HOLDING METHOD

LAMINATING DEVICE AND METHOD OF FABRICATING SEMICONDUCTOR CHIP USIN...

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER

Integrated Devices in Semiconductor Packages and Methods of Forming...