TREA

with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers

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Industry

  • CPC
  • F28D15/0266
This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

FMECHANICAL ENGINEERING LIGHTING HEATING WEAPONS BLASTING ENGINES OR PUMPS F28Heat exchange F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies

Current Industry

F28D15/0266with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    Refrigerant Cycling Air Cooling Assembly
    • Publication number 20250060169
    • Publication date Feb 20, 2025
    • Kenneth Wealand
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Application

    HEAT DISSIPATION STRUCTURE
    • Publication number 20250060170
    • Publication date Feb 20, 2025
    • ASIA VITAL COMPONENTS (SHEN ZHEN) CO., LTD.
    • Dan-Jun Chen
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Application

    Pumped Two-Phase Cooling of Aircraft Electronics
    • Publication number 20250060168
    • Publication date Feb 20, 2025
    • The Boeing Company
    • Michael F. Stoia
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Application

    Boiling-Cooler Production Method and Boiling Cooler
    • Publication number 20250020413
    • Publication date Jan 16, 2025
    • Sumitomo Precision Products Co., Ltd.
    • Akihiro TANABE
    • B22 - CASTING POWDER METALLURGY
  • Information Patent Application

    WICK STRUCTURE FOR OPTIMIZED THERMAL PERFORMANCE AND METHOD OF MAKI...
    • Publication number 20250003694
    • Publication date Jan 2, 2025
    • NVIDIA Corporation
    • Ron CHAO
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Application

    HEAT TRANSPORT DEVICE
    • Publication number 20240410657
    • Publication date Dec 12, 2024
    • FURUKAWA ELECTRIC CO., LTD.
    • Yosuke WATANABE
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Application

    LOOP HEAT PIPE ONE-WAY CIRCULATION DEVICE
    • Publication number 20240361083
    • Publication date Oct 31, 2024
    • AURAS Technology Co., Ltd.
    • Chih-Wei CHEN
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Application

    THERMAL DIFFUSION DEVICE AND ELECTRONIC APPARATUS
    • Publication number 20240361084
    • Publication date Oct 31, 2024
    • Murata Manufacturing Co., Ltd.
    • Tatsuhiro NUMOTO
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Application

    VAPOR CHAMBER
    • Publication number 20240310126
    • Publication date Sep 19, 2024
    • VAST GLORY ELECTRONICS & HARDWARE & PLASTIC(HUI ZHOU) LTD.
    • Lei Lei LIU
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Application

    THERMOSYPHON COOLING DEVICE
    • Publication number 20240310127
    • Publication date Sep 19, 2024
    • Delta Electronics, Inc.
    • Cheng-Tang YEH
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Application

    THERMAL DIFFUSION DEVICE
    • Publication number 20240302105
    • Publication date Sep 12, 2024
    • Murata Manufacturing Co., Ltd.
    • Tatsuhiro NUMOTO
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Application

    HERMETICALLY SEALED COMPACT CLOSED LOOP COOLING SYSTEM FOR A LASER...
    • Publication number 20240295802
    • Publication date Sep 5, 2024
    • CHRISTIE DIGITAL SYSTEMS USA, INC.
    • Dinesh BHATIA
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Application

    Heat Exchanger
    • Publication number 20240280323
    • Publication date Aug 22, 2024
    • Robert Louis CLEGG
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Application

    VAPOR CHAMBER AND SINGLE-PIECE SUPPORT STRUCTURE THEREOF
    • Publication number 20240280329
    • Publication date Aug 22, 2024
    • TAIWAN MICROLOOPS CORP.
    • Chun-Hung LIN
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Application

    FLEXIBLE TWO-PHASE CONVERSION HEAT TRANSFER DEVICE
    • Publication number 20240271877
    • Publication date Aug 15, 2024
    • ASIA VITAL COMPONENTS (CHINA) CO., LTD.
    • Han-Min Liu
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Application

    Boiling Cooler
    • Publication number 20240263887
    • Publication date Aug 8, 2024
    • Sumitomo Precision Products Co., Ltd.
    • Akihiro TANABE
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Application

    THERMAL MANAGEMENT APPARATUS AND METHOD
    • Publication number 20240255229
    • Publication date Aug 1, 2024
    • Kelvin Cooling, Inc.
    • Zilong Wang
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Application

    LOOP-TYPE HEAT PIPE
    • Publication number 20240247878
    • Publication date Jul 25, 2024
    • Shinko Electric Industries Co., Ltd.
    • Yoshihiro MACHIDA
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Application

    IMMERSION COOLING SYSTEM AND CONDENSATION DEHUMIDIFICATION DEVICE T...
    • Publication number 20240240871
    • Publication date Jul 18, 2024
    • Wiwynn Corporation
    • Hsien-Chieh Hsieh
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Application

    MICRO-CHANNEL PULSATING HEAT PIPE
    • Publication number 20240240872
    • Publication date Jul 18, 2024
    • GLOBAL COOLING TECHNOLOGY GROUP, LLC
    • Victor Adrian CHIRIAC
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Application

    HEAT DISSIPATION DEVICE
    • Publication number 20240230241
    • Publication date Jul 11, 2024
    • AURAS Technology Co., Ltd.
    • Yi-Le CHENG
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Application

    SEPARATE CAPILLARY VAPOR CHAMBER STRUCTURE FOR DUAL HEAT SOURCES
    • Publication number 20240200879
    • Publication date Jun 20, 2024
    • TAIWAN MICROLOOPS CORP.
    • Chun-Hung LIN
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Application

    HEAT PIPE
    • Publication number 20240191949
    • Publication date Jun 13, 2024
    • VAST GLORY ELECTRONIC & HARDWARE & PLASTIC (HUI ZHOU) LTD
    • XUE-MEI WANG
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Application

    Cryogenic Intermediate Temperature Storage System
    • Publication number 20240183622
    • Publication date Jun 6, 2024
    • ALCOR LIFE EXTENSION FOUNDATION, INC.
    • Jacob GRABER
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Application

    HEAT PIPE
    • Publication number 20240183621
    • Publication date Jun 6, 2024
    • VAST GLORY ELECTRONICS & HARDWARE & PLASTIC(HUI ZHOU) LTD.
    • Xue Mei WANG
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Application

    VAPOR CHAMBER STRUCTURE AND MANUFACTURING METHOD THEREOF
    • Publication number 20240159473
    • Publication date May 16, 2024
    • Unimicron Technology Corp.
    • Chin-Sheng Wang
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PULSATING VAPOR CHAMBER
    • Publication number 20240159472
    • Publication date May 16, 2024
    • COOLER MASTER CO., LTD.
    • Jen-Chih CHENG
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Application

    VAPOR CHAMBER AND ELECTRONIC DEVICE
    • Publication number 20240130083
    • Publication date Apr 18, 2024
    • DAI NIPPON PRINTING CO.,LTD
    • Shinichiro TAKAHASHI
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Application

    LOOP-TYPE HEAT PIPE
    • Publication number 20240110752
    • Publication date Apr 4, 2024
    • Shinko Electric Industries Co., Ltd.
    • Yoshihiro MACHIDA
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Application

    LIQUID-COOLED COOLING STRUCTURE
    • Publication number 20240102742
    • Publication date Mar 28, 2024
    • AIC INC.
    • Yen-Chih CHEN
    • F28 - HEAT EXCHANGE IN GENERAL