Dispersed materials

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CPC
H05K1/092

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/092Dispersed materials

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Wiring board and method for manufacturing same
- Patent number 12,356,542
- Issue date Jul 8, 2025
- MATERIAL CONCEPT, INC.
- Junichi Koike
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dynamic pattern transfer printing and pattern transfer sheets with...
- Patent number 12,337,608
- Issue date Jun 24, 2025
- Wuhan DR Laser Technology Corp., LTD
- Amir Noy
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Conductive resin composition
- Patent number 12,305,057
- Issue date May 20, 2025
- SAKATA INX CORPORATION
- Masayuki Sasaki
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Thin film-based microfluidic electronic device, method of forming t...
- Patent number 12,302,505
- Issue date May 13, 2025
- Singapore University of Technology and Design
- Kento Yamagishi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method of dispensing paste for a printer using a paste dispensing a...
- Patent number 12,275,232
- Issue date Apr 15, 2025
- Applied Materials Italia S.R.L.
- Davide Colla
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Curable composition for inkjet, cured product and flexible printed...
- Patent number 12,264,249
- Issue date Apr 1, 2025
- Microcosm Technology Co., Ltd.
- Bo-Hung Lai
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Printed circuit board and electronic device including same
- Patent number 12,245,373
- Issue date Mar 4, 2025
- ASUSTeK COMPUTER Inc.
- Ping-Han Tsou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermally curable ink-jet ink
- Patent number 12,240,986
- Issue date Mar 4, 2025
- Konica Minolta, Inc.
- Ai Katsuda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible pressure sensors and user interfaces
- Patent number 12,232,548
- Issue date Feb 25, 2025
- LOOMIA Technologies, Inc.
- Madison Thea Maxey
- A41 - WEARING APPAREL
Information Patent Grant
Printed circuit board and manufacturing method thereof
- Patent number 12,232,254
- Issue date Feb 18, 2025
- Unimicron Technology Corporation
- Po-Hsiang Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive paste and electronic device
- Patent number 12,224,081
- Issue date Feb 11, 2025
- BEIJING DREAM INK TECHNOLOGIES CO., LTD.
- Zhongwei Ren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring
- Patent number 12,223,147
- Issue date Feb 11, 2025
- Japan Aviation Electronics Industry, Limited
- Akitoshi Sakaue
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Conductive ink interconnected devices
- Patent number 12,213,250
- Issue date Jan 28, 2025
- NCR Voyix Corporation
- John Paul Bacalso Aliganga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Branched proximal connectors for high density neural interfaces
- Patent number 12,186,570
- Issue date Jan 7, 2025
- VERILY LIFE SCIENCES LLC
- Bo Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring
- Patent number 12,182,369
- Issue date Dec 31, 2024
- Japan Aviation Electronics Industry, Limited
- Akitoshi Sakaue
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Printed circuit board
- Patent number 12,101,880
- Issue date Sep 24, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Hee-Joon Chun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive resin composition, circuit board fabricated using conduc...
- Patent number 12,094,622
- Issue date Sep 17, 2024
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Tomohiro Fukao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible and stretchable structures
- Patent number 12,096,563
- Issue date Sep 17, 2024
- Liquid Wire Inc.
- Mark William Ronay
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic textiles and methods for fabrication thereof
- Patent number 12,075,564
- Issue date Aug 27, 2024
- Purdue Research Foundation
- Chi Hwan Lee
- D06 - TREATMENT OF TEXTILES OR THE LIKE LAUNDERING FLEXIBLE MATERIALS NOT OTH...
Information Patent Grant
Pure copper plate, copper/ceramic bonded body, and insulated circui...
- Patent number 12,035,469
- Issue date Jul 9, 2024
- Mitsubishi Materials Corporation
- Hirotaka Matsunaga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electroconductive substrate having metal wiring, method for produci...
- Patent number 12,035,470
- Issue date Jul 9, 2024
- Tanaka Kikinzoku Kogyo K.K.
- Kenjiro Koshiji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stretchable mounting board and method for manufacturing stretchable...
- Patent number 12,035,464
- Issue date Jul 9, 2024
- Murata Manufacturing Co., Ltd.
- Yui Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connection body, method for manufacturing connection body, and conn...
- Patent number 12,034,260
- Issue date Jul 9, 2024
- Dexerials Corporation
- Ryota Aizaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting method and mounting structure formed by the same
- Patent number 12,028,986
- Issue date Jul 2, 2024
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Naomichi Ohashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and method for preparing same, and electronic device
- Patent number 12,028,965
- Issue date Jul 2, 2024
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Qing Gong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Additively manufactured metal energetic ligand precursors and combu...
- Patent number 12,017,279
- Issue date Jun 25, 2024
- Triad National Security, LLC
- Bryce Tappan
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Rules for sensor integrated substrates
- Patent number 12,011,942
- Issue date Jun 18, 2024
- Smith & Nephew PLC
- Allan Kenneth Frazer Grugeon Hunt
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Printed wiring
- Patent number 12,014,012
- Issue date Jun 18, 2024
- Japan Aviation Electronics Industry, Limited
- Akitoshi Sakaue
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Ceramic-based circuit board assemblies formed using metal nanoparti...
- Patent number 12,016,118
- Issue date Jun 18, 2024
- Kuprion Inc.
- Alfred A. Zinn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive device, method for producing conductive device, and radio
- Patent number 12,009,586
- Issue date Jun 11, 2024
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Takuya Mino
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SUPERCONDUCTING WS2-BASED NANOSHEET INK
- Publication number 20250223452
- Publication date Jul 10, 2025
- The Trustees of Princeton University
- Leslie M. SCHOOP
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Printed Circuit Board For Battery Pack Capable Of Measuring Tempera...
- Publication number 20250227847
- Publication date Jul 10, 2025
- LG ENERGY SOLUTION, LTD.
- Sang Ok Seon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD
- Publication number 20250220813
- Publication date Jul 3, 2025
- KYOCERA CORPORATION
- Hiroaki SANO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC WIRING BOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULE
- Publication number 20250203768
- Publication date Jun 19, 2025
- KYOCERA CORPORATION
- Makoto YAMAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ANISOTROPIC CONDUCTIVE ELASTIC MATERIAL, METHOD FOR PREPARING THE S...
- Publication number 20250194005
- Publication date Jun 12, 2025
- MIDAS H&T INC.
- Un Yong JEONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE PRESSURE SENSORS AND USER INTERFACES
- Publication number 20250169555
- Publication date May 29, 2025
- LOOMIA Technologies, Inc.
- Madison Thea Maxey
- A41 - WEARING APPAREL
Information Patent Application
PRINTED DE-COUPLING PLANE FOR PRINTED CIRCUIT BOARDS
- Publication number 20250168968
- Publication date May 22, 2025
- Microsoft Technology Licensing, LLC
- Chee Kiong FONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING-ATTACHED ADHESIVE SUBSTRATE, STACKED DEVICE, GLASS STACKED B...
- Publication number 20250159795
- Publication date May 15, 2025
- AGC Inc.
- Kenji FUJITA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
FLEXIBLE AND STRETCHABLE STRUCTURES
- Publication number 20250151201
- Publication date May 8, 2025
- Liquid Wire Inc.
- Mark William Ronay
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF DISPENSING PASTE FOR A PRINTER USING A PASTE DISPENSING A...
- Publication number 20250100268
- Publication date Mar 27, 2025
- Applied Materials Italia S.R.L.
- Davide COLLA
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
REAL-TIME IN-SITU ADDITIVE CIRCUIT TUNING FOR RF/MICROWAVE ELECTRONICS
- Publication number 20250063672
- Publication date Feb 20, 2025
- Raytheon Company
- Christopher Areias
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MEMBRANE CIRCUIT BOARD
- Publication number 20250063655
- Publication date Feb 20, 2025
- Primax Electronics Ltd.
- Lei-Lung Tsai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240414850
- Publication date Dec 12, 2024
- Unimicron Technology Corp.
- Chin-Sheng Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND SYSTEM FOR PROVIDING ILLUMINATING OBJECTS WITHIN SUBSTRATE
- Publication number 20240349424
- Publication date Oct 17, 2024
- John Simonetti
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DESIGN RULES FOR SENSOR INTEGRATED SUBSTRATES
- Publication number 20240316972
- Publication date Sep 26, 2024
- Smith & Nephew PLC
- Allan Kenneth Frazer Grugeon Hunt
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
CIRCUIT DEVICE
- Publication number 20240306294
- Publication date Sep 12, 2024
- AUO Corporation
- CHUN-YUEH HOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC-BASED CIRCUIT BOARD ASSEMBLIES FORMED USING METAL NANOPARTI...
- Publication number 20240292531
- Publication date Aug 29, 2024
- Kuprion Inc.
- Alfred A. ZINN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND SYSTEM FOR PROVIDING A COMPOSITE OF CIRCUITRY AND FABRIC
- Publication number 20240283452
- Publication date Aug 22, 2024
- HTI Technology and Industries, Inc.
- John Simonetti
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
PRINTED WIRING
- Publication number 20240272754
- Publication date Aug 15, 2024
- Japan Aviation Electronics Industry, Limited
- Akitoshi SAKAUE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Transparent Conductive Circuit
- Publication number 20240276638
- Publication date Aug 15, 2024
- Chasm Advanced Materials, Inc.
- Richard P. Heroux
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
FABRICATING FUNCTIONAL CIRCUITS ON 3D FREEFORM SURFACES VIA INTENSE...
- Publication number 20240276648
- Publication date Aug 15, 2024
- The Penn State Research Foundation
- Ning Yi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND CHIP PACKAGE COMPRISING SAME
- Publication number 20240268031
- Publication date Aug 8, 2024
- LG Innotek Co., Ltd.
- In Jae LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240244745
- Publication date Jul 18, 2024
- BEIJING DREAM INK TECHNOLOGIES CO., LTD.
- Zhongwei REN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE RESIN COMPOSITION
- Publication number 20240228745
- Publication date Jul 11, 2024
- SAKATA INX CORPORATION
- Yuki SHIRAKAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Fully Printed Sensor with Internal Ion Reservoirs
- Publication number 20240237206
- Publication date Jul 11, 2024
- The Regents of the University of Colorado, a Body Corporate
- Elliot J. STRAND
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING
- Publication number 20240184409
- Publication date Jun 6, 2024
- Japan Aviation Electronics Industry, Limited
- Akitoshi SAKAUE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PACKAGING STRUCTURE, PACKAGING SUBSTRATE, AND MANUFACTURING METHOD...
- Publication number 20240170301
- Publication date May 23, 2024
- QING DING PRECISION ELECTRONICS (HUAIAN) CO.,LTD
- ZHI-CHENG LAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR ADDITIVE MANUFACTURING OF ELECTRONICS
- Publication number 20240164016
- Publication date May 16, 2024
- Aviv Mordechai RONEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICES, SYSTEMS, AND METHODS FOR MAKING AND USING HIGHLY SUSTAINAB...
- Publication number 20240147631
- Publication date May 2, 2024
- Liquid Wire, LLC
- Jorge E. Carbo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CONFORMAL HIGH TEMPERATURE ELECTRONICS USING COPPER NANOINK
- Publication number 20240101850
- Publication date Mar 28, 2024
- The Research Foundation for The State University of New York
- Shenqiang REN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Dispersed materials

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Wiring board and method for manufacturing same

Dynamic pattern transfer printing and pattern transfer sheets with...

Conductive resin composition

Thin film-based microfluidic electronic device, method of forming t...

Method of dispensing paste for a printer using a paste dispensing a...

Curable composition for inkjet, cured product and flexible printed...

Printed circuit board and electronic device including same

Thermally curable ink-jet ink

Flexible pressure sensors and user interfaces

Printed circuit board and manufacturing method thereof

Conductive paste and electronic device

Printed wiring

Conductive ink interconnected devices

Branched proximal connectors for high density neural interfaces

Printed wiring

Printed circuit board

Conductive resin composition, circuit board fabricated using conduc...

Flexible and stretchable structures

Electronic textiles and methods for fabrication thereof

Pure copper plate, copper/ceramic bonded body, and insulated circui...

Electroconductive substrate having metal wiring, method for produci...

Stretchable mounting board and method for manufacturing stretchable...

Connection body, method for manufacturing connection body, and conn...

Mounting method and mounting structure formed by the same

Circuit board and method for preparing same, and electronic device

Additively manufactured metal energetic ligand precursors and combu...

Rules for sensor integrated substrates

Printed wiring

Ceramic-based circuit board assemblies formed using metal nanoparti...

Conductive device, method for producing conductive device, and radio

Patents Applicationslast 30 patents

SUPERCONDUCTING WS2-BASED NANOSHEET INK

Printed Circuit Board For Battery Pack Capable Of Measuring Tempera...

WIRING BOARD

CERAMIC WIRING BOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULE

ANISOTROPIC CONDUCTIVE ELASTIC MATERIAL, METHOD FOR PREPARING THE S...

FLEXIBLE PRESSURE SENSORS AND USER INTERFACES

PRINTED DE-COUPLING PLANE FOR PRINTED CIRCUIT BOARDS

WIRING-ATTACHED ADHESIVE SUBSTRATE, STACKED DEVICE, GLASS STACKED B...

FLEXIBLE AND STRETCHABLE STRUCTURES

METHOD OF DISPENSING PASTE FOR A PRINTER USING A PASTE DISPENSING A...

REAL-TIME IN-SITU ADDITIVE CIRCUIT TUNING FOR RF/MICROWAVE ELECTRONICS

MEMBRANE CIRCUIT BOARD

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

METHOD AND SYSTEM FOR PROVIDING ILLUMINATING OBJECTS WITHIN SUBSTRATE

DESIGN RULES FOR SENSOR INTEGRATED SUBSTRATES

CIRCUIT DEVICE

CERAMIC-BASED CIRCUIT BOARD ASSEMBLIES FORMED USING METAL NANOPARTI...

METHOD AND SYSTEM FOR PROVIDING A COMPOSITE OF CIRCUITRY AND FABRIC

PRINTED WIRING

Transparent Conductive Circuit

FABRICATING FUNCTIONAL CIRCUITS ON 3D FREEFORM SURFACES VIA INTENSE...

CIRCUIT BOARD AND CHIP PACKAGE COMPRISING SAME

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

CONDUCTIVE RESIN COMPOSITION

Fully Printed Sensor with Internal Ion Reservoirs

PRINTED WIRING

PACKAGING STRUCTURE, PACKAGING SUBSTRATE, AND MANUFACTURING METHOD...

SYSTEMS AND METHODS FOR ADDITIVE MANUFACTURING OF ELECTRONICS

DEVICES, SYSTEMS, AND METHODS FOR MAKING AND USING HIGHLY SUSTAINAB...

PRINTED CONFORMAL HIGH TEMPERATURE ELECTRONICS USING COPPER NANOINK