1. Field of the Invention
The invention relates to a connector and a printed circuit board (PCB), and more particularly to a connector and a PCB for discharging electrostatic stress.
2. Description of the Related Art
Electrostatic charge is easily accumulated in human bodies due to friction or other causes. When a person having a large amount of electrostatic charge touches a cable connecting an input/output connector, the accumulated electrostatic charge enters IC 130 from pad 112 and trace 120. Thus, IC 130 is damaged.
When an electrostatic event occurs in pad 112, electrostatic current IESD is generated. Voltage Vgen of point A is expressed by the following equation (1):
V
gen=(Z23+Z24)×IESD (1)
If the electrostatic charge entering from the outside is not properly taken care of, the ICs welded in the PCB are damaged. Thus, the computer comprising the damaged ICs crashes.
Connectors are provided. An exemplary embodiment of a connector comprises a first pin and a second pin. The first pin comprises a first side comprising a first protrudent part. The second pin comprises a second side facing the first side. The first protrudent part approaches the second side.
Printed circuit boards are also provided. An exemplary embodiment of a printed circuit board comprises a first pad and a second pad. The first pad comprises a first side comprising a first protrudent part. The second pad comprises a second side facing the first side. The first protrudent part approaches the second side
A detailed description is given in the following embodiments with reference to the accompanying drawings.
The invention can be more fully understood by referring to the following detailed description and examples with references made to the accompanying drawings, wherein:
a is a schematic diagram of an exemplary embodiment of a printed circuit board;
b is a schematic diagram of an exemplary embodiment of protrudent parts;
The following description is of the best-contemplated mode of carrying out the invention. This description is made for the purpose of illustrating the general principles of the invention and should not be taken in a limiting sense. The scope of the invention is best determined by reference to the appended claims.
a is a schematic diagram of an exemplary embodiment of a printed circuit board. Printed circuit board (PCB) 200 comprises a pad group 210, traces 220-222, and an IC 230. Pad group 210 comprises pads 211-219 for welding with a connector (not shown). When the pins of the connector is welded to pads 211-219, if a connection line is utilized for connecting an external peripheral device and the connector, data can be transmitted between the external peripheral device and IC 230. In this embodiment, shapes of pads 211-219 are squares, but the disclosure is not limited thereto. In some embodiments, the shapes of pads 211-219 are circular or other shapes.
Pad 219 receives a power signal, such as a grounding signal. Pad 218 receives a data signal. Pad 218 comprises a side adjoining pad 219. The side of pad 218 comprises protrudent part P1. Pad 219 comprises a side adjoining pad 218. The side of pad 219 comprises protrudent part P2. Protrudent part P1 faces and approaches protrudent part P2. In this embodiment, the shapes of protrudent parts P1 and P2 are triangles, but are not limited to these. In some embodiments, only pad 218 receiving the data signal comprises a protrudent part P1 facing pad 219. Pad 219 does not comprise protrudent part P2. In one embodiment, only pad 219 receiving the power signal comprises protrudent part P2 and pad 218 receiving the data signal does not comprises protrudent part P1, wherein protrudent part P2 faces pad 218.
b is a schematic diagram of an exemplary embodiment of protrudent parts. The side of pad 311, facing pad 312, comprises protrudent part P3. The side of pad 312, facing pad 311, comprises protrudent part P4. Protrudent part P3 faces and approaches protrudent part P4. In this embodiment, protrudent parts P3 and P4 are arcs.
Referring to
When an electrostatic event occurs in pad 218, electrostatic current IESD is generated. Voltage Vnew of point B is expressed by the following equation (2):
Compared with equation (1), assuming impedances Z23 and Z24 equal to impedances Z43 and Z44, respectively. After calculating, voltage Vnew is less than voltage Vgen. Thus, the effect of the electrostatic event is reduced through protrudent parts P1 and P2 of pads 218 and 219. When the electrostatic voltage is higher, impedance Z45 is reduced, thus, the electrostatic effect is reduced. Impedance Z45 bases on the shapes of protrudent parts P1 and P2 and a distance between protrudent parts P1 and P2. Electrostatic tolerance of PCB 200 is controlled when protrudent parts P1 and P2 are controlled. Additionally, a region connecting pad 219 is paved with copper such that other pads may utilize peak discharge to release the electrostatic current to ground.
While the invention has been described by way of example and in terms of the preferred embodiments, it is to be understood that the invention is not limited to the disclosed embodiments. To the contrary, it is intended to cover various modifications and similar arrangements (as would be apparent to those skilled in the art). Therefore, the scope of the appended claims should be accorded the broadest interpretation so as to encompass all such modifications and similar arrangements.
This application is a Divisional of co-pending application Ser. No. 11/882,536, filed on Aug. 2, 2007, the entire contents of which are hereby incorporated by reference and for which priority is claimed under 35 U.S.C. §120.
| Number | Date | Country | |
|---|---|---|---|
| Parent | 11882536 | Aug 2007 | US |
| Child | 12203770 | US |