BACKGROUND OF THE INVENTION
1. Field of the Invention
The invention relates to a condenser and a heat dissipation apparatus, and more particularly to a condenser and a heat dissipation apparatus which are applied to electronic devices.
2. Description of Related Art
When an electronic device is in operation, the temperature in the electronic device will gradually rise. The electronic device will work improperly if the temperature of the electronic device rises to a certain high degree, incurring high risk of damage to the components of the electronic device. Therefore, a heat dissipation device is mounted at a heat source of the electronic device to dissipate heat via convection and conduction, and the temperature of the electronic device may be cooled down.
The heat dissipation device has an evaporator and a condenser. The evaporator is used to mount on the heat source of the electronic device. The condenser is connected with the evaporator via an evaporation tube and a return tube. The evaporator, the evaporation tube, the return tube, and the condenser form a closed loop circuit. The closed loop circuit is filled with refrigerants. When the electronic device is in operation, the heat will be generated at the heat source. Then the heat will be conducted to the evaporator, making the liquid refrigerants in the evaporator absorb heat and vaporize to gas refrigerants. The gas refrigerants will flow into the condenser via the evaporation tube, and then the gas refrigerants will cool down and condense to the liquid refrigerants. The liquid refrigerants will return to the evaporator via the return tube and absorb heat again. Therefore, the heat from the heat source of the electronic device may be dissipated via the phase change between the gas state and the liquid state of the refrigerants.
However, the conventional heat dissipation device only has a condenser, and the cooling efficiency provided by the conventional heat dissipation device is limited. When the refrigerants absorb heat and vaporize to gas refrigerants and flow through the condenser, only part of the gas refrigerants condense to liquid refrigerants. The amount of refrigerant vaporization is gradually greater than the amount of refrigerant condensation, and the heat dissipating efficiency decreases.
SUMMARY OF THE INVENTION
The present invention relates to a condenser and a heat dissipation that are applied to electronic devices.
The condenser has a main condensing module, an auxiliary condensing module, and a connecting tube. The main condensing module has an input base tube, a first connecting base tube, and a main heat dissipating mechanism, which are series connected. The auxiliary condensing module has a second connecting base tube, an output base tube, and an auxiliary heat dissipating mechanism, which are series connected. The connecting tube is mounted between the main condensing module and the auxiliary condensing module. An interior room of the first connecting base tube communicates with an interior room of the second connecting base tube in a vertical direction.
Other objects, advantages, and novel features of the invention will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is a perspective view of a condenser in accordance with the present invention;
FIG. 2 is a top view of the condenser in FIG. 1;
FIG. 3 is a side view of the condenser in FIG. 1;
FIG. 4 is a perspective view of a heat dissipation apparatus in accordance with the present invention;
FIG. 5 is an operational side view in partial section of an evaporator of the heat dissipation apparatus in FIG. 4 mounted at a heat source;
FIG. 6 is an operational perspective view of the heat dissipation apparatus in FIG. 4; and
FIG. 7 is an operational top view of the heat dissipation apparatus in FIG. 4.
DETAILED DESCRIPTION OF PREFERRED EMBODIMENT
With reference to FIGS. 1 to 3, a condenser in accordance with the present invention comprises a main condensing module 10, an auxiliary condensing module 20, and a connecting tube 30.
With reference to FIGS. 1 to 3, the main condensing module 10 has an input base tube 11, a first connecting base tube 12, and a main heat dissipating mechanism 13. The main heat dissipating mechanism 13 has a first side end and a second side end. The first side end of the main heat dissipating mechanism 13 is connected with and communicates with the input base tube 11. The first connecting base tube 12 is connected with and communicates with the second side end of the main heat dissipating mechanism 13. That is, the input base tube 11 and the first connecting base tube 12 are arranged at a spaced interval. The main heat dissipating mechanism 13 has multiple main heat dissipating tubes 14 and multiple main heat dissipating sheets 15. The multiple main heat dissipating tubes 14 are mounted between the input base tube 11 and the first connecting base tube 12 and are disposed at spaced intervals in a vertical direction. The multiple main heat dissipating sheets 15 are mounted between the multiple main heat dissipating tubes 14. The multiple main heat dissipating sheets 15 are in thermally-conductive contact with the multiple main heat dissipating tubes 14.
With reference to FIGS. 1 to 3, the auxiliary condensing module 20 and the main condensing module 10 are disposed at a spaced interval. The auxiliary condensing module 20 has a second connecting base tube 21, an output base tube 22, and an auxiliary heat dissipating mechanism 23. The auxiliary heat dissipating mechanism 23 has a first side end and a second side end. The first side end of the auxiliary heat dissipating mechanism 23 is connected with and communicates with the second connecting base tube 21. The output base tube 22 is connected with and communicates with the second side end of the auxiliary heat dissipating mechanism 23. The second connecting base tube 21 and the output base tube 22 are arranged at a spaced interval. The auxiliary heat dissipating mechanism 23 is mounted between the second connecting base tube 21 and the output base tube 22 and has multiple auxiliary heat dissipating tubes 24 and multiple auxiliary heat dissipating sheets 25. The multiple auxiliary heat dissipating tubes 24 are mounted between the second connecting base tube 21 and the output base tube 22 and are disposed at spaced intervals in a vertical direction. The multiple auxiliary heat dissipating sheets 25 are mounted between the multiple auxiliary heat dissipating tubes 24. The multiple auxiliary heat dissipating sheets 25 are in thermally-conductive contact with the multiple auxiliary heat dissipating tubes 24.
With reference to FIGS. 1 to 3, the connecting tube 30 is mounted between the main condensing module 10 and the auxiliary condensing module 20. The connecting tube 30 has a first end and a second end. The first end of the connecting tube 30 is connected with and communicates with the first connecting base tube 12. The second end of the connecting tube 30 is connected with and communicates with the second connecting base tube 21. Therefore, an interior space of the first connecting base tube 12 communicates with an interior space of the second connecting base tube 21. The connecting tube 30 has multiple connecting flow channels 31. The multiple connecting flow channels 31 are formed in the connecting tube 30 and are arranged at spaced intervals in a vertical direction. That is, each connecting flow channel 31 communicates with the first connecting base tube 12 and the second connecting base tube 21.
With reference to FIG. 4, a heat dissipation apparatus in accordance with the present invention comprises a condenser and an evaporation component 40.
With reference to FIGS. 4 and 5, the evaporation component 40 has an evaporator 41, an input tube 42, and an output tube 43. The evaporator 41 has an evaporation chamber 411 and a conducting base plate 412. The evaporation chamber 411 is formed in the evaporator 41. The conducting base plate 412 is mounted at a bottom surface of the evaporator 41. The input tube 42 has a first end and a second end. The first end of the input tube 42 is connected with a top surface of the evaporator 41. The second end of the input tube 42 is connected with the input base tube 11 of the main condensing module 10. The output tube 43 has a first end and a second end. The first end of the output tube 43 is connected with a side surface of the evaporator 41. The second end of the output tube 43 is connected with the output base tube 22 of the auxiliary condensing module 20. The evaporation component 40 and the condenser form a closed loop, and the closed loop is filled with refrigerants 50.
With reference to FIGS. 1 and 4, a refrigerant input hole 16 is formed in an upper section of the input base tube 11. The second end of the input tube 42 is connected with the refrigerant input hole 16 of the input base tube 11. A refrigerant output hole 26 is formed in a lower section of the output base tube 22. The second end of the output tube 43 is connected with the refrigerant output hole 26 of the output base tube 22. Furthermore, a return hole 17 is formed in a lower section of the input base tube 11. The evaporation component 40 further has a return tube 44. The return tube 44 has a first end and a second end. The first end of the return tube 44 is connected with a side surface of the evaporation component 40. The second end of the return tube 44 is connected with the return hole 17 of the input base tube 11. Furthermore, a diameter of the input tube 42 is larger than a diameter of the output tube 43. The diameter of the input tube 42 is larger than a diameter of the return tube 44.
With reference to FIG. 5, the condenser in the present invention can be applied to any heat dissipation apparatus or the aforementioned heat dissipation apparatus. The refrigerants 50 sequentially flow through the main condensing module 10 and the auxiliary condensing module 20 to cool down an electronic device via the series connection of the main condensing module 10 and the auxiliary condensing module 20.
With reference to FIGS. 5 to 7, the heat dissipation apparatus in accordance with the present invention is applied to cool down an electronic device. The electronic device has a heat source. The evaporator 41 is mounted at the heat source. When the temperature of the heat source of the electronic device increases, heat will be transferred into the evaporation chamber 411 via the conducting base plate 412. The refrigerants 50 in the evaporation chamber 411 absorb heat and are vaporized to gas refrigerants 50. The gas refrigerants 50 will flow into the input tube 42 under the principle that hot air rises. The gas refrigerants 50 will flow into the input base tube 11 via the input tube 42, and then the gas refrigerants 50 will sequentially flow into the main condensing module 10, the connecting tube 30, and the auxiliary condensing module 20. In the aforementioned process, the gas refrigerants 50 will gradually cool down to liquid refrigerants 50. Finally, the liquid refrigerants 50 will flow into the output tube 43 via the output base tube 22, and return to the evaporator 41 to absorb heat again.
With reference to FIGS. 5 to 7, the main condensing module 10 and the auxiliary condensing module 20 are in series connection, and this may extend a flowing path of the refrigerants 50 in the condenser. The main heat dissipating mechanism 13 and the auxiliary heat dissipating mechanism 23 provide second time cooling and heat dissipating, and the cooling efficiency of the refrigerants 50 is enhanced. The gas refrigerants 50 may completely condense to liquid refrigerants 50 in the process of flowing through the condenser. That is, there is no residual gas refrigerant 50 in the aforementioned process (avoiding the situation that the amount of vaporization of the refrigerant 50 is greater than the amount of condensation of the refrigerant 50), and this may enhance the heat dissipating efficiency of the heat dissipation device.
With reference to FIG. 3, the interior space of the first connecting base tube 12 communicates with the interior space of the second connecting base tube 21 by the connecting tube 30. The gas refrigerants 50 floating in the upper portion of the first connecting base tube 12 or the liquid refrigerants 50 deposited in the lower portion of the first connecting base tube 12 can smoothly enter the second connecting base tube 21 through the connecting pipe 30.
With reference to FIGS. 5 to 7, when the gas refrigerants 50 are flowing into the input base tube 11, some gas refrigerants 50 will directly condense to liquid refrigerants 50 when the refrigerants 50 are away from the heat source. The aforementioned gas refrigerants 50 will directly flow into the lower section of the input base tube 11, and then return to the evaporator 41 via the return tube 44. The remaining gas refrigerants 50 will sequentially flow through the main condensing module 10, the connecting tube, and the auxiliary condensing module 20, and flow into the evaporator 41 via the input tube 43 eventually. The gas refrigerants 50 and liquid refrigerants 50 may flow in separate ways through the phase change of the refrigerants 50, and this may enhance the heat dissipating effect of the heat dissipation apparatus.
To sum up, the main condensing module 10 and the auxiliary condensing module 20 are in series connection, and this may extend the flowing path of the refrigerants 50 in the condenser. The main heat dissipating mechanism 13 and the auxiliary heat dissipating mechanism 23 provide second time cooling and heat dissipating, and the cooling efficiency of the refrigerants 50 is enhanced. The gas refrigerants 50 may completely condense to liquid refrigerants 50 after flowing into the condenser, and the cooling efficiency of the heat dissipation apparatus is enhanced.
Even though numerous characteristics and advantages of the present invention have been set forth in the foregoing description, together with details of the structure and function of the invention, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
Patent Application
20200064074
