Claims
- 1. A thermoplastic composition which comprises:
- (a) a major proportion of a high molecular weight aromatic polycarbonate resin; and
- (b) a minor proportion of a linear low density polyethylene resin having a density of from about 0.89 to about 0.96 gm./cc., said polyethylene resin comprising polymer chain units derived from ethylene and a minor amount of a comonomer consisting of an alpha-olefin having from 4 to 6 inclusive carbon atoms or a mixture of such alpha-olefins.
- 2. A thermoplastic molding composition which comprises:
- (a) a major proportion of a high molecular weight aromatic polycarbonate resin; and
- (b) a minor proportion of a linear low density polyethylene resin having a density of from about 0.89 to about 0.96 gm./cc., said polyethylene resin comprising polymer chain units derived from ethylene and a minor amount of hexene-1 as a comonomer.
- 3. A thermoplastic composition as defined in claim 1 wherein the linear low density polyethylene has a density of from about 0.915 to about 0.945 gm./cc.
- 4. A thermoplastic composition as defined in claim 1 wherein the linear low density polyethylene is the product of a low pressure gas phase process.
- 5. A thermoplastic molding composition as defined in claim 1 wherein the linear low density polyethylene is a virgin ethylene copolymer formed from ethylene and hexene-1 with a melt flow ratio of .gtoreq.22 to .ltoreq.32, and an unsaturated group content of .ltoreq.C=C/1000 carbon atom.
- 6. A thermoplastic composition which comprises:
- (a) from about 70 to about 92 parts by weight of a high molecular weight aromatic polycarbonate; and
- (b) from about 8 to about 30 parts by weight of a linear low density polyethylene resin having a density of from about 0.89 to about 0.96 gm./cc., said polyethylene resin comprising polymer chain units derived from ethylene and a minor amount of a comonomer consisting of an alpha-olefin having from 4 to 6 inclusive carbon atoms or a mixture of such alpha-olefins, per 100 parts by weight or components (a) and (b) in said composition.
- 7. A thermoplastic composition which comprises:
- (a) from about 70 to about 92 parts by weight of an aromatic polycarbonate resin; and
- (b) from about 8 to about 30 parts by weight of a linear low density polyethylene resin having a density of from about 0.89 to about 0.96 gm./cc., said polyethylene resin comprising polymer chain units derived from ethylene and a minor amount of hexene-1 as a comonomer, per 100 parts by weight of components (a) and (b) in said composition.
- 8. A thermoplastic molding composition as defined in claim 1 wherein the high molecular weight polycarbonate resin is of the formula: ##STR4## wherein A is a divalent aromatic radical of a dihydric phenol.
- 9. A thermoplastic molding composition as defined in claim 1 wherein the high molecular weight polycarbonate is of the formula: ##STR5## wherein R.sup.1 and R.sup.2 are hydrogen, (lower) alkyl or phenyl, X is selected from the group consisting of hydrogen, (lower) alkyl, chloro, bromo and mixtures thereof, and n is at least 30.
- 10. A thermoplastic molding composition as defined in claim 1 which includes from 70 to 99.5 parts by weight of the high molecular weight polycarbonate resin (a) and from 0.5 to 30 parts by weight of linear low density polyethylene resin (b) per 100 parts by weight of total resinous components (a) and (b) in said composition.
- 11. A thermoplastic molding composition as defined in claim 10 wherein the high molecular weight polycarbonate is derived from 2,2-bis(4-hydroxyphenyl)propane said composition having from about 85-96 parts by weight of the high molecular weight polycarbonate resin (a) and from about 4-15 parts by weight of linear low density polyethylene resin (b) per 100 parts by weight of total resinous components (a) and (b).
Parent Case Info
This is a continuation of copending application Ser. No. 743,526, filed June 7, 1985, now abandoned, which is a continuation of application Ser. No. 574,572, filed on Jan. 27, 1984 and issued as U.S. Pat. No. 4,563,502, which is a continuation of application Ser. No. 421,789, filed on Sept. 23, 1982, now abandoned.
US Referenced Citations (4)
Number |
Name |
Date |
Kind |
3431224 |
Goldblum |
Mar 1969 |
|
3654219 |
Boyer et al. |
Apr 1972 |
|
4123436 |
Holub et al. |
Oct 1978 |
|
4131575 |
Adelmann et al. |
Dec 1978 |
|
Foreign Referenced Citations (2)
Number |
Date |
Country |
705482 |
Mar 1965 |
CAX |
1495674 |
Apr 1969 |
DEX |
Continuations (3)
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Number |
Date |
Country |
Parent |
743526 |
Jun 1985 |
|
Parent |
574572 |
Jan 1984 |
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Parent |
421789 |
Sep 1982 |
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