1. Technical Field
Embodiments of the present disclosure relates to circuit simulating systems and methods, and more particularly, to a computing device and a method for checking the distance between switching vias of a differential pair and the distance between switching vias of two differential pairs in a printed circuit board (PCB) layout.
2. Description of related art
The first via distance between switching vias of a differential pair and the second via distance between switching vias of two differential pairs in a printed circuit board (PCB) layout has an important impact on signal integrity. Thus the first and second via distance in a printed circuit board (PCB) layout should satisfy design standards. However, checking whether the first and second via distances satisfy design standards are often done visually by a technician, which is not only time-consuming, but also error-prone.
The components of the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present disclosure. Moreover, in the drawings, like reference numerals designate corresponding parts throughout several views.
The disclosure, including the accompanying drawings in which like references indicate similar elements, is illustrated by way of examples and not by way of limitation. It should be noted that references to “an” or “one” embodiment in this disclosure are not necessarily to the same embodiment, and such references mean at least one.
The window control module 11 includes various software components and/or set of instructions, which may be implemented by the processor 20 to display a check window 60 (see
The design standard obtaining module 12 includes various software components and/or set of instructions, which may be implemented by the processor 20 to receive the via pitch range and the via gap range input through the check window 60.
The differential pair identifying module 13 includes various software components and/or set of instructions, which may be implemented by the processor 20 to identify differential pairs in a currently run PCB layout 50 according to the types of signal transmission lines defined in the information file for the currently run PCB layout 50.
The via information obtaining module 14 includes various software components and/or set of instructions, which may be implemented by the processor 20 to obtain the radius and the coordinates of the centers of the switching vias according to the information file for the currently run PCB layout.
The computing module 15 includes various software components and/or set of instructions, which may be implemented by the processor 20 to determine each via pitch according to the coordinates of the centers of the switching vias of each differential pair, and determine each via gap according to the radius and the coordinates of the centers of the switching vias of each two differential pairs. The detailed method of determining the via gap is described as follows: the computing module 15 is implemented to determine each center distance between the centers of each two switching vias of each adjacent two differential pairs, then determine two switching vias which center distance is shortest, and determine the via gap between the two determined switching vias by taking the total of the radius of the two determined switching vias from the center distance between the centers of the two determined switching vias.
The comparing module 16 includes various software components and/or set of instructions, which may be implemented by the processor 20 to determine the switching vias that does not satisfy the design standards. If the via pitch is not within the via pitch range, or the via gap is not within the pitch range, the comparing module 16 is implemented to determine that the switching vias does not satisfy design standards.
The display control module 17 includes various software components and/or set of instructions, which may be implemented by the processor 20 to display information related to the switching vias that does not satisfy design standard on the check window 60 (see
The marking module 18 includes various software components and/or set of instructions, which may be implemented by the processor 20 to mark each switching via that does not satisfy design standards in the currently displayed PCB layout, for example, highlight each switching via that does not satisfy design standards in the currently displayed PCB layout.
In block S501, the window control module 11 is implemented by the processor 20 to display the check window 60 on the display unit 40 for users to input a via pitch range each via pitch should fall into and a via gap range each via gap should fall into.
In block S502, the design standard obtaining module 12 is implemented by the processor 20 to receive the via pitch range and the via gap range input through the check window 60.
In block S503, the differential pair identifying module 12 is implemented by the processor 20 to identify differential pairs in a currently run PCB layout 50 according to the types of signal transmission lines defined in the information file for the currently run PCB layout 50.
In block S504, the via information obtaining module 14 is implemented by the processor 20 to obtain the radius and the coordinates of the centers of the switching vias of differential pairs according to the information file for the currently run PCB layout.
In block S505, the computing module 15 is implemented by the processor 20 to determine each via pitch according to the coordinates of the centers of the switching vias of each differential pair, and determine each via gap according to the radius and the coordinates of the centers of the switching vias of each differential pair.
In block S506, the comparing module 16 is implemented by the processor 20 to determine the switching vias that does not satisfy the design standards. If the via pitch is not within the pitch range, or the via gap is not within the gap range, the comparing module 16 is implemented to determine that switching vias does not satisfy design standards.
In block S507, the display control module 17 includes various software components and/or set of instructions, which may be implemented by the processor 20 to display information related to the switching vias that does not satisfy design standard on the check window 60.
In block S508, the marking module 18 is implemented by the processor 20 to mark each switching via that does not satisfy design standards in the currently displayed PCB layout.
Although certain inventive embodiments of the present disclosure have been specifically described, the present disclosure is not to be construed as being limited thereto. Various changes or modifications may be made to the present disclosure without departing from the scope and spirit of the present disclosure.
| Number | Date | Country | Kind |
|---|---|---|---|
| 201110418249.0 | Dec 2011 | CN | national |