The present invention relates to systems for distributing liquids. More particularly, the present invention relates to a new and improved liquid delivery system with anti-clog function which is particularly adaptable for the delivery of CMP polishing slurry to a CMP apparatus.
Apparatus for polishing thin, flat semiconductor wafers are well-known in the art. Such apparatus normally includes a polishing head which carries a membrane for engaging and forcing a semiconductor wafer against a wetted polishing surface, such as a polishing pad. Either the pad or the polishing head is rotated and oscillates the wafer over the polishing surface. The polishing head is forced downwardly onto the polishing surface by a pressurized air system or similar arrangement. The downward force pressing the polishing head against the polishing surface can be adjusted as desired. The polishing head is typically mounted on an elongated pivoting carrier arm, which can move the pressure head between several operative positions. In one operative position, the carrier arm positions a wafer mounted on the pressure head in contact with the polishing pad. In order to remove the wafer from contact with the polishing surface, the carrier arm is first pivoted upwardly to lift the pressure head and wafer from the polishing surface. The carrier arm is then pivoted laterally to move the pressure head and wafer carried by the pressure head to an auxiliary wafer processing station. The auxiliary processing station may include, for example, a station for cleaning the wafer and/or polishing head, a wafer unload station, or a wafer load station.
More recently, chemical-mechanical polishing (CMP) apparatus has been employed in combination with a pneumatically-actuated polishing head. CMP apparatus is used primarily for polishing the front face or device side of a semiconductor wafer during the fabrication of semiconductor devices on the wafer. A wafer is “planarized” or smoothed one or more times during a fabrication process in order for the top surface of the wafer to be as flat as possible. A wafer is polished by being placed on a carrier and pressed face down onto a polishing pad covered with a slurry of colloidal silica or alumina in deionized water.
CMP polishing results from a combination of chemical and mechanical effects. A possible mechanism for the CMP process involves the formation of a chemically altered layer at the surface of the material being polished. The layer is mechanically removed from the underlying bulk material. An altered layer is then regrown on the surface while the process is repeated again. For instance, in metal polishing, a metal oxide may be formed and removed separately. The chemical mechanical polishing method can be used to provide a planar surface on dielectric layers, on deep and shallow trenches that are filled with polysilicon or oxide, and on various metal films.
Referring initially to
A typical conventional CMP system 10 is shown in
As the polishing slurry flows through the slurry filter 16, extraneous particles are removed from the slurry. However, due to the high viscosity of the slurry and large variations in size of the particles in the slurry, the slurry filter 16 frequently becomes clogged with the removed particles. Consequently, the slurry filter 16 must be replaced typically every 2˜7 days. This contributes to high operational cost, is labor-intensive and adversely impacts the CMP process performance. Moreover, since the conventional system 10 includes only one slurry delivery line, the CMP process must be halted during replacement of the slurry filter. Accordingly, a new and improved slurry delivery and filtering system is needed which facilitates the continuous flow of slurry to a CMP apparatus and which substantially prolongs the lifetime of a slurry filter or filters.
An object of the present invention is to provide a new and improved, continuous liquid delivery system which can be adapted to distribute any of a variety of liquids.
Another object of the present invention is to provide a new and improved, continuous liquid delivery system which can be adapted to deliver polishing slurry from a slurry reservoir to a CMP apparatus.
Still another object of the present invention is to provide a new and improved, continuous liquid delivery system which is capable of substantially prolonging the functional lifetime of a liquid filter or filters.
Yet another object of the present invention is to provide a new and improved, continuous liquid delivery system which facilitates the cleaning or replacement of one set of filters while permitting delivery of a liquid through another set of filters to facilitate a continuous and uninterrupted flow of the liquid.
A still further object of the present invention is to provide a continuous liquid delivery system which may include a pair of separate liquid delivery lines, each having one or multiple filters and a system of valves to facilitate grouped or individual backwashing of a filter or filters in one liquid delivery line while permitting the flow of liquid through the other liquid delivery line.
Yet another object of the present invention is to provide a continuous liquid delivery system which substantially reduces costs and labor associated with replacing a liquid filter or filters.
In accordance with these and other objects and advantages, the present invention is generally directed to a new and improved, continuous liquid delivery system for delivering and filtering liquids. The continuous liquid delivery system is particularly adaptable to the filtering and delivery of polishing slurry from a slurry reservoir to a CMP apparatus in the polishing of semiconductor wafer substrates. The continuous liquid delivery system includes primary and secondary liquid delivery lines, each provided with at least one filter and provided in fluid communication with each other. A water inlet line and a water outlet line, each provided with a valve, are provided in fluid communication with each liquid delivery line, on the respective sides of each filter.
The continuous liquid delivery system is capable of delivering a liquid through either the primary liquid delivery line or the secondary liquid delivery line. When cleaning of the filter or filters in the primary liquid delivery line is necessary, the liquid is distributed through the secondary liquid delivery line. Simultaneously, deionized water or other cleaning fluid is distributed, in the reverse direction, through the filter in the primary liquid delivery line using the water inlet line and the water outlet line, thus backwashing particles from the filter. Each filter in the primary liquid delivery line is typically filtered individually.
After backwashing of the filter or filters in the primary liquid delivery line is completed, the primary liquid delivery line is subjected to a purification step in which deionized water or other cleaning fluid is distributed through the primary liquid delivery line, including the filter or filters therein, to dislodge any remaining particles from the filters and the line. Delivery of the liquid through the primary liquid delivery line is then resumed, at which time the secondary liquid delivery line is cleaned in the same manner as was the primary liquid delivery line. In this manner, the liquid is continuously delivered from a source to a destination and filtered while simultaneously permitting cleaning or unclogging of a filter or filters in the liquid delivery system.
The invention will now be described, by way of example, with reference to the accompanying drawings, in which:
The present invention has particularly beneficial utility in the continuous delivery of polishing slurry from a slurry supply or reservoir to a chemical mechanical planarization (CMP) apparatus used to polish layers on a semiconductor wafer substrate. However, the invention is not so limited in application, and while references may be made to such polishing slurry and CMP apparatus, the invention is more generally applicable to facilitating the continuous delivery of liquids in a variety of industrial applications.
Referring initially to
As used herein, the terms, “upstream” and “downstream” shall be construed to mean upstream and downstream, respectively, with respect to the normal flow direction of the liquid to be filtered and distributed through the system 34 as the liquid flows and is filtered through the system 34.
A primary entrance valve 40 is provided in the inlet end of the primary liquid delivery line 38. The course filter 46 is typically provided in the primary liquid delivery line 38 downstream of the primary entrance valve 40, for the filtering of course particles from a liquid. The fine filter 52 is typically further provided in the primary liquid delivery line 38 downstream of the course filter 46, for the filtering of fine particles from the liquid. However, the primary liquid delivery line 38 may include one or any desired number of filters, depending on the particular application of the system 34. A primary exit valve 60 is provided in the downstream end of the primary liquid delivery line 38.
A primary purification inlet line 42, fitted with a valve 43, extends into the primary liquid delivery line 38 adjacent to the entrance valve 40. A primary purification outlet line 44, fitted with a valve 45, extends from the primary liquid delivery line 38 adjacent to the exit valve 60. A source (not shown) of deionized water or other cleaning fluid is provided in confluent relationship with the purification inlet line 42 to facilitate flushing of the primary liquid delivery line 38, typically with flushing deionized water, as hereinafter described. The flushing water exits the primary liquid delivery line 38 typically through the purification outlet line 44.
A primary course filter inlet line 48, fitted with a primary valve 49, extends into the primary liquid delivery line 38, downstream of the course filter 46. A primary course filter outlet line 50, fitted with a primary valve 51, extends from the primary liquid delivery line 38, upstream of the course filter 46. The course filter inlet line 48 is confluently attached to a backwash water source (not shown) to facilitate the flow of backwash deionized water or cleaning fluid through the course filter inlet line 48 and course filter 46, and from the primary liquid delivery line 38 through the course filter outlet line 50, to facilitate the removal of clogging particles from the course filter 46, as hereinafter described. Accordingly, the primary course filter inlet line 48 and primary course filter outlet line 50 form a backwash circuit for backwashing of the primary course filter 46.
A primary fine filter inlet line 54, fitted with a primary valve 55, extends into the primary liquid delivery line 38, downstream of the primary fine filter 52. A primary fine filter outlet line 56, fitted with a primary valve 57, extends from the primary liquid delivery line 38, upstream of the fine filter 52. The fine filter inlet line 54 is confluently attached to a backwash water source (not shown) to facilitate the flow of backwash deionized water or cleaning fluid through the fine filter inlet line 54 and fine filter 52, and from the primary liquid delivery line 38 through the fine filter outlet line 56. This facilitates the removal of clogging particles from the fine filter 52, as hereinafter described.
A secondary course filter inlet line 48a, fitted with a secondary valve 49a, and a secondary course filter outlet line 50a, fitted with a secondary valve 51a, are confluently attached to the secondary liquid delivery line 38a, at the downstream and upstream ends, respectively, of the secondary course filter 46a. A secondary fine filter inlet line 54a, fitted with a secondary valve 55a, and a secondary fine filter outlet line 56a, fitted with a secondary valve 57a, are confluently attached to the secondary liquid delivery line 38a, at the downstream and upstream ends, respectively, of the secondary fine filter 52a. Accordingly, the secondary course filter inlet line 48a and the secondary course filter outlet line 50a of the secondary liquid delivery line 38a are functional equivalents of the primary course filter inlet line 48 and the primary course filter outlet line 50 of the primary liquid delivery line 38, respectively, and are used to backwash the secondary course filter 46a, in the manner hereinafter described. Similarly, the secondary fine filter inlet line 54a and the secondary fine filter outlet line 56a are functional equivalents of the primary fine filter inlet line 54 and the primary fine filter outlet line 56, respectively, of the primary liquid delivery line 38, and are used to backwash the secondary fine filter 52a, in the manner hereinafter described.
A shunt return line 64 extends from the discharge end of the secondary liquid delivery line 38a and enters the discharge end of the primary liquid delivery line 38. A main outlet line 66 extends beyond the shunt return line 64 and leads to the destination of the liquid to be filtered through the system 34. At least one controller 68 may be operably connected to the various valves of the system 34 for programmed opening and closing of the valves in automated operation of the system 34, as hereinafter described.
Referring next to
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As the liquid 70 flows through the secondary liquid delivery line 38a, the valves 49 and 51 are opened to facilitate flow of deionized water 72 or other cleaning fluid through the course filter inlet line 48 into the primary liquid delivery line 38. Accordingly, the water 72 flows upstream through the course filter 46 to remove particles (not shown) from the course filter 46 and distribute these particles from the primary liquid delivery line 38 through the course filter outlet line 50. Flow of the backwashing water 72 is continued for a time period of typically about 1˜30 minutes.
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After it is purified, the primary liquid delivery line 38 is set to resume flow of the liquid 70 through the primary liquid delivery line 38. During this time, the course filter 46a and fine filter 52a of the secondary liquid delivery line 38b are backwashed with deionized water 72 or other cleaning fluid, typically in the same manner as heretofore described with respect to the course filter 46 and the fine filter 52, in order to remove entrapped particles from the course filter 46a and fine filter 52a. The course filter inlet line 48a and course filter outlet line 50a are used to backwash the course filter 46a, whereas the fine filter inlet line 54a and the fine filter outlet line 56a are used to backwash the fine filter 52a. Purification of the secondary liquid delivery line 38a may be accomplished by the introduction of deionized water 72 or cleaning fluid into the line 38a through the course filter outlet line 50a, by opening of the valve 51a; and from the line 38a through the purification outlet line 44a, by opening of the valve 45a.
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While the preferred embodiments of the invention have been described above, it will be recognized and understood that various modifications can be made in the invention and the appended claims are intended to cover all such modifications which may fall within the spirit and scope of the invention.