Protection against electrostatic charges or discharges

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/60Protection against electrostatic charges or discharges

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Electrostatic discharge prevention in ion beam system
- Patent number 12,368,117
- Issue date Jul 22, 2025
- Plasma-Therm NES LLC
- Sarpangala Hariharakeshava Hegde
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer with semiconductor devices and integrated electrostatic disch...
- Patent number 12,362,294
- Issue date Jul 15, 2025
- NXP USA, INC.
- Colby Greg Rampley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including uneven structures and electronic de...
- Patent number 12,347,795
- Issue date Jul 1, 2025
- Samsung Electronics Co., Ltd.
- Bonggyu Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having multiple electrostatic discharge (ESD)...
- Patent number 12,349,470
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Feng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lthc as charging barrier in info package formation
- Patent number 12,334,489
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Jen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transient stabilized SOI FETs
- Patent number 12,322,713
- Issue date Jun 3, 2025
- pSemi Corporation
- Robert Mark Englekirk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer reconstitution and die-stitching
- Patent number 12,322,730
- Issue date Jun 3, 2025
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit
- Patent number 12,322,665
- Issue date Jun 3, 2025
- NXP B.V.
- Denizhan Karaca
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die package and methods of formation
- Patent number 12,317,517
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Hui Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 12,300,580
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsu-Lun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device including a discharge contact
- Patent number 12,302,568
- Issue date May 13, 2025
- SK hynix Inc.
- Kwang Hwi Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D chip sharing data bus
- Patent number 12,293,993
- Issue date May 6, 2025
- Adeia Semiconductor Inc.
- Javier A. Delacruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device with guard ring
- Patent number 12,283,579
- Issue date Apr 22, 2025
- Japan Display Inc.
- Yoshinori Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making electrostatic discharge protection cell and antenn...
- Patent number 12,272,658
- Issue date Apr 8, 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- HoChe Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for integrating high-voltage (HV) device, medium-voltage (MV...
- Patent number 12,261,086
- Issue date Mar 25, 2025
- United Microelectronics Corp.
- Chih-Kai Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensing substrate and electronic device
- Patent number 12,237,279
- Issue date Feb 25, 2025
- BEIJING BOE SENSOR TECHNOLOGY CO., LTD.
- Guan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Active protection circuits for semiconductor devices
- Patent number 12,237,278
- Issue date Feb 25, 2025
- Micron Technology, Inc.
- Michael A. Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shield structure for backside through substrate vias (TSVs)
- Patent number 12,230,554
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor device assembly in computer system
- Patent number 12,222,880
- Issue date Feb 11, 2025
- RAMBUS INC.
- Scott C. Best
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Devices based on wave localization and methods for their use
- Patent number 12,199,050
- Issue date Jan 14, 2025
- SOFTWARE DEFINED TECHNOLOGIES, INC.
- Manichandra Morampudi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,199,089
- Issue date Jan 14, 2025
- SOCIONEXT INC.
- Kazuya Okubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having uniform multi-package antenna array and...
- Patent number 12,199,333
- Issue date Jan 14, 2025
- NXP B.V.
- Antonius Hendrikus Jozef Kamphuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trace routable radiation shield
- Patent number 12,193,149
- Issue date Jan 7, 2025
- Intel Corporation
- Sami Markus Heinisuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device
- Patent number 12,185,534
- Issue date Dec 31, 2024
- Samsung Electronics Co., Ltd.
- Junhyoung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of package
- Patent number 12,166,014
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 12,165,549
- Issue date Dec 10, 2024
- Innolux Corporation
- Yuan-Lin Wu
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Substrate-less electrostatic discharge (ESD) integrated circuit str...
- Patent number 12,166,031
- Issue date Dec 10, 2024
- Intel Corporation
- Biswajeet Guha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor
- Patent number 12,154,926
- Issue date Nov 26, 2024
- Samsung Electronics Co., Ltd.
- Kyung Duck Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Detection substrate and manufacturing method thereof, flat panel de...
- Patent number 12,148,720
- Issue date Nov 19, 2024
- BEIJING BOE SENSOR TECHNOLOGY CO., LTD.
- Bin Zhao
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Substrate assembly and display device
- Patent number 12,142,581
- Issue date Nov 12, 2024
- Innolux Corporation
- Tsung-Lun Tsai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MAKING ELECTROSTATIC DISCHARGE PROTECTION CELL AND ANTENN...
- Publication number 20250239541
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- HoChe YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARRAY SUBSTRATE AND DISPLAY APPARATUS
- Publication number 20250234650
- Publication date Jul 17, 2025
- CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Xiangdan Dong
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250218981
- Publication date Jul 3, 2025
- Samsung Electronics Co., Ltd.
- Donghwan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND PACKAGING METHOD
- Publication number 20250218919
- Publication date Jul 3, 2025
- HEFEI SMAT TECHNOLOGY CO. LTD.
- Xiaochun TAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING AN ELECTROMAGNETIC SHIELD AND METHO...
- Publication number 20250210547
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- Byoung-Gug MIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROSTATIC DISCHARGE PATH FOR PREVENTING PLASMA-INDUCED DAMAGE D...
- Publication number 20250212705
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Yen-Liang Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR COMPONENT
- Publication number 20250201737
- Publication date Jun 19, 2025
- XIAMEN SAN'AN INTEGRATED CIRCUIT CO., LTD.
- Houngchi WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250194226
- Publication date Jun 12, 2025
- UNITED MICROELECTRONICS CORP.
- Chih-Kai Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACTIVE PROTECTION CIRCUITS FOR SEMICONDUCTOR DEVICES
- Publication number 20250192075
- Publication date Jun 12, 2025
- Micron Technology, Inc.
- Michael A. Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Light-Emitting Substrate, Backlight Module, and Display Apparatus
- Publication number 20250183200
- Publication date Jun 5, 2025
- Hefei BOE Ruisheng Technology Co., Ltd.
- Yiding Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPERATURE SENSOR MODULE AND ELECTRONIC DEVICE
- Publication number 20250172434
- Publication date May 29, 2025
- DENSO CORPORATION
- Kazuaki FUJISAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked Semiconductor Device Assembly in Computer System
- Publication number 20250165420
- Publication date May 22, 2025
- Rambus Inc.
- Scott C. Best
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
WAFER RECONSTITUTION AND DIE-STITCHING
- Publication number 20250157991
- Publication date May 15, 2025
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSING SUBSTRATE AND ELECTRONIC DEVICE
- Publication number 20250157951
- Publication date May 15, 2025
- BEIJING BOE SENSOR TECHNOLOGY CO., LTD.
- Guan ZHANG
- G01 - MEASURING TESTING
Information Patent Application
SHIELD STRUCTURE FOR BACKSIDE THROUGH SUBSTRATE VIAS (TSVS)
- Publication number 20250149407
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Transient Stabilized SOI FETs
- Publication number 20250149470
- Publication date May 8, 2025
- pSemi Corporation
- Robert Mark Englekirk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE ASSEMBLY AND DISPLAY DEVICE
- Publication number 20250140715
- Publication date May 1, 2025
- Red Oak Innovations Limited
- Tsung-Lun TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH COUPLER STRUCTURE
- Publication number 20250133779
- Publication date Apr 24, 2025
- International Business Machines Corporation
- Adinath Shantinath Narasgond
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARC PREVENTION FOR BONDED WAFERS OF A CHIP STACK
- Publication number 20250125284
- Publication date Apr 17, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jeffrey Peter GAMBINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE ASSEMBLY AND A METHOD FOR FORMING THE SAME
- Publication number 20250118611
- Publication date Apr 10, 2025
- STATS ChipPAC Pte Ltd.
- NamGu KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250118686
- Publication date Apr 10, 2025
- SK HYNIX INC.
- Hwae Bong JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAMING DISPLAY SYSTEMS USING INTEGRATED ELECTROSTATIC DISCHARGE PRO...
- Publication number 20250112178
- Publication date Apr 3, 2025
- LNW Gaming, Inc.
- Nicholas BANAS
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME
- Publication number 20250105212
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ching-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARRAY SUBSTRATE, DISPLAY PANEL AND MANUFACTURING METHOD THEREOF
- Publication number 20250098305
- Publication date Mar 20, 2025
- Fuzhou BOE Optoelectronics Technology Co., Ltd.
- Chunyu LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL AND METHOD FOR MANUFACTURING THE SAME, DISPLAY DEVICE...
- Publication number 20250098383
- Publication date Mar 20, 2025
- BOE MLED TECHNOLOGY CO., LTD.
- Lili WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADING POINT OF DISCHARGE STRUCTURES FOR ELECTROSTATIC DISCHARGE P...
- Publication number 20250079354
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Steven Sze Hang Poon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Silicon Substrate with ESD Protection Element
- Publication number 20250081628
- Publication date Mar 6, 2025
- TDK Electronics AG
- Thomas Feichtinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL FABRICATION OF ELECTROSTATIC DISCHARGE DEVICES
- Publication number 20250079401
- Publication date Mar 6, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Rongwei ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250062289
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250061824
- Publication date Feb 20, 2025
- InnoLux Corporation
- Yuan-Lin WU
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS

Protection against electrostatic charges or discharges

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electrostatic discharge prevention in ion beam system

Wafer with semiconductor devices and integrated electrostatic disch...

Semiconductor package including uneven structures and electronic de...

Semiconductor device having multiple electrostatic discharge (ESD)...

Lthc as charging barrier in info package formation

Transient stabilized SOI FETs

Wafer reconstitution and die-stitching

Integrated circuit

Semiconductor die package and methods of formation

Semiconductor device and method

Semiconductor memory device including a discharge contact

3D chip sharing data bus

Display device with guard ring

Method of making electrostatic discharge protection cell and antenn...

Method for integrating high-voltage (HV) device, medium-voltage (MV...

Sensing substrate and electronic device

Active protection circuits for semiconductor devices

Shield structure for backside through substrate vias (TSVs)

Stacked semiconductor device assembly in computer system

Devices based on wave localization and methods for their use

Semiconductor device

Semiconductor device having uniform multi-package antenna array and...

Trace routable radiation shield

Integrated circuit device

Manufacturing method of package

Electronic device

Substrate-less electrostatic discharge (ESD) integrated circuit str...

Image sensor

Detection substrate and manufacturing method thereof, flat panel de...

Substrate assembly and display device

Patents Applicationslast 30 patents

METHOD OF MAKING ELECTROSTATIC DISCHARGE PROTECTION CELL AND ANTENN...

ARRAY SUBSTRATE AND DISPLAY APPARATUS

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE STRUCTURE AND PACKAGING METHOD

SEMICONDUCTOR PACKAGE INCLUDING AN ELECTROMAGNETIC SHIELD AND METHO...

ELECTROSTATIC DISCHARGE PATH FOR PREVENTING PLASMA-INDUCED DAMAGE D...

SEMICONDUCTOR CHIP AND SEMICONDUCTOR COMPONENT

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

ACTIVE PROTECTION CIRCUITS FOR SEMICONDUCTOR DEVICES

Light-Emitting Substrate, Backlight Module, and Display Apparatus

TEMPERATURE SENSOR MODULE AND ELECTRONIC DEVICE

Stacked Semiconductor Device Assembly in Computer System

WAFER RECONSTITUTION AND DIE-STITCHING

SENSING SUBSTRATE AND ELECTRONIC DEVICE

SHIELD STRUCTURE FOR BACKSIDE THROUGH SUBSTRATE VIAS (TSVS)

Transient Stabilized SOI FETs

SUBSTRATE ASSEMBLY AND DISPLAY DEVICE

SEMICONDUCTOR DEVICE WITH COUPLER STRUCTURE

ARC PREVENTION FOR BONDED WAFERS OF A CHIP STACK

ELECTRONIC PACKAGE ASSEMBLY AND A METHOD FOR FORMING THE SAME

MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME

GAMING DISPLAY SYSTEMS USING INTEGRATED ELECTROSTATIC DISCHARGE PRO...

SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME

ARRAY SUBSTRATE, DISPLAY PANEL AND MANUFACTURING METHOD THEREOF

DISPLAY PANEL AND METHOD FOR MANUFACTURING THE SAME, DISPLAY DEVICE...

LEADING POINT OF DISCHARGE STRUCTURES FOR ELECTROSTATIC DISCHARGE P...

Silicon Substrate with ESD Protection Element

WAFER-LEVEL FABRICATION OF ELECTROSTATIC DISCHARGE DEVICES

PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC DEVICE