Wafer tapes

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CPC
H01L21/6836

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/6836Wafer tapes

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method for separating dies from a semiconductor substrate
- Patent number 12,170,226
- Issue date Dec 17, 2024
- Infineon Technologies AG
- Franz-Josef Pichler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for ring frame cleaning and inspection
- Patent number 12,165,901
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Fa Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses for executing a direct transfer of a semiconductor devi...
- Patent number 12,165,895
- Issue date Dec 10, 2024
- Cowles Semi, LLC
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single-shot encapsulation
- Patent number 12,166,001
- Issue date Dec 10, 2024
- Semtech Corporation
- Kok Khoon Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer adaptor for adapting different sized wafers
- Patent number 12,165,921
- Issue date Dec 10, 2024
- UTAC HEADQUARTERS PTD. LTD.
- Enrique Sarile
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Patterned carrier assemblies having an integrated adhesive film
- Patent number 12,154,805
- Issue date Nov 26, 2024
- Daewon Semiconductor Packaging Industrial Company
- Jonathan Kevin Lie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Layered sheet, container, carrier tape, and electronic component pa...
- Patent number 12,154,818
- Issue date Nov 26, 2024
- DENKA COMPANY LIMITED
- Yuko Fukuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pickup apparatus and method of using the same
- Patent number 12,142,499
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Jung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etched trenches in bond materials for die singulation, and associat...
- Patent number 12,132,155
- Issue date Oct 29, 2024
- Micron Technology, Inc.
- Vladimir Odnoblyudov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer dicing using femtosecond-based laser and plasma etch
- Patent number 12,131,952
- Issue date Oct 29, 2024
- Applied Materials, Inc.
- Wei-Sheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adhesive sheet
- Patent number 12,122,947
- Issue date Oct 22, 2024
- Nitto Denko Corporation
- Shusaku Ueno
- B24 - GRINDING POLISHING
Information Patent Grant
Method of processing workpiece and laser processing apparatus
- Patent number 12,121,993
- Issue date Oct 22, 2024
- Disco Corporation
- Masatoshi Nayuki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Layered sheet, container, carrier tape, and electronic component pa...
- Patent number 12,119,255
- Issue date Oct 15, 2024
- DENKA COMPANY LIMITED
- Yuko Fukuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package having an electronic component and an encapsulant encapsula...
- Patent number 12,112,992
- Issue date Oct 8, 2024
- Infineon Technologies AG
- Daniel Porwol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Affixing device
- Patent number 12,103,288
- Issue date Oct 1, 2024
- Mitsui Chemicals Tohcello, Inc.
- Masao Nogami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer processing method and machine
- Patent number 12,100,620
- Issue date Sep 24, 2024
- Disco Corporation
- Yoshinobu Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tape heating methods
- Patent number 12,094,750
- Issue date Sep 17, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same, and elec...
- Patent number RE50134
- Issue date Sep 17, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Shogo Ono
Information Patent Grant
Method of processing a substrate
- Patent number 12,094,751
- Issue date Sep 17, 2024
- Disco Corporation
- Karl Heinz Priewasser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processing apparatus
- Patent number 12,094,742
- Issue date Sep 17, 2024
- Disco Corporation
- Yoshinobu Saito
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods, systems, and apparatus for tape-frame substrate cleaning a...
- Patent number 12,087,571
- Issue date Sep 10, 2024
- Applied Materials, Inc.
- Ying Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolation bonding film for semiconductor packages and methods of fo...
- Patent number 12,087,732
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Tsu Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor die having edge with multiple grad...
- Patent number 12,087,618
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Sheng Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temporary adhesive containing epoxy-modified polysiloxane
- Patent number 12,077,686
- Issue date Sep 3, 2024
- NISSAN CHEMICAL CORPORATION
- Kazuhiro Sawada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer dividing method and dividing apparatus
- Patent number 12,074,067
- Issue date Aug 27, 2024
- Disco Corporation
- Kenji Furuta
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adhesive sheet for temporary attachment and method for producing se...
- Patent number 12,065,595
- Issue date Aug 20, 2024
- LG Chem, Ltd.
- Sera Kim
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Processed stacked dies
- Patent number 12,068,278
- Issue date Aug 20, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component producing method, holding film, and holding tool forming...
- Patent number 12,068,188
- Issue date Aug 20, 2024
- Mitsui Chemicals Tohcello, Inc.
- Eiji Hayashishita
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Protection film, method for affixing same, and method for manufactu...
- Patent number 12,064,946
- Issue date Aug 20, 2024
- Mitsui Chemicals Tohcello, Inc.
- Masao Nogami
- B32 - LAYERED PRODUCTS
Information Patent Grant
Processed inorganic wafer and processing wafer stack with abrasive...
- Patent number 12,062,534
- Issue date Aug 13, 2024
- MOSAIC MICROSYSTEMS LLC
- Shelby Forrester Nelson
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PROCESSED STACKED DIES
- Publication number 20240404990
- Publication date Dec 5, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROLESS PLATING METHODS
- Publication number 20240404879
- Publication date Dec 5, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Takashi NOMA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SHEET RELEASE APPARATUS
- Publication number 20240404847
- Publication date Dec 5, 2024
- Tokyo Seimitsu Co., Ltd.
- Hitoshi AOKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PROCESSING METHOD
- Publication number 20240395620
- Publication date Nov 28, 2024
- Disco Corporation
- Jonghyun RYU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM-LIKE ADHESIVE FOR SEMICONDUCTORS, METHOD FOR PRODUCING FILM-LI...
- Publication number 20240395759
- Publication date Nov 28, 2024
- Resonac Corporation
- Hiroyuki ISHIGE
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
TAPE HEATING METHODS
- Publication number 20240395593
- Publication date Nov 28, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. SEDDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOSENSITIVE COMPOSITION, TRANSFER FILM, CURED FILM, SEMICONDUCTO...
- Publication number 20240395551
- Publication date Nov 28, 2024
- FUJIFILM CORPORATION
- Keigo YAMAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON FRAGMENT DEFECT REDUCTION IN GRINDING PROCESS
- Publication number 20240387312
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Cheng Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240389363
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AFFIXING DEVICE
- Publication number 20240383245
- Publication date Nov 21, 2024
- Mitsui Chemicals Tohcello, Inc.
- Masao NOGAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND DEVICE FOR PRODUCING AND PREPARING ELECTRONIC COMPONENTS
- Publication number 20240387270
- Publication date Nov 21, 2024
- EV GROUP E. THALLNER GMBH
- Jurgen Burggraf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIGITALIZED INTERCONNECT REDISTRIBUTION ENABLED CHIPLET PACKAGING
- Publication number 20240387336
- Publication date Nov 21, 2024
- Applied Materials, Inc.
- Guan-Shian CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PICKUP APPARATUS AND METHOD OF USING THE SAME
- Publication number 20240387206
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Jung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF COMPENSATING DIE SHIFT IN THE COMPRESSION MOLDING
- Publication number 20240387222
- Publication date Nov 21, 2024
- PEP INNOVATION PTE LTD.
- Hwee Seng CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPORARY ADHESIVE CONTAINING EPOXY-MODIFIED POLYSILOXANE
- Publication number 20240376356
- Publication date Nov 14, 2024
- NISSAN CHEMICAL CORPORATION
- Kazuhiro SAWADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXPANDING DEVICE, SEMICONDUCTOR CHIP MANUFACTURING METHOD, AND SEMI...
- Publication number 20240379389
- Publication date Nov 14, 2024
- YAMAHA HATSUDOKI KABUSHIKI KAISHA
- Yoshikuni SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK GRINDING ADHESIVE FILM AND METHOD FOR MANUFACTURING ELECTRONIC...
- Publication number 20240379403
- Publication date Nov 14, 2024
- MITSUI CHEMICALS TOHCELLO, INC.
- Hiroto YASUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE WITH A GLASS INTERPOSER
- Publication number 20240371714
- Publication date Nov 7, 2024
- ADVANCED MICRO DEVICES, INC.
- Deepak Vasant KULKARNI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240371817
- Publication date Nov 7, 2024
- RENESAS ELECTRONICS CORPORATION
- Yasutaka NAKASHIBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES FOR PROCESSING DEVICES
- Publication number 20240371850
- Publication date Nov 7, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE HAVING EDGE WITH MULTIPLE GRADIENTS
- Publication number 20240363398
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Sheng TANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER DICING TO CONTROL SPLASH
- Publication number 20240363413
- Publication date Oct 31, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Bo LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REMOVING EPITAXIAL LAYER AND RESPECTIVE SEMICONDUCTOR ST...
- Publication number 20240363416
- Publication date Oct 31, 2024
- MICLEDI MICRODISPLAYS BV
- Soeren STEUDEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING LAMINATE AND KIT OF ADHESIVE COMPOSITIONS
- Publication number 20240363387
- Publication date Oct 31, 2024
- NISSAN CHEMICAL CORPORATION
- Takahisa OKUNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WORKPIECE TAPE REMOVING
- Publication number 20240355651
- Publication date Oct 24, 2024
- Yangtze Memory Technologies Co., Ltd.
- Jinhua YIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC DEVICE AND ELECTRONIC DEVICE
- Publication number 20240355677
- Publication date Oct 24, 2024
- TDK Corporation
- Shinji HARA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PROTECTION FILM, METHOD FOR AFFIXING SAME, AND METHOD FOR MANUFACTU...
- Publication number 20240351323
- Publication date Oct 24, 2024
- Mitsui Chemicals Tohcello, Inc.
- Masao NOGAMI
- B32 - LAYERED PRODUCTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES
- Publication number 20240355782
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE SHEET, PRODUCTION METHOD FOR ADHESIVE SHEET, ROLL, AND PRO...
- Publication number 20240355665
- Publication date Oct 24, 2024
- Resonac Corporation
- Kenta KIKUCHI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
THERMALLY CONDUCTIVE FILM ADHESIVE COMPOSITION AND THERMALLY CONDUC...
- Publication number 20240352289
- Publication date Oct 24, 2024
- FURUKAWA ELECTRIC CO., LTD.
- Minoru MORITA
- H01 - BASIC ELECTRIC ELEMENTS

Wafer tapes

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for separating dies from a semiconductor substrate

System and method for ring frame cleaning and inspection

Apparatuses for executing a direct transfer of a semiconductor devi...

Single-shot encapsulation

Wafer adaptor for adapting different sized wafers

Patterned carrier assemblies having an integrated adhesive film

Layered sheet, container, carrier tape, and electronic component pa...

Pickup apparatus and method of using the same

Etched trenches in bond materials for die singulation, and associat...

Wafer dicing using femtosecond-based laser and plasma etch

Adhesive sheet

Method of processing workpiece and laser processing apparatus

Layered sheet, container, carrier tape, and electronic component pa...

Package having an electronic component and an encapsulant encapsula...

Affixing device

Wafer processing method and machine

Tape heating methods

Semiconductor device and method of manufacturing the same, and elec...

Method of processing a substrate

Processing apparatus

Methods, systems, and apparatus for tape-frame substrate cleaning a...

Isolation bonding film for semiconductor packages and methods of fo...

Method for forming semiconductor die having edge with multiple grad...

Temporary adhesive containing epoxy-modified polysiloxane

Wafer dividing method and dividing apparatus

Adhesive sheet for temporary attachment and method for producing se...

Processed stacked dies

Component producing method, holding film, and holding tool forming...

Protection film, method for affixing same, and method for manufactu...

Processed inorganic wafer and processing wafer stack with abrasive...

Patents Applicationslast 30 patents

PROCESSED STACKED DIES

ELECTROLESS PLATING METHODS

SHEET RELEASE APPARATUS

WAFER PROCESSING METHOD

FILM-LIKE ADHESIVE FOR SEMICONDUCTORS, METHOD FOR PRODUCING FILM-LI...

TAPE HEATING METHODS

PHOTOSENSITIVE COMPOSITION, TRANSFER FILM, CURED FILM, SEMICONDUCTO...

SILICON FRAGMENT DEFECT REDUCTION IN GRINDING PROCESS

PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

AFFIXING DEVICE

METHOD AND DEVICE FOR PRODUCING AND PREPARING ELECTRONIC COMPONENTS

DIGITALIZED INTERCONNECT REDISTRIBUTION ENABLED CHIPLET PACKAGING

PICKUP APPARATUS AND METHOD OF USING THE SAME

METHOD OF COMPENSATING DIE SHIFT IN THE COMPRESSION MOLDING

TEMPORARY ADHESIVE CONTAINING EPOXY-MODIFIED POLYSILOXANE

EXPANDING DEVICE, SEMICONDUCTOR CHIP MANUFACTURING METHOD, AND SEMI...

BACK GRINDING ADHESIVE FILM AND METHOD FOR MANUFACTURING ELECTRONIC...

CHIP PACKAGE WITH A GLASS INTERPOSER

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

TECHNIQUES FOR PROCESSING DEVICES

SEMICONDUCTOR DIE HAVING EDGE WITH MULTIPLE GRADIENTS

LASER DICING TO CONTROL SPLASH

METHOD FOR REMOVING EPITAXIAL LAYER AND RESPECTIVE SEMICONDUCTOR ST...

METHOD OF MANUFACTURING LAMINATE AND KIT OF ADHESIVE COMPOSITIONS

WORKPIECE TAPE REMOVING

METHOD FOR MANUFACTURING ELECTRONIC DEVICE AND ELECTRONIC DEVICE

PROTECTION FILM, METHOD FOR AFFIXING SAME, AND METHOD FOR MANUFACTU...

INTEGRATED CIRCUIT PACKAGES

ADHESIVE SHEET, PRODUCTION METHOD FOR ADHESIVE SHEET, ROLL, AND PRO...

THERMALLY CONDUCTIVE FILM ADHESIVE COMPOSITION AND THERMALLY CONDUC...