Claims
- 1. A metallic composition derived from shredding and grinding at least one printed wiring assembly, said at least one printed wiring assembly having at least one printed circuit board and at least one integrated circuit attached to said at least one printed circuit board, wherein analysis of said metallic composition shows the following elements: Copper, Tin, Carbon, Nickel, Iron, Calcium, Lead, Aluminum, Zinc; and Sulfur.
- 2. The metallic composition of claim 1, wherein elements are present in the following ratio: said Copper is present at 65.9% by weight, said Tin is present at 15.9% by weight, said Carbon is 14.8% by weight; said Nickel is present at 0.8% by weight, said Iron is present at 0.8% by weight, said Calcium is present at 0.6% by weight, said Lead is present less than 0.1% by weight, said Aluminum is present less than 0.1% by weight, said Zinc is present less than 0.1% by weight, and said Sulfur is present at 1.1% by weight.
- 3. The metallic composition of claim 1, wherein said analysis of said metallic composition shows the following additional elements: Gold, Silver, Platinum, Palladium, Rhodium, and Ruthenium.
- 4. A composition derived from shredding and grinding printed wiring assemblies together, said printed wiring assemblies having at least one printed circuit board and at least one integrated circuit attached to said printed circuit board, comprising:(a) 98%-99.5% metals extracted from said at least one printed circuit board of said printed wiring assemblies, said metals are granulated; and (b) 2%-0.5% fiberglass and epoxy resin extracted from said at least one printed circuit board of said printed wiring assemblies.
- 5. The composition of claim 4, wherein said metals comprise Copper and Tin.
- 6. The composition of claim 5, wherein said Copper is 88-93% pure.
Parent Case Info
This application is a division of application having U.S. Ser. No. 08/939,086, filed Sep. 26, 1997, which is a divisional of application Ser. No. 08/582,780, filed Jan. 4, 1996, now U.S. Pat. No. 5,829,694.
US Referenced Citations (22)
Foreign Referenced Citations (4)
Number |
Date |
Country |
05-329841 |
Dec 1993 |
JP |
07-60227 |
Mar 1995 |
JP |
07-246382 |
Sep 1995 |
JP |
476295 |
Jul 1975 |
RU |
Non-Patent Literature Citations (4)
Entry |
Iji, M. et al. “Recycling of plastics wastes from electronic parts production processes” RILEM Proc. (1995), 27 (Disposal and Recycling of Organic and Polymeric Construction Materials) 126-136 (Abstract. |
Patent Abstracts of Japan, Unexamined Applications, Section: M, Sect. No. 1576, vol. 18, No. 151, p. 153 (19940314). |
Patent Abstracts of Japan, (CD-ROM), Unexamined Applications, vol. 95, No. 9. |
Patent Abstracts of Japan, (CD-ROM), Unexamined Applications, vol. 95, No. 3. |