1. Technical Field
The disclosure relates to compound material articles and a method of manufacturing the same.
2. Description of Related Art
For reinforcing a plastic article, fibers are usually added to the plastic. A conventional compound material article formed by injection has a coarse surface because of fibers at the surface of the compound material article. It is difficult to decorate the coarse surface.
Referring to
Step 102, providing a film with patterns and symbols printed thereon;
Step 104, placing the film into a cavity of an injecting mold;
Step 106, closing the injecting mold and injecting melted compound material into the cavity. The melted compound material is in contact with the film. The compound material includes basic material, and additive material. The additive material is generally made of carbon fiber and fiberglass. The basic material is generally made of one or more of Polycarbonate (PC), Acrylonitrile-butadienestyrene (ABS), and nylon 66 (PA66). The percent content of the additive material relative to total volume of the compound material may range from about 5% to 65%;
Step 108, cooling the injecting mold;
Step 110, opening the injecting mold to remove the formed article, which is now decorated with the patterns and symbols.
The method of the disclosure can be used to form enclosures of different notebook computers, mobile phones, and so on, with different patterns and characters thereon.
Referring to
The base layer 102 is used for protecting the formed compound material article from wear. The base layer 102 is generally made of one or more of Polycarbonate (PC), Polyethylene Terephthalate (PET), acrylic (PMMA), Oriented Polypropylene (OPP) and PolyvinylChloride (PVC), for example. In this embodiment, the thickness of the base layer 102 ranges from about 0.038 millimeters to 0.5 millimeters.
The pattern layer 106 is provided by printing ink on the first attaching layer 104. A metal decoration layer can also be provided as the pattern layer 106 via plating any of aluminum, chromium, copper, nickel, indium, and tin, alone or in combination, on the base layer 102 via vacuum evaporation method or electroplating method.
The first attaching layer 104 is arranged between the base layer 102 and the pattern layer 106. The second attaching layer 108 is arranged between the pattern layer 106 and the substrate 200 for attaching the film 100 to the substrate 200.
The first and second attaching layers 104, 108 may be made from materials selected from the group consisting of acrylic resin, nitrification fiber resin, polyamine formate resin, chlorination rubber resin, vinyl chloride-co-vinyl-acetic ester copolymer resin, polyamide resin, polyester resin, epoxy resin, polycarbonate resin, olefin resin, acrylonitrile-butylene-styrene monomer resin, for example. In this embodiment, the thickness of the second attaching layer 108 may range from about 0.0005 millimeters to 0.5 millimeters. The second attaching layer 108 is generally provided via concave printing, screen printing, offset printing, spraying method, dip coating method, coating in reverse order method and so on.
The base layer 102 may be transparent or translucent to view the patterns and/or colors of the pattern layer 106.
Referring to
Referring to
Referring to
It is believed that the present embodiments and their advantages will be understood from the foregoing description, and it will be apparent that various changes may be made thereto without departing from the spirit and scope of the description or sacrificing all of its material advantages, the examples hereinbefore described merely being exemplary embodiments.
Number | Date | Country | Kind |
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200910305058.6 | Jul 2009 | CN | national |