Claims
- 1. A monolithic ceramic electronic component made by the method comprising:
providing a sintered compact having internal conductor layers comprising nickel and having on an external face in electrical contact with internal conductor layers, a conductive paste comprising at least one of a silver powder and a silver alloy powder; a boron powder in an amount of at least about 0.5 percent by weight and less than about 7.0 percent by weight of the total weight of the conductive paste; an inorganic binder; and an organic vehicle; and baking the conductive paste to form terminal electrodes electrically connected to the internal conductor layers of the sintered compact.
- 2. The monolithic ceramic electronic component according to claim 1, wherein the inorganic binder is at least one selected from the group consisting of bismuth borate glass, bismuth borosilicate glass and zinc borosilicate glass.
- 3. The monolithic ceramic electronic component according to claim 2, wherein the inorganic binder is lead free.
- 4. The monolithic ceramic electronic component according to claim 3, wherein the average particle diameter of the boron powder is about 60 μm or less.
- 5. The monolithic ceramic electronic component according to claim 4, wherein the amount of the inorganic binder is about 1 to 20 percent by volume of the total volume of the inorganic binder, said at least one of the silver powder and the silver alloy powder, and the boron powder.
- 6. The monolithic ceramic electronic component according to claim 1, wherein the amount of the inorganic binder is about 1 to 20 percent by volume of the total volume of the inorganic binder, said at least one of the silver powder and the silver alloy powder, and the boron powder.
- 7. The monolithic ceramic electronic component according to claim 1, wherein the average particle diameter of the boron powder is about 60 μm or less.
- 8. The monolithic ceramic electronic component according to claim 1, wherein the paste is lead free.
- 9. The monolithic ceramic electronic component according to claim 1, wherein the layers of the sintered compact other than the internal electrode layers are dielectric, and the monolithic ceramic electronic component is a monolithic ceramic capacitor.
- 10. The monolithic ceramic electronic component according to claim 10, wherein the layers of the sintered compact other than the internal electrode layers are semiconductive and the monolithic ceramic electronic component is a monolithic positive temperature coefficient thermistor.
- 11. The monolithic ceramic electronic component according to claim 1, wherein the conductive paste is baked at a temperature of about 400 to 900° C.
- 12. The monolithic ceramic electronic component of claim 11, wherein the method further comprising:
preparing ceramic green sheets; forming a precursor of an internal conductor layer of nickel or a material containing nickel as the primary component on each of the ceramic green sheets; stacking the ceramic green sheets to form a composite; sintering the composite to form the sintered compact; and applying said paste to an external surface of the sintered compact in electrical contact with the internal conductor layer.
- 13. The monolithic ceramic electronic component of claim 1, further comprising:
preparing ceramic green sheets; forming a precursor of an internal conductor layer of nickel or a material containing nickel as the primary component on each of the ceramic green sheets; stacking the ceramic green sheets to form a composite; sintering the composite to form the sintered compact; and applying said paste to an external surface of the sintered compact in electrical contact with the internal conductor layer.
- 14. A monolithic ceramic electronic component comprising a sintered compact of a plurality of ceramic layers having therein an internal conductor layer comprising nickel and having on an external face a terminal electrode comprising silver and boron in electrical contact with the internal conductor layer, wherein at least of portion of the nickel and silver are in solid solution.
- 15. The monolithic ceramic electronic component of claim 14, having a pair of internal conductor layers and a pair of separated terminal electrodes, wherein each of the internal conductor layers is in electrical contact with a different terminal electrode.
- 16. The monolithic ceramic electronic component of claim 15, wherein the pair of internal conductor layers sandwich a dielectric ceramic layer and the monolithic ceramic electronic component is a monolithic ceramic capacitor.
- 17. The monolithic ceramic electronic component according to claim 15, wherein the pair of internal conductor layers sandwich a semiconductive ceramic layer and the monolithic ceramic electronic component is a monolithic positive temperature coefficient thermistor.
Priority Claims (2)
Number |
Date |
Country |
Kind |
2001-287487 |
Sep 2001 |
JP |
|
2002-172870 |
Jun 2002 |
JP |
|
Parent Case Info
[0001] This is a division of application Ser. No. 10/247,518, filed Sep. 20, 2002.
Divisions (1)
|
Number |
Date |
Country |
Parent |
10247518 |
Sep 2002 |
US |
Child |
10849129 |
May 2004 |
US |