for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents

Industry

CPC
B24B57/02

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B24Grinding technology B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS B24B57/00Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents

Current Industry

B24B57/02for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Liquid feeder and polishing apparatus
- Patent number 12,358,098
- Issue date Jul 15, 2025
- Ebara Corporation
- Kuniaki Yamaguchi
- B24 - GRINDING POLISHING
Information Patent Grant
High-throughput, precise semiconductor slurry blending tool
- Patent number 12,343,841
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Wei Chiu
- B24 - GRINDING POLISHING
Information Patent Grant
Buffer and self-feeding compound apparatus
- Patent number 12,337,435
- Issue date Jun 24, 2025
- Timothy Edward Thompson
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus for polishing a wafer and method for fabricating a semico...
- Patent number 12,341,015
- Issue date Jun 24, 2025
- Samsung Electronics Co., Ltd.
- Dong Hoon Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Break-in processing apparatus and break-in processing method
- Patent number 12,337,438
- Issue date Jun 24, 2025
- Ebara Corporation
- Osamu Nabeya
- B24 - GRINDING POLISHING
Information Patent Grant
Grinding method of workpiece
- Patent number 12,325,104
- Issue date Jun 10, 2025
- Disco Corporation
- Daisuke Akita
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing liquid supply system, polishing apparatus, exhausting met...
- Patent number 12,311,500
- Issue date May 27, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Peng Zhang
- B24 - GRINDING POLISHING
Information Patent Grant
System and method for removing debris during chemical mechanical pl...
- Patent number 12,311,501
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Wei Hsu
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus and method for CMP temperature control
- Patent number 12,296,427
- Issue date May 13, 2025
- Applied Materials, Inc.
- Haosheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluid-tight electrical connection techniques for semiconductor proc...
- Patent number 12,290,897
- Issue date May 6, 2025
- Applied Materials, Inc.
- Chad Pollard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cleaning system for polishing liquid delivery arm
- Patent number 12,240,078
- Issue date Mar 4, 2025
- Applied Materials, Inc.
- Roy C. Nangoy
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate transporter and substrate processing apparatus including...
- Patent number 12,237,194
- Issue date Feb 25, 2025
- EBARA CORPORATION
- Akihiro Yazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temperature control of chemical mechanical polishing
- Patent number 12,214,468
- Issue date Feb 4, 2025
- Applied Materials, Inc.
- Haosheng Wu
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus for polishing, processing system, and method of polishing
- Patent number 12,179,312
- Issue date Dec 31, 2024
- Ebara Corporation
- Takuya Moriura
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus, systems and methods for cleaning and polishing accessories
- Patent number 12,179,313
- Issue date Dec 31, 2024
- Clinton D. Nelson
- B08 - CLEANING
Information Patent Grant
Polishing liquid supply system
- Patent number 12,179,314
- Issue date Dec 31, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Fuyou Jiang
- B24 - GRINDING POLISHING
Information Patent Grant
Containment and exhaust system for substrate polishing components
- Patent number 12,145,236
- Issue date Nov 19, 2024
- Axus Technology, LLC
- Daniel Ray Trojan
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing fluid collection apparatus and methods related thereto
- Patent number 12,138,741
- Issue date Nov 12, 2024
- Applied Materials, Inc.
- Lizhong Sun
- B24 - GRINDING POLISHING
Information Patent Grant
Methods and apparatus for processing a substrate
- Patent number 12,138,742
- Issue date Nov 12, 2024
- Applied Materials, Inc.
- Prayudi Lianto
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing system apparatus and methods for defect reduction at a su...
- Patent number 12,138,732
- Issue date Nov 12, 2024
- Applied Materials, Inc.
- Asheesh Jain
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate polishing apparatus and polishing liquid discharge method...
- Patent number 12,138,734
- Issue date Nov 12, 2024
- Ebara Corporation
- Tetsuji Togawa
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing head, chemical-mechanical polishing system and method for...
- Patent number 12,128,522
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shu-Bin Hsu
- B24 - GRINDING POLISHING
Information Patent Grant
Electrical cleaning tool for wafer polishing tool system
- Patent number 12,128,455
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Wen Liu
- B08 - CLEANING
Information Patent Grant
Polishing device
- Patent number 12,115,620
- Issue date Oct 15, 2024
- Rud. Starcke GmbH & Co. KG
- Werner Unnerstall
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical-mechanical polishing apparatus
- Patent number 12,103,133
- Issue date Oct 1, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Hsi Huang
- B24 - GRINDING POLISHING
Information Patent Grant
Face-up wafer electrochemical planarization apparatus
- Patent number 12,090,600
- Issue date Sep 17, 2024
- Applied Materials, Inc.
- Kevin H. Song
- B24 - GRINDING POLISHING
Information Patent Grant
Manufacturing method for grinding wheel and grinding method for gri...
- Patent number 12,048,986
- Issue date Jul 30, 2024
- GUILIN CHAMPION UNION DIAMOND Co., Ltd.
- Jingxin Song
- B24 - GRINDING POLISHING
Information Patent Grant
System and method for removing debris during chemical mechanical pl...
- Patent number 12,017,325
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Wei Hsu
- B24 - GRINDING POLISHING
Information Patent Grant
Manufacturing apparatus and method of manufacturing display apparat...
- Patent number 12,010,902
- Issue date Jun 11, 2024
- Samsung Display Co., Ltd.
- Seungbae Kang
- B24 - GRINDING POLISHING
Information Patent Grant
Method for polishing semiconductor substrate
- Patent number 11,999,027
- Issue date Jun 4, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- James Jeng-Jyi Hwang
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE LAPPING APPARATUS AND SUBSTRATE LAPPING METHOD USING THE...
- Publication number 20250235980
- Publication date Jul 24, 2025
- Samsung Electronics Co., Ltd.
- SUKHOON JEONG
- B24 - GRINDING POLISHING
Information Patent Application
GRINDING APPARATUS, METHOD OF GRINDING WORKPIECE, AND METHOD OF MAN...
- Publication number 20250235983
- Publication date Jul 24, 2025
- Disco Corporation
- Keiichiro NIITSU
- B24 - GRINDING POLISHING
Information Patent Application
CMP Polisher Head Over-Rotation Restrictor with Vertical Lift Force
- Publication number 20250235981
- Publication date Jul 24, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Christopher Schutte
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND METHOD OF PROCESSING SUBSTRATE U...
- Publication number 20250214198
- Publication date Jul 3, 2025
- Samsung Electronics Co., Ltd.
- Imbi YEO
- B24 - GRINDING POLISHING
Information Patent Application
SEMICONDUCTOR PROCESSING DEVICE AND POLISHING DEVICE
- Publication number 20250205851
- Publication date Jun 26, 2025
- EBARA CORPORATION
- MAKOTO TAKAYAMA
- B24 - GRINDING POLISHING
Information Patent Application
METHOD FOR CMP TEMPERATURE CONTROL
- Publication number 20250205847
- Publication date Jun 26, 2025
- Applied Materials, Inc.
- Haosheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING PAD AND CHEMICAL MECHANICAL POLISHING APPARATUS
- Publication number 20250196286
- Publication date Jun 19, 2025
- WINBOND ELECTRONICS CORP.
- Min-Hsun Lin
- B24 - GRINDING POLISHING
Information Patent Application
APPARATUS AND METHOD FOR IN-SITU CHEMICAL SEPARATION AND RECIRCULAT...
- Publication number 20250187141
- Publication date Jun 12, 2025
- AXUS TECHNOLOGY, LLC
- Daniel Ray Trojan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING APPARATUS AND METHOD FOR POLISHING SUBSTRATE
- Publication number 20250178159
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shi-Ting Wu
- B24 - GRINDING POLISHING
Information Patent Application
FLEXIBLE SPINDLE POLISHING
- Publication number 20250153307
- Publication date May 15, 2025
- Worcester Polytechnic Institute
- Yihao Zheng
- B24 - GRINDING POLISHING
Information Patent Application
BRUSH AGING PAD, CHEMICAL MECHANICAL POLISHING CLEANING APPARATUS,...
- Publication number 20250144768
- Publication date May 8, 2025
- Samsung Electronics Co., Ltd.
- Heesung KIM
- B24 - GRINDING POLISHING
Information Patent Application
HIGH SPEED INJECTION NOZZLE FOR PRE-POLISH MODIFICATION OF SUBSTRAT...
- Publication number 20250114910
- Publication date Apr 10, 2025
- Applied Materials, Inc.
- Priscilla Diep LaRosa
- B24 - GRINDING POLISHING
Information Patent Application
RETAINING RING FOR EDGE COMPENSATION BY SLURRY FLOW CONTROL
- Publication number 20250114898
- Publication date Apr 10, 2025
- Applied Materials, Inc.
- Zhize Zhu
- B24 - GRINDING POLISHING
Information Patent Application
TEMPERATURE CONTROL OF CHEMICAL MECHANICAL POLISHING
- Publication number 20250108476
- Publication date Apr 3, 2025
- Applied Materials, Inc.
- Haosheng Wu
- B24 - GRINDING POLISHING
Information Patent Application
Buffer and Self-Feeding Compound Apparatus
- Publication number 20250108472
- Publication date Apr 3, 2025
- Timothy Edward Thompson
- B24 - GRINDING POLISHING
Information Patent Application
CHEMICAL MECHANICAL POLISHING EDGE CONTROL WITH PAD RECESSES
- Publication number 20250108477
- Publication date Apr 3, 2025
- Applied Materials, Inc.
- Huanbo Zhang
- B24 - GRINDING POLISHING
Information Patent Application
CHEMICAL MECHANICAL POLISHING PROCESS USING STEAM FOR POLISHING FLU...
- Publication number 20250083282
- Publication date Mar 13, 2025
- WESTERN DIGITAL TECHNOLOGIES, INC.,
- Yohei YAMADA
- B24 - GRINDING POLISHING
Information Patent Application
CONTAINMENT AND EXHAUST SYSTEM FOR SUBSTRATE POLISHING COMPONENTS
- Publication number 20250065473
- Publication date Feb 27, 2025
- AXUS TECHNOLOGY, LLC
- Daniel Ray Trojan
- B24 - GRINDING POLISHING
Information Patent Application
APPARATUS FOR POLISHING, PROCESSING SYSTEM, AND METHOD OF POLISHING
- Publication number 20250058431
- Publication date Feb 20, 2025
- EBARA CORPORATION
- Takuya MORIURA
- B24 - GRINDING POLISHING
Information Patent Application
SLURRY COMPOSITION FOR CHEMICAL MECHANICAL POLISHING AND CHEMICAL M...
- Publication number 20250043149
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- DONGHOON KWON
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Publication number 20250033164
- Publication date Jan 30, 2025
- EBARA CORPORATION
- Hirotaka OHASHI
- B24 - GRINDING POLISHING
Information Patent Application
CHEMICAL MECHANICAL POLISHING (CMP) APPARATUS
- Publication number 20250025982
- Publication date Jan 23, 2025
- Samsung Electronics Co., Ltd.
- Donghoon Kwon
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING FLUID RECOVERY AND REUSE SYSTEM FOR SEMICONDUCTOR SUBSTRA...
- Publication number 20250010431
- Publication date Jan 9, 2025
- Applied Materials, Inc.
- Jianjun HU
- B24 - GRINDING POLISHING
Information Patent Application
METHOD FOR POLISHING A SUBSTRATE
- Publication number 20250001542
- Publication date Jan 2, 2025
- Illumina, Inc.
- Alisina BAZRAFSHAN
- B24 - GRINDING POLISHING
Information Patent Application
FACE-UP WAFER ELECTROCHEMICAL PLANARIZATION APPARATUS
- Publication number 20250001547
- Publication date Jan 2, 2025
- Applied Materials, Inc.
- Kevin H. Song
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE SUCTION MEMBER, ELASTIC SEAL ASSEMBLY, TOP RING, AND SUBS...
- Publication number 20240416480
- Publication date Dec 19, 2024
- EBARA CORPORATION
- Kazuhiro TAJIMA
- B24 - GRINDING POLISHING
Information Patent Application
METHOD AND DISK CARRIER FOR USE IN POLISHING GLASS SUBSTRATE DISKS
- Publication number 20240408719
- Publication date Dec 12, 2024
- Western Digital Technologies, Inc.
- Stefano Ching Kiat Boon
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING APPARATUS AND POLISHING METHOD
- Publication number 20240391054
- Publication date Nov 28, 2024
- EBARA CORPORATION
- Osamu NABEYA
- B24 - GRINDING POLISHING
Information Patent Application
METHOD AND SYSTEM FOR SLURRY QUALITY MONITORING
- Publication number 20240375238
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- CHIH-CHIANG TSENG
- B24 - GRINDING POLISHING
Information Patent Application
CHEMICAL MECHANICAL PLANARIZATION SLURRY PROCESSING TECHNIQUES AND...
- Publication number 20240379371
- Publication date Nov 14, 2024
- Ara PHILIPOSSIAN
- B24 - GRINDING POLISHING

for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Liquid feeder and polishing apparatus

High-throughput, precise semiconductor slurry blending tool

Buffer and self-feeding compound apparatus

Apparatus for polishing a wafer and method for fabricating a semico...

Break-in processing apparatus and break-in processing method

Grinding method of workpiece

Polishing liquid supply system, polishing apparatus, exhausting met...

System and method for removing debris during chemical mechanical pl...

Apparatus and method for CMP temperature control

Fluid-tight electrical connection techniques for semiconductor proc...

Cleaning system for polishing liquid delivery arm

Substrate transporter and substrate processing apparatus including...

Temperature control of chemical mechanical polishing

Apparatus for polishing, processing system, and method of polishing

Apparatus, systems and methods for cleaning and polishing accessories

Polishing liquid supply system

Containment and exhaust system for substrate polishing components

Polishing fluid collection apparatus and methods related thereto

Methods and apparatus for processing a substrate

Polishing system apparatus and methods for defect reduction at a su...

Substrate polishing apparatus and polishing liquid discharge method...

Polishing head, chemical-mechanical polishing system and method for...

Electrical cleaning tool for wafer polishing tool system

Polishing device

Chemical-mechanical polishing apparatus

Face-up wafer electrochemical planarization apparatus

Manufacturing method for grinding wheel and grinding method for gri...

System and method for removing debris during chemical mechanical pl...

Manufacturing apparatus and method of manufacturing display apparat...

Method for polishing semiconductor substrate

Patents Applicationslast 30 patents

SUBSTRATE LAPPING APPARATUS AND SUBSTRATE LAPPING METHOD USING THE...

GRINDING APPARATUS, METHOD OF GRINDING WORKPIECE, AND METHOD OF MAN...

CMP Polisher Head Over-Rotation Restrictor with Vertical Lift Force

SUBSTRATE PROCESSING APPARATUS AND METHOD OF PROCESSING SUBSTRATE U...

SEMICONDUCTOR PROCESSING DEVICE AND POLISHING DEVICE

METHOD FOR CMP TEMPERATURE CONTROL

POLISHING PAD AND CHEMICAL MECHANICAL POLISHING APPARATUS

APPARATUS AND METHOD FOR IN-SITU CHEMICAL SEPARATION AND RECIRCULAT...

POLISHING APPARATUS AND METHOD FOR POLISHING SUBSTRATE

FLEXIBLE SPINDLE POLISHING

BRUSH AGING PAD, CHEMICAL MECHANICAL POLISHING CLEANING APPARATUS,...

HIGH SPEED INJECTION NOZZLE FOR PRE-POLISH MODIFICATION OF SUBSTRAT...

RETAINING RING FOR EDGE COMPENSATION BY SLURRY FLOW CONTROL

TEMPERATURE CONTROL OF CHEMICAL MECHANICAL POLISHING

Buffer and Self-Feeding Compound Apparatus

CHEMICAL MECHANICAL POLISHING EDGE CONTROL WITH PAD RECESSES

CHEMICAL MECHANICAL POLISHING PROCESS USING STEAM FOR POLISHING FLU...

CONTAINMENT AND EXHAUST SYSTEM FOR SUBSTRATE POLISHING COMPONENTS

APPARATUS FOR POLISHING, PROCESSING SYSTEM, AND METHOD OF POLISHING

SLURRY COMPOSITION FOR CHEMICAL MECHANICAL POLISHING AND CHEMICAL M...

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

CHEMICAL MECHANICAL POLISHING (CMP) APPARATUS

POLISHING FLUID RECOVERY AND REUSE SYSTEM FOR SEMICONDUCTOR SUBSTRA...

METHOD FOR POLISHING A SUBSTRATE

FACE-UP WAFER ELECTROCHEMICAL PLANARIZATION APPARATUS

SUBSTRATE SUCTION MEMBER, ELASTIC SEAL ASSEMBLY, TOP RING, AND SUBS...

METHOD AND DISK CARRIER FOR USE IN POLISHING GLASS SUBSTRATE DISKS

POLISHING APPARATUS AND POLISHING METHOD

METHOD AND SYSTEM FOR SLURRY QUALITY MONITORING

CHEMICAL MECHANICAL PLANARIZATION SLURRY PROCESSING TECHNIQUES AND...