Wafer tapes

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CPC
H01L21/6836

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/6836Wafer tapes

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Inspection apparatus
- Patent number 12,270,790
- Issue date Apr 8, 2025
- Disco Corporation
- Naoki Murazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive tapes for receiving discrete components
- Patent number 12,266,558
- Issue date Apr 1, 2025
- KULICKE & SOFFA NETHERLANDS B.V.
- Val Marinov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated devices in semiconductor packages and methods of forming...
- Patent number 12,266,619
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor package, method of handling w...
- Patent number 12,266,559
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Shiuan Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip package unit and associated packaging method
- Patent number 12,266,583
- Issue date Apr 1, 2025
- Chengdu Monolithic Power Systems Co., Ltd.
- Yingjiang Pu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out wafer level packaging of semiconductor devices
- Patent number 12,261,084
- Issue date Mar 25, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- George Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Curable silicone-(meth)acrylate composition and methods for its pre...
- Patent number 12,258,503
- Issue date Mar 25, 2025
- Dow Silicones Corporation
- Juyoung Yook
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor packages with an intermetallic layer
- Patent number 12,255,167
- Issue date Mar 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Expanding apparatus
- Patent number 12,255,087
- Issue date Mar 18, 2025
- Disco Corporation
- Tomohito Matsuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processing method of wafer
- Patent number 12,255,086
- Issue date Mar 18, 2025
- Disco Corporation
- Kohei Tsujimoto
- B24 - GRINDING POLISHING
Information Patent Grant
Back grinding adhesive sheet, and method for manufacturing semicond...
- Patent number 12,243,766
- Issue date Mar 4, 2025
- Disco Corporation
- Karl Heinz Priewasser
- B24 - GRINDING POLISHING
Information Patent Grant
Dummy structure of stacked and bonded semiconductor device
- Patent number 12,237,291
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company
- Li-Hui Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,237,239
- Issue date Feb 25, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Jin Young Khim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminate peeling method, laminate, and laminate production method
- Patent number 12,227,678
- Issue date Feb 18, 2025
- NISSAN CHEMICAL CORPORATION
- Kazuhiro Sawada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die cleaning systems and related methods
- Patent number 12,230,543
- Issue date Feb 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Protective component forming apparatus
- Patent number 12,230,520
- Issue date Feb 18, 2025
- Disco Corporation
- Yoshinori Kakinuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of separating electronic devices having a back layer and app...
- Patent number 12,224,208
- Issue date Feb 11, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Gordon M. Grivna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing a workpiece and system for processing a workpiece
- Patent number 12,224,207
- Issue date Feb 11, 2025
- Disco Corporation
- Hitoshi Hoshino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and method of forming same
- Patent number 12,222,545
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer object and release agent composition
- Patent number 12,215,259
- Issue date Feb 4, 2025
- NISSAN CHEMICAL CORPORATION
- Hiroto Ogata
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Wafer processing method
- Patent number 12,211,731
- Issue date Jan 28, 2025
- Disco Corporation
- Kazuma Sekiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment device and alignment method
- Patent number 12,211,723
- Issue date Jan 28, 2025
- DISCO HI-TEC EUROPE GMBH
- Karl Heinz Priewasser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dynamic release tapes for assembly of discrete components
- Patent number 12,211,730
- Issue date Jan 28, 2025
- KULICKE & SOFFA NETHERLANDS B.V.
- Val Marinov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of transferring wafer
- Patent number 12,211,732
- Issue date Jan 28, 2025
- Disco Corporation
- Yoshinori Kakinuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for treating transparent adhesive layer of protective film o...
- Patent number 12,207,490
- Issue date Jan 21, 2025
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Mingjiong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer chuck for a laser beam wafer dicing equipment
- Patent number 12,205,842
- Issue date Jan 21, 2025
- Infineon Technologies AG
- Franz-Josef Pichler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon nitride films having reduced interfacial strain
- Patent number 12,198,926
- Issue date Jan 14, 2025
- PSIQUANTUM, CORP.
- Yong Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser dicing for singulation
- Patent number 12,198,982
- Issue date Jan 14, 2025
- Texas Instruments Incorporated
- Michael Todd Wyant
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer structure containing embedded silicon-less link chiplet
- Patent number 12,199,025
- Issue date Jan 14, 2025
- Chengdu ECHINT Technology Co., Ltd.
- Minghao Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for processing substrate
- Patent number 12,198,950
- Issue date Jan 14, 2025
- Semes Co., Ltd.
- Myung A Jeon
- B08 - CLEANING

Patents Applicationslast 30 patents

Information Patent Application
METHOD AND APPARATUS FOR DIVIDING WAFER
- Publication number 20250118601
- Publication date Apr 10, 2025
- Disco Corporation
- Shinya ARUGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE TRANSFER METHOD AND APPARATUS FOR MULTI-CHIP MODULE
- Publication number 20250118589
- Publication date Apr 10, 2025
- Silicon Box, Ltd.
- Byung Joon Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WORKPIECE PROCESSING METHOD
- Publication number 20250118561
- Publication date Apr 10, 2025
- Disco Corporation
- Younsuk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR CHIP
- Publication number 20250118565
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- Hyunho Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGES
- Publication number 20250118574
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- Jeonggi Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER STRUCTURE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES
- Publication number 20250112080
- Publication date Apr 3, 2025
- ROHM CO., LTD.
- Takaaki YAMANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER THINNING TAPE AND PREPARATION METHOD THEREOF, AND WAFER GRIND...
- Publication number 20250112079
- Publication date Apr 3, 2025
- WUHAN CHOICE TECHNOLOGY CO., LTD.
- De WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Detecting Semiconductor Wafer Ce...
- Publication number 20250112078
- Publication date Apr 3, 2025
- STATS ChipPAC Pte Ltd.
- Tack Chee Yong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D Multichip Package
- Publication number 20250105238
- Publication date Mar 27, 2025
- iCometrue Company Ltd.
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20250095999
- Publication date Mar 20, 2025
- Kabushiki Kaisha Toshiba
- Takeyuki SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER TAPE
- Publication number 20250087520
- Publication date Mar 13, 2025
- RENESAS ELECTRONICS CORPORATION
- Kouji NAKAJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE COMPOSITION, LAMINATE, AND METHOD FOR PRODUCING PROCESSED...
- Publication number 20250084291
- Publication date Mar 13, 2025
- NISSAN CHEMICAL CORPORATION
- Takahisa OKUNO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
BACK GRINDING TAPE HAVING TABS TO ASSIST IN REMOVING THE BACK GRIND...
- Publication number 20250087519
- Publication date Mar 13, 2025
- Western Digital Technologies, Inc.
- Seng Yu Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BACKGRINDING
- Publication number 20250073845
- Publication date Mar 6, 2025
- TEXAS INSTRUMENTS INCORPORATED
- GAIL EDSELLE REYES
- B24 - GRINDING POLISHING
Information Patent Application
ADHESIVE COMPOSITION AND METHOD OF MANUFACTURING A SEMICONDUCTOR DE...
- Publication number 20250075111
- Publication date Mar 6, 2025
- Samsung Electronics Co., Ltd.
- Hyungjun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE TRANSFER METHOD AND APPARATUS
- Publication number 20250079204
- Publication date Mar 6, 2025
- Silicon Box, Ltd.
- Byung Joon Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DICING TAPE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE USING...
- Publication number 20250079225
- Publication date Mar 6, 2025
- Samsung Electronics Co., Ltd.
- Hajung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR RING FRAME CLEANING AND INSPECTION
- Publication number 20250062153
- Publication date Feb 20, 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Chien-Fa LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE TREATMENT IN INTEGRATED CIRCUIT PACKAGE AND METHOD
- Publication number 20250062201
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Shien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DICING FILM AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE BY US...
- Publication number 20250062152
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Hyungjun Kim
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD OF SELECTIVE RELEASE OF COMPONENTS USING THERMAL RELEASE LAYER
- Publication number 20250054785
- Publication date Feb 13, 2025
- Deca Technologies USA, Inc.
- Benedict SAN JOSE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING TOPSIDE COOLED SEMICONDUCTOR PACKAGES BY FIL...
- Publication number 20250054831
- Publication date Feb 13, 2025
- INFINEON TECHNOLOGIES AG
- Chee Yang Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING S...
- Publication number 20250054806
- Publication date Feb 13, 2025
- Mitsubishi Electric Corporation
- Misato HISANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20250054875
- Publication date Feb 13, 2025
- DENSO CORPORATION
- MASASHI UECHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHED TRENCHES IN BOND MATERIALS FOR DIE SINGULATION, AND ASSOCIAT...
- Publication number 20250056937
- Publication date Feb 13, 2025
- Micron Technology, Inc.
- Vladimir Odnoblyudov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERNED CARRIER ASSEMBLIES HAVING AN INTEGRATED ADHESIVE FILM
- Publication number 20250054791
- Publication date Feb 13, 2025
- Daewon Semiconductor Packaging Industrial Company
- Jonathan Kevin Lie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LAMINATION SYSTEMS AND METHODS THEREOF FOR SEMICONDUCTOR WAFERS
- Publication number 20250038037
- Publication date Jan 30, 2025
- UTAC Headquarters Pte. Ltd.
- IL KWON SHIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250038052
- Publication date Jan 30, 2025
- Chipbond Technology Corporation
- Cheng-Hung Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING DEVICE, WAFER MOUNTING DEVICE, DICING D...
- Publication number 20250038038
- Publication date Jan 30, 2025
- Mitsubishi Electric Corporation
- Osamu ZAIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING METHOD, BONDING APPARATUS AND ARTICLE MANUFACTURING METHOD
- Publication number 20250028295
- Publication date Jan 23, 2025
- Canon Kabushiki Kaisha
- AKIFUMI KOMUKAI
- H01 - BASIC ELECTRIC ELEMENTS

Wafer tapes

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Inspection apparatus

Adhesive tapes for receiving discrete components

Integrated devices in semiconductor packages and methods of forming...

Method of manufacturing semiconductor package, method of handling w...

Flip chip package unit and associated packaging method

Fan-out wafer level packaging of semiconductor devices

Curable silicone-(meth)acrylate composition and methods for its pre...

Semiconductor packages with an intermetallic layer

Expanding apparatus

Processing method of wafer

Back grinding adhesive sheet, and method for manufacturing semicond...

Dummy structure of stacked and bonded semiconductor device

Semiconductor device and manufacturing method thereof

Laminate peeling method, laminate, and laminate production method

Die cleaning systems and related methods

Protective component forming apparatus

Method of separating electronic devices having a back layer and app...

Method of processing a workpiece and system for processing a workpiece

Package and method of forming same

Multilayer object and release agent composition

Wafer processing method

Alignment device and alignment method

Dynamic release tapes for assembly of discrete components

Method of transferring wafer

Method for treating transparent adhesive layer of protective film o...

Wafer chuck for a laser beam wafer dicing equipment

Silicon nitride films having reduced interfacial strain

Laser dicing for singulation

Interposer structure containing embedded silicon-less link chiplet

Apparatus and method for processing substrate

Patents Applicationslast 30 patents

METHOD AND APPARATUS FOR DIVIDING WAFER

DIE TRANSFER METHOD AND APPARATUS FOR MULTI-CHIP MODULE

WORKPIECE PROCESSING METHOD

METHOD OF MANUFACTURING SEMICONDUCTOR CHIP

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGES

WAFER STRUCTURE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES

WAFER THINNING TAPE AND PREPARATION METHOD THEREOF, AND WAFER GRIND...

Semiconductor Device and Method of Detecting Semiconductor Wafer Ce...

3D Multichip Package

MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE

CARRIER TAPE

ADHESIVE COMPOSITION, LAMINATE, AND METHOD FOR PRODUCING PROCESSED...

BACK GRINDING TAPE HAVING TABS TO ASSIST IN REMOVING THE BACK GRIND...

WAFER BACKGRINDING

ADHESIVE COMPOSITION AND METHOD OF MANUFACTURING A SEMICONDUCTOR DE...

DIE TRANSFER METHOD AND APPARATUS

DICING TAPE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE USING...

SYSTEM AND METHOD FOR RING FRAME CLEANING AND INSPECTION

SURFACE TREATMENT IN INTEGRATED CIRCUIT PACKAGE AND METHOD

DICING FILM AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE BY US...

METHOD OF SELECTIVE RELEASE OF COMPONENTS USING THERMAL RELEASE LAYER

METHOD FOR FABRICATING TOPSIDE COOLED SEMICONDUCTOR PACKAGES BY FIL...

SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING S...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

ETCHED TRENCHES IN BOND MATERIALS FOR DIE SINGULATION, AND ASSOCIAT...

PATTERNED CARRIER ASSEMBLIES HAVING AN INTEGRATED ADHESIVE FILM

WAFER LAMINATION SYSTEMS AND METHODS THEREOF FOR SEMICONDUCTOR WAFERS

CHIP STRUCTURE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR MANUFACTURING DEVICE, WAFER MOUNTING DEVICE, DICING D...

BONDING METHOD, BONDING APPARATUS AND ARTICLE MANUFACTURING METHOD