Wafer tapes

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CPC
H01L21/6836

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/6836Wafer tapes

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Wafer processing method
- Patent number 12,211,731
- Issue date Jan 28, 2025
- Disco Corporation
- Kazuma Sekiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment device and alignment method
- Patent number 12,211,723
- Issue date Jan 28, 2025
- DISCO HI-TEC EUROPE GMBH
- Karl Heinz Priewasser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dynamic release tapes for assembly of discrete components
- Patent number 12,211,730
- Issue date Jan 28, 2025
- KULICKE & SOFFA NETHERLANDS B.V.
- Val Marinov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of transferring wafer
- Patent number 12,211,732
- Issue date Jan 28, 2025
- Disco Corporation
- Yoshinori Kakinuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for treating transparent adhesive layer of protective film o...
- Patent number 12,207,490
- Issue date Jan 21, 2025
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Mingjiong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer chuck for a laser beam wafer dicing equipment
- Patent number 12,205,842
- Issue date Jan 21, 2025
- Infineon Technologies AG
- Franz-Josef Pichler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon nitride films having reduced interfacial strain
- Patent number 12,198,926
- Issue date Jan 14, 2025
- PSIQUANTUM, CORP.
- Yong Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser dicing for singulation
- Patent number 12,198,982
- Issue date Jan 14, 2025
- Texas Instruments Incorporated
- Michael Todd Wyant
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer structure containing embedded silicon-less link chiplet
- Patent number 12,199,025
- Issue date Jan 14, 2025
- Chengdu ECHINT Technology Co., Ltd.
- Minghao Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for processing substrate
- Patent number 12,198,950
- Issue date Jan 14, 2025
- Semes Co., Ltd.
- Myung A Jeon
- B08 - CLEANING
Information Patent Grant
Film, laminate, semiconductor wafer with film layer, substrate for...
- Patent number 12,195,566
- Issue date Jan 14, 2025
- Mitsubishi Gas Chemical Company, Inc.
- Takahito Sekido
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processing method of workpiece
- Patent number 12,191,138
- Issue date Jan 7, 2025
- Disco Corporation
- Toshio Tsuchiya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Silicon carbide wafer and method for manufacturing the same
- Patent number 12,188,151
- Issue date Jan 7, 2025
- Denso Corporation
- Hiroaki Fujibayashi
- C30 - CRYSTAL GROWTH
Information Patent Grant
Tape mounter
- Patent number 12,191,172
- Issue date Jan 7, 2025
- Disco Corporation
- Toshiyasu Rikiishi
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Method and system for manufacturing a semiconductor package structure
- Patent number 12,183,712
- Issue date Dec 31, 2024
- Advanced Semiconductor Engineering, Inc.
- Che-Ting Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Parallel assembly of discrete components onto a substrate
- Patent number 12,176,239
- Issue date Dec 24, 2024
- KULICKE & SOFFA NETHERLANDS B.V.
- Val Marinov
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for separating dies from a semiconductor substrate
- Patent number 12,170,226
- Issue date Dec 17, 2024
- Infineon Technologies AG
- Franz-Josef Pichler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for ring frame cleaning and inspection
- Patent number 12,165,901
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Fa Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses for executing a direct transfer of a semiconductor devi...
- Patent number 12,165,895
- Issue date Dec 10, 2024
- Cowles Semi, LLC
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single-shot encapsulation
- Patent number 12,166,001
- Issue date Dec 10, 2024
- Semtech Corporation
- Kok Khoon Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer adaptor for adapting different sized wafers
- Patent number 12,165,921
- Issue date Dec 10, 2024
- UTAC HEADQUARTERS PTD. LTD.
- Enrique Sarile
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Patterned carrier assemblies having an integrated adhesive film
- Patent number 12,154,805
- Issue date Nov 26, 2024
- Daewon Semiconductor Packaging Industrial Company
- Jonathan Kevin Lie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Layered sheet, container, carrier tape, and electronic component pa...
- Patent number 12,154,818
- Issue date Nov 26, 2024
- DENKA COMPANY LIMITED
- Yuko Fukuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pickup apparatus and method of using the same
- Patent number 12,142,499
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Jung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer dicing using femtosecond-based laser and plasma etch
- Patent number 12,131,952
- Issue date Oct 29, 2024
- Applied Materials, Inc.
- Wei-Sheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Etched trenches in bond materials for die singulation, and associat...
- Patent number 12,132,155
- Issue date Oct 29, 2024
- Micron Technology, Inc.
- Vladimir Odnoblyudov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive sheet
- Patent number 12,122,947
- Issue date Oct 22, 2024
- Nitto Denko Corporation
- Shusaku Ueno
- B24 - GRINDING POLISHING
Information Patent Grant
Method of processing workpiece and laser processing apparatus
- Patent number 12,121,993
- Issue date Oct 22, 2024
- Disco Corporation
- Masatoshi Nayuki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Layered sheet, container, carrier tape, and electronic component pa...
- Patent number 12,119,255
- Issue date Oct 15, 2024
- DENKA COMPANY LIMITED
- Yuko Fukuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package having an electronic component and an encapsulant encapsula...
- Patent number 12,112,992
- Issue date Oct 8, 2024
- Infineon Technologies AG
- Daniel Porwol
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WAFER LAMINATION SYSTEMS AND METHODS THEREOF FOR SEMICONDUCTOR WAFERS
- Publication number 20250038037
- Publication date Jan 30, 2025
- UTAC Headquarters Pte. Ltd.
- IL KWON SHIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250038052
- Publication date Jan 30, 2025
- Chipbond Technology Corporation
- Cheng-Hung Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING DEVICE, WAFER MOUNTING DEVICE, DICING D...
- Publication number 20250038038
- Publication date Jan 30, 2025
- Mitsubishi Electric Corporation
- Osamu ZAIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING METHOD, BONDING APPARATUS AND ARTICLE MANUFACTURING METHOD
- Publication number 20250028295
- Publication date Jan 23, 2025
- Canon Kabushiki Kaisha
- AKIFUMI KOMUKAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing a Package Having an Electronic Component an...
- Publication number 20250029884
- Publication date Jan 23, 2025
- INFINEON TECHNOLOGIES AG
- Daniel Porwol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER DICING USING FEMTOSECOND-BASED LASER AND PLASMA ETCH
- Publication number 20250022755
- Publication date Jan 16, 2025
- Applied Materials, Inc.
- Wei-Sheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
TEMPORARY FIXATION SUBSTRATE, METHOD OF MANUFACTURING TEMPORARY FIX...
- Publication number 20250022742
- Publication date Jan 16, 2025
- NGK Insulators, Ltd.
- Yoshio KIKUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXPANSION RETAINING RING
- Publication number 20250022744
- Publication date Jan 16, 2025
- TOKYO SEIMITSU CO., LTD.
- Ryo HIRUMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250014937
- Publication date Jan 9, 2025
- Resonac Corporation
- Motoo AOYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRE-WAFER FABRICATION LASER DICING
- Publication number 20250006501
- Publication date Jan 2, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Hao ZHANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS FOR SEPARATING SINGULATED DIE FROM SUBSTRATE DICING TAPE...
- Publication number 20250006520
- Publication date Jan 2, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSED STACKED DIES
- Publication number 20240404990
- Publication date Dec 5, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROLESS PLATING METHODS
- Publication number 20240404879
- Publication date Dec 5, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Takashi NOMA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SHEET RELEASE APPARATUS
- Publication number 20240404847
- Publication date Dec 5, 2024
- Tokyo Seimitsu Co., Ltd.
- Hitoshi AOKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM-LIKE ADHESIVE FOR SEMICONDUCTORS, METHOD FOR PRODUCING FILM-LI...
- Publication number 20240395759
- Publication date Nov 28, 2024
- Resonac Corporation
- Hiroyuki ISHIGE
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
WAFER PROCESSING METHOD
- Publication number 20240395620
- Publication date Nov 28, 2024
- Disco Corporation
- Jonghyun RYU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TAPE HEATING METHODS
- Publication number 20240395593
- Publication date Nov 28, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. SEDDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOSENSITIVE COMPOSITION, TRANSFER FILM, CURED FILM, SEMICONDUCTO...
- Publication number 20240395551
- Publication date Nov 28, 2024
- FUJIFILM CORPORATION
- Keigo YAMAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON FRAGMENT DEFECT REDUCTION IN GRINDING PROCESS
- Publication number 20240387312
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Cheng Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240389363
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AFFIXING DEVICE
- Publication number 20240383245
- Publication date Nov 21, 2024
- Mitsui Chemicals Tohcello, Inc.
- Masao NOGAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND DEVICE FOR PRODUCING AND PREPARING ELECTRONIC COMPONENTS
- Publication number 20240387270
- Publication date Nov 21, 2024
- EV GROUP E. THALLNER GMBH
- Jurgen Burggraf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PICKUP APPARATUS AND METHOD OF USING THE SAME
- Publication number 20240387206
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Jung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF COMPENSATING DIE SHIFT IN THE COMPRESSION MOLDING
- Publication number 20240387222
- Publication date Nov 21, 2024
- PEP INNOVATION PTE LTD.
- Hwee Seng CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIGITALIZED INTERCONNECT REDISTRIBUTION ENABLED CHIPLET PACKAGING
- Publication number 20240387336
- Publication date Nov 21, 2024
- Applied Materials, Inc.
- Guan-Shian CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPORARY ADHESIVE CONTAINING EPOXY-MODIFIED POLYSILOXANE
- Publication number 20240376356
- Publication date Nov 14, 2024
- NISSAN CHEMICAL CORPORATION
- Kazuhiro SAWADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXPANDING DEVICE, SEMICONDUCTOR CHIP MANUFACTURING METHOD, AND SEMI...
- Publication number 20240379389
- Publication date Nov 14, 2024
- YAMAHA HATSUDOKI KABUSHIKI KAISHA
- Yoshikuni SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK GRINDING ADHESIVE FILM AND METHOD FOR MANUFACTURING ELECTRONIC...
- Publication number 20240379403
- Publication date Nov 14, 2024
- MITSUI CHEMICALS TOHCELLO, INC.
- Hiroto YASUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE WITH A GLASS INTERPOSER
- Publication number 20240371714
- Publication date Nov 7, 2024
- ADVANCED MICRO DEVICES, INC.
- Deepak Vasant KULKARNI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240371817
- Publication date Nov 7, 2024
- RENESAS ELECTRONICS CORPORATION
- Yasutaka NAKASHIBA
- H01 - BASIC ELECTRIC ELEMENTS

Wafer tapes

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Wafer processing method

Alignment device and alignment method

Dynamic release tapes for assembly of discrete components

Method of transferring wafer

Method for treating transparent adhesive layer of protective film o...

Wafer chuck for a laser beam wafer dicing equipment

Silicon nitride films having reduced interfacial strain

Laser dicing for singulation

Interposer structure containing embedded silicon-less link chiplet

Apparatus and method for processing substrate

Film, laminate, semiconductor wafer with film layer, substrate for...

Processing method of workpiece

Silicon carbide wafer and method for manufacturing the same

Tape mounter

Method and system for manufacturing a semiconductor package structure

Parallel assembly of discrete components onto a substrate

Method for separating dies from a semiconductor substrate

System and method for ring frame cleaning and inspection

Apparatuses for executing a direct transfer of a semiconductor devi...

Single-shot encapsulation

Wafer adaptor for adapting different sized wafers

Patterned carrier assemblies having an integrated adhesive film

Layered sheet, container, carrier tape, and electronic component pa...

Pickup apparatus and method of using the same

Wafer dicing using femtosecond-based laser and plasma etch

Etched trenches in bond materials for die singulation, and associat...

Adhesive sheet

Method of processing workpiece and laser processing apparatus

Layered sheet, container, carrier tape, and electronic component pa...

Package having an electronic component and an encapsulant encapsula...

Patents Applicationslast 30 patents

WAFER LAMINATION SYSTEMS AND METHODS THEREOF FOR SEMICONDUCTOR WAFERS

CHIP STRUCTURE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR MANUFACTURING DEVICE, WAFER MOUNTING DEVICE, DICING D...

BONDING METHOD, BONDING APPARATUS AND ARTICLE MANUFACTURING METHOD

Method of Manufacturing a Package Having an Electronic Component an...

WAFER DICING USING FEMTOSECOND-BASED LASER AND PLASMA ETCH

TEMPORARY FIXATION SUBSTRATE, METHOD OF MANUFACTURING TEMPORARY FIX...

EXPANSION RETAINING RING

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

PRE-WAFER FABRICATION LASER DICING

APPARATUS FOR SEPARATING SINGULATED DIE FROM SUBSTRATE DICING TAPE...

PROCESSED STACKED DIES

ELECTROLESS PLATING METHODS

SHEET RELEASE APPARATUS

FILM-LIKE ADHESIVE FOR SEMICONDUCTORS, METHOD FOR PRODUCING FILM-LI...

WAFER PROCESSING METHOD

TAPE HEATING METHODS

PHOTOSENSITIVE COMPOSITION, TRANSFER FILM, CURED FILM, SEMICONDUCTO...

SILICON FRAGMENT DEFECT REDUCTION IN GRINDING PROCESS

PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

AFFIXING DEVICE

METHOD AND DEVICE FOR PRODUCING AND PREPARING ELECTRONIC COMPONENTS

PICKUP APPARATUS AND METHOD OF USING THE SAME

METHOD OF COMPENSATING DIE SHIFT IN THE COMPRESSION MOLDING

DIGITALIZED INTERCONNECT REDISTRIBUTION ENABLED CHIPLET PACKAGING

TEMPORARY ADHESIVE CONTAINING EPOXY-MODIFIED POLYSILOXANE

EXPANDING DEVICE, SEMICONDUCTOR CHIP MANUFACTURING METHOD, AND SEMI...

BACK GRINDING ADHESIVE FILM AND METHOD FOR MANUFACTURING ELECTRONIC...

CHIP PACKAGE WITH A GLASS INTERPOSER

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME