Computer integrated manufacturing techniques

Abstract
The present invention provides a novel distributed factory system framework including a novel factory automation lifecycle (200) having lifecycle activities for SW developing and integrating (210), installing and administrating (220), factory modeling (230), manufacturing planning (240), manufacturing controlling, monitoring and tracking (250) and analyzing of manufacturing results (260). The factory lifecycle comprises framework components. The distributed factory system framework also includes application components and software building blocks. The framework components are adapted for managing the application components, while the application components are utilized to provide instructions for managing a process such as a wafer fab. The building blocks are adapted for forming or modifying framework and application components. The distributed factory system framework provides computer implemented methods for integrating processing systems and facilitates process and equipment changes.
Description
FIELD OF THE INVENTION

The present invention relates to techniques for computer integrated manufacturing.


BACKGROUND OF THE INVENTION

A semiconductor device such as an IC (integrated circuit) generally has electronic circuit elements such as transistors, diodes and resistors fabricated integrally on a single body of semiconductor material. The various circuit elements are connected through conductive connectors to form a complete circuit which can contain millions of individual circuit elements. Integrated circuits are typically fabricated from semiconductor wafers in a process consisting of a sequence of processing steps. This process, usually referred to as wafer fabrication or wafer fab, includes such operations as oxidation, etch mask preparation, etching, material deposition, planarization and cleaning.


A summary of an aluminum gate PMOS (p-channel metal oxide semiconductor transistor) wafer fab process 40 is schematically shown in FIG. 1, illustrating major processing steps 41 through 73, as described in W. R. Runyan et al., Semiconductor Integrated Circuit Processing Technology, Addison-Wesley Publ. Comp. Inc., p.48, 1994. Each of these major processing steps typically include several sub steps. For example, a major processing step such as metallization to provide an aluminum layer by means of sputter deposition in a wafer fab chamber is disclosed in U.S. Pat. No. 5,108,570 (R. C. Wang, 1992). This sputter deposition process is schematically shown in sub steps 81 through 97 of process 80, see FIG. 2.



FIGS. 1 and 2 show sequential wafer fab processes. It is also known to utilize wafer fab sub systems which provide parallel processing steps. Such sub systems typically include one or more cluster tools. A cluster tool as defined herein includes a system of chambers and wafer handling equipment wherein wafers are processed in the cluster tool chambers without leaving a controlled cluster tool environment such as vacuum. An example of a cluster tool is disclosed in U.S. Pat. No. 5,236,868 (J. Nulman, 1993) which employs a vacuum apparatus having a central chamber and four processing chambers. A wafer handling robot in the central chamber has access to the interior of each the processing chambers in order to transfer wafers from the central chamber into each of the chambers while keeping the wafers in a vacuum environment. In one example, wafers in the ‘868 cluster are first transferred for processing to a cleaning chamber, then to a PVD (physical vapor deposition) chamber, followed by transfer to an annealing chamber and subsequently to a degassing chamber, thus utilizing a sequential process. It is also known to use cluster tools such as those disclosed in the ‘868 patent to process wafers in chambers which are used in parallel. For example, if a slow processing step is followed by a fast processing step, three chambers can be used in parallel for the slow process while the fourth chamber is used for the fast process.


Effective wafer inventory management is necessary for maintaining inventories of unprocessed or partly processed wafers at a minimum and thereby minimizing the unit cost of the semiconductor devices which are produced in the wafer fab. Minimizing inventories of wafers in process also has a wafer yield benefit because it is well known that the longer wafers are in the process, the lower their yield. Wafer inventory management typically uses scheduling techniques to maximize equipment capabilities in view of the demand for processed wafers, for example by scheduling parallel and series processing steps to avoid processing bottlenecks. It is well known to those of ordinary skill in the art that in-process wafer inventory management is facilitated by in-process wafer tracking, such as tracking wafer lots and wafer cassettes throughout a wafer fab. Effective inventory management of a wafer fab also requires a low incidence of bottlenecks or interruptions due to unscheduled down times which can for example be caused by unscheduled maintenance, interruptions resulting from processing parameters which are outside their specified limits, unavailability of required materials such as a process gas, unavailability of necessary maintenance replacement parts or unavailability of a processing tool such as a chamber.


Many components or sub-systems of a wafer fab are automated in order to achieve a high degree of processing reliability and reproducibility and to maximize yields. Wafer fab tools such as chambers are typically controlled by a computer using a set of instructions which are generally known as a recipe for operating the process which is executed by the tool. However, it is recognized that a high degree of automation wherein various processes and metrologies are integrated, is difficult to achieve due to the complexity and inter dependency of many of the wafer fab processes, see for example Peter van Zandt, Microchip Fabrication, 3rd ed., McGraw-Hill, pp. 472–478, 1997. Manufacturing systems such as a wafer fab are known to utilize software which provides an MES (manufacturing executions systems) function. Desirably, a wafer fab MES should be integrated for an entire wafer fab in order to achieve centralized wafer fab management and control. However, it is well known to those of ordinary skill in the art that a commercial wafer fab typically includes semiconductor processing tools from different equipment manufacturers, resulting in tool compatibility difficulties when attempts are made to develop an integrated MES. Another shortcoming of currently available wafer fab MES is the need for extensive software programming for each process change in the wafer fab, such as is necessary for changing a recipe, adding or replacing a tool, or changing the wafer fab to make a different wafer product.


It is well known to those of ordinary skill in the art that the functions of semiconductor manufacturing equipment, including for example a wafer fab, can be defined in basic equipment states such as the six states schematically illustrated in FIG. 3, see SEMI E10-96, Standard For Definition And Measurement Of Equipment Reliability, Availability, And Maintainability (RAM), published by Semiconductor Equipment and Materials International (SEMI), pp. 1–23, 1996. The semiconductor industry typically uses these six equipment states to measure and express equipment RAM (reliability availability and maintainability), based on functional equipment issues which are independent of who performs the function. These six basic equipment states include non-scheduled time 102 (FIG. 3), unscheduled downtime 104, scheduled downtime 106, engineering time 108, standby time 110 and productive time 112. Non-scheduled time 102 represents the time period wherein the equipment is not scheduled to be used, for example unworked shift. Unscheduled downtime 104 concerns time periods wherein the equipment is not in a condition to perform its intended function, e.g. during equipment repair. Scheduled downtime 106 occurs when the equipment is capable of performing its function but is not available to do this, such as process setup or preventive maintenance. Engineering time 108 concerns the time period wherein the equipment is operated to conduct engineering tests, for example equipment evaluation. Standby time 110 is a time period wherein the equipment is not operated even though it is in a condition to perform its intended function and is capable of performing its function, for example no operator is available or there is no input from the relevant information systems. Productive state 112 represents the time period wherein the equipment is performing its intended function, such as regular production and rework.


Total time period 114, see FIG. 3, is the total time during the period being measured; this includes the six equipment states 102, 104, 106, 108, 110 and 112. Operations time 116 concerns the total time period of states 104, 106, 108, 110 and 112. Operations time 116 includes equipment downtime 118 consisting of states 104 and 106, and equipment uptime 120. Equipment uptime 120 includes engineering time 108 and manufacturing time 122 which consists of standby time 110 and productive time 112.



FIGS. 4 and 5 provide more detailed schematic illustrations of the six equipment states shown in FIG. 3, see SEMI E10-96, at pp. 1–6. As depicted in FIG. 4, total time 114 consists of non-scheduled time 102 and operations time 116. Non-scheduled time 102 includes unworked shifts 130, equipment installation, modification, rebuilding or upgrading 132, off-line training 134 and shutdown or start-up time period 136. Operations time 116, as schematically illustrated in FIG. 5, consists of equipment downtime 118 and equipment uptime 120. Equipment downtime 118 consists of unscheduled downtime 104 and scheduled downtime 106. Unscheduled downtime 104 includes downtime for maintenance delay 140, repair time 142, changing consumables/chemicals 144, out of specification input 146 or facilities related downtime 148. Scheduled downtime 106 concerns downtime for maintenance delay 150, production test 152, preventive maintenance 154, changing consumables/chemicals 156, setup 158 or facilities related 159.


Equipment uptime 120, depicted in FIG. 5, consists of engineering time 108 and manufacturing time 122. Engineering time 108 includes process experiments 160 and equipment experiments 162. Manufacturing time 110 consists of standby time 110 and productive time 112. Standby time 110 includes time during which there is no operator 180, no product 182, no support tool 184 or when an associated cluster module is down 186. Productive time 112 concerns a time period during which there is regular production 190, work for a third party 192, rework 194 or an engineering run 196. The various equipment states as described in connection with FIGS. 3–5 provide a basis for communicating and evaluating RAM related equipment information in the semiconductor industry. RAM related equipment information includes topics which are well known to those of ordinary skill in the art such as: equipment reliability, equipment availability, equipment maintainability and equipment utilization, see for example SEMI E10-96 at pp. 6–11. Generally, MES functions can be employed to keep track of information regarding equipment states in manufacturing systems such as a wafer fab.


Advances in semiconductor materials, processing and test techniques have resulted in reducing the overall size of the IC circuit elements, while increasing their number on a single body. This requires a high degree of product and process control for each processing step and for combinations or sequences of processing steps. It is thus necessary to control impurities and particulate contamination in the processing materials such as process gases. Also, it is necessary to control processing parameters such as temperature, pressure, gas flow rates, processing time intervals and input sputter power. As illustrated in FIGS. 1 and 2, a wafer fab includes a complex sequence of processing steps wherein the result of any particular processing step typically is highly dependent on one or more preceding processing steps. For example, if there is an error in the overlay or alignment of etch masks for interconnects in adjacent IC layers, the resulting interconnects are not in their proper design location. This can result in interconnects which are packed too closely, forming electrical short defects between these interconnects. It is also well known that two different processing problems can have a cumulative effect. For example, a misalignment of interconnect etch masks which is not extensive enough to result in an electrical short, can still contribute to causing an electrical short if the process is slightly out of specification for allowing (or not detecting) particulate contamination having a particle size which would not have caused an electrical short if the interconnect masks had been in good alignment.


Processing and/or materials defects such as described above generally cause a reduced wafer fab yield, wherein the yield is defined as the percentage of acceptable wafers that are produced in a particular fab. In-process tests and monitoring of processing parameters are utilized to determine whether a given in-process product or process problem or defect indicates that intervention in the process run is necessary, such as making a processing adjustment or aborting the run. Consequently, product and process control techniques are used extensively throughout a wafer fab. When possible, yield problems are traced back to specific product or processing problems or defects to ultimately improve the yield of the wafer fab. High yields are desirable for minimizing manufacturing costs for each processed wafer and to maximize the utilization of resources such as electrical power, chemicals and water, while minimizing scrap re-work or disposal.


It is known to use SPC (statistical process control) and SQC (statistical quality control) methods to determine suitable wafer fab control limits and to maintain the process within these limits, see for example R. Zorich, Handbook Of Quality Integrated Circuit Manufacturing, Academic Press Inc., pp. 464–498, 1991. SPC and SQC methodologies suitable for a wafer fab include the use of control charts, see for example R. Zorich at pp. 475–498. As is well known to those of ordinary skill in the art, a control chart is a graphical display of one or more selected process or product variables, such as chamber pressure, which are sampled over time. The target value of a particular variable and its upper and lower control limits are designated on the chart, using well known statistical sampling and computation methods. The process is deemed out of control when the observed value of the variable, or a statistically derived value such as the average of several observed values, is outside the previously determined control limits. Control limits are typically set at a multiple of the standard deviation of the mean of the target value, such as for example 2σ or 3σ. The target value is derived from a test run or a production run which meets such wafer fab design criteria as yield, process control and product quality. SPC and SQC are considered synonymous when used in the above context, see R. Zorich at p. 464.


Accordingly, a need exists for methods and techniques which provide improved computer implemented integration of semiconductor manufacturing techniques in order to optimize process control, quality, yield and cost reduction. Also, there is a need for centralized wafer fab management and control through a computer integrated manufacturing system which facilitates processing or equipment changes without extensive software programming.


SUMMARY OF THE INVENTION

The present invention provides novel techniques for computer integrated manufacturing, particularly for manufacturing integrated circuit structures such as semiconductor wafers. These novel techniques provide the needed improvements in computer integration.


In one embodiment of the present invention a novel factory automation lifecycle is provided which includes SW for lifecycle activities for developing and integrating, installing and administrating, factory modeling, manufacturing planning, manufacturing controlling, monitoring and tracking, and lifecycle activities for analyzing manufacturing results. Output from an analyzing manufacturing results lifecycle activity can provide an input to other lifecycle activities, such as the factory modeling lifecycle activity. Framework components are associated with various lifecycle activities.


In another embodiment of the present invention a novel method for managing a processing system is provided which includes utilizing framework software components, application software components and software building blocks. The application components provide instructions for managing the system while the framework components are employed to manage the application components. The building blocks are adapted for forming or modifying framework and application components. A factory automation lifecycle includes the framework components. A novel tool integration component is employed by the novel method to communicate instructions to processing tools of the system. The tool integration component comprises a tool interface program and a tool integration component adapter. Instructions for managing the system can be modified by inputting data.


In still another embodiment of the present invention a novel method for processing a product includes determining the specifications for processing the product and then managing the process by means of a novel distributed factory system framework which includes framework components, application components and SW building blocks. The novel distributed factory system can be modified, if necessary, by inputting data. Computer implemented instructions for managing are formed by application components. These instructions are communicated to the process for manufacturing a product, for example by utilizing a tool integration component. The instructions are then implemented in the process, for example for fabricating integrated circuit structures.


In yet another embodiment of the present invention a novel method for starting a wafer fab run includes determining the sequence of processing steps and subsequently forming a workflow defining this sequence in a visual workflow component. The visual workflow component is included in a novel distributed factory system framework comprising framework components and application components. A request is then made to the visual workflow component to start the run by means of a work in progress management component or a GUI.


In another embodiment of the present invention an apparatus is provided including product processing equipment, a central processing unit, a link for operably linking the processing equipment to the central processing unit, a memory for storing digitally coded data structures, and data structures comprising a novel factory automation lifecycle. The present embodiment also provides for data structures including application components and building block components.


In still another embodiment of the present invention a distributed factory system framework is provided for managing a processing system, including a digitally coded first data structure comprising framework components, a second data structure including application components and a link for communicating digitally coded instructions to the processing system.


In yet another embodiment of the present invention a novel apparatus is provided comprising processing equipment and a novel distributed factory system framework for managing a processing system.


In additional embodiments of the present invention, novel data storage devices are provided comprising data structures such as novel factory automation lifecycle activity data structures, framework component data structures, application component data structures and building block data structures.





BRIEF DESCRIPTION OF THE DRAWINGS


FIG. 1 is a flowchart schematically illustrating a prior art wafer fab process.



FIG. 2 is a flowchart schematically illustrating a prior art wafer fab sputter metallization process.



FIG. 3 is a stack chart schematically illustrating prior art equipment time states.



FIG. 4 is a block diagram schematically showing prior art equipment time states of the stack chart illustrated in FIG. 3.



FIG. 5 is a block diagram schematically showing prior art equipment time states of the stack chart illustrated in FIG. 3.



FIG. 6 is a block diagram schematically illustrating a factory automation lifecycle of the present invention.



FIG. 7 is a schematic diagram illustrating interactions between framework components of the present invention.



FIG. 8 is a block diagram schematically illustrating component servers of the present invention.



FIG. 9 is a block diagram schematically illustrating a tool integration component of the present invention.



FIG. 10 is a schematic diagram illustrating a sequence of messages from a visual workflow component to a tool interface program of the present invention.





DETAILED DESCRIPTION OF THE INVENTION

While describing the invention and its embodiments, certain terminology will be utilized for the sake of clarity. It is intended that such terminology includes the recited embodiments as well as all equivalents.


In one embodiment of the invention a DFS/F (distributed factory system framework) SW (software) environment is provided to automate, integrate and coordinate factory MES (manufacturing execution system(s)) comprising equipment steps, decision steps and data steps which can be present in a processing, manufacturing or fabricating system or facility such as a wafer fab for processing or fabricating semiconductor structures, such as IC (integrated circuit) structures. The expression “FW” (framework) as defined herein, includes a collection of linked SW structures, components or classes that provide a functionality or a set of services. The expression “MES” as defined herein, includes a collection of SW data structures for starting processing related tasks, managing and/or controlling work in progress and facilitating the use of resources, such as materials, equipment, information and historical data for the execution of processing/ manufacturing/fabrication tasks, optionally including testing and data gathering tasks. The expression “IC structures” as defined herein, includes completely formed ICs and partially formed ICs.


DFS/F of the present invention includes a novel FALC (factory automation lifecycle) 200, shown in FIG. 6, to form an overall structure for integrated factory automation MES. FALC 200 is adapted for integrating, automating, managing or controlling various manufacturing related aspects of a processing, manufacturing or fabricating system or facility, thereby forming a factory model. These aspects can include wafer fab related equipment, such as wafer fab tools, methods such as wafer fab processing procedures, materials such as wafer fab process gases, inventory control, such as in-process wafer inventory control, work in process status determinations, evaluating in-process test data, monitoring equipment functions and quality management features, such as SPC (statistical process control). The novel lifecycle additionally facilitates the integration of tools, equipment or software from different tool, equipment or software suppliers to provide a coordinated manufacturing or fabricating facility wherein several tools are integrated.


Novel FALC 200, depicted in FIG. 6, includes an SW developing and integrating lifecycle activity 210, an installing and administrating lifecycle activity 220, a factory modeling lifecycle activity 230, a manufacturing planning lifecycle activity 240, a manufacturing controlling, monitoring and tracking lifecycle activity 250 and an analyzing of manufacturing results lifecycle activity 260. As schematically shown in FIG. 6, selected output from analyzing of manufacturing results lifecycle activity 260 can provide feedback to other lifecycle activities of the lifecycle, such as SW developing and integrating lifecycle activity 210, factory modeling lifecycle activity 230 and manufacturing planning lifecycle activity 240. The output and input interactions between these lifecycle activities will be described in more detail in connection with the description of lifecycle activity 260 for analyzing the manufacturing results.


The various lifecycle activities of FALC 200 of the present invention comprise SW. Hardware parts, equipment or assemblies are needed to support, operate or utilize the SW, which provides the functionality of the six lifecycle activities of FALC 200. The FALC 200 software includes FW SW components. The FW components define common system or factory operation rules and services and they are employed to provide services to application SW components which manage/control processing functions or systems, for example factories including fabricating facilities and various combinations of wafer fab tools, through interaction with the control system of processing equipment, such as on-board wafer fab tool controllers. Application components are adapted to meet the specific requirements of the process and the processing equipment, such as a wafer fab recipe. In other words, repeat processing runs of the same type of product in the same equipment using the same processing conditions does not require a modification in the application components. However, a change in materials, products, equipment or processing conditions typically requires modification of the data of one or more application components. For example, a change in a processing condition requires a corresponding change in one or more application components in order to provide the changed instructions to the equipment. FW components provide the services which enable a user to modify one or more application components to match novel DFS/F to a new processing condition or to a different material or tool. A novel FALC, such as FALC 200, can be adapted to new processing conditions, materials or equipment through data input, provided the adaptation does not require a change to a processing system which is substantially different. For example, the SW code of several application components of a wafer fab FALC is different from the SW code of the corresponding components of a FALC for a batch manufacturing process of a pharmaceutical product. Application components of the novel DFS/F communicate with equipment such as individual wafer fab tools through protocols and interfaces as will be described more fully in connection with TIC (tool integration component).


FW and application SW elements are referred to as components because they are separate SW entities, each with its own database, server, and standard GUI. The components inter-operate through a public set of communication standards such as DCOM (MICROSOFT®—Microsoft is a registered trademark of Microsoft Corporation, Redmond, Wash.13 distribute common object model) APIs (application programming interface) or CORBA (common object request broker architecture). SW common building blocks are provided in DFS/F to facilitate the creation of new FW and application components and to modify existing FW and application components. These building blocks typically include GUI (graphical user interface), server and DB (database) elements. Typically, DFS/F and FALC 200 components and SW building blocks are processed by one or more central processing units for data processing or one or more computers. Central processing units and computers which are suitable for the embodiments of the present invention are well known to those of ordinary skill in the art.


The six lifecycle activities of FALC 200, see FIG. 6, include the following functions. SW developing and integrating lifecycle activity 210 is adapted for defining a common structure for factory objects and servers. This common structure simplifies the formation of DFS/F compliant applications. Installing and administrating lifecycle activity 220 installs MES applications. It is necessary to register the capabilities of the MES applications with the DFS/F to make it possible to integrate the MES applications jointly with the capabilities of other applications. Lifecycle activity 220 also monitors and controls the software comprising the factory's MES. Additionally, it regulates access to MES capabilities, providing a common security service. Factory modeling lifecycle activity 230 is adapted for coordinating the formation of a consistent factory model in multiple manufacturing related applications. For example, the introduction of a new product typically requires changes in multiple applications, such as adding the product in both a WIP (work in progress) application and in a planning application. Lifecycle activity 230 is also adapted for defining the manner in which multiple applications will work together, for example defining how a WIP application and an equipment application can operate together to ensure that the correct equipment is used to manufacture a given product. SW of factory modeling lifecycle activity 230 is adapted for planning, controlling and tracking the manufacturing once a model of the factory's MES functions has been built by using factory modeling related SW.


Manufacturing planning lifecycle activity 240, depicted in FIG. 6, gathers status information from multiple applications in order to provide a planning application component. Additionally, lifecycle activity 240 develops and distributes manufacturing plans/schedules to the application components which manage the factory resources. Manufacturing controlling, monitoring and tracking lifecycle activity 250 is provided to coordinate the functioning of manufacturing application components in the execution of the manufacturing plan/schedule, to produce products according to the steps which are defined in the factory model. Analyzing manufacturing results lifecycle activity 260 is adapted for combining information from application components for analysis. It correlates data in different application components for data analysis and defines, detects and responds to specific factory events. This lifecycle activity is adapted for comparing actual production with planned production and indicating when an updated plan is needed through inputs to SW developing and integrating lifecycle activity 210, factory modeling lifecycle activity 230, and/or manufacturing planning lifecycle activity 240. As illustrated in FIG. 6, feedback loops from lifecycle activity 260 to these lifecycle activities form FALC 200 feedback cycles as follows. Feedback from lifecycle activity 260 to lifecycle activity 210 forms a SW developing cycle 270 while feedback from lifecycle activity 260 to lifecycle activity 280 provides a modeling cycle 280. An executing cycle 290 is formed in the feedback loop from lifecycle activity 260 to lifecycle activity 240. While the six lifecycle activities of novel FALC 200 have been depicted and described in a sequential manner, it will be understood that the SW associated with each of these lifecycle activities typically proceeds concurrently with one or more of the other lifecycle activities.


FALC 200 of the present invention described above is one facet of novel DFS/F. Two other facets of DFS/F are defined as: system layers and N tiers. The system layers aspect of novel DFS/F is described in Table I.









TABLE I





DFS/F System Layers















1. Base technology:


This includes the basic technology building blocks for DFS/F such as


messaging, graphical user interface (GUI) construction, use of for example


MTS (Microsoft transaction manager) for server construction, and


mapping objects to a relational database for persistence.


2. Common building blocks:


This includes common items such as user-defined attributes, versioning,


history and classification schemes. Typical common building blocks are


listed and described in Table II.


3. Framework components:


FW components manage the overall operation of the factory system


through the process of building a factory model, manufacturing products


according to the model, and then assessing the outcome to determine the


need for improvements. FALC 200 includes these components. Typical


FW components are listed and described in Table III.


4. Application components:


These components comprise factory resource management functionality,


such as material management, equipment management and tool integration


such as VFEI (virtual factory equipment interface) level communications


with tools. Typical application components are listed and described in


Table IV.









The common building blocks of the novel DFS/F are typically utilized to form or modify FW and application components. Representative building blocks are shown in Table II.









TABLE II





Common Building Blocks
















1.
Server construction building block which includes interfacing



between server API (application programming interface) and factory



object instantiation (construction of an object instance).


2.
Persistence building block for generating object to SQL/ODBC



(structure query language/open DB connection) mapping.


3.
DFS/F common GUI controls building block to provide the common



controls for the construction of the GUIs.


4.
Publish and subscribe messaging building block for publish subscribe



messaging, which differs from synchronous DCOM messaging.


5.
Dynamic API discovery building block used by FW components to



discover services provided by DFS/F components.


6.
Associations building block to connect objects across DFS/F



components. Representative uses include linking modeling data to



answer “where used” questions and linking MES execution



information, such as quality data, to equipment history.


7.
History building block to provide a common service to store and



retrieve the history of factory events.


8.
Generic service executor building block to execute the different types



of DFS/F services including: (1) synchronous services, (2) long



running services which are implemented through a completion



callback protocol and (3) GUI based services that are implemented



through a link between other services and a target computer desktop.


9.
Classifications building block which provides a common service to



classify factory objects for queries and analysis.


10.
Customer defined attributes building block for extending the DFS/F



component based object models. DFS/F typically provides user



extensible attribute models which support expansion of the model



based on the user's needs.


11.
State models building block includes a service to define and then



operate state models, such as tracking states for equipment, material



and ECNs (engineering change notice). A state model building block



can be defined such that it tracks unplanned downtime of the various



chambers of a cluster tool.


12.
Namespace building block defines management areas within DFS/F



data models.


13.
Schedule/datebook building block to support scheduling and add the



capability for each factory object to have a datebook showing future



events and history enhancements to indicate how a particular schedule



was followed.


14.
Templates building block provides services to define base definitions



that can be shared among factory objects. For example, this building



block can be used to define common characteristics for all memory



products.


15.
Versioned objects building block includes services to manage and



track changes in factory model objects over time, e.g. for example



managing and tracking changes in the definition of a particular



product over time.


16.
Navigation building block to view the relationship between factory



objects such as a material lot history.
















TABLE III





Framework Components
















1.
SC (security component) provides basic security having 3 security



modes: (1) defining user roles, (2) assigning users to roles and (3)



defining access to DFS/F objects and methods by role.


2.
GCC (GUI console component) is a container supporting navigation



and showing of data between DFS/F GUIs. Custom and/or third



party applications can be added to the console toolbar. A custom



environment can be created by adding GUIs and factory objects. The



console can include a transaction view, i.e. full screen, cascade,



tile and icons. A GUI console navigator allows browsing and



selecting DFS/F factory objects and has search capability based



on server-supplied search criteria. For example, it provides



navigation and data sharing between ActiveX GUIs.


3.
PLMC (performance & license management component) for tracking



and regulating system usage of components.


4.
SMC (saga management component) provides support for “long



running” transactions that should be treated as a unit but take too



long to rely on standard DB locking techniques.


5.
CRC (context resolution component) aids in MES execution by



linking context to results, insuring that the appropriate instructions



are delivered to any resource by allowing users to flexibly model how



resource selections are made.


6.
CMC (configuration management component) provides the



management of factory model changes across components.


7.
CC (calendar component) provides calendar and shift definitions for



scheduling and reporting.


8.
VWC (visual workflow component) defines and executes



manufacturing processes and is capable of executing predetermined



business processes. VWC defines business processes graphically as



a sequence/network of service invocations from a palette of DFS/F



services. Other DFS/F components utilize the VWC for process



definitions. For example, the WIP management component uses



VWC services to define how products are produced and uses it



to execute the processing of material lots. VWC process



definition capability includes the exchange of data between



service invocations and control structures to determine/select



the path(s) through predefined business processes. VWC is adapted



for executing business processes autonomously, i.e. functioning



independently of other SW components, and is capable of



responding to automated inputs as well as to user inputs.


9.
RCC (resource coordination component) is responsible for



having active resources available at dispatch stations. Matches



resources to common jobs/batches employing BRC. Together with



BRC it coordinates rendezvous of active and passive resources.


10.
EVMC (event monitor component) monitors/subscribes to events



published by DFS/F services. A DFS/F service can be executed



(including launching a VWC job) when a monitored event



occurs. EVMC supports vigilant manufacturing through



the creation of factory monitors.


11.
BRC (bill of resources component) establishes the resources across



multiple DFS/F components needed to launch a batch process, i.e. a



batch process involving the coordinated action of multiple resources.


12.
DMC (data manager component) consolidates data from FW



components and application components for reporting and analysis. It



is based on DW (data warehouse) technology and can provide sample



DW star schema and reports. DMC can access DBs for unstructured



data analysis.
















TABLE IV





Application Components
















1.
QMC (quality management component) provides quality analysis and



flexible data collection. It is able to determine corrective



manufacturing tactics in order to ensure conformance to



predetermined business rules.


2.
TIC (tool integration component) providing two way communications



between DFS/F and diverse equipment types. It is adapted for



communicating through tool protocols such as SECS (SEMI -



Semiconductor Equipment and Materials International - Equipment



Communication Standard), GEM (generic equipment model) and



VFEI (virtual factory equipment interface). SECS, GEM and



VFEI are tool protocols which are well known to those of



ordinary skill in the art.


3.
EMC (equipment management component) resolves the different



equipment states in SEMI E10 states, using a novel hierarchical



model to track individual tools in chambers in cluster tools.


4.
RMC (recipe management component) providing definition, selection



and distribution of recipes to equipment such as fab tools.


5.
DSC (dispatching and scheduling component) for scheduling and



dispatching of factory tasks including processing and maintenance.


6.
MHC (material handling component) for interfacing with materials



handling equipment.


7.
WMC (WIP -work in progress- management component) is provided



to support tracking of wafers, lots, batches and carrier,



supporting proactive business decisions for example: “if, then”.



WIP offers cluster tool visibility and control thereby providing



MES to wafer lots inside the cluster tool.


8.
Legacy system interface which is a component to access



existing factory software.









A third facet of DFS/F of the present invention comprises the various tiers which can be present in the FW components, application components and common building blocks. For example, this can be a 3 tier facet as follows. A first tier includes clients using services from other SW programs or components, e.g. visual WF jobs, GUIs and customer programs, such as VB (virtual Basic). A second tier comprises application or FW servers using for example MTS/DCOM to communicate DCOM. A third tier includes a DB engine, such as Oracle using an ODB (open database connectivity) interface. All DFS/F components employ these three tiers, while common building blocks can be used in one or more of these tiers depending on the structure and function of the building block.


FW components are associated with various lifecycle activities of FALC 200. Representative examples of these associations are shown in Table IV.









TABLE V







FW Components Associated With FALC 200 lifecycle activities








FALC 200



lifecycle activity
FW Component





220
SC, GCC, PLMC, SMC


230
CRC, CMC, CC


250
VWC, RCC, EVMC, BRC


260
DMC









FW components of an FALC of the present invention, such as FALC 200, are adapted for interacting with each other, thereby working together. For example, a factory model can be revised as illustrated in FIG. 7, by utilizing an exchange of messages between a GCC (GUI console component) 310, a CMC (configuration management component) 312 and a VWC (visual workflow component) 314. Changes in the factory model are collected to form an ECN (engineering change notice) in a CMC such as CMC 312 depicted in FIG. 7. The ECN is opened 316 (FIG. 7) to collect the changes in the factory model. The resulting ECN data 318 are employed by GCC 310 during the editing of the VWC workflow 320. The workflow is displayed and edited through a GUI 322 contained within GCC 310. The changed VWC workflow is returned to VWC in step 324, and VWC 314 then adds the changed workflow to the CMC ECN in step 326.


Any application component of the novel DFS/F can participate in the DFS/F by implementing the needed services from the appropriate FW components, thereby forming a plug and play type of SW framework, as is schematically illustrated in FIG. 8, employing FW or application servers working together through exchanges of messages. As shown in FIG. 8, FW components using FW component servers for CMC 410, VWC 412, DMC 414, EMC 416, GCC 418 and SC 419 use common service protocols to provide services to application components using application component servers for EMC 420, WMC 422, DSC 424, QMC 426, TIC 428 and gateway component 429. These services communicate through common service protocols 430 using for example DCOM communications. This SW technique of the present invention enables a user to modify processing and equipment MES instructions through data inputs rather than coding thus eliminating the need for time consuming programming changes requiring specialized skills. The application components require effective communications with integrated pieces of equipment such as wafer fab tools and materials handling equipment in order to execute the MES instructions to the controllers of wafer fab tools and/or other equipment. Typical controllers include processors for example micro processors such as on-board computers, computer operated software and mechanical/electrical controllers such as switches and electrical circuits employing for example a variable resistor such as a potentiometer.


DFS/F of the present invention includes a novel TIC application component (Table IV) for facilitating communications between various DFS/F components and equipment, such as wafer fab tools, by providing the basic equipment control building blocks which can be assembled in a VWC (Table III) workflow to control a machine. TIC provides services which include sending and receiving VFEI messages or commands to and from equipment. A sequence of these commands or messages represents a business logic such as commands to control a tool. These types of sequences can be defined in a VWC workflow. TIC provides the building blocks which are used to send commands or messages to a tool and to receive messages or information from the tool, and to communicate the received messages or information to other DFS/F components. TIC is part of the communications link between DFS/F and equipment such as wafer fab tools.


TIC of the present invention comprises a novel combination of a TIP (tool interface program) and a novel TIC adapter. TIP is provided for each machine or tool type to translate VFEI commands or messages to an interface, such as SECS, of a machine and its controls such as control SW. Equipment which is adapted for communicating with novel DFS/F will have a TIP instance, i.e. a SW process dedicated to the equipment, running as an intermediary between the equipment and the DFS/F. An example of a suitable communication protocol between a TIP instance for a machine and DFS/F is a VFEI on DCOM protocol. Additionally it is contemplated to provide a novel VFEI+ on DCOM protocol wherein VFEI+ will include enhancements for administration, for modeling and for the RPC (remote procedure call) nature of DCOM. It is contemplated to distribute TIP on several computers, for example where these computers are utilized in computer integrated wafer fab tools employing TIP SW.


A TIC adapter of the present invention is an intermediary between DFS/F and TIPs for example by allowing other DFS/F components to access tool capabilities through generalized commands which the adapter then adapts to the needs of the tool's specific TIP instances. This is illustrated in the following example for collecting measurements using a metrology tool in a wafer fab having different tools available for collecting the measurements. These novel techniques are adapted for embedding the collection process in a VWC WF which then enables a user, such as a process technician or engineer, to send identical measurement requests to TIC. The TIC adapter then translates the request into tool specific VFEI requests based on the particular tool which is selected at run time. These techniques of the present invention are capable of defining for example a single QMC (quality management component) data collection plan which can then be used for different tools collecting the same types of data, because the TIC adapter can translate the data parameter names from the generic name in the QMC plan to the specific names required by specific equipment types or tools.


Advantageously, a TIC adapter can also perform a protocol conversion between DFS/F style communications and the TIPs. This is a useful function because many DFS/F components are constructed using MTS and are designed to be transactional and stateless. For example, DFS/F servers both request and process services are either “synchronous”, i.e. services that are expected to be completed within a predictably short completion time of one second or less, and services that are considered long running and that use an LRSP (long running service protocol). As defined herein, the term “long running service” includes services having a completion time which cannot be predicted and which are thus unsuitable for DB locking techniques which are typically employed in connection with conventional services, such as synchronous services. It is contemplated to process the service by an MTS based server using a relatively short lived MTS thread and wherein any longer term state is saved in a DB. It is also contemplated that service requests can be based on a DCOM RPC style model, where a service is requested which is then followed by a returned reply The TIC adapter is an intermediary between DFS/F and TIPs.


An example of a novel TIC is illustrated in FIG. 9, showing a novel DFS/F 500 including TIC 520 of the present invention. In the present example, a distributed computer having nodes A, B and C was used. DFS/F components 510 communicated with fab tools 538 and 548 by means of TIC 520. MES instructions for tools 538 and 548 were sent by components 510 to novel TIC adapter 522 of TIC 520. For example, instructions for starting the processing of a material can be communicated from a DFS/F component 510, such as a VWC workflow, to tool 538 through TIC 520. The TIC adapter was accessed through an MTS server on node A. The instructions for tool 538 were communicated from TIC adapter 522, through a VFEI protocol on DCOM 532, to a TIP instance 534 on node B. TIP instance 534 then communicated these instructions to tool 538 using SECS protocol 536 of tool 538. Similarly, the instructions for tool 548 were communicated from TIC adapter 522 to a TIP instance 544 on node C, through a VFEI protocol on DCOM 542. TIP instance 544 communicated the instructions to tool 548 using SECS protocol 546 of tool 548. Also a DB (not shown) can be provided which can be accessed by TIC adapter 522 to store and retrieve TIC data such as the network locations of specific TIPs, using such methods and techniques as are well known to those of ordinary skill in the art.


TICs of the present invention employ Microsoft DCOM messaging technology to send messages between DFS/F components of the present invention and a TIC adapter, and between a TIC adapter and tool interface program instances according to the present invention. A TIC adapter is constructed using common building blocks of the present invention such as those described in Table II. An inventive TIC adapter can be constructed using a Microsoft transaction server. The adapter is capable of simultaneously managing messages from many DFS/F components and many TIP instances. A TIC adapter of the present invention is capable of saving information such as pending event requests, i.e. the instruction to a TIP regarding a request that a tool should report a particular status or operating event. The information can for example be saved using Oracle database technology using such techniques as are well known to those of ordinary skill in the art.



FIG. 10 shows a sequence of messages from a VWC 610 executing a business process which is defined in a VWC WF, to a TIC adapter 612 and then on to a TIP instance 614. This TIP instance includes a tool interface program for interfacing with processing equipment (not shown) such as a wafer fab tool for manufacturing an integrated circuit structure. The VWC business process sends an instruction to TIC adapter 612, requesting an event setup 616 which is a request for reporting an equipment event, for example reporting the completion of a wafer fabrication process. The event setup request is then routed 618 to TIP instance 614, which is subsequently acknowledged 620 to VWC 610. VWC then requests an event report 622 concerning the event setup request from TIC adapter 612. Event report request 622 is acknowledged in step 624. When the requested event occurs on the equipment, a report concerning the event is communicated 626 from TIP instance 614 to TIC adapter 612, which then checks to determine if there is a pending report request. When there is a pending report request, such as request 622, TIC adapter 612 delivers the requested report 628 to the VWC WF and acknowledges delivery 630 of the event report to TIP instance 614. Optionally, the VWC business WF can execute a loop requesting additional event reports. Once the requested reports are received from the tool, the loop terminates and VWC WF will send a concluding command to TIC to notify the tool, via its TIP, that the requested event reports should no longer be sent. It will be noted that TIP instance 614 might need a protocol such as SECS (not shown) in order to communicate with the equipment.


As shown in the above examples, application components such as TIC, communicate with and utilize FW components such as VWC (Table III). Additionally, a particular FW component can communicate with another FW component and utilize its services. For example, all FW components can use the common security FW component to regulate access to the services which these FW components provide, as is illustrated in FIG. 8.


Plug and play capabilities of a VWC are illustrated for example by WFs wherein the VWC is a technique for defining a business process as a WF which is subsequently executed as a job. WFs are graphical representations of business processes defined for manufacturing a product such as a semiconductor structure typically including many processing steps, equipment steps, movement steps, decision steps and data steps. Each of these steps is defined as a step in a WF. WFs can include movements, decisions, quality activities and equipment commands. WFs are built using drag and drop techniques in a computer graphical environment using techniques which are well known to those or ordinary skill in the art. Once defined, a WF is executed as a job. For example, a WF can be executed to create a lot of a product.


DFS/F of the present invention can be utilized to start production, such as a wafer fab run, by means of the WIP management application component (Table IV) as follows. A user, such as a process engineer, defines how a particular product is made by creating a WF in VWC that defines the sequence of steps needed to make the product. This sequence can for example include a wafer fab recipe. The user then starts the lot by using the WIP management application component service or GUI requesting VWC to start the WF for the lot. In summary, WIP uses VMC as a service for defining the processing steps and subsequently for actually manufacturing/fabricating production lots.


Building blocks provide common functionality to the novel DFS/F techniques to facilitate the construction of application and FW components. For example, a DFS/F classification building block (Table II) can be used in the EMC application component (Table IV) to classify equipment. It can also be used in the WIP management application component (Table IV) to classify products. This building block includes the three DFS/F tiers. A first tier uses a DFS/F GUI within the GCC to view and modify or update classification information. A second tier includes SW code/logic that is provided in the component server, such as EMC or WMC servers. This particular SW defines how the classifications are specified. For example, this SW enables a user to classify a particular wafer fab tool as an etcher. The classification building block SW is used in the component servers through for example a C++ inheritance capability, i.e. the capability to pass resources or attributes from component servers down to the specifics of a particular product, process or machine. A third tier comprises a DB table definition that is employed by the component server logic for storing and retrieving classification information.


Digitally coded data structures or information of novel DFS/F or its components and building blocks can be stored on a removable electronic data storage medium or device, such as computer floppy disks, removable computer hard disks, magnetic tapes and optical disks, to facilitate the use of the same technique at different processing locations. Alternatively, the data structure or information can be stored on a non-removable electronic data storage medium, including a medium positioned at a location which is remote from the tool, using such storage devices as are well known to those of ordinary skill in the art. The data structures or information can be communicated from a remote location to a central data processing unit or to a computer using communications techniques which are well known to those of ordinary skill in the art including hard wire connections, wireless connections and data communications methods utilizing one or more modems or techniques using one or more computers commonly known as servers. Once DSF/F or its components or building blocks are installed, they are commonly stored in a data storage device or memory of a dedicated computer or a distributed computer system which is integrated with the processing system and its equipment, using such data storage techniques as are well known to those of ordinary skill in the art.


It is contemplated to provide novel products comprising digitally coded data structures or information of novel DFS/F or its components or building blocks, stored in memory such as a removable electronic data storage medium or device. It is also contemplated to provide a novel computer integrated apparatus having a memory or data storage device for storage of electronic or digital data, a central processing unit or a computer, and processing equipment wherein DFS/F or its components or building blocks are stored in the data storage device.


The invention has been described in terms of the preferred embodiment. One skilled in the art will recognize that it would be possible to construct the elements of the present invention from a variety of means and to modify the placement of components in a variety of ways. While the embodiments of the invention have been described in detail and shown in the accompanying drawings, it will be evident that various further modifications are possible without departing from the scope of the invention as set forth in the following claims.

Claims
  • 1. A method for defining a computer implemented factory automation lifecycle, the method comprising: a) installing and administrating lifecycle activity framework components;b) factory modeling lifecycle activity framework components; andc) manufacturing controlling, monitoring and tracking lifecycle activity framework components that include a visual workflow component configured to execute at least one manufacturing process and at least one business process.
  • 2. The method of claim 1, wherein said administrating lifecycle activity framework components comprise a performance and license management component.
  • 3. The method of claim 1, wherein said factory modeling lifecycle activity framework components comprise a configuration management component.
  • 4. The method of claim 1, wherein said manufacturing controlling, monitoring and tracking lifecycle activity framework components comprise defining one or more framework components selected from a resource coordination component, an event monitor component and a bill of resources component.
  • 5. The method of claim 1 additionally comprising a method for defining one or more analyzing of manufacturing results lifecycle activity framework components.
  • 6. The method of claim 5, wherein defining one or more analyzing of manufacturing results lifecycle activity framework components comprises defining a data manager component.
  • 7. The method of claim 5 additionally defining a method for defining interactions between the one or more manufacturing results lifecycle activity framework components and components selected from the group consisting of factory modeling lifecycle activity framework components.
  • 8. The method of claim 1 additionally defining a software (SW) developing and integrating lifecycle activity.
  • 9. The method of claim 1 additionally defining a manufacturing planning lifecycle activity.
  • 10. The method of claim 1 wherein defining a factory automation lifecycle comprises defining a factory automation lifecycle for processing an integrated circuit structure.
  • 11. The method of claim 1, wherein defining a factory automation lifecycle additionally comprises defining framework components such that the framework components are adapted for communicating with a tool integration component, wherein the framework components are selected from the group consisting of installing and administrating lifecycle activity framework components, factory modeling lifecycle activity framework components, and manufacturing controlling, monitoring and tracking lifecycle activity framework components.
  • 12. An apparatus for processing a product, the apparatus comprising: a) product processing equipment;b) at least one central processing unit for electronic data processing;c) a link for operably linking the central processing unit to the product processing equipment;d) a memory for storing digitally coded data structures, wherein the memory is operably linked to the at least one central processing unit; ande) a digitally coded first data structure stored in the memory wherein the data structure comprises a factory automation lifecycle including: (1) administrating lifecycle activity framework components,(2) factory modeling lifecycle activity framework components, and(3) manufacturing, controlling and tracking lifecycle activity framework components that include a visual workflow component configured to execute at least one manufacturing process and at least one business process.
  • 13. The apparatus of claim 12, wherein the administrating lifecycle activity framework components comprise a performance and license management component.
  • 14. The apparatus of claim 12, wherein the factory modeling lifecycle activity framework components comprise configuration management component.
  • 15. The apparatus of claim 12, wherein the manufacturing controlling and tracking lifecycle activity framework components comprise one or more framework components selected from a resource coordination component, an event monitor component and a bill of resources component.
  • 16. The apparatus of claim 12 additionally comprising one or more analyzing of manufacturing results lifecycle activity framework components.
  • 17. The apparatus of claim 16, wherein the one or more analyzing of manufacturing results lifecycle activity framework components comprise a data manager component.
  • 18. The apparatus of claim 12 additionally comprising a digitally coded second data structure including application components, wherein the first data structure is adapted for managing the second data structure.
  • 19. The apparatus of claim 18 additionally comprising a digitally coded third data structure including software building blocks for forming one or more of the framework components.
  • 20. The apparatus of claim 12, wherein the first data structure comprises: a) a digitally coded fourth data structure including a graphical user interface (GUI) console component; andb) a digitally coded fifth data structure including a configuration management component.
  • 21. The apparatus of claim 20, wherein the fourth and fifth data structures are adapted for interacting.
  • 22. The apparatus of claim 12 wherein the link comprises a tool integration component including: (1) a tool integration component adapter and (2) a tool interface program.
  • 23. The apparatus of claim 12 comprising an apparatus for processing an integrated circuit structure.
  • 24. A data storage device comprising a digitally coded first data structure including a factory automation lifecycle having: a) administrating lifecycle activity framework components;b) factory modeling lifecycle activity framework components; andc) manufacturing controlling and tracking lifecycle activity framework components that include a visual workflow component configured to execute at least one manufacturing process and at least one business process.
  • 25. The device of claim 24, wherein the administrating lifecycle activity framework components comprise a performance and license management component.
  • 26. The device of claim 24, wherein the factory modeling lifecycle activity framework components comprise configuration management component.
  • 27. The device of claim 24, wherein the manufacturing controlling and tracking lifecycle activity framework components comprise one or more framework components selected from a resource coordination component, an event monitor component and a bill of resources component.
  • 28. The device of claim 24 additionally comprising one or more analyzing of manufacturing results lifecycle activity framework components.
  • 29. The device of claim 28, wherein the one or more analyzing of manufacturing results lifecycle activity framework components comprise a data manager component.
  • 30. The device of claim 24 comprising a plurality of framework components which are adapted for interacting with a graphical user interface (GUI) console framework component.
  • 31. The device of claim 24 additionally comprising a digitally coded second data structure including application components, wherein the first data structure is adapted for managing the second data structure.
  • 32. The device of claim 31 additionally comprising a digitally coded third data structure including software building blocks for forming one or more of the framework components.
  • 33. The device of claim 32 wherein the first, second and third data structures are adapted for processing an integrated circuit structure.
  • 34. A method for defining a computer implemented automation lifecycle of a factory, the method comprising the steps of: a) defining software components relating to a lifecycle activity framework for automating the factory comprising a plurality of wafer fabrication tools; andb) installing and controlling the defined software components that include a visual workflow component configured to execute at least one manufacturing process and at least one business process.
  • 35. The method of claim 34, wherein the software components include a manufacturing execution system.
  • 36. A computer implemented method of automating a factory for manufacturing semiconductor devices, the method comprising the acts of: a) developing and installing control software for automating the factory;b) modeling tools and manufacturing processes of the factory;c) generating a plan to manufacture one or more semiconductor devices;d) controlling, tracking and monitoring manufacture of the semiconductor devices according to the plan;e) analyzing manufacturing results, wherein at least one of acts a), b) and c) is modified based on the results; andf) constructing one or more framework components configured to allow a user to conduct acts a)–e), wherein said framework components include a visual workflow component.
  • 37. The method of claim 36 further comprises the act of: g) allowing the one or more framework components to access features of the tools and manufacturing processes of the factory with one or more generalized commands.
  • 38. The method of claim 37 further comprises the act of: h) providing an interface between the one or more framework components and the tools of the factory, wherein the providing the interface includes the act of:translating the one or more generalized commands to commands adapted to control one or more of the tools of the factory.
  • 39. The method of claim 36 further comprising the act of: providing common service protocols among a plurality of components of the one or more framework components.
  • 40. The method of claim 39 further comprising the act of: configuring the one or more framework components to be capable of including one or more of:a configuration management component;a data manager component;an event monitor component;a GUI console component; anda security component.
  • 41. The method of claim 39 further comprising the act of: configuring a configuration management component to manage the act of (b) modeling tools and manufacturing processes of the factory.
  • 42. The method of claim 39 further comprising the act of: providing a performance and license management component.
  • 43. The method of claim 39 further comprising the act of: providing a data manager component to manage the act of e) analyzing manufacturing results, wherein at least one of acts a), b) and c) is modified based on the results.
  • 44. The method of claim 39 further comprising the act of: providing an event monitor component to manage the act of d) controlling, tracking and monitoring manufacture of the semiconductor devices according to the plan.
  • 45. The method of claim 39 further comprising the act of: providing a GUI console component to manage the acts of a) developing and installing control software for automating the factory and f) constructing one or more framework components configured to allow a user to conduct acts a)–e).
  • 46. The method of claim 39 further comprising the act of: configuring the one or more framework components to be capable of including any one or more of:a configuration management component;a data manager component;an event monitor component;a GUI console component;a security component;a equipment management component; sample applicationa work-in-progress management component;a dispatching and scheduling component;a quality management component;a tool integration component; anda gateway component.
  • 47. The method according to claim 36, wherein the visual workflow component is configured to execute at least one manufacturing process and at least one business process.
  • 48. A computer implemented method of automating a factory for manufacturing semiconductor devices, the method comprising the acts of: constructing a software framework configured to conduct a plurality of lifecycle activities, wherein the lifecycle activities comprise:a) developing and integrating control software for automating the factory;b) installing and administrating the control software;c) modeling tools of the factory;d) generating a plan to manufacture semiconductor devices;e) controlling, tracking and monitoring manufacture of the semiconductor devices according to the plan; andf) analyzing manufacturing results, wherein at least one of acts a), c) and d) is modified based on the results.
  • 49. The method of claim 48, wherein the act b) further comprises modeling manufacturing processes of the factory.
  • 50. The method of claim 48 further comprises the act of: g) allowing the software framework to access features of the tools of the factory with one or more generalized commands.
  • 51. The method of claim 50 further comprises the act of: h) providing an interface between the software framework and the tools of the factory, wherein the providing the interface includes the act of:translating the generalized commands to commands adapted to control one or more the tools of the factory.
  • 52. The method of claim 48 further comprising the act of: providing common service protocols among a plurality of components of the software framework.
  • 53. The method of claim 52 further comprising the act of: configuring the software framework to be capable of including one or more of:a configuration management component;a data manager component;an event monitor component;a GUI console component; anda security component.
  • 54. The method of claim 52 further comprising the act of: configuring a configuration management component to manage the act of (b) modeling tools of the factory.
  • 55. The method of claim 52 further comprising the act of: providing a performance and license management component.
  • 56. The method of claim 52 further comprising the act of: providing a data manager component to manage the act of e) analyzing manufacturing results, wherein at least one of acts a), b) and c) is modified based on the results.
  • 57. The method of claim 52 further comprising the act of: providing an event monitor component to manage the act of d) controlling, tracking and monitoring manufacture of the semiconductor devices according to the plan.
  • 58. The method of claim 52 further comprising the act of: providing a GUI console component to manage the acts of a) developing and installing control software for automating the factory and f) constructing a software framework configured to allow a user to conduct acts a)–e).
  • 59. The method of claim 52 further comprising the act of: configuring the software framework to be capable of including any one or more of:a configuration management component;a data manager component;an event monitor component;a GUI console component;a security component;a equipment management component; sample application;a work-in-progress management component;a dispatching and scheduling component;a quality management component;a tool integration component; anda gateway component.
  • 60. The method according to claim 48, wherein the visual workflow component is configured to execute at least one manufacturing process and at least one business process.
  • 61. A computer implemented system for automating a factory for manufacturing semiconductor devices, the system comprising: a software framework configured to conduct a plurality of lifecycle activities, wherein the software framework comprises:a) means for developing and integrating control software for automating the factory;b) means for installing and administrating the control software;c) means for modeling tools and manufacturing processes of the factory;d) means for modeling manufacturing processes of the factory;e) means for generating a plan to manufacture semiconductor devices;f) means for controlling, tracking and monitoring manufacture of the semiconductor devices according to the plan; andg) means for analyzing manufacturing results, wherein at least one of acts a), c) and d) is modified based on the results wherein said software framework includes a visual workflow component.
  • 62. The system of claim 61 further comprising: h) an interface configured to allow the software framework to access features of the tools of the factory with one or more generalized commands.
  • 63. The system of claim 61 wherein the interface is configured to translate the generalized commands to commands adapted to control one or more the tools of the factory.
  • 64. The system of claim 61 further comprising: common service protocols among a plurality of components of the software framework.
  • 65. The system of claim 64 the software framework to be capable of including one or more of: a configuration management component;a data manager component;an event monitor component;a GUI console component; anda security component.
  • 66. The system of claim 64 further comprising: a configuration management component configured to manage the act of (b) modeling tools and manufacturing processes of the factory.
  • 67. The system of claim 64 further comprising: a performance and license management component.
  • 68. The system of claim 64 further comprising: a data manager component to configured to manage the act of e) analyzing manufacturing results, wherein at least one of acts a), b) and c) is modified based on the results.
  • 69. The system of claim 64 further comprising: an event monitor component configured to manage the act of d) controlling, tracking and monitoring manufacture of the semiconductor devices according to the plan.
  • 70. The system of claim 64 further comprising: a GUI console component configured to manage the acts of a) developing and installing control software for automating the factory and f) constructing a software framework configured to allow a user to conduct acts a)–e).
  • 71. The system of claim 64 wherein the software framework is capable of including any one or more of: a configuration management component;a data manager component;an event monitor component;a GUI console component;a security component;a equipment management component; sample application;a work-in-progress management component;a dispatching and scheduling component;a quality management component;a tool integration component; anda gateway component.
  • 72. The system according to claim 61, wherein the visual workflow component is configured to execute at least one manufacturing process and at least one business process.
  • 73. A computer readable medium for storing instructions being executed by one or more computers, the instructions directing the one or more computers for automating a factory for manufacturing semiconductor devices, the instructions comprising the acts of: constructing a software framework configured to conduct a plurality of lifecycle activities, wherein the lifecycle activities comprise:a) developing and integrating control software for automating the factory;b) installing and administrating the control software;c) modeling tools of the factory;d) generating a plan to manufacture semiconductor devices;e) controlling, tracking and monitoring manufacture of the semiconductor devices according to the plan; andf) analyzing manufacturing results, wherein at least one of acts a), c) and d) is modified based on the results, wherein said software framework includes a visual workflow component.
  • 74. The medium of claim 73, wherein the act b) further comprises modeling manufacturing processes of the factory.
  • 75. The medium of claim 73 further comprises the instructions for the act of: g) allowing the software framework to access features of the tools of the factory with one or more generalized commands.
  • 76. The medium of claim 75 further comprises the instructions for the act of: h) providing an interface between the software framework and the tools of the factory, wherein the providing the interface includes the act of:translating the generalized commands to commands adapted to control one or more the tools of the factory.
  • 77. The medium of claim 73 further comprising the instructions for the act of: providing common service protocols among a plurality of components of the software framework.
  • 78. The medium of claim 77 further comprising the instructions for the act of: configuring the software framework to be capable of including one or more of:a configuration management component;a data manager component;an event monitor component;a GUI console component; anda security component.
  • 79. The medium of claim 77 further comprising the instructions for the act of: configuring a configuration management component to manage the act of (b) modeling tools of the factory.
  • 80. The medium of claim 77 further comprising the instructions for the act of: providing a performance and license management component.
  • 81. The medium of claim 77 further comprising the instructions for the act of: providing a data manager component to manage the act of e) analyzing manufacturing results, wherein at least one of acts a), b) and c) is modified based on the results.
  • 82. The medium of claim 77 further comprising the instructions for the act of: providing an event monitor component to manage the act of d) controlling, tracking and monitoring manufacture of the semiconductor devices according to the plan.
  • 83. The medium of claim 77 further comprising the instructions for the act of: providing a GUI console component to manage the acts of a) developing and installing control software for automating the factory and f) constructing a software framework configured to allow a user to conduct acts a)–e).
  • 84. The medium of claim 77 further comprising the instructions for the act of: configuring the software framework to be capable of including any one or more of:a configuration management component;a data manager component;an event monitor component;a GUI console component;a security component;a equipment management component; sample application;a work-in-progress management component;a dispatching and scheduling component;a quality management component;a tool integration component; anda gateway component.
  • 85. The medium according to claim 73, wherein the visual workflow component is configured to execute at least one manufacturing process and at least one business process.
  • 86. A method for defining a computer implemented factory automation lifecycle, the method comprising: a) installing and administrating lifecycle activity framework components;b) factory modeling lifecycle activity framework components; andc) manufacturing controlling, monitoring and tracking lifecycle activity framework components that include a visual workflow component.
  • 87. The method of claim 86, wherein said administrating lifecycle activity framework components comprise a performance and license management component.
  • 88. The method of claim 86, wherein said factory modeling lifecycle activity framework components comprise a configuration management component.
  • 89. The method of claim 86, wherein the visual workflow component is configured to execute at least one manufacturing process and at least one business process.
Government Interests

This invention was made with United States Government support under Cooperative Agreement No. 70NANB7H3043 awarded by NIST. The United States Government has certain rights in the invention.

US Referenced Citations (349)
Number Name Date Kind
3205485 Noltingk Sep 1965 A
3229198 Libby Jan 1966 A
3767900 Chao et al. Oct 1973 A
3920965 Sohrwardy Nov 1975 A
4000458 Miller et al. Dec 1976 A
4207520 Flora et al. Jun 1980 A
4209744 Gerasimov et al. Jun 1980 A
4302721 Urbanek et al. Nov 1981 A
4368510 Anderson Jan 1983 A
4609870 Lale et al. Sep 1986 A
4616308 Morshedi et al. Oct 1986 A
4663703 Axelby et al. May 1987 A
4698766 Entwistle et al. Oct 1987 A
4750141 Judell et al. Jun 1988 A
4755753 Chern Jul 1988 A
4757259 Charpentier Jul 1988 A
4796194 Atherton Jan 1989 A
4901218 Cornwell Feb 1990 A
4938600 Into Jul 1990 A
4957605 Hurwitt et al. Sep 1990 A
4967381 Lane et al. Oct 1990 A
5089970 Lee et al. Feb 1992 A
5108570 Wang Apr 1992 A
5208765 Turnbull May 1993 A
5220517 Sierk et al. Jun 1993 A
5226118 Baker et al. Jul 1993 A
5231585 Kobayashi et al. Jul 1993 A
5236868 Nulman Aug 1993 A
5240552 Yu et al. Aug 1993 A
5260868 Gupta et al. Nov 1993 A
5270222 Moslehi Dec 1993 A
5283141 Yoon et al. Feb 1994 A
5295242 Mashruwala et al. Mar 1994 A
5309221 Fischer et al. May 1994 A
5329463 Sierk et al. Jul 1994 A
5338630 Yoon et al. Aug 1994 A
5347446 Iino et al. Sep 1994 A
5367624 Cooper Nov 1994 A
5369544 Mastrangelo Nov 1994 A
5375064 Bollinger Dec 1994 A
5398336 Tantry et al. Mar 1995 A
5402367 Sullivan et al. Mar 1995 A
5408405 Mozumder et al. Apr 1995 A
5410473 Kaneko et al. Apr 1995 A
5420796 Weling et al. May 1995 A
5427878 Corliss Jun 1995 A
5444837 Bomans et al. Aug 1995 A
5469361 Moyne Nov 1995 A
5485082 Wisspeintner et al. Jan 1996 A
5490097 Swenson et al. Feb 1996 A
5495417 Fuduka et al. Feb 1996 A
5497316 Sierk et al. Mar 1996 A
5497381 O'Donoghue et al. Mar 1996 A
5503707 Maung et al. Apr 1996 A
5508947 Sierk et al. Apr 1996 A
5511005 Abbe et al. Apr 1996 A
5519605 Cawlfield May 1996 A
5525808 Irie et al. Jun 1996 A
5526293 Mozumder et al. Jun 1996 A
5534289 Bilder et al. Jul 1996 A
5541510 Danielson Jul 1996 A
5546312 Mozumder et al. Aug 1996 A
5553195 Meijer Sep 1996 A
5586039 Hirsch et al. Dec 1996 A
5599423 Parker et al. Feb 1997 A
5602492 Cresswell et al. Feb 1997 A
5603707 Trombetta et al. Feb 1997 A
5617023 Skalski Apr 1997 A
5627083 Tounai May 1997 A
5629216 Wijaranakula et al. May 1997 A
5642296 Saxena Jun 1997 A
5646870 Krivokapic et al. Jul 1997 A
5649169 Berezin et al. Jul 1997 A
5654903 Reitman et al. Aug 1997 A
5655951 Meikle et al. Aug 1997 A
5657254 Sierk et al. Aug 1997 A
5661669 Mozumder et al. Aug 1997 A
5663797 Sandhu Sep 1997 A
5664987 Renteln Sep 1997 A
5665199 Sahota et al. Sep 1997 A
5665214 Iturralde Sep 1997 A
5666297 Britt et al. Sep 1997 A
5667424 Pan Sep 1997 A
5674787 Zhao et al. Oct 1997 A
5694325 Fukuda et al. Dec 1997 A
5695810 Dubin et al. Dec 1997 A
5698989 Nulman Dec 1997 A
5719495 Moslehi Feb 1998 A
5719796 Chen Feb 1998 A
5735055 Hochbein et al. Apr 1998 A
5740429 Wang et al. Apr 1998 A
5751582 Saxena et al. May 1998 A
5754297 Nulman May 1998 A
5761064 La et al. Jun 1998 A
5761065 Kittler et al. Jun 1998 A
5764543 Kennedy Jun 1998 A
5777901 Berezin et al. Jul 1998 A
5787021 Samaha Jul 1998 A
5787269 Hyodo Jul 1998 A
5808303 Schlagheck et al. Sep 1998 A
5812407 Sato et al. Sep 1998 A
5823854 Chen Oct 1998 A
5824599 Schacham-Diamand et al. Oct 1998 A
5825356 Habib et al. Oct 1998 A
5825913 Rostami et al. Oct 1998 A
5828778 Hagi et al. Oct 1998 A
5831851 Eastburn et al. Nov 1998 A
5832224 Fehskens et al. Nov 1998 A
5838595 Sullivan et al. Nov 1998 A
5838951 Song Nov 1998 A
5844554 Geller et al. Dec 1998 A
5857258 Penzes et al. Jan 1999 A
5859777 Yokoyama et al. Jan 1999 A
5859964 Wang et al. Jan 1999 A
5859975 Brewer et al. Jan 1999 A
5862054 Li Jan 1999 A
5863807 Jang et al. Jan 1999 A
5867389 Hamada et al. Feb 1999 A
5870306 Harada Feb 1999 A
5871805 Lemelson Feb 1999 A
5883437 Maruyama et al. Mar 1999 A
5889991 Consolatti et al. Mar 1999 A
5901313 Wolf et al. May 1999 A
5903455 Sharpe, Jr. et al. May 1999 A
5910011 Cruse Jun 1999 A
5910846 Sandhu Jun 1999 A
5912678 Saxena et al. Jun 1999 A
5916016 Bothra Jun 1999 A
5923553 Yi Jul 1999 A
5926690 Toprac et al. Jul 1999 A
5930138 Lin et al. Jul 1999 A
5940300 Ozaki Aug 1999 A
5943237 Van Boxem Aug 1999 A
5943550 Fulford, Jr. et al. Aug 1999 A
5960185 Nguyen Sep 1999 A
5960214 Sharpe, Jr. et al. Sep 1999 A
5961369 Bartels et al. Oct 1999 A
5963881 Kahn et al. Oct 1999 A
5975994 Sandhu et al. Nov 1999 A
5978751 Pence et al. Nov 1999 A
5982920 Tobin, Jr. et al. Nov 1999 A
6002989 Shiba et al. Dec 1999 A
6012048 Gustin et al. Jan 2000 A
6017771 Yang et al. Jan 2000 A
6036349 Gombar Mar 2000 A
6037664 Zhao et al. Mar 2000 A
6041263 Boston et al. Mar 2000 A
6041270 Steffan et al. Mar 2000 A
6054379 Yau et al. Apr 2000 A
6059636 Inaba et al. May 2000 A
6064759 Buckley et al. May 2000 A
6072313 Li et al. Jun 2000 A
6074443 Venkatesh et al. Jun 2000 A
6077412 Ting et al. Jun 2000 A
6078845 Friedman Jun 2000 A
6094688 Mellen-Garnett et al. Jul 2000 A
6096649 Jang Aug 2000 A
6097887 Hardikar et al. Aug 2000 A
6100195 Chan et al. Aug 2000 A
6108092 Sandhu Aug 2000 A
6111634 Pecen et al. Aug 2000 A
6112130 Fukuda et al. Aug 2000 A
6113462 Yang Sep 2000 A
6114238 Liao Sep 2000 A
6127263 Parikh Oct 2000 A
6128016 Coelho et al. Oct 2000 A
6136163 Cheung et al. Oct 2000 A
6141660 Bach et al. Oct 2000 A
6143646 Wetzel Nov 2000 A
6148099 Lee et al. Nov 2000 A
6148239 Funk et al. Nov 2000 A
6148246 Kawazome Nov 2000 A
6150270 Matsuda et al. Nov 2000 A
6157864 Schwenke et al. Dec 2000 A
6159075 Zhang Dec 2000 A
6159644 Satoh et al. Dec 2000 A
6161054 Rosenthal et al. Dec 2000 A
6169931 Runnels Jan 2001 B1
6172756 Chalmers et al. Jan 2001 B1
6173240 Sepulveda et al. Jan 2001 B1
6175777 Kim Jan 2001 B1
6178390 Jun Jan 2001 B1
6181013 Liu et al. Jan 2001 B1
6183345 Kamono et al. Feb 2001 B1
6185324 Ishihara et al. Feb 2001 B1
6191864 Sandhu Feb 2001 B1
6192291 Kwon Feb 2001 B1
6197604 Miller et al. Mar 2001 B1
6204165 Ghoshal Mar 2001 B1
6210983 Atchison et al. Apr 2001 B1
6211094 Jun et al. Apr 2001 B1
6212961 Dvir Apr 2001 B1
6214734 Bothra et al. Apr 2001 B1
6217412 Campbell et al. Apr 2001 B1
6219711 Chari Apr 2001 B1
6222936 Phan et al. Apr 2001 B1
6226563 Lim May 2001 B1
6226792 Goiffon et al. May 2001 B1
6228280 Li et al. May 2001 B1
6230069 Campbell et al. May 2001 B1
6236903 Kim et al. May 2001 B1
6237050 Kim et al. May 2001 B1
6240330 Kurtzberg et al. May 2001 B1
6240331 Yun May 2001 B1
6245581 Bonser et al. Jun 2001 B1
6246972 Klimasauskas Jun 2001 B1
6248602 Bode et al. Jun 2001 B1
6249712 Boiquaye Jun 2001 B1
6252412 Talbot et al. Jun 2001 B1
6253366 Mutschler, III Jun 2001 B1
6259160 Lopatin et al. Jul 2001 B1
6263255 Tan et al. Jul 2001 B1
6268270 Scheid et al. Jul 2001 B1
6271670 Caffey Aug 2001 B1
6276989 Campbell et al. Aug 2001 B1
6277014 Chen et al. Aug 2001 B1
6278899 Piche et al. Aug 2001 B1
6280289 Wiswesser et al. Aug 2001 B1
6281127 Shue Aug 2001 B1
6284622 Campbell et al. Sep 2001 B1
6287879 Gonzales et al. Sep 2001 B1
6290572 Hofmann Sep 2001 B1
6291367 Kelkar Sep 2001 B1
6292708 Allen et al. Sep 2001 B1
6298274 Inoue Oct 2001 B1
6298470 Breiner et al. Oct 2001 B1
6303395 Nulman Oct 2001 B1
6304999 Toprac et al. Oct 2001 B1
6307628 Lu et al. Oct 2001 B1
6314379 Hu et al. Nov 2001 B1
6317643 Dmochowski Nov 2001 B1
6320655 Matsushita et al. Nov 2001 B1
6324481 Atchison et al. Nov 2001 B1
6334807 Lebel et al. Jan 2002 B1
6336841 Chang Jan 2002 B1
6339727 Ladd Jan 2002 B1
6340602 Johnson et al. Jan 2002 B1
6345288 Reed et al. Feb 2002 B1
6345315 Mishra Feb 2002 B1
6346426 Toprac et al. Feb 2002 B1
6355559 Havemann et al. Mar 2002 B1
6360133 Campbell et al. Mar 2002 B1
6360184 Jacquez Mar 2002 B1
6363294 Coronel et al. Mar 2002 B1
6366934 Cheng et al. Apr 2002 B1
6368879 Toprac Apr 2002 B1
6368883 Bode et al. Apr 2002 B1
6368884 Goodwin et al. Apr 2002 B1
6379980 Toprac Apr 2002 B1
6381564 David et al. Apr 2002 B1
6388253 Su May 2002 B1
6389491 Jacobson et al. May 2002 B1
6391780 Shih et al. May 2002 B1
6395152 Wang May 2002 B1
6397114 Eryurek et al. May 2002 B1
6400162 Mallory et al. Jun 2002 B1
6405096 Toprac et al. Jun 2002 B1
6405144 Toprac et al. Jun 2002 B1
6417014 Lam et al. Jul 2002 B1
6427093 Toprac Jul 2002 B1
6432728 Tai et al. Aug 2002 B1
6435952 Boyd et al. Aug 2002 B1
6438438 Takagi et al. Aug 2002 B1
6440295 Wang Aug 2002 B1
6442496 Pasadyn et al. Aug 2002 B1
6449524 Miller et al. Sep 2002 B1
6455415 Lopatin et al. Sep 2002 B1
6455937 Cunningham Sep 2002 B1
6465263 Coss, Jr. et al. Oct 2002 B1
6470230 Toprac et al. Oct 2002 B1
6479902 Lopatin et al. Nov 2002 B1
6479990 Mednikov et al. Nov 2002 B1
6482660 Conchieri et al. Nov 2002 B1
6484064 Campbell Nov 2002 B1
6486492 Su Nov 2002 B1
6492281 Song et al. Dec 2002 B1
6495452 Shih Dec 2002 B1
6503839 Gonzales et al. Jan 2003 B1
6515368 Lopatin et al. Feb 2003 B1
6517413 Hu et al. Feb 2003 B1
6517414 Tobin et al. Feb 2003 B1
6528409 Lopatin et al. Mar 2003 B1
6529789 Campbell et al. Mar 2003 B1
6532555 Miller et al. Mar 2003 B1
6535783 Miller et al. Mar 2003 B1
6537912 Agarwal Mar 2003 B1
6540591 Pasadyn et al. Apr 2003 B1
6541401 Herner et al. Apr 2003 B1
6546508 Sonderman et al. Apr 2003 B1
6556881 Miller Apr 2003 B1
6560504 Goodwin et al. May 2003 B1
6563308 Nagano et al. May 2003 B1
6567717 Krivokapic et al. May 2003 B1
6580958 Takano Jun 2003 B1
6587744 Stoddard et al. Jul 2003 B1
6590179 Tanaka et al. Jul 2003 B1
6604012 Cho et al. Aug 2003 B1
6605549 Leu et al. Aug 2003 B1
6607976 Chen et al. Aug 2003 B1
6609946 Tran Aug 2003 B1
6616513 Osterheld Sep 2003 B1
6618692 Takahashi et al. Sep 2003 B1
6624075 Lopatin et al. Sep 2003 B1
6625497 Fairbairn et al. Sep 2003 B1
6630741 Lopatin et al. Oct 2003 B1
6640151 Somekh et al. Oct 2003 B1
6652355 Wiswesser et al. Nov 2003 B1
6660633 Lopatin et al. Dec 2003 B1
6678570 Pasadyn et al. Jan 2004 B1
6708074 Chi et al. Mar 2004 B1
6708075 Sonderman et al. Mar 2004 B1
6725402 Coss, Jr. et al. Apr 2004 B1
6728587 Goldman et al. Apr 2004 B1
6735492 Conrad et al. May 2004 B1
6751518 Sonderman et al. Jun 2004 B1
6774998 Wright et al. Aug 2004 B1
20010001755 Sandhu et al. May 2001 A1
20010003084 Finarov Jun 2001 A1
20010006873 Moore Jul 2001 A1
20010030366 Nakano et al. Oct 2001 A1
20010039462 Mendez et al. Nov 2001 A1
20010040997 Tsap et al. Nov 2001 A1
20010042690 Talieh Nov 2001 A1
20010044667 Nakano et al. Nov 2001 A1
20020032499 Wilson et al. Mar 2002 A1
20020058460 Lee et al. May 2002 A1
20020070126 Sato et al. Jun 2002 A1
20020077031 Johansson et al. Jun 2002 A1
20020081951 Boyd et al. Jun 2002 A1
20020089676 Pecen et al. Jul 2002 A1
20020102853 Li et al. Aug 2002 A1
20020107599 Patel et al. Aug 2002 A1
20020107604 Riley et al. Aug 2002 A1
20020113039 Mok et al. Aug 2002 A1
20020127950 Hirose et al. Sep 2002 A1
20020128805 Goldman et al. Sep 2002 A1
20020149359 Crouzen et al. Oct 2002 A1
20020165636 Hasan Nov 2002 A1
20020183986 Stewart et al. Dec 2002 A1
20020185658 Inoue et al. Dec 2002 A1
20020193899 Shanmugasundram et al. Dec 2002 A1
20020193902 Shanmugasundram et al. Dec 2002 A1
20020197745 Shanmugasundram et al. Dec 2002 A1
20020197934 Paik Dec 2002 A1
20020199082 Shanmugasundram et al. Dec 2002 A1
20030017256 Shimane Jan 2003 A1
20030020909 Adams et al. Jan 2003 A1
20030020928 Ritzdorf et al. Jan 2003 A1
20030154062 Daft et al. Aug 2003 A1
Foreign Referenced Citations (81)
Number Date Country
2050247 Aug 1991 CA
2165847 Aug 1991 CA
2194855 Aug 1991 CA
0 397 924 Nov 1990 EP
0 621 522 Oct 1994 EP
0 747 795 Dec 1996 EP
0 869 652 Oct 1998 EP
0877308 Nov 1998 EP
0 881 040 Dec 1998 EP
0 895 145 Feb 1999 EP
0 910 123 Apr 1999 EP
0 932 194 Jul 1999 EP
0 932 195 Jul 1999 EP
1 066 925 Jan 2001 EP
1 067 757 Jan 2001 EP
1 083 470 Mar 2001 EP
1 092 505 Apr 2001 EP
1072967 Nov 2001 EP
1 071 128 Jan 2002 EP
1 182526 Feb 2002 EP
2 347 885 Sep 2000 GB
2 365 215 Feb 2002 GB
61-66104 Apr 1986 JP
61-171147 Aug 1986 JP
HEI 1-283934 Nov 1989 JP
3-202710 Sep 1991 JP
05-151231 Jun 1993 JP
05-216896 Aug 1993 JP
05-266029 Oct 1993 JP
06-110894 Apr 1994 JP
06-176994 Jun 1994 JP
6-184434 Jul 1994 JP
06-252236 Sep 1994 JP
06-260380 Sep 1994 JP
8-23166 Jan 1996 JP
8-50161 Feb 1996 JP
HEI 8-149583 Jun 1996 JP
8-304023 Nov 1996 JP
HEI 9-34535 Feb 1997 JP
9-246547 Sep 1997 JP
10-34522 Feb 1998 JP
10-173029 Jun 1998 JP
11-126816 May 1999 JP
11-135601 May 1999 JP
HEI 11-67853 Jul 1999 JP
2000-183001 Jun 2000 JP
2001-76982 Mar 2001 JP
2001-284299 Oct 2001 JP
2001-305108 Oct 2001 JP
2002-9030 Jan 2002 JP
2002-343754 Nov 2002 JP
434103 May 2001 TW
436383 May 2001 TW
455938 Sep 2001 TW
455976 Sep 2001 TW
WO 9805066 Feb 1998 WO
WO 9845090 Oct 1998 WO
WO 9909371 Feb 1999 WO
WO 9925520 May 1999 WO
WO 9959200 Nov 1999 WO
WO 9534866 Dec 1999 WO
WO 0000874 Jan 2000 WO
WO 0005759 Feb 2000 WO
WO 0035063 Jun 2000 WO
WO 0054325 Sep 2000 WO
WO 0079355 Dec 2000 WO
WO 0111679 Feb 2001 WO
WO 0115865 Mar 2001 WO
WO 0118623 Mar 2001 WO
WO 0125865 Apr 2001 WO
WO 0133277 May 2001 WO
WO 0133501 May 2001 WO
WO 0152055 Jul 2001 WO
WO 0152319 Jul 2001 WO
WO 0157823 Aug 2001 WO
WO 01080306 Oct 2001 WO
WO 0217150 Feb 2002 WO
WO 0231613 Apr 2002 WO
WO 0231613 Apr 2002 WO
WO 0233737 Apr 2002 WO
WO 01074491 Sep 2002 WO