Portable electronic devices, such as portable media players, tablet, netbook, and laptop computers, cell, media, and smart phones, have become ubiquitous in recent years. These devices often include an audio jack through which they receive and provide audio information. The audio jacks may include, or be connected to, electronic circuits such as audio drivers for driving headphones or speakers, audio receivers for receiving audio signals from a microphone, and other circuits. These audio jacks may be arranged to receive an audio plug that may be connected to headphones, speakers, microphones, or other equipment.
These audio plugs may be electrical audio plugs. Audio jacks may include a number of ring-shaped contacts along their lengths. These contacts may connect to conductors in a cable attached to the audio plug. These contacts may include contacts for left audio, right audio, ground, and microphone. These audio plugs may also be optical audio plugs, that is, they may have an opening at an end to transmit or receive optical signals. In such a situation, the audio plug may be formed of plastic or other nonconductive material.
When an audio plug is inserted into an audio jack, it may be desirable that the audio plug remain in a fixed position. Since the audio plug may be connected to headphones or ear buds through a cord, forces may be exerted on the plug in a direction that could inadvertently remove the audio plug from the audio jack.
Also, some electronic devices employing audio jacks may achieve great commercial success. As such, millions of these audio jacks may need to be manufactured. Due to the magnitude of this task, any simplification in the assembly process is multiplied the millions of times the audio jacks are assembled. Accordingly, it may be desirable to provide an audio jack that is readily manufactured.
Thus, what is needed are circuits, methods, and apparatus that may provide audio jacks capable of providing a sufficient retention force to avoid at least some inadvertent extractions of an audio plug. It may also be desirable that these audio jacks be readily assembled.
Accordingly, embodiments of the present invention provide circuits, methods, and apparatus that may provide audio jacks capable of providing a sufficient retention force to avoid at least some inadvertent extractions of an audio plug. Some of these embodiments may also provide audio jacks that may be readily assembled. While embodiments of the present invention are well-suited to audio jacks, other types of connectors may be realized consistent with embodiments of the present invention.
An illustrative embodiment of the present invention may provide contact structures having one or more contacts, each having a contact support mechanism to increase contact retention force. In various embodiments of the present invention, different materials may be used to form the contacts than what is used to form the contact support mechanisms. In this way, contacts may be formed using a highly conductive material, while the support mechanism may be formed of a material having good spring characteristics. While a contact formed of a highly conductive material may not be able to provide an adequate retention force on its own, the use of a contact support mechanism having good spring characteristics may sufficiently increase the retention force to prevent accidental extractions of an audio plug or other connector.
Again, the contacts may be formed of a material having a low series resistance or impedance. For example, the contacts may be formed using titanium copper, copper, bronze, phosphor bronze or other bronze alloy, or other material. This material may be highly conductive to reduce contact resistance and reduce signal loss through the contact.
The contact supports may be formed using a material having good spring characteristics. For example, the contact supports may be formed using stainless steel, such as stainless steel 301, beryllium copper, spring steel, or other such material. The contact supports may be alternatively formed using a compressible material. For example, the compressible material may be rubber, foam, or other such material. These materials may increase the retention force generated by a contact and corresponding contact support such that accidental extractions of a connector plug or other contact are reduced. Also, while one contact support mechanism may be used for each contact, in other embodiments of the present invention, more than one contact support mechanism may be used to increase the retention force of a contact. In still other embodiments, one contact support may be used for more than one contact. The contacts and contact supports may be formed using stamping, machining, metal-injection molding, 3-D printing, or other manufacturing process.
An illustrative embedment of the present invention may provide a method whereby audio jacks may readily be assembled. In a specific embodiment of the present invention, a first retention contact may be inserted in an audio jack housing. A first contact support may be inserted behind the first retention contact such that the first retention contact is between the first contact support and a passage in the housing for an audio plug. A plug may be inserted into the passage in the housing. The plug may contact the first retention contact at a first contact portion.
The first retention contact may deflect due to this contact. A switch contact may then be inserted. Since the first retention contact is deflected at this point, the switch contact may be readily inserted. The plug may then be withdrawn, and the first retention contact may move towards it original position. A first contact portion of the switch may contact a second contact portion of the first retention contact as the retention contact returns to its original position.
In this and various embodiments of the present invention, more than one retention contact and corresponding contact support and switch contacts may be included and inserted into the housing. For example, two retention contacts may be included. These retention contacts may be used as audio contacts, such as left audio contacts. Additional contacts for audio, microphone, and ground (or grounds) may be included and inserted into the housing either before or after the retention contacts and corresponding contact supports and switch contacts are inserted. An optical light-emitting diode module may be included at a rear of the housing passage.
While embodiments of the present invention are well-suited to audio jacks having right and left audio, ground, and microphone contacts, embodiments of the present invention may be employed in other types of audio jacks and other types of connectors. For example, embodiments of the present invention may provide audio jacks having right and left audio contacts and one or more ground contacts. In other embodiments of the present invention, one or more contacts may be used for other digital or audio signals, or the one or more contacts may be used for more than one type of signal depending on a configuration of circuitry associated with the audio jack.
Still other embodiments of the present invention may be used in other types of connectors. An embodiment of the present invention may provide a first connector having a contact structure. The contact structure may include a first contact having a first contact portion to deflect when the first contact is mated with a corresponding contact in a second connector. The first contact may provide a retention force at the first contact portion, where the retention force maintains a position of the second connector when the second connector is mated with the first connector. The contact structure may include a first contact support located such that at least a portion of the first contact is between the first contact support and the corresponding contact in the second connector. The first contact support may increase the retention force provided at the first contact portion of the first contact.
Various embodiments of the present invention may incorporate one or more of these and the other features described herein. A better understanding of the nature and advantages of the present invention may be gained by reference to the following detailed description and the accompanying drawings.
Audio jack 100 may include housing 130 covered by shell or shield 140. Housing 130 may include passage 120 forming an opening 110. Opening 110 in passage 120 may accept an audio plug (not shown.) Shell 140 may include one or more fingers 142. Fingers 142 may form electrical connections with a device enclosure or other structure. Shell 140 may further include tabs 144. Tabs 144 may be inserted into openings in a main-logic board or other appropriate substrate. Tabs 144 may further be soldered to form a connection to a ground plane or trace on the board.
Again, an audio plug may be inserted into opening 110 in housing 130 of audio jack 100. This plug may be connected through a cable to ear buds, headphones, or other electronic structure. In such a configuration, a force may be applied to the audio plug through the cable. This force may, on occasion, inadvertently cause an extraction of the audio plug. Accordingly, embodiments the present invention provide retention contacts inside audio jack 100 that may be adequate to avoid at least some of these inadvertent extractions.
Again, embodiments of the present invention may provide a contact structure having a retention contact and a contact support. The contacts may be arranged to provide a good electronic connection, while the contact support may be arranged to reinforce the contact such that it provides an adequate retention force. An example illustrating various contacts in a specific embodiment of the present invention is shown in the following figure.
In this example, retention contacts 450 and 480 are provided. Contact support structures 460 and 485 may be located behind the retention contacts 450 and 480, such that retention contacts 450 and 485 are at least partially between contact support 460 and 465 and passage 120.
Again, by separating the functions of electrical connection and providing retention force, the materials used for contacts 450 and 480 and contact supports 460 and 485 may be chosen independently. Again, the material chosen for contacts 450 and 480 may be highly conductive in order to reduce impedance through the contacts. However highly conductive materials are often too soft and pliable to provide much retention force. Further, they may permanently set in a deflected position after several insertions of an audio plug. Accordingly, contact supports 460 and 485 may be formed using a material with good spring characteristics.
In various embodiments of the present invention, contacts 450 and 480 may be formed using titanium copper, bronze, and other materials. In these and other embodiments of the present invention, support contacts 460 and 485 may be formed using stainless steel, such as stainless steel 301, beryllium copper, spring steel, or other such material. The contact supports may be alternatively formed using a compressible material. For example, the compressible material may be rubber, foam, or other such material.
Contact 450 may include notch 452, which may be used to secure contact 450 in housing 130. Contact 450 may further include a contacting portion 454 exiting a bottom of the housing as pin 2 where it can be soldered to a main logic board or other appropriate substrate.
Contact 450 may further include a first contact portion 456. Contact portion 456 may engage an audio plug when it is inserted into passage 120 in housing 130. This engagement may cause contact 450 to deflect downward. Contact 450 may further include a second contacting portion 485, which may engage contacting portion 472 of switch contact 470. Switch contact 470 may include notch 474 which may be used to secure switch contact 470 in housing 130. Switch contact 470 may further include contact portion 476 which may exit through a bottom of housing 130 as pin 1, where it may be connected to a trace on a main logic board or other appropriate substrate. This audio jack may further include contact 480, contact support 485, and contacts switch 490 which may be similarly arranged.
In a specific embodiment of the present invention, contacts 450 and 480 may be used as audio contacts. In this specific example, other audio, ground, and microphone contacts may be included. For example, microphone contact 410 may include a contacting portion 412 and a through-hole contact portion 414, which may exit through a bottom of housing 132 as pin 5 to be connected to a trace on a printed circuit board or other appropriate substrate. Similarly, ground contacts 420 and 430 may include contacting portions 422 and 432, and contact tail portions 424 and 434, which are pins 6 and 4. By using multiple grounds, associated circuitry may detect a short between these contacts to determine that a metal audio plug is inserted into passage 120.
When a non-metallic audio plug is detected, the ground pins are not shorted, and LED module 495 and associated circuitry (not shown) may be activated. This audio jack may further include another audio contact 442, which may include contacting portions 442 and through-hole contact portion 444, which may be pin 3.
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Once switch contacts 470 and 490 are in place, audio plug 710 may be removed. At some point in, before, or after, this process, the remaining contacts and LED module may also be inserted.
The above description of embodiments of the invention has been presented for the purposes of illustration and description. It is not intended to be exhaustive or to limit the invention to the precise form described, and many modifications and variations are possible in light of the teaching above. The embodiments were chosen and described in order to best explain the principles of the invention and its practical applications to thereby enable others skilled in the art to best utilize the invention in various embodiments and with various modifications as are suited to the particular use contemplated. Thus, it will be appreciated that the invention is intended to cover all modifications and equivalents within the scope of the following claims.
This application is a non-provisional of U.S. provisional patent application No. 61/799,119, filed Mar. 15, 2013, which is incorporated by reference.
Number | Date | Country | |
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61799119 | Mar 2013 | US |