KIC Application Note #00121 Rev: 98-06, “Profiling Using the SlimKIC,” downloaded Aug. 7, 2002 from http://www.kicthermal.com, pp. 1-9, (1998).* |
KIC Application Note #00001 Rev: 98-05, “Attaching Thermocouples for Solder Reflow Board Profiling Using High Temperature Solder,” downloaded Aug. 7, 2002 from http://www.kicthermal.com, pp. 1-4, (1998).* |
O'Rourke, H. T.; “Controlling wave soldering through the use of time/temperature instrumentation,” Insulation Circuits (USA), vol. 24, No. 11, pp. 27-29, Oct. 1978.* |
“The Temperature Handbook,” vol. 29, Omega Engineering, Stamford, CT, (no month) 1995, pp. S-145.* |
“The Temperature Handbook,” vol. 29, Omega Engineering, Stamford, CT, (no month) 1995, pp. G-42, G-43, G-45, G-59. |