1. Field of the Invention
The present invention relates to a contact for an electrical connector, and more particularly to such a contact with increased elasticity to provide a desired resilient compliance for electrically connecting an IC package and a printed circuit board.
2. Description of Prior Art
With the trend of miniaturization in computer technology, the electrical connectors with an insulating housing and a plurality of terminals becomes smaller and smaller. Due to their miniaturized dimension, the terminals, especially mating beams of the terminals are easily damaged because of stress overly exerted thereon when the terminals engage with pins of a complementary electronic package, such as an IC package. Several measurements are proposed to solve this problem. For example, as that disclosed in U.S. Pat. No. 6,929,483 issued to Huang on Aug. 16, 2005, and U.S. Pat. No. 6,695,624 issued to Szu on Feb. 24, 2004, is to modify the configuration of the terminals so as to obtain optimal electrical and mechanical performance of the mating beams of the terminals.
As disclosed in U.S. Pat. No. 6,695,624 issued to Szu on Feb. 24, 2004, an electrical connector is used for electrically connecting an IC package and a printed circuit board. The electrical connector includes a base defining a surface and a number of passageways, and a number of contacts. Each contact comprises an engaging portion for engaging with the passageway, a medial portion extending upwardly from an end of the engaging portion, a solder portion extending perpendicularly from an opposite end of the engaging portion, an inclined portion extending aslant from the medial portion, and a cantilever extending from the inclined portion. The inclined portion and the medial portion form a connecting portion having a first line therebetween. The first line forms an angle relative to the surface of the base. The inclined portion and the cantilever portion form another connecting portion therebetween having a second line, the second line forming another angle relative to the surface of the base. A contact portion is defined on an upper end of the cantilever. Thus, the length of the mating arm is long enough to be deformable and compliance to touch a pad of the IC package mounted on the electrical connector in order to ensure reliable electrical connection between the electrical connector and the IC package. However, the contact portions of the contacts are easy to slide out the pads of the IC package because of overly exerted stress when the IC package is mounted on the electrical connector. If that happens, the electrical connector can not work normally.
Hence, an improved contact for an electrical connector is required to overcome the disadvantages of the prior art.
An object of the present invention is to provide a contact for an electrical connector, wherein the contact has an increased elasticity to provide a good performance for electrically connecting an IC package and a printed circuit board.
To fulfill the above-mentioned object, a contact adapted for electrically connecting with an IC package and a printed circuit board, comprises a base portion adapted for being retained to an insulating housing, a solder portion extending from a lower end of the base portion and a turned portion bent downwardly from one end of the base portion. The solder portion is adapted for soldering the contact to the printed circuit board. The contact further includes a resilient arm extending upwardly from a bottom end of the turned portion. The resilient arm has an inclined portion and a cantilever beam. The inclined portion is connecting with the turned portion. The cantilever extends upwardly from a top end of the inclined portion and toward the turned portion to lengthen the resilient arm of the contact.
Other objects, advantages and novel features of the invention will become more apparent from the following detailed description of the present embodiment when taken in conjunction with the accompanying drawings.
Reference will now be made to the drawings to describe the present invention in detail.
Referring to
As shown in
A resilient arm 206 extends upwardly from a bottom end of the turned portion 205 of the contact 20. The resilient arm 206 includes an inclined portion 2061 connecting with the turned portion 205 and a cantilever beam 2062 extending upwardly from a top end of the inclined portion 2061. An acute angle α is formed between the inclined portion 2061 of the resilient arm 206 and the turned portion 205. The cantilever beam 2062 extends toward the projecting portions 202. The inclined portion 2061 is approximately in a tapered shape and is tapered off from its lower end to its upper end. The cantilever beam 2062 is narrower than the inclined portion 2061 so as to increase an elasticity of the whole resilient arm 206. An arc contact portion 2063 is formed on an upper end of the cantilever beam 2062 to conductively contact a corresponding conductive point 30 formed on the IC package 3 when the IC package 3 presses the arc contact portion 2063 downwardly.
The insulative housing 10 has a substantially rectangular shape, and includes a base 101 defining a mating surface 102 and a mounting surface 103. A plurality through slots 104 extend between the mating surface 102 and the mounting surface 103 of the base 101. The through slot 104 includes a first hole 1041 and a second hole 1041 connecting with the first hole 1041. A length of the first hole 1041 at a longitudinal direction is L1, a length of the second hole 1042 at the longitudinal direction is L3, and L3 is longer than the L1. The first hole 1041 is used to receive the base portion 201 of the contact 20. A plurality of protrusions 1043 extend from inner walls of the first holes 1041 for engaging with the barbs 204 of the contacts 20 so as to retain the contact 20 in the through slots 104 of the insulative housing 10. A length of the second hole 1042 at a transverse direction is L2, the biggest distance between the inclined portion 2061 and the turned portion 205 is L, and L2 is shorter than L.
Referring to
The contact 20 has the turned portion 205 extending downwardly from a top edge of the base portion 201 and the resilient arm 206 extending from a bottom edge of the turned portion 205 so that the resilient arm 206 of the contact 20 of the electrical connector 1 has an adequate length, and the cantilever beam 2062 can elastically touch with the IC package 3. Thus, it can ensure a reliable electrical connection between the IC package 3 and the printed circuit board 4. Additionally, when the contact 20 is received in the through slot 104 of the insulative housing 10, the resilient arm 206 can be pre-loaded by the inner wall of the through slot 204, the cantilever beam 2062 of the resilient arm 206 can deflect downwardly a certain distance and a height of the contact 20 become lower. So it can satisfy the miniaturized trend of the electrical connector 1. Finally, the cantilever beam 2062 of the contact 20 can be pre-loaded by the inner walls of the through slot 104. Thus it can avoid a wiping appearance caused by the contact portion 2063 of the contact 20 sliding excessively when the contact portion 2063 touches with the IC package 3. From an overview point, the preferable embodiment of the instant invention essentially discloses a contact having the solder tail section (203) exposed below the bottom face of the housing, a contacting section (2062, 2063) upwardly extending above the upper face of the housing, and a serpentine connection section (201, 205, 2061) linked between the tail section (203) and the contacting section (2062, 2063) and located in the slot (104) and compressible in a transverse direction wherein two outermost segments of said serpentine connection section (201, 205, 2062) abut against the housing in an upstanding manner.
It is to be understood, however, that even though numerous characteristics and advantages of the present invention have been set forth in the foregoing description, together with details of the structure and function of the invention, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
Number | Date | Country | Kind |
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98201020 | Jan 2009 | TW | national |
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Number | Date | Country | |
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20100184334 A1 | Jul 2010 | US |