This is the U.S. national phase of International Application No. PCT/US2010/054936 filed Nov. 1, 2010, which claims the benefit of U.S. Patent Application Ser. No. 61/258,124 filed Nov. 4, 2009, the entire disclosures of which are hereby incorporated herein by reference.
The disclosure relates to appliances for cooking and baking, which have a spill containment pattern disposed thereon, and methods of making the same. More particularly, the disclosure is directed to a cooking appliance or cooking appliance surface that includes a spill containment pattern having a hydrophobic pattern bounding a non-hydrophobic spill containment region.
The surfaces of various cooking appliances including cooktops, range tops, stoves, and ovens can be subject to a variety of spills occurring during the cooking process. These spills must be contained and prevented from leaking over the edge of a cooking surface. In general, commercially available cooktops include a molded member or border encapsulating the edge of the cooktop to prevent spills from exiting the cooktop surface. However, such encapsulating member designs are difficult to clean and can trap food products and liquid between the cooking appliance surface and the encapsulating member. It can be further desirable to include a trim member surrounding the burner unit, as a means of directing spilled liquids away from the hot burner unit in order to prevent the spill from burning, drying out, and crusting on the burner area. However, such trim units also can result in the accumulation of trapped food or liquid products and are difficult to clean.
In an embodiment of the present disclosure, a cooking appliance having a spill containment pattern includes a cooking appliance surface having a top surface, the top surface comprising a non-hydrophobic region, at least one heating element disposed on or adjacent to the cooking appliance surface, and a spill containment pattern comprising a hydrophobic pattern disposed on the top surface and bounding at least a portion of the non-hydrophobic region, the bounded non-hydrophobic region defining a non-hydrophobic spill containment region.
In another embodiment of the present disclosure, a cooking appliance surface having a spill containment pattern includes a top surface, the top surface comprising, wherein at least a portion of the top surface is adapted to be heated by a heating element, and a portion of the top surface is non-hydrophobic, and a spill containment pattern disposed on the top surface, the spill containment patter comprising a hydrophobic pattern bounding at least a portion of the non-hydrophobic portion of the top surface, the bounded non-hydrophobic portion of the top surface defining a non-hydrophobic spill containment region.
In yet another embodiment of the present disclosure, a method of manufacturing a cooking appliance surface capable of containing spills thereon includes providing a cooking appliance surface comprising a top surface having a non-hydrophobic region, wherein at least a portion of the cooking appliance surface is adapted to be heated by at least one heating element, and forming a hydrophobic pattern on the top surface, the hydrophobic pattern arranged to bound at least a portion of the non-hydrophobic region, the bounded non-hydrophobic region defining a non-hydrophobic spill containment region.
These and other aspects, advantages and features of the disclosure will be more fully understood and appreciated by reference to the Description of the Preferred Embodiments, and the appended drawings.
Preferred embodiments of the disclosure will now be described with reference to the drawings in which:
The present disclosure is directed to a cooking appliance surface having a spill containing pattern disposed on a top surface of the cooking appliance surface. The cooking appliance surface can include the surface of any appliance used for cooking and/or baking, such as, cooktops, stovetops, range cooking tops, and ovens. The cooking appliance surface of the disclosure can be adapted for use with any commercially available cooktop, stove, range, oven, or any similar such appliance. The cooking appliance surface can be any shape, including, for example, a rectangle, a lazy s-shape, and an oval. Certain embodiments are especially advantageous for use with cooktops that include a glass or ceramic top surface with burners disposed beneath the top surface and one or more controls disposed on or adjacent to the top surface. At least a portion of the top surface of the cooking appliance surface is adapted to be heated by at least one heating element. For example, the cooking appliance surface can be a cooktop, with a portion of the cook disposed near the burners adapted to be heated by the burners. Alternatively, the entire top surface of the cooking appliance surface can be adapted to be heated by at least one heating element. For example, the cooking appliance surface can be the bottom wall of an oven, which is heated by the oven heating element.
As mentioned, the cooking appliance surface includes a top surface. At least a portion of the top surface is non-hydrophobic. The top surface can be formed of metal, glass, ceramic, composites, or any other suitable material, or combinations thereof. For example, the metal can be porcelain enameled metal, plated metal, including steel, cast iron, and stainless steel, and combinations thereof. The glass can be, for example, borosilicate glass, high temperature resistive glass, spun glass, glass fibers, and combinations thereof. The top surface can include a coating that allows for easy clean-up for a spill on the surface. Such a coating, however, would not function to retain spills on the top surface.
Referring to
The spill containment pattern, and particularly, a hydrophobic pattern 18, is generally formed so as to be in the same plane as the cooking appliance surface. The spill containment pattern can be designed to contain spills 22 resulting from over-boiling of a container of liquid or other food substance and/or to contain spills 22 of room temperature liquids or other food substances resulting from the general cooking process, for example, when pouring liquid or other food substance into a container, when placing a full container on or over the cooking appliance surface, or when removing cooking utensils from pots on a stove.
As mentioned, the spill containment pattern includes a hydrophobic pattern 18 disposed on the top surface, bounding at least a portion of the non-hydrophobic region of the top surface 10. The bounded portion of the non-hydrophobic region defines a non-hydrophobic spill containment region 20. The hydrophobicity of the hydrophobic pattern 18 repels a spilled liquid or other food substance and causes the same to bead up or puddle up in the non-hydrophobic spill containment region 20. In some embodiments, the spill containment pattern can retain a spill 22 having a height when pooled in the non-hydrophobic spill containment region 20 of less than about 5.5 mm. For example, the spill containment pattern can retain a spill having a height of about 0.5 mm, about 1 mm, about 1.5 mm, about 2 mm, about 2.5 mm, about 3 mm, about 3.5 mm, about 4 mm, about 4.5 mm, about 5mm, or about 5.5 mm. The height of the spilled liquid provides a measure of the amount of spilled liquid retained by a top surface regardless of the area of the non-hydrophobic spill containing region of the top surface. The height of the retained spilled liquid is determined by dividing the volume of spilled liquid retained by the top surface before failure (i.e. leakage) by the area of the non-hydrophobic spill containing region.
The hydrophobic pattern 18 can be disposed in substantially the same plane as the top surface 10. For example, the hydrophobic pattern 18 can have a thickness of from about 0.001 microns to about 250 microns. Other suitable thickness ranges include from about 0.001 microns to about 2 microns, about 0.01 microns to about 1.5 microns, about 0.1 microns to about 1 microns, about 0.001 microns to about 10 microns, about 0.01 microns to about 8 microns, about 0.05 microns to about 7 microns, about 0.1 microns to about 5 microns, about 1 micron to about 4 microns, about 1 micron to about 10 microns, about 2 microns to about 8 microns, about 4 microns to about 6 microns, about 10 microns to about 100 microns, about 20 microns to about 80 microns, about 40 microns to about 60 microns, about 100 microns to about 250 microns, about 150 to about 200 microns, about 1 micron to about 250 microns, about 10 microns to about 200 microns, about 20 microns to about 150 microns, about 30 microns to about 100 microns, about 40 microns to about 80 microns, and about 50 microns to about 70 microns. Other suitable thickness include, for example, about 0.001, 0.005, 0.01, 0.05, 0.1, 0.5, 1, 5, 10, 15, 20, 30, 40, 50, 60, 70, 80, 90, 100, 110, 120, 130, 140, 150, 160, 170, 180, 190, 200, 210, 220, 320, 240, and 250 microns.
A variety of spill containment patterns can be used depending on the desired spill containment effect. Referring to
More specifically, the hydrophobic pattern 18 can include a continuous pattern formed of parallel left and right side edge containment strips 18a, 18b, and parallel front and rear edge containment strips 18c, 18d, i.e., all respectively engaged to adjacent ones. Each of the edge containment strips 18a-18d is generally uniform in width. In forming a frame-like border hydrophobic pattern 18, as shown in
The side edge containment strips 18a, 18b are disposed at substantially right angles relative to the front and rear edge containment strips 18c, 18d. So configured, the hydrophobic pattern 18 of the embodiment depicted in
Referring to
The grid-like hydrophobic pattern 18 defines a plurality of non-hydrophobic spill containment regions 20a-1 to 20a-p (where p is the number of non-hydrophobic spill containment regions disposed on the top surface 10). In general, each of the non-hydrophobic spill containment regions 20a-1 to 20a-p is completely bounded, encircled, and/or enclosed by four of the spill containment strips and is therefore square, rectangular, and/or box-shaped. In the case where the grid pattern is not continuously disposed over the burners 12, control knobs 14a, control panels 14b, or fan 16 regions, the non-hydrophobic spill containment regions disposed near those features may have a different shape and may be bounded by four spill containment strips, with portions of other spill containment strips being disposed within the non-hydrophobic spill containment region 20. In the grid-like arrangement, each of the non-hydrophobic spill containment regions 20a-1 to 20a-p is capable of containing a spill 22 (not shown) separate from the other non-hydrophobic spill containment regions 20a-1 to 20a-p.
Referring to
The first hydrophobic surface border 24 can be disposed about the perimeter edge of the top surface 10, and the second hydrophobic surface border 26 can be offset inwardly from the first hydrophobic surface border 24. The first hydrophobic surface border 24 includes parallel left and right side edge containment strips 24a, 24b, and parallel front and rear edge containment strips 24c, 24d. Each of the edge containment strips 24a-24d of the first continuous hydrophobic surface border 24 is generally uniform in width and arranged in an elongated linear configuration directly at the edge of the perimeter of the top surface 10. The side edge containment strips 24a, 24b are disposed at right angles relative to the front and rear edge containment strips 24c, 24d. So configured, the first hydrophobic surface border 24 forms a continuous generally square, rectangular, and/or box-shape completely bounding, encircling, and/or enclosing the non-hydrophobic spill containment region 28, which is also generally square, rectangular, and/or box-shaped.
Moreover, as depicted, the second continuous hydrophobic surface border 26 includes parallel left and right side edge containment strips 26a, 26b, and parallel front and rear edge containment strips 26c, 26d. Each of the edge containment strips 26a-26d of the second hydrophobic surface border 26 is generally uniform in width and arranged in an elongated linear configuration offset inwardly from the first hydrophobic surface border 24. The side edge containment strips 26a, 26b are disposed at right angles relative to the front and rear edge containment strips 26c, 26d such that the second hydrophobic surface border 26 forms a generally square, rectangular, and/or box-shape completely bounding, encircling, and/or enclosing a portion of the non-hydrophobic spill containment region 28 of the top surface 10. So configured, the first and second hydrophobic surface borders 24, 26 define a non-hydrophobic spill containment ring region 30 located between the two borders 24, 26. The non-hydrophobic spill containment ring region 30 can advantageously capture any spill overflow which might escape from the non-hydrophobic spill containment region 28 and travel over the second hydrophobic surface border 26.
These and other variations in the spill containment pattern 18 can be made without departing from the spirit and scope of the novel concepts of the preferred embodiments of the present disclosure. For example, while
Referring to
To illustrate the concepts of liquid spillage, a spill 22 is illustrated in
The hydrophobic pattern 18 is formed by applying a hydrophobic or super hydrophobic compound to the top surface 10 in the desired hydrophobic pattern 18 arrangement. A variety of hydrophobic or super-hydrophobic compounds can be used to form the hydrophobic pattern, and the compounds can be applied by a variety of methods. If it is desired to contain hot liquids, the hydrophobic or super-hydrophobic material should be adapted to maintain its hydrophobicity when contacted with the hot liquids, so as to be able to repel the hot liquids and direct them to pool in the non-hydrophobic spill containment region 20 of the top surface 10 of the cooking appliance surface. In general, as to domestic and professional cooking procedures, hot liquids have a temperature in a range of 50° C. to about 210° C. For example, suitable hydrophobic materials for use in repelling hot liquids can include, fluorocarbons, flurorpolymers such as polytetrafluoroethylene (commercially available from DuPont as TEFLON), a superhydrophobic surface coating using TEFLON (See Van der Wal et al., 3 Soft Matter 426 (2009)), silicone based coatings, a composite of polytetrafluoroethylene (commercially available from DuPont as TEFLON) and carbon nanotubes (See Liu et al., 19 J. Materials Chem. 5602 (2009)), and combinations thereof.
As described above, at least a portion of the top surface 10 of the cooking appliance surface is adapted to be heated by a heating element. In various embodiments of the disclosure, the hydrophobic pattern 18 is disposed on or near the regions of the top surface 10 adapted to be heated by the heating element. In these embodiments, the hydrophobic or super-hydrophobic compound and any other compounds used to form the hydrophobic pattern 18 should be suitable for use on a heated surface. For example, the hydrophobic or super-hydrophobic material should be suitable for use on a surface having a temperature in a range of ambient temperature to about 500° C. Preferably, the hydrophobic compound and any other compounds used to form the hydrophobic pattern 18 are stable and resilient against repeated heating and cooling cycles.
Examples of hydrophobic compounds for use in forming the hydrophobic pattern 18 include, for example, organic polymers, inorganic polymers, fluorocarbons, olefins, nanomaterials, nanomaterial-organic polymer blends, ceramics, and combinations thereof. The organic polymers include fluoropolymers, graph polymers, copolymers, and blends. Specific fluoropolymers include, for example, PTFE/polyphenylene sulfide blends and copolymers, plasma deposited fluoropolymer coating from CFC-113 and C2H4, plasma deposited fluoropolymer coatings from precursors that include CF4, C2F6, C4F8, and mixtures thereof, electrospun initiated-chemical vapor deposited perfluoroalkyl ethyl methacrylate, fluoropolyamide-polyimide polymers, and fluorinated graph polymers. Also suitable are blends of polysulfone resins and fluoropolymers. The inorganic polymers include, for example, organopolysiloxanes, fluoropolysiloxane, and fluorinated polyester modified polysiloxane polymers. The fluorocarbons include, for example, fluoroalkyl silanes, fluoroalkoxy silanes, fluoroalkyl alkyl silanes, and combinations thereof. Specific silanes include, for example, tridecafluoro-1,1,2,2-tetrahydrooctyl trichlorosilane, nonafluorohexyldimethyl-(dimethylamino)silane, heptadecafluorotetrahydrodecyldimethyl(dimethylamino)silane, tetrandyrodecyl-tris(dimethylamino)silane, tridecafluoro-1,1,2,2,-tetrahydrooctyl silane, (tridecafluoro-1,1,2,2-tetrahydooctyl)trimethoxysilane, (tridecafluoro-1,1,2,2-tetrahydooctyl)triethoxysilane, n-octadecyl trimethoxysilane, n-octyl triethoxysilane, and heptadecafluoro-1,1,2,2-tetrahedyodecyl-tris(dimethylamino)silane. Nanomaterials include, for example, colloidal silica, 60-nm SiO2 on NH3-terminated self-assembled monolayers, silica nanocrystals, silica nanowires, silica nanofibers, silica nanorods, silica nanotrees, colloidal silica mixed with n-hexane, silica nanofibers coated with an organic polymer, an inorganic polymer, fluoro and/or silyl compounds, e.g., PTFE, Tri-sil, tridecafluoro-1,1,2,2-tetrahydrooctyl-1-tricholorosilane, hexamethyldisilazane, aliphatic hydrocarbon containing molecules, aromatic hydrocarbon containing molecules, halogen containing molecules, and paralyene. Ceramics include, for example, patterned SiO2 /TiO2 surfaces treated with a fluoroalkylsilane, roughened silica, Si3TiO8, fumed silicon dioxide, silica aerogel, and glow discharged polymerized silicon. Other suitable ceramics include, for example, TiO2, MgAl2O4 spinels, diatomaceous earth, colloidal silver impregnated polymer matrices, carbonized lotus leaf, graphite on polytetrahaloethylene, ZnO and/or MgO deposited on polytetrahaloethylene, CVD deposited diamond, nano-laminas of boron nitride, hydrophobic zeolites, such as (SiO2)10+(Al2O3), and hydrophobic aerogels.
Any method of applying the hydrophobic compound to form the hydrophobic spill containment pattern may be used. For example, the hydrophobic compound can be applied using an application technique such as spraying; brushing; wiping; dipping; solvent casting; flow coating; curtain coating; roller coating; spin coating; printing; screen printing; ink jet printing; vacuum coating; magnetic field-assisted cathodic sputtering; plasma deposition; plasma magnetron deposition; chemical vapor deposition (“CVD”); plasma or atmospheric CVD; powder or liquid pyrolysis; atomization; electrophoretic deposition; cross-linking processes; and combinations thereof.
In various embodiments the hydrophobic pattern 18 can be formed by first roughening the portion of the top surface 10 to be made hydrophobic using various methods, and then applying a hydrophobic compound to the roughened surface. Suitable roughening methods include, for example, sanding, abrading, etching, such as acid etching, or otherwise removing material from the top surface 10.
Etching can be performed using, for example, hydrofluoric acid, sodium silicate, bifluorides, including for example, a ammonium bifluoride sodium bifluoride, and mixtures thereof, any other known etching solutions, and any mixtures thereof. Commercially available etching solutions are available, for example from Armour® Products (Hawthorne, N.J.). For examples, the Armour Etch Bath® Glass Dipping Solution (product name) or Armour Etch® Glass Etching Cream (product name), available from Armour® Products can be used, and includes a mixture of ammonium bifluoride and sodium bifluoride. The etching solution can be applied to the top surface 10 with an applicator in the desired pattern. A mask, which is resistant to the etching solution, can be placed on the region of the top surface 10 to be non-hydrophobic to protect this region from being etched. The etching solution can be allowed to remain on the top surface for a time in a range of about 15 seconds to about 20 minutes, about 20 seconds to about 15 minutes, about 30 seconds to about 10 minutes, about 45 seconds to about 8 minutes, about 1 minute to about 10 minutes, about 2 minutes to about 8 minutes, about 4 minutes to about 6 minutes, about 15 seconds to about 1 minute, about 20 seconds to about 50 seconds, about 25 seconds to about 45 seconds, about 30 seconds to about 40 seconds, about 1 minute to about 20 minutes, about 5 to about 15 minutes, or about 7 minutes to about 10 minutes. Other suitable times include, for example, about 15 seconds, 20 seconds, 25 seconds, 30 seconds, 35 seconds, 40 seconds, 45 seconds, 50 seconds, 55 seconds, 1 minute, 2 minutes, 3 minutes, 4 minutes, 5 minutes, 6 minutes, 7minutes, 8 minutes, 9 minutes, 10 minutes, 11 minutes, 12 minutes, 13 minutes, 14 minutes, 15 minutes, 16 minutes, 17 minutes, 18 minutes, 19 minutes, and 20 minutes.
The hydrophobic pattern 18 can also be formed, for example, by providing a coating of hydrophobic particles on the surface, by using sol-gel deposition, either on top of or within the matrix of the sol-gel, by applying a metal oxide primer with an integrated or separate hydrophobic compound, by applying a hydrophobic compound comprising a variety of molecular chain lengths to create a coating with surface irregularities, or by adhering a thin material to the surface, such as a tape of thin glass or plastic which has been made hydrophobic. The hydrophobic pattern 18 can be formed, for example, by applying a fit material, such as a ceramic or porcelain frit material, with or without structure forming particles therein, to the top surface 10 in the desired pattern arrangement, curing the frit, and then applying a hydrophobic compound over the cured fit and curing the hydrophobic compound. The frit can be a ceramic frit, a porcelain frit, or a combination thereof. In some embodiments, the frit layer can have a thermal insulating effect sufficient to prevent or reduce the amount of heat transfer that may occur between the top surface and the hydrophobic material applied thereto, thereby increasing the useful life of the hydrophobic pattern by reducing potential thermal degradation.
Any combination of the above-described surface treatment methods can be also be used. For example, the top surface 10 can be first prepared by applying and curing a frit material to the top surface 10. The frit material can then be etched using an etching solution as described above, and a hydrophobic compound can be applied to the etched fit. Alternatively, the entire top surface 10 including the frit material can be etched using an etching solution, and a hydrophobic compound can then be applied to the etched ceramic frit. Without intending to be bound by theory, it is believed that etching the frit prior to application of the hydrophobic compound can improve the hydrophobic properties of the hydrophobic pattern 18 by creating additional bonding sites on the frit to which the hydrophobic compound can bond. Additionally, the etched fit may include more surface area to which the hydrophobic compound can attached by virtue of the combined macro-scale surface roughening provided by the frit and micro-scale surface roughening provided by etching the frit.
The hydrophobic surface treatments described herein can be cured according to a number of different methods, if curing is required by the surface preparation or the hydrophobic compound, including without limitation: conduction heating; convection heating; UV radiation; VUV radiation; electron beam irradiation; ionizing radiation; laser; IR; and thermal radiation. The hydrophobic surface treatments can also be cured by remaining at ambient conditions for a sufficient length of time, for example, from about 16 hours to about 48 hours, from about 20 hours to about 40 hours, and from about 25 hours to about 35 hours. Curing can be performed in a controlled humidity environment. For example, curing can be performed at less than 70% humidity, less than 60% humidity, less than 50% humidity, less than 40% humidity, less than 30% humidity, less than 20% humidity, less than 10% humidity, or at 0% humidity.
In one embodiment, the cooking appliance assembly comprises a glass, a glass ceramic, or a tempered glass top surface 10 which is printed, e.g., screen printed, with a frit material, over which a hydrophobic coating can be applied if needed to impart hydrophobicity to the fit. The frit can be patterned on the top surface 10 using any known placing, printing, or other patterning methods. The frit material is placed or printed in a pattern, for example, a frame-like border pattern on the top surface 10, which defines at least a portion of the spill containment pattern. For example, the frit material can be screen printed onto the top surface 10 in the desired pattern using, for example, a silk screen having a mesh count in a range of about 80 to about 360, about 100 to about 300, about 120 to about 280, about 140 to about 240, about 160 to about 220, about 180 to about 200, about 86 to about 360. Other suitable mesh counts include about 80, 82, 84, 86, 88, 90, 92, 94, 96, 98, 100, 110, 120, 130, 140, 150, 160, 170, 180, 190, 200, 210, 220, 320, 240, 250, 260, 270, 280, 290, 300, 310, 320, 340, 350, and 360. Various other mesh counts may be suitable depending on the composition and particle size of the frit material used. As described in above, the hydrophobic pattern 18, and consequently, the fit pattern, can have a variety of shapes and sizes, and can be placed in a variety of locations on the glass top surface 10. Additionally, portions of the hydrophobic pattern 18 can be formed, for example, using different hydrophobic compounds and/or different surface treatments. For example, a portion of the hydrophobic pattern 18 can be formed, for example, by applying and curing a ceramic frit to the top surface 10 and applying a hydrophobic compound to the cured fit, and another portion of the hydrophobic spill containment pattern can be formed, for example, by acid etching a portion of the top surface 10 and applying the hydrophobic compound to the etched portion.
In accordance with various aspects of the invention, the frit material can include finely ground particles. For example, the ceramic frit material can include lead oxide, silicon dioxide, aluminum oxide, and mixtures thereof. Preferably, the frit material includes silicon dioxide. For example, the frit material includes from 5 weight percent (wt. %) to about 100 wt. % silicon dioxide, from about 10 wt. % to about 80 wt. %, from about 20 wt. % to about 60 wt. % from about 30 wt. % to about 40 wt. % from about 15 wt. % to about 75 wt. %, from about 20 wt. % to about 50 wt. %. Other suitable amounts of silicon dioxide in the fit material can include, for example, 5, 10, 15, 20, 25, 30, 35, 40, 45, 50, 55, 60, 65, 70, 75, 80, 85, 90, 95 and 100 wt. %. The ceramic frit material can include about 29 wt. % silicon dioxide. The ceramic frit material can also include, for example, additives, such as tantalum oxide, titanium dioxide, calcium oxide, zirconium oxide, sodium oxide, potassium oxides, iron oxide magnesium oxide, barium oxide, bismuth oxide, and mixtures thereof Suitable commercially available frit materials can be used. For example, a commercially available frit material is available from Ferro Corp. (hereinafter “the Ferro frit”) under Product No. A0430 Etch C32 Medium, and contains about 53.71 wt. % lead oxide, about 29 wt. % silicon dioxide, 15.72 wt. % aluminum oxide, 0.39 wt. % tantalum oxide, 0.38 wt. % titanium dioxide, 0.28 wt. % calcium oxide, 0.26 wt. % zirconium oxide, 0.11 wt. % sodium oxide, 0.04 wt. % potassium oxide, 0.04 wt. % iron oxide, 0.03 wt. % magnesium oxide, 0.02 wt. % barium oxide, and 0.02 wt. % bismuth oxide. Another suitable a commercially available frit material is available from Ferro Corp. (hereinafter “the Ferro frit”) under Product No. GAL-41727, and contains about 36.25 wt. % lead oxide, about 33.82 wt. % silicon dioxide, 4.31 wt. % aluminum oxide, 19.74 wt. % zinc oxide, 5.50 wt. % titanium dioxide, 0.13 wt. % potassium oxide, 0.08 wt. % iron oxide, 0.07 wt. % zirconium oxide, 0.04 wt. % niobium oxide, 0.02 wt. % calcium oxide, 0.02 wt. % magnesium oxide, 0.01 wt. % cobalt oxide, and 0.01 wt. % nickel oxide.
The particles of the frit material may be mixed with inorganic or organic pigments or dyes, so as to yield a desired color. The frit material may be provided as a dry powder or as a paste or other such mixture. Once the frit material is placed on the top surface 10, the frit is then coupled to the top surface 10. For example, the frit can be coupled to the top surface 10 by fusing the frit to the top surface 10. The frit can be coupled or fused to top surface 10 by heating the top surface 10 to a temperature in a range of about 1000° F. to about 1400° F., about 1100° F. to about 1300° F., about 1100° F. to about 1200° F., and about 1200° F. to about 1400° F. Other suitable temperatures include about 1000° F., 1050° F., 1100° F., 115020 F., 1200° F., 1250° F., 1300° F., 1350° F., and 1400° F. This heat treatment will cause the particles of the frit to cure by fusing to each other and to the glass surface to form a continuous structure and thereby couple the frit to the top surface 10. The pattern of the fused frit will be substantially identical to the pattern in which the frit material was placed on the top surface 10. It is believed that this fused frit coating can be characterized as being nearly as hard and tough as the glass itself.
In one embodiment, the frit can include some micro-scale additive particles which will remain unmelted at the temperature at which the frit is sintered, as described for example in U.S. Pat. Nos. 4,591,530, 6,872,441, 6,800,354, 5,324,566, and 5,437,894, the disclosures of which are incorporated herein by reference in their entirety. The frit is printed or placed in the pattern of a frame-like border at or near the outer perimeter of the cooking appliance surface or other desired location for the spill containment pattern. The surface with the printed frit is then heated to a temperature above the melting point of the primary components of the frit material, but below the melting point of the material of the cooking appliance surface, for a time sufficient to cure the frit so that it is fused or bonded to the surface. The specific time and temperature required to sinter the frit will vary based on the materials chosen for the frit.
The hydrophobic compound can be applied to the fit material as a hydrophobic solution, which includes a solvent and the hydrophobic compound dissolved or dispersed in the solvent. The solvent can be, for example, dry or wet hexane. Suitable solvents include, for example, hexane, heptanes, methyl chloride, naptha, toluene, acetone, perfluorocarbons, and mixtures thereof. The hydrophobic solution can include from about 0.1% to about 5% of hydrophobic compound. Other suitable ranges include, for example, about 0.5% to 4%, about 1% to about 3%, about 1% to about 5%, and about 2% to about 4%. Suitable amounts of the hydrophobic compound in the hydrophobic solution, can include, for example, about 0.1, 0.2, 0.3, 0.4, 0.5, 0.6, 0.7, 0.8, 0.9, 1, 1.5, 2, 2.5, 3, 3.5, 4, 4.5, and 5%. For example, a 1% solution of tridecafluoro-1,1,2,2-tetrahydrooctyl trichlorosilane, a perfluoroalkyl alkyl silane, in hexane, can be applied, for example by wiping the solution onto the cooking appliance surface or a frit or other surface pretreatment, or applying the solution using an applicator tip, or by using any other known method. The hydrophobic compound can be applied to the solution using, for example, a one pass method in which a coated applicator is swept across the region designed as the spill containment pattern a single time or a multiple pass method in which the applicator is passed over the frit border two or more times.
The hydrophobic solution is then cured by heating it and/or exposing it to controlled humidity for a period of time. For example, conductive heating, convention heating, thermal radiation, UV radiation, VUV radiation, electron beam irradiation, ionizing radiation, laser, IR can be used to cure the hydrophobic solution. The hydrophobic solution can be cured, for example, at a temperature in a range of about 100° F. to about 600° F., about 150° F. to about 550° F., about 200° F. to about 500° F., about 250° F. to about 450° F., about 300° F. to about 350° F., or about 100° F. to about 300° F. Other suitable temperatures include, for example, about 100° F., 150° F., 200° F., 250° F., 300° F., 350° F., 400° F., 450° F., 500° F., 550° F., and 600° F. The hydrophobic solution can be cured, for example, by heating for a time in a range of about 2 seconds to about 1 hour, about 2 seconds to about 1 minute, about 4 seconds to about 50 seconds, about 6 seconds to about 40 seconds, about 8 seconds to about 30 seconds, about 10 seconds to about 20 seconds, about 2 seconds to about 5 seconds, about 25 seconds to about 1 minutes, about 5 minutes to about 1 hour, about 10 minutes to about 45 minutes, about 20 minutes to about 30 minutes, about 10 minutes to about 20 minutes, and about 15 minutes to about 30 minutes. Other suitable times include, for example, about 2 seconds, 4 seconds, 6 seconds, 8 seconds, 10 seconds, 15 seconds, 20 seconds, 25 seconds, 30 seconds, 35 seconds, 40 seconds, 50 seconds, 55 seconds, 60 seconds, 5 minutes, 10 minutes, 15 minutes, 20 minutes, 25 minutes, 30 minutes, 35 minutes, 40 minutes, 45 minutes, 50 minutes, 55 minutes, and 60 minutes.
Alternatively, the hydrophobic solution can be cured without heating. Heating, however, can accelerate the curing process. For example, the hydrophobic solution can be allowed to cure by leaving the glass top surface 10 having the cured ceramic frit coated with the hydrophobic solution in ambient conditions for a time in a range of about 16 to about 48 hours, about 20 to about 40 hours, about 25 to about 35 hours, about 16 to about 24 hours, or about 20 hours to about 30 hours. The hydrophobic solution can be cured, whether at elevated temperatures or at ambient temperature, in relatively dry environment. For example, the hydrophobic solution can be cured in an environment having less than 70% humidity, less than 60% humidity, less than 50% humidity, less than 40% humidity, less than 30% humidity, less than 20% humidity, less than 10% humidity, or at 0% humidity. Upon curing, the hydrophobic compound preferably forms a continuous hydrophobic layer on the fused frit or other surface treatment.
Without intending to be bound by theory, it is believed that in the case of a fluorosilane, bonding is achieved between surface Si—OH contained on and extending from the surface of the fused frit material or other modified top surface 10 surface, such as, for example, an acid etched surface, and the Si—OH groups of the silane. The surface hydroxyl groups can results from partial hydrolysis of the silane and the silicon dioxide in the fused frit material during heating. The Si—OH groups are caused to react with corresponding groups to form Si—O—Si linkages between the silane and the fused frit material. Correspondingly, Si—OH groups of adjacent silane molecules are also caused to react and form Si—O—Si cross linkages, thereby forming a continuous hydrophobic layer across the frit material. The method described herein will produce a hydrophobic surface that is a continuous border around the perimeter of the top surface 10 which will operate as a spill containment feature. The bonding of other hydrophobic materials to the modified top surface 10 can occur through chemical or physical adhesions mechanisms. It is believed that silane nanomaterials bind to the surface through an analogous binding mechanism as described for the binding of fluorosilanes, above. Other nanomaterials may bind through similar chemical adhesion mechanisms, through molecular rearrangement, or through interpenetration with the top surface 10. Electrodeposition, chemical vapor deposition, electrophoretic deposition, sputtering, and other physiochemical deposition methods yield materials bound to the top surface 10 through physiochemical and electrochemical bonds that are dependant on the chemical formulation of the deposited hydrophobic material.
One advantage of using a ceramic frit material to prepare the top surface 10 for coating with the hydrophobic solution as described herein, in addition to improving the durability of the hydrophobic surface, is that frit material is commercially available in multiple colors and can be printed in a manner which allows for the inclusion of designs, company names or logos in the surface area where the frit material is applied to the top surface 10.
Preferably, the hydrophobic pattern 18 is durable, and resists chipping, peeling, fading, and scratching. Advantageously, the hydrophobic pattern 18 can be designed to be resistant to abrasions from common household containers, such as, for example, pots, pans, cooking utensils, and other such cooking containers, as well as glass jars and other food containers. In addition, the hydrophobic pattern 18 can be designed to be resistant to most chemicals, such as for example, dish soap, Windex, Sparkle, Clorox wipes, and Formula 409 All Purpose Cleaner. The hydrophobic pattern 18 can resist multiple cleanings without experiencing a decrease in the spill containment pattern's ability to retain a spill.
It will be apparent to those skilled in the pertinent arts that other embodiments of cooking appliance and cooking appliance surfaces in accordance with the disclosure may be designed. That is, the principles of cooking appliance surfaces in accordance with the disclosure are not limited to the specific embodiments described herein. For example, cooking appliance surface having a spill containment pattern could be used in various settings, such as toaster ovens, indoor grilling appliances, or the like.
Further, it will be apparent to those skilled in the pertinent art that any method which may be used for creating a hydrophobic pattern in substantially the same plane as the top surface of the cooking appliance surface is within the scope of the disclosure described herein, even if such method requires the use of multiple pieces to manufacture the cooking appliance surface. For example, a frame of hydrophobic material may be bonded to the top surface of the cooking appliance surface such that it forms a continuous border which is generally in the same plane as the top surface. Accordingly, it will be apparent to those skilled in the art that modifications and other variations of the above-described illustrative embodiments of the disclosure may be effected without departing from the spirit and scope of the novel concepts of the invention.
Filing Document | Filing Date | Country | Kind | 371c Date |
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PCT/US2010/054936 | 11/1/2010 | WO | 00 | 4/30/2012 |
Publishing Document | Publishing Date | Country | Kind |
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WO2011/056742 | 5/12/2011 | WO | A |
Number | Name | Date | Kind |
---|---|---|---|
392061 | Peckham | Oct 1888 | A |
870439 | Kade | Nov 1907 | A |
2191701 | Wood | Feb 1940 | A |
2976386 | Salton | Mar 1961 | A |
3185426 | Bjerke | May 1965 | A |
3354022 | Dettre et al. | Nov 1967 | A |
3579540 | Ohlhausen | May 1971 | A |
3673292 | Kock | Jun 1972 | A |
3716502 | Loew | Feb 1973 | A |
3931428 | Reick | Jan 1976 | A |
3963349 | Albright et al. | Jun 1976 | A |
3967030 | Johnson et al. | Jun 1976 | A |
3975197 | Mikelsons | Aug 1976 | A |
3976572 | Reick | Aug 1976 | A |
3980153 | Andrews | Sep 1976 | A |
4120798 | Mischutin | Oct 1978 | A |
4142724 | Reick | Mar 1979 | A |
4151327 | Lawton | Apr 1979 | A |
4184936 | Paul et al. | Jan 1980 | A |
4199142 | Reick | Apr 1980 | A |
4301197 | Franz et al. | Nov 1981 | A |
4301213 | Davies | Nov 1981 | A |
4311755 | Rummel | Jan 1982 | A |
4345465 | Gruner et al. | Aug 1982 | A |
4415405 | Ruddle et al. | Nov 1983 | A |
4442324 | Blanchard et al. | Apr 1984 | A |
4451619 | Heilmann et al. | May 1984 | A |
4452834 | Nachtkamp et al. | Jun 1984 | A |
4453533 | Scheidler et al. | Jun 1984 | A |
4483784 | Temple | Nov 1984 | A |
4492217 | Scheidler | Jan 1985 | A |
4493917 | Bailleux et al. | Jan 1985 | A |
4495238 | Adiletta | Jan 1985 | A |
4520073 | Randolph et al. | May 1985 | A |
4581149 | Horodysky et al. | Apr 1986 | A |
4591530 | Lui | May 1986 | A |
4594311 | Frisch et al. | Jun 1986 | A |
4614464 | Christensen | Sep 1986 | A |
4624900 | Fau | Nov 1986 | A |
4646948 | Jennings | Mar 1987 | A |
4680173 | Burger | Jul 1987 | A |
4687707 | Matsuo et al. | Aug 1987 | A |
4717810 | Schreder | Jan 1988 | A |
4728578 | Higgins et al. | Mar 1988 | A |
4733843 | Bessinger | Mar 1988 | A |
4738426 | Bessinger | Apr 1988 | A |
D295950 | Johnston | May 1988 | S |
4749110 | Maeno et al. | Jun 1988 | A |
4753977 | Merrill | Jun 1988 | A |
4782112 | Kondo et al. | Nov 1988 | A |
4835014 | Roth et al. | May 1989 | A |
4835217 | Jorgensen et al. | May 1989 | A |
4855176 | Ohwaki et al. | Aug 1989 | A |
4870907 | McKee | Oct 1989 | A |
4923260 | Poulsen | May 1990 | A |
4954611 | Chen, Sr. et al. | Sep 1990 | A |
4963647 | Vora et al. | Oct 1990 | A |
4971912 | Buhl et al. | Nov 1990 | A |
4983459 | Franz et al. | Jan 1991 | A |
4987049 | Komamura et al. | Jan 1991 | A |
5009652 | Morgan et al. | Apr 1991 | A |
5011727 | Kido et al. | Apr 1991 | A |
5011963 | Ogawa et al. | Apr 1991 | A |
5030507 | Mudge et al. | Jul 1991 | A |
5032641 | Nanishi et al. | Jul 1991 | A |
5041304 | Kusano et al. | Aug 1991 | A |
5057050 | Hill | Oct 1991 | A |
5084191 | Nagase et al. | Jan 1992 | A |
5110655 | Engler et al. | May 1992 | A |
5121134 | Albinson et al. | Jun 1992 | A |
5156611 | Haynes et al. | Oct 1992 | A |
5202361 | Zimmerman et al. | Apr 1993 | A |
5203696 | Gonser | Apr 1993 | A |
5225274 | Ogawa et al. | Jul 1993 | A |
5228764 | Cherry et al. | Jul 1993 | A |
5228905 | Grunewalder et al. | Jul 1993 | A |
5238746 | Soga et al. | Aug 1993 | A |
5240774 | Ogawa et al. | Aug 1993 | A |
5244726 | Laney et al. | Sep 1993 | A |
5246762 | Nakamura | Sep 1993 | A |
5273354 | Herrmann et al. | Dec 1993 | A |
5274159 | Pellerite et al. | Dec 1993 | A |
5284707 | Ogawa et al. | Feb 1994 | A |
5294252 | Gun | Mar 1994 | A |
5300239 | Ozaki et al. | Apr 1994 | A |
5308705 | Franz et al. | May 1994 | A |
5316799 | Brunken et al. | May 1994 | A |
5317129 | Taplan et al. | May 1994 | A |
5324566 | Ogawa et al. | Jun 1994 | A |
5324877 | West et al. | Jun 1994 | A |
5328768 | Goodwin | Jul 1994 | A |
5338345 | Scarborough et al. | Aug 1994 | A |
5348547 | Payne et al. | Sep 1994 | A |
5352733 | Hart | Oct 1994 | A |
5362145 | Bird et al. | Nov 1994 | A |
5364299 | Hill et al. | Nov 1994 | A |
5366810 | Merrifield et al. | Nov 1994 | A |
5368892 | Berquier | Nov 1994 | A |
5372888 | Ogawa et al. | Dec 1994 | A |
5380585 | Ogawa et al. | Jan 1995 | A |
5382558 | Inagaki et al. | Jan 1995 | A |
5385966 | Hermansen et al. | Jan 1995 | A |
5395657 | Strepparola et al. | Mar 1995 | A |
5424130 | Nakanishi et al. | Jun 1995 | A |
5429433 | Bird et al. | Jul 1995 | A |
5435839 | Ogawa | Jul 1995 | A |
5437894 | Ogawa et al. | Aug 1995 | A |
5437900 | Kuzowski | Aug 1995 | A |
5441338 | Kane et al. | Aug 1995 | A |
5458976 | Horino et al. | Oct 1995 | A |
5464492 | Gregory et al. | Nov 1995 | A |
5466770 | Audenaert et al. | Nov 1995 | A |
5489328 | Ono et al. | Feb 1996 | A |
5500216 | Julian et al. | Mar 1996 | A |
5540493 | Kane et al. | Jul 1996 | A |
5556667 | Teranishi et al. | Sep 1996 | A |
5558940 | Michels et al. | Sep 1996 | A |
5564809 | Kane et al. | Oct 1996 | A |
5576096 | Ono et al. | Nov 1996 | A |
5577817 | Reynolds | Nov 1996 | A |
5578361 | Tsujioka et al. | Nov 1996 | A |
5584957 | Schultheis et al. | Dec 1996 | A |
5585896 | Yamazaki et al. | Dec 1996 | A |
5590861 | Ardolino | Jan 1997 | A |
5599893 | Asai et al. | Feb 1997 | A |
5612130 | Smirnov et al. | Mar 1997 | A |
5612433 | Ono et al. | Mar 1997 | A |
5618627 | Merrifield et al. | Apr 1997 | A |
5636256 | Matumura et al. | Jun 1997 | A |
5651921 | Kaijou | Jul 1997 | A |
5656759 | Ito et al. | Aug 1997 | A |
5674967 | Goodwin | Oct 1997 | A |
5679460 | Schakenraad et al. | Oct 1997 | A |
5688864 | Goodwin | Nov 1997 | A |
5697991 | Frazer | Dec 1997 | A |
5703147 | Martin et al. | Dec 1997 | A |
5707740 | Goodwin | Jan 1998 | A |
5725789 | Huber et al. | Mar 1998 | A |
5735589 | Herrmann et al. | Apr 1998 | A |
5747561 | Smirnov et al. | May 1998 | A |
5753734 | Maruyama | May 1998 | A |
5798144 | Varanasi et al. | Aug 1998 | A |
5800785 | Bochner | Sep 1998 | A |
5800918 | Chartier et al. | Sep 1998 | A |
5813741 | Fish et al. | Sep 1998 | A |
5814411 | Merrifield et al. | Sep 1998 | A |
5824421 | Kobayashi et al. | Oct 1998 | A |
5830529 | Ross | Nov 1998 | A |
5834600 | Hida et al. | Nov 1998 | A |
5840201 | Elledge | Nov 1998 | A |
5843338 | Inoue et al. | Dec 1998 | A |
5853690 | Hibino et al. | Dec 1998 | A |
5853800 | Dombrowski et al. | Dec 1998 | A |
5856378 | Ring et al. | Jan 1999 | A |
5858551 | Salsman | Jan 1999 | A |
5876806 | Ogawa | Mar 1999 | A |
5890907 | Minasian | Apr 1999 | A |
5910557 | Audenaert et al. | Jun 1999 | A |
5921411 | Merl | Jul 1999 | A |
5924359 | Watanabe | Jul 1999 | A |
5945482 | Fukuchi et al. | Aug 1999 | A |
5947574 | Avendano | Sep 1999 | A |
5948685 | Angros | Sep 1999 | A |
5952053 | Colby | Sep 1999 | A |
5958601 | Salsman | Sep 1999 | A |
5980990 | Goodwin | Nov 1999 | A |
5989757 | Satoi | Nov 1999 | A |
6013724 | Mizutani et al. | Jan 2000 | A |
6017609 | Akamatsu et al. | Jan 2000 | A |
6017831 | Beardsley et al. | Jan 2000 | A |
6017997 | Snow et al. | Jan 2000 | A |
6024948 | Samain et al. | Feb 2000 | A |
6025025 | Bartrug et al. | Feb 2000 | A |
6033738 | Teranishi et al. | Mar 2000 | A |
6045650 | Mitchnick et al. | Apr 2000 | A |
6068911 | Shouji et al. | May 2000 | A |
6090447 | Suzuki et al. | Jul 2000 | A |
6093559 | Bookbinder et al. | Jul 2000 | A |
6096380 | Takebe et al. | Aug 2000 | A |
6105233 | Neal | Aug 2000 | A |
6114446 | Narisawa et al. | Sep 2000 | A |
6117555 | Fujimori et al. | Sep 2000 | A |
6119626 | Miyazawa et al. | Sep 2000 | A |
6120720 | Meier et al. | Sep 2000 | A |
6136210 | Biegelsen et al. | Oct 2000 | A |
6149978 | Bladel et al. | Nov 2000 | A |
6153304 | Smith et al. | Nov 2000 | A |
6155677 | Kitani et al. | Dec 2000 | A |
6187143 | Juppo et al. | Feb 2001 | B1 |
6191122 | Lux et al. | Feb 2001 | B1 |
6197438 | Faulkner | Mar 2001 | B1 |
6201058 | Mahr et al. | Mar 2001 | B1 |
6207236 | Araki et al. | Mar 2001 | B1 |
6221434 | Visca et al. | Apr 2001 | B1 |
6224974 | Wuu | May 2001 | B1 |
6228435 | Yoshikawa et al. | May 2001 | B1 |
6228972 | Hikita et al. | May 2001 | B1 |
6235383 | Hong et al. | May 2001 | B1 |
6235833 | Akamatsu et al. | May 2001 | B1 |
6245387 | Hayden | Jun 2001 | B1 |
6264751 | Kamura et al. | Jul 2001 | B1 |
6280834 | Veerasamy et al. | Aug 2001 | B1 |
6290803 | Maksymkiw et al. | Sep 2001 | B1 |
6291054 | Thomas et al. | Sep 2001 | B1 |
6296685 | Cammann et al. | Oct 2001 | B1 |
6308728 | Frazier | Oct 2001 | B1 |
6333074 | Ogawa et al. | Dec 2001 | B1 |
6333558 | Hasegawa | Dec 2001 | B1 |
6337133 | Akamatsu et al. | Jan 2002 | B1 |
6340502 | Azzopardi et al. | Jan 2002 | B1 |
6342268 | Samain | Jan 2002 | B1 |
6352758 | Huang et al. | Mar 2002 | B1 |
6358569 | Badyal et al. | Mar 2002 | B1 |
6361868 | Bier et al. | Mar 2002 | B1 |
6371034 | Simpson et al. | Apr 2002 | B1 |
6372290 | Berkenkoetter et al. | Apr 2002 | B1 |
6372507 | Angros | Apr 2002 | B1 |
6376592 | Shimada et al. | Apr 2002 | B1 |
6379751 | Schafer et al. | Apr 2002 | B1 |
6383642 | Le Bellac et al. | May 2002 | B1 |
6403397 | Katz | Jun 2002 | B1 |
6419985 | Ishizuka | Jul 2002 | B1 |
6422673 | Bienick | Jul 2002 | B1 |
6423372 | Genzer et al. | Jul 2002 | B1 |
6447897 | Liang et al. | Sep 2002 | B1 |
6451432 | Azzopardi et al. | Sep 2002 | B1 |
6458420 | Akamatsu et al. | Oct 2002 | B1 |
6461537 | Turcotte et al. | Oct 2002 | B1 |
6461670 | Akamatsu et al. | Oct 2002 | B2 |
6462115 | Takahashi et al. | Oct 2002 | B1 |
6471761 | Fan et al. | Oct 2002 | B2 |
6476095 | Simendinger, III | Nov 2002 | B2 |
6479612 | Del Pesco et al. | Nov 2002 | B1 |
6482524 | Yamamoto et al. | Nov 2002 | B1 |
6488347 | Bienick | Dec 2002 | B1 |
6555384 | Angros | Apr 2003 | B1 |
6564935 | Yamamoto et al. | May 2003 | B1 |
6579620 | Mizuno et al. | Jun 2003 | B2 |
6582825 | Amarasekera et al. | Jun 2003 | B2 |
6584744 | Schultheis et al. | Jul 2003 | B1 |
6589641 | Stirniman et al. | Jul 2003 | B1 |
6596060 | Michaud | Jul 2003 | B1 |
6610363 | Arora et al. | Aug 2003 | B2 |
6613860 | Dams et al. | Sep 2003 | B1 |
6623863 | Kamitani et al. | Sep 2003 | B2 |
6641654 | Akamatsu et al. | Nov 2003 | B2 |
6649222 | D'Agostino et al. | Nov 2003 | B1 |
6652640 | Asai et al. | Nov 2003 | B2 |
6660339 | Datta et al. | Dec 2003 | B1 |
6660363 | Barthlott | Dec 2003 | B1 |
6660686 | Inagaki et al. | Dec 2003 | B2 |
6679573 | Bienick | Jan 2004 | B2 |
6683126 | Keller et al. | Jan 2004 | B2 |
6685992 | Ogawa et al. | Feb 2004 | B1 |
6689200 | Scarborough et al. | Feb 2004 | B2 |
6692565 | Johansen, Jr. et al. | Feb 2004 | B2 |
6706798 | Kobayashi et al. | Mar 2004 | B2 |
6713304 | Angros | Mar 2004 | B2 |
6720371 | Furuta et al. | Apr 2004 | B2 |
6729704 | Ames | May 2004 | B2 |
6743467 | Jones et al. | Jun 2004 | B1 |
6767984 | Toui et al. | Jul 2004 | B2 |
6770323 | Genzer et al. | Aug 2004 | B2 |
6780497 | Walter | Aug 2004 | B1 |
6786562 | Obrock et al. | Sep 2004 | B2 |
6793821 | Lee et al. | Sep 2004 | B2 |
6800354 | Baumann et al. | Oct 2004 | B2 |
6806299 | Baumann et al. | Oct 2004 | B2 |
6808835 | Green et al. | Oct 2004 | B2 |
6811045 | Masker et al. | Nov 2004 | B1 |
6811716 | Stengard et al. | Nov 2004 | B1 |
6811844 | Trouilhet | Nov 2004 | B2 |
6818451 | Angros | Nov 2004 | B2 |
6845788 | Extrand | Jan 2005 | B2 |
6852390 | Extrand | Feb 2005 | B2 |
6855375 | Nakagawa et al. | Feb 2005 | B2 |
6855759 | Kudo et al. | Feb 2005 | B2 |
6858284 | Nun et al. | Feb 2005 | B2 |
6871923 | Dietz et al. | Mar 2005 | B2 |
6872441 | Baumann et al. | Mar 2005 | B2 |
6890360 | Cole et al. | May 2005 | B2 |
6921506 | Mitchell et al. | Jul 2005 | B1 |
6923216 | Extrand et al. | Aug 2005 | B2 |
6926946 | Ogawa et al. | Aug 2005 | B2 |
6931888 | Shekunov et al. | Aug 2005 | B2 |
6938774 | Extrand | Sep 2005 | B2 |
6942746 | Niejelow et al. | Sep 2005 | B2 |
6956080 | Scholz et al. | Oct 2005 | B2 |
6966990 | Chattopadhyay et al. | Nov 2005 | B2 |
6976585 | Extrand | Dec 2005 | B2 |
6976998 | Rizzo et al. | Dec 2005 | B2 |
6982242 | Liss et al. | Jan 2006 | B2 |
6994045 | Paszkowski | Feb 2006 | B2 |
6998051 | Chattopadhyay et al. | Feb 2006 | B2 |
7019069 | Kobayashi et al. | Mar 2006 | B2 |
7022416 | Teranishi | Apr 2006 | B2 |
7026018 | Kranovich | Apr 2006 | B2 |
7037591 | Henze et al. | May 2006 | B2 |
7048889 | Arney et al. | May 2006 | B2 |
7052244 | Fouillet et al. | May 2006 | B2 |
7056409 | Dubrow | Jun 2006 | B2 |
7057832 | Wu et al. | Jun 2006 | B2 |
7057881 | Chow et al. | Jun 2006 | B2 |
7074273 | Shimomura et al. | Jul 2006 | B2 |
7074294 | Dubrow | Jul 2006 | B2 |
7083748 | Chattopadhyay et al. | Aug 2006 | B2 |
7083828 | Muller et al. | Aug 2006 | B2 |
7108833 | Samsoondar | Sep 2006 | B2 |
7109256 | Amano et al. | Sep 2006 | B2 |
7112369 | Wang et al. | Sep 2006 | B2 |
7148181 | Tanaka et al. | Dec 2006 | B2 |
7150904 | D'Urso et al. | Dec 2006 | B2 |
7153357 | Baumgart et al. | Dec 2006 | B2 |
7157018 | Scheidler | Jan 2007 | B2 |
7166235 | Majeti et al. | Jan 2007 | B2 |
7175723 | Jones et al. | Feb 2007 | B2 |
7179758 | Chakrapani et al. | Feb 2007 | B2 |
7179864 | Wang | Feb 2007 | B2 |
7188917 | Bienick | Mar 2007 | B2 |
7198855 | Liebmann-Vinson et al. | Apr 2007 | B2 |
7204298 | Hodes et al. | Apr 2007 | B2 |
7211223 | Fouillet et al. | May 2007 | B2 |
7211313 | Nun et al. | May 2007 | B2 |
7211329 | Metz et al. | May 2007 | B2 |
7211605 | Coronado et al. | May 2007 | B2 |
7213309 | Wang et al. | May 2007 | B2 |
D547640 | Remmers | Jul 2007 | S |
7238751 | Wang et al. | Jul 2007 | B2 |
7253130 | Chiang et al. | Aug 2007 | B2 |
7258731 | D'Urso et al. | Aug 2007 | B2 |
7261768 | Luten et al. | Aug 2007 | B2 |
7264845 | Papadaki et al. | Sep 2007 | B2 |
7265468 | Manel et al. | Sep 2007 | B1 |
7273658 | Benayoun et al. | Sep 2007 | B2 |
7285331 | Reihs et al. | Oct 2007 | B1 |
7288311 | Kawashima et al. | Oct 2007 | B2 |
7291653 | Baumann et al. | Nov 2007 | B2 |
7306304 | Jang | Dec 2007 | B2 |
7306895 | Kano et al. | Dec 2007 | B2 |
7309278 | Shibata | Dec 2007 | B2 |
7312057 | Bookbinder et al. | Dec 2007 | B2 |
7323033 | Kroupenkine et al. | Jan 2008 | B2 |
7338835 | Bao | Mar 2008 | B2 |
7342551 | King | Mar 2008 | B2 |
7344619 | Helmeke | Mar 2008 | B2 |
7344758 | Franchina et al. | Mar 2008 | B2 |
7344783 | Shea | Mar 2008 | B2 |
7354328 | Lee | Apr 2008 | B2 |
7354624 | Millero et al. | Apr 2008 | B2 |
7354650 | Nakajima et al. | Apr 2008 | B2 |
D568344 | Baacke et al. | May 2008 | S |
7368510 | Lee et al. | May 2008 | B2 |
7388211 | Chao et al. | Jun 2008 | B2 |
7393515 | Hoshino et al. | Jul 2008 | B2 |
7396395 | Chen et al. | Jul 2008 | B1 |
7419615 | Strauss | Sep 2008 | B2 |
7449233 | Arora | Nov 2008 | B2 |
7459197 | Aizenberg et al. | Dec 2008 | B2 |
7468333 | Kimbrell, Jr. et al. | Dec 2008 | B2 |
7478785 | Herron, III et al. | Jan 2009 | B2 |
7485343 | Branson et al. | Feb 2009 | B1 |
7524531 | Axtell, III et al. | Apr 2009 | B2 |
7527832 | Sakoske et al. | May 2009 | B2 |
7544411 | Baumann et al. | Jun 2009 | B2 |
D596931 | Fernandez | Jul 2009 | S |
D596932 | Kleinsasser | Jul 2009 | S |
7563505 | Reihs | Jul 2009 | B2 |
7568583 | Wing et al. | Aug 2009 | B2 |
7572855 | Fudemoto et al. | Aug 2009 | B2 |
7582214 | Brook et al. | Sep 2009 | B2 |
7607744 | Casoli et al. | Oct 2009 | B2 |
D607020 | Baacke et al. | Dec 2009 | S |
D612404 | Picken et al. | Mar 2010 | S |
D612405 | Eicher | Mar 2010 | S |
D613316 | Schmidt | Apr 2010 | S |
7726615 | Rutz | Jun 2010 | B2 |
7731316 | Wing | Jun 2010 | B2 |
7748806 | Egan | Jul 2010 | B2 |
7919180 | Furukawa | Apr 2011 | B2 |
7943234 | Lawin et al. | May 2011 | B2 |
7989619 | Guire et al. | Aug 2011 | B2 |
8071219 | Berrux et al. | Dec 2011 | B2 |
8192994 | Angros | Jun 2012 | B2 |
8262177 | Picken et al. | Sep 2012 | B2 |
8286561 | Driver et al. | Oct 2012 | B2 |
8287062 | Nash et al. | Oct 2012 | B2 |
8372496 | Le Bris et al. | Feb 2013 | B2 |
20010018130 | Hayden | Aug 2001 | A1 |
20010019773 | Akamatsu et al. | Sep 2001 | A1 |
20010024728 | Kamitani et al. | Sep 2001 | A1 |
20010024805 | Williams et al. | Sep 2001 | A1 |
20010030808 | Komatsu et al. | Oct 2001 | A1 |
20010055677 | Wuu | Dec 2001 | A1 |
20020001676 | Hayden | Jan 2002 | A1 |
20020034627 | Jacquiod et al. | Mar 2002 | A1 |
20020045007 | Arora et al. | Apr 2002 | A1 |
20020077412 | Kobayashi et al. | Jun 2002 | A1 |
20020111402 | Mizuno et al. | Aug 2002 | A1 |
20020119595 | Kim et al. | Aug 2002 | A1 |
20020177655 | Pratt et al. | Nov 2002 | A1 |
20020192472 | Metz et al. | Dec 2002 | A1 |
20020197490 | Amidaiji et al. | Dec 2002 | A1 |
20030021902 | Yamamoto et al. | Jan 2003 | A1 |
20030026972 | Reihs | Feb 2003 | A1 |
20030040243 | Ward | Feb 2003 | A1 |
20030040568 | Furuta et al. | Feb 2003 | A1 |
20030068481 | Kody et al. | Apr 2003 | A1 |
20030070677 | Handique et al. | Apr 2003 | A1 |
20030072723 | Gers-Barlag et al. | Apr 2003 | A1 |
20030073067 | Bookfinder et al. | Apr 2003 | A1 |
20030077533 | Murota et al. | Apr 2003 | A1 |
20030091809 | Scarborough et al. | May 2003 | A1 |
20030110976 | Abidh et al. | Jun 2003 | A1 |
20030117051 | Kweon | Jun 2003 | A1 |
20030119684 | Tsao | Jun 2003 | A1 |
20030125656 | Davankov et al. | Jul 2003 | A1 |
20030143339 | Kobayashi | Jul 2003 | A1 |
20030149218 | Cote′ et al. | Aug 2003 | A1 |
20030162903 | Day | Aug 2003 | A1 |
20030166840 | Urry et al. | Sep 2003 | A1 |
20030170401 | Shimomura et al. | Sep 2003 | A1 |
20030176572 | Maekawa et al. | Sep 2003 | A1 |
20030179494 | Kaneko | Sep 2003 | A1 |
20040005469 | Metz et al. | Jan 2004 | A1 |
20040025747 | Kamitani et al. | Feb 2004 | A1 |
20040050297 | Kobayashi et al. | Mar 2004 | A1 |
20040053058 | Kamitani et al. | Mar 2004 | A1 |
20040056575 | Dietz et al. | Mar 2004 | A1 |
20040077738 | Field et al. | Apr 2004 | A1 |
20040097616 | Hoppler et al. | May 2004 | A1 |
20040102124 | Suzuki | May 2004 | A1 |
20040121168 | Goodwin et al. | Jun 2004 | A1 |
20040137814 | Kimbrell et al. | Jul 2004 | A1 |
20040138083 | Kimbrell et al. | Jul 2004 | A1 |
20040142557 | Levy et al. | Jul 2004 | A1 |
20040142572 | Deveau et al. | Jul 2004 | A1 |
20040154106 | Oles et al. | Aug 2004 | A1 |
20040179973 | Angros | Sep 2004 | A1 |
20040201048 | Seki et al. | Oct 2004 | A1 |
20040209072 | Henze et al. | Oct 2004 | A1 |
20040209203 | Kano et al. | Oct 2004 | A1 |
20040213904 | Muller et al. | Oct 2004 | A1 |
20040216227 | Papadaki et al. | Nov 2004 | A1 |
20040245146 | Kulp et al. | Dec 2004 | A1 |
20040247819 | Khieu et al. | Dec 2004 | A1 |
20050000463 | Mochizuki | Jan 2005 | A1 |
20050004264 | Tanabe | Jan 2005 | A1 |
20050008859 | Forgacs | Jan 2005 | A1 |
20050009953 | Shea | Jan 2005 | A1 |
20050016828 | Bednarek et al. | Jan 2005 | A1 |
20050022313 | Scheidler | Feb 2005 | A1 |
20050031489 | Angros | Feb 2005 | A1 |
20050053793 | Benay-Oun et al. | Mar 2005 | A1 |
20050063876 | Angros | Mar 2005 | A1 |
20050070026 | Angros | Mar 2005 | A1 |
20050070424 | Chiang et al. | Mar 2005 | A1 |
20050075020 | Benayoun et al. | Apr 2005 | A1 |
20050106762 | Chakrapani et al. | May 2005 | A1 |
20050121782 | Nakamura et al. | Jun 2005 | A1 |
20050143547 | Stark et al. | Jun 2005 | A1 |
20050165194 | Benayoun et al. | Jul 2005 | A1 |
20050170098 | Baumann et al. | Aug 2005 | A1 |
20050181195 | Dubrow | Aug 2005 | A1 |
20050211405 | Yeh | Sep 2005 | A1 |
20050221098 | Azzopardi et al. | Oct 2005 | A1 |
20050239211 | Uchihara et al. | Oct 2005 | A1 |
20050245395 | Tanaka et al. | Nov 2005 | A1 |
20060013983 | Sebastian et al. | Jan 2006 | A1 |
20060029808 | Zhai et al. | Feb 2006 | A1 |
20060040164 | Vyas et al. | Feb 2006 | A1 |
20060051561 | Badyal | Mar 2006 | A1 |
20060052556 | Franchina et al. | Mar 2006 | A1 |
20060057390 | Kittle et al. | Mar 2006 | A1 |
20060062695 | Haab et al. | Mar 2006 | A1 |
20060062929 | Kittle et al. | Mar 2006 | A1 |
20060081394 | Li et al. | Apr 2006 | A1 |
20060089466 | Shimomura et al. | Apr 2006 | A1 |
20060099397 | Thierauf et al. | May 2006 | A1 |
20060110541 | Russell et al. | May 2006 | A1 |
20060110542 | Dietz et al. | May 2006 | A1 |
20060113443 | Remmers | Jun 2006 | A1 |
20060147634 | Strauss | Jul 2006 | A1 |
20060151739 | Sandner et al. | Jul 2006 | A1 |
20060154048 | Teranishi et al. | Jul 2006 | A1 |
20060160984 | Nagasawa et al. | Jul 2006 | A1 |
20060162373 | McMillin et al. | Jul 2006 | A1 |
20060172641 | Hennige et al. | Aug 2006 | A1 |
20060185555 | Giessler et al. | Aug 2006 | A1 |
20060207032 | Reiners et al. | Sep 2006 | A1 |
20060213849 | Bienick | Sep 2006 | A1 |
20060222865 | Hoshino et al. | Oct 2006 | A1 |
20060244034 | Sakurai et al. | Nov 2006 | A1 |
20060263516 | Jones et al. | Nov 2006 | A1 |
20060266258 | Asakura et al. | Nov 2006 | A1 |
20060269758 | Helmeke | Nov 2006 | A1 |
20060281889 | Kobayashi et al. | Dec 2006 | A1 |
20060286305 | Thies et al. | Dec 2006 | A1 |
20060292345 | Dave et al. | Dec 2006 | A1 |
20070003705 | Strauss | Jan 2007 | A1 |
20070005024 | Weber et al. | Jan 2007 | A1 |
20070009657 | Zhang et al. | Jan 2007 | A1 |
20070014970 | Nun et al. | Jan 2007 | A1 |
20070026193 | Luzinov et al. | Feb 2007 | A1 |
20070028625 | Joshi et al. | Feb 2007 | A1 |
20070046160 | Egan | Mar 2007 | A1 |
20070065668 | Idei | Mar 2007 | A1 |
20070075199 | Stewart et al. | Apr 2007 | A1 |
20070141306 | Kasai et al. | Jun 2007 | A1 |
20070148407 | Chen et al. | Jun 2007 | A1 |
20070166513 | Sheng et al. | Jul 2007 | A1 |
20070172650 | O'Rear et al. | Jul 2007 | A1 |
20070172658 | Deruelle et al. | Jul 2007 | A1 |
20070172661 | Fechner et al. | Jul 2007 | A1 |
20070176379 | Sonnendorfer et al. | Aug 2007 | A1 |
20070196656 | Rowell | Aug 2007 | A1 |
20070202342 | Whiteford et al. | Aug 2007 | A1 |
20070213230 | Pfeiffer et al. | Sep 2007 | A1 |
20070215004 | Kuroda et al. | Sep 2007 | A1 |
20070218265 | Harris et al. | Sep 2007 | A1 |
20070224898 | Deangelis et al. | Sep 2007 | A1 |
20070231517 | Golownia | Oct 2007 | A1 |
20070237947 | Gleason et al. | Oct 2007 | A1 |
20070238807 | Safir et al. | Oct 2007 | A1 |
20070259156 | Kempers et al. | Nov 2007 | A1 |
20070274871 | Jiang | Nov 2007 | A1 |
20070298216 | Jing et al. | Dec 2007 | A1 |
20080012459 | Picken et al. | Jan 2008 | A1 |
20080018709 | Takenaka et al. | Jan 2008 | A1 |
20080020127 | Whiteford et al. | Jan 2008 | A1 |
20080021212 | Whiteford et al. | Jan 2008 | A1 |
20080032403 | Saito et al. | Feb 2008 | A1 |
20080039558 | Lazzari et al. | Feb 2008 | A1 |
20080044635 | O'Neill et al. | Feb 2008 | A1 |
20080050567 | Kawashima et al. | Feb 2008 | A1 |
20080063870 | O'Rear et al. | Mar 2008 | A1 |
20080066648 | Asakura et al. | Mar 2008 | A1 |
20080070146 | Fomitchev et al. | Mar 2008 | A1 |
20080073505 | Niu et al. | Mar 2008 | A1 |
20080076005 | Levesque et al. | Mar 2008 | A1 |
20080088192 | Hsu | Apr 2008 | A1 |
20080090004 | Zhang et al. | Apr 2008 | A1 |
20080101041 | Chang et al. | May 2008 | A1 |
20080102347 | Blunk | May 2008 | A1 |
20080107864 | Zhang et al. | May 2008 | A1 |
20080131653 | Lyons et al. | Jun 2008 | A1 |
20080160257 | Takada et al. | Jul 2008 | A1 |
20080166549 | Shieh et al. | Jul 2008 | A1 |
20080171805 | Mingarelli et al. | Jul 2008 | A1 |
20080172937 | Palmer et al. | Jul 2008 | A1 |
20080176991 | Osawa et al. | Jul 2008 | A1 |
20080197760 | Leconte et al. | Aug 2008 | A1 |
20080199657 | Capron et al. | Aug 2008 | A1 |
20080199659 | Zhao | Aug 2008 | A1 |
20080205950 | Moorlag et al. | Aug 2008 | A1 |
20080206550 | Borlner | Aug 2008 | A1 |
20080207581 | Whiteford et al. | Aug 2008 | A1 |
20080213601 | Yamamoto et al. | Sep 2008 | A1 |
20080220170 | Van Der Flaas | Sep 2008 | A1 |
20080220676 | Marin et al. | Sep 2008 | A1 |
20080221009 | Kanagasabapathy et al. | Sep 2008 | A1 |
20080221263 | Kanagasabapathy et al. | Sep 2008 | A1 |
20080226694 | Gelbart et al. | Sep 2008 | A1 |
20080233355 | Henze et al. | Sep 2008 | A1 |
20080237126 | Hoek et al. | Oct 2008 | A1 |
20080241512 | Boris et al. | Oct 2008 | A1 |
20080241523 | Huignard et al. | Oct 2008 | A1 |
20080245273 | Vyorkka et al. | Oct 2008 | A1 |
20080246804 | Kawase et al. | Oct 2008 | A1 |
20080248263 | Kobrin | Oct 2008 | A1 |
20080250978 | Baumgart et al. | Oct 2008 | A1 |
20080261024 | Xenopoulos et al. | Oct 2008 | A1 |
20080268233 | Lawin et al. | Oct 2008 | A1 |
20080269358 | Inoue et al. | Oct 2008 | A1 |
20080280148 | Nun et al. | Nov 2008 | A1 |
20080280699 | Jarvholm | Nov 2008 | A1 |
20080286556 | D'urso et al. | Nov 2008 | A1 |
20080295347 | Braham | Dec 2008 | A1 |
20080296252 | D'Urso et al. | Dec 2008 | A1 |
20080299288 | Kobrin et al. | Dec 2008 | A1 |
20080306202 | Lin et al. | Dec 2008 | A1 |
20080310660 | Lin | Dec 2008 | A1 |
20090010870 | Greiner et al. | Jan 2009 | A1 |
20090011222 | Xiu et al. | Jan 2009 | A1 |
20090011227 | Furukawa | Jan 2009 | A1 |
20090011960 | Wu | Jan 2009 | A1 |
20090018249 | Kanagasabapathy et al. | Jan 2009 | A1 |
20090025508 | Liao et al. | Jan 2009 | A1 |
20090025609 | Egami et al. | Jan 2009 | A1 |
20090032088 | Rabinowitz | Feb 2009 | A1 |
20090036978 | Kleiner et al. | Feb 2009 | A1 |
20090042469 | Simpson | Feb 2009 | A1 |
20090058247 | Collins et al. | Mar 2009 | A1 |
20090064894 | Baumgart et al. | Mar 2009 | A1 |
20090076430 | Simpson et al. | Mar 2009 | A1 |
20090084914 | Picken et al. | Apr 2009 | A1 |
20090085453 | Daley et al. | Apr 2009 | A1 |
20090087670 | Peng et al. | Apr 2009 | A1 |
20090095941 | Nakata et al. | Apr 2009 | A1 |
20090099301 | Naraghi et al. | Apr 2009 | A1 |
20090105409 | Munzmay et al. | Apr 2009 | A1 |
20090105679 | Joubert et al. | Apr 2009 | A1 |
20090111344 | Murphy et al. | Apr 2009 | A1 |
20090115302 | Benz et al. | May 2009 | A1 |
20090123659 | Oles et al. | May 2009 | A1 |
20090134758 | Vardon | May 2009 | A1 |
20090136737 | Ring et al. | May 2009 | A1 |
20090142604 | Imai et al. | Jun 2009 | A1 |
20090155566 | Gentleman et al. | Jun 2009 | A1 |
20090162592 | Baikerikar et al. | Jun 2009 | A1 |
20090163637 | Li et al. | Jun 2009 | A1 |
20090167182 | Frick | Jul 2009 | A1 |
20090181237 | Kaiser et al. | Jul 2009 | A1 |
20090182085 | Escobar Barrios et al. | Jul 2009 | A1 |
20090186070 | Guire et al. | Jul 2009 | A1 |
20090188877 | Stewart | Jul 2009 | A1 |
20090195136 | Wing et al. | Aug 2009 | A1 |
20090196990 | Simpson et al. | Aug 2009 | A1 |
20090212505 | McMillin et al. | Aug 2009 | A1 |
20090227164 | Broch-Nielsen et al. | Sep 2009 | A1 |
20090236091 | Hammami et al. | Sep 2009 | A1 |
20090246473 | Lee et al. | Oct 2009 | A1 |
20090298369 | Koene et al. | Dec 2009 | A1 |
20100001625 | Eckartsberg et al. | Jan 2010 | A1 |
20100003493 | Cheng et al. | Jan 2010 | A1 |
20100026156 | Leconte et al. | Feb 2010 | A1 |
20100052491 | Vardon | Mar 2010 | A1 |
20100102693 | Driver et al. | Apr 2010 | A1 |
20100109498 | Ramm et al. | May 2010 | A1 |
20100117502 | Kang et al. | May 2010 | A1 |
20100133970 | Shin et al. | Jun 2010 | A1 |
20100176703 | Kim | Jul 2010 | A1 |
20100181884 | De La Garza et al. | Jul 2010 | A1 |
20100196702 | Furukawa | Aug 2010 | A9 |
20100213334 | Davenport | Aug 2010 | A1 |
20100294721 | Frazier et al. | Nov 2010 | A1 |
20100330347 | Badyal et al. | Dec 2010 | A1 |
20110164399 | Driver et al. | Jul 2011 | A1 |
20110268973 | Guire et al. | Nov 2011 | A1 |
20120104924 | Nash et al. | May 2012 | A1 |
20120104925 | Nash et al. | May 2012 | A1 |
20120216880 | Nall et al. | Aug 2012 | A1 |
20120234113 | Angros | Sep 2012 | A1 |
20130037505 | Driver et al. | Feb 2013 | A1 |
Number | Date | Country |
---|---|---|
2175848 | Jan 2000 | CA |
2436871 | Feb 2004 | CA |
2113879 | Aug 1992 | CN |
2313146 | Apr 1999 | CN |
1566891 | Jan 2005 | CN |
101046271 | Oct 2007 | CN |
101255549 | Sep 2008 | CN |
101311238 | Nov 2008 | CN |
0 207 282 | Jan 1987 | EP |
0 294 906 | Dec 1988 | EP |
0 307 915 | Mar 1989 | EP |
0 317 057 | May 1989 | EP |
0 332 141 | Sep 1989 | EP |
0 399 568 | Nov 1990 | EP |
0 405 317 | Jan 1991 | EP |
0 452 723 | Oct 1991 | EP |
0 472 215 | Feb 1992 | EP |
0 493 270 | Jul 1992 | EP |
0 535 451 | Apr 1993 | EP |
0 437 268 | Jan 1994 | EP |
0 623 656 | Nov 1994 | EP |
0 624 404 | Nov 1994 | EP |
0 649 887 | Apr 1995 | EP |
0 657 393 | Jun 1995 | EP |
0 657 939 | Jun 1995 | EP |
0 669 871 | Sep 1995 | EP |
0 714 870 | Jun 1996 | EP |
0 714 921 | Jun 1996 | EP |
0 719 743 | Jul 1996 | EP |
0 719 821 | Jul 1996 | EP |
0 738 309 | Oct 1996 | EP |
0 739 714 | Oct 1996 | EP |
0 745 567 | Dec 1996 | EP |
0 745 568 | Dec 1996 | EP |
0 752 459 | Jan 1997 | EP |
0 770 706 | May 1997 | EP |
0 799 791 | Oct 1997 | EP |
0 811 430 | Dec 1997 | EP |
0 863 191 | Sep 1998 | EP |
0 867 048 | Sep 1998 | EP |
0 903 389 | Mar 1999 | EP |
0 904 343 | Mar 1999 | EP |
0 914 873 | May 1999 | EP |
0 915 103 | May 1999 | EP |
0 930 351 | Jul 1999 | EP |
0 969 718 | Jan 2000 | EP |
1 047 735 | Nov 2000 | EP |
1 048 696 | Nov 2000 | EP |
1 072 572 | Jan 2001 | EP |
1 095 923 | May 2001 | EP |
1 097 979 | May 2001 | EP |
1 108 735 | Jun 2001 | EP |
1 113 064 | Jul 2001 | EP |
1 136 539 | Sep 2001 | EP |
1 180 533 | Feb 2002 | EP |
1 187 872 | Mar 2002 | EP |
1 193 289 | Apr 2002 | EP |
1 204 617 | May 2002 | EP |
1 215 252 | Jun 2002 | EP |
1 261 559 | Dec 2002 | EP |
1 333 053 | Aug 2003 | EP |
1 360 253 | Nov 2003 | EP |
1 362 904 | Nov 2003 | EP |
1 387 011 | Feb 2004 | EP |
1 387 169 | Feb 2004 | EP |
1 392 619 | Mar 2004 | EP |
1 392 772 | Mar 2004 | EP |
1 401 903 | Mar 2004 | EP |
1 407 792 | Apr 2004 | EP |
1 429 919 | Jun 2004 | EP |
1 431 126 | Jun 2004 | EP |
1 433 821 | Jun 2004 | EP |
1 449 582 | Aug 2004 | EP |
1 473 355 | Nov 2004 | EP |
1 475 234 | Nov 2004 | EP |
1 479 738 | Nov 2004 | EP |
1 492 837 | Jan 2005 | EP |
1 503 813 | Feb 2005 | EP |
1 524 290 | Apr 2005 | EP |
1 583 615 | Oct 2005 | EP |
1 752 284 | Feb 2007 | EP |
1 772 479 | Apr 2007 | EP |
1 787 716 | May 2007 | EP |
1 857 497 | Nov 2007 | EP |
1 873 218 | Jan 2008 | EP |
1 875 279 | Jan 2008 | EP |
1 883 669 | Feb 2008 | EP |
1 902 091 | Mar 2008 | EP |
1 908 804 | Apr 2008 | EP |
1 988 129 | Nov 2008 | EP |
1 997 619 | Dec 2008 | EP |
2 030 779 | Mar 2009 | EP |
1 503 718 | Jul 2009 | EP |
1 341 605 | Dec 1973 | GB |
54031585 | Mar 1979 | JP |
56122815 | Sep 1981 | JP |
57053535 | Mar 1982 | JP |
61250010 | Nov 1986 | JP |
62215610 | Sep 1987 | JP |
62-246960 | Oct 1987 | JP |
1005884 | Jan 1989 | JP |
08007650 | Jan 1996 | JP |
08104370 | Apr 1996 | JP |
08130268 | May 1996 | JP |
08151280 | Jun 1996 | JP |
2002283511 | Oct 2002 | JP |
2002284907 | Oct 2002 | JP |
2002363424 | Dec 2002 | JP |
2004130785 | Apr 2004 | JP |
2004219534 | Aug 2004 | JP |
2004308984 | Nov 2004 | JP |
2004308984 | Nov 2004 | JP |
2005126605 | May 2005 | JP |
2007070411 | Mar 2007 | JP |
2007182491 | Jul 2007 | JP |
2008228958 | Oct 2008 | JP |
2009071672 | Apr 2009 | JP |
10-2003-0052853 | Jun 2003 | KR |
175646 | Aug 1994 | MX |
183533 | Dec 1996 | MX |
192053 | May 1999 | MX |
195031 | Jan 2000 | MX |
199899 | Nov 2000 | MX |
201072 | Mar 2001 | MX |
203880 | Aug 2001 | MX |
205074 | Nov 2001 | MX |
PA01011653 | Dec 2002 | MX |
215752 | Aug 2003 | MX |
PA02006399 | Sep 2003 | MX |
PA05006898 | Aug 2005 | MX |
PA02012841 | Jan 2006 | MX |
234477 | Feb 2006 | MX |
PA06003323 | Mar 2006 | MX |
1288191 | Feb 1987 | SU |
I252213 | Apr 2006 | TW |
I263619 | Oct 2006 | TW |
WO-8801286 | Feb 1988 | WO |
WO-9104305 | Apr 1991 | WO |
WO-9316131 | Aug 1993 | WO |
WO-9320165 | Oct 1993 | WO |
WO-9413734 | Jun 1994 | WO |
WO-9604123 | Feb 1996 | WO |
WO-9607621 | Mar 1996 | WO |
WO-9631771 | Oct 1996 | WO |
WO-9707993 | Mar 1997 | WO |
WO-9820960 | May 1998 | WO |
WO-9923137 | May 1999 | WO |
WO-9923437 | May 1999 | WO |
WO-9940431 | Aug 1999 | WO |
WO-9947578 | Sep 1999 | WO |
WO-9948339 | Sep 1999 | WO |
WO-9957185 | Nov 1999 | WO |
WO-9964363 | Dec 1999 | WO |
WO-0005321 | Feb 2000 | WO |
WO-0014297 | Mar 2000 | WO |
WO-0025938 | May 2000 | WO |
WO-0034361 | Jun 2000 | WO |
WO-0039240 | Jul 2000 | WO |
WO-0046464 | Aug 2000 | WO |
WO-0066241 | Nov 2000 | WO |
WO-0112317 | Feb 2001 | WO |
WO-0119745 | Mar 2001 | WO |
WO-0162682 | Aug 2001 | WO |
WO-0174739 | Oct 2001 | WO |
WO-0179142 | Oct 2001 | WO |
WO-0179371 | Oct 2001 | WO |
WO-0198399 | Dec 2001 | WO |
WO-0214417 | Feb 2002 | WO |
WO-0220259 | Mar 2002 | WO |
WO-0228951 | Apr 2002 | WO |
WO-0243937 | Jun 2002 | WO |
WO-0247187 | Jun 2002 | WO |
WO-02062910 | Aug 2002 | WO |
WO-02074869 | Sep 2002 | WO |
WO-02096831 | Dec 2002 | WO |
WO-02098983 | Dec 2002 | WO |
WO-03010255 | Feb 2003 | WO |
WO-03012004 | Feb 2003 | WO |
WO-03030879 | Apr 2003 | WO |
WO-03037702 | May 2003 | WO |
WO-03045693 | Jun 2003 | WO |
WO-03064025 | Aug 2003 | WO |
WO-03080258 | Oct 2003 | WO |
WO-03082998 | Oct 2003 | WO |
WO-03092748 | Nov 2003 | WO |
WO-03093568 | Nov 2003 | WO |
WO-2004012625 | Feb 2004 | WO |
WO-2004043319 | May 2004 | WO |
WO-2004058418 | Jul 2004 | WO |
WO-2004072556 | Aug 2004 | WO |
WO-2004076154 | Sep 2004 | WO |
WO-2004104116 | Dec 2004 | WO |
WO-2004110132 | Dec 2004 | WO |
WO-2005005679 | Jan 2005 | WO |
WO-2005021843 | Mar 2005 | WO |
WO-2005023935 | Mar 2005 | WO |
WO-2005028562 | Mar 2005 | WO |
WO-2005068399 | Jul 2005 | WO |
WO-2005077429 | Aug 2005 | WO |
WO-2005081722 | Sep 2005 | WO |
WO-2006044641 | Apr 2006 | WO |
WO-2006044642 | Apr 2006 | WO |
WO-2006081891 | Aug 2006 | WO |
WO-2006083600 | Aug 2006 | WO |
WO-2006091235 | Aug 2006 | WO |
WO-2006101934 | Sep 2006 | WO |
WO-2006121534 | Nov 2006 | WO |
WO-2006135755 | Dec 2006 | WO |
WO-2007011731 | Jan 2007 | WO |
WO-2007007995 | Jan 2007 | WO |
WO-2007027276 | Mar 2007 | WO |
WO-2007052260 | May 2007 | WO |
WO-2007053266 | May 2007 | WO |
WO-2007056427 | May 2007 | WO |
WO-2007070801 | Jun 2007 | WO |
WO-2007075407 | Jul 2007 | WO |
WO-2007075390 | Jul 2007 | WO |
WO-2007092746 | Aug 2007 | WO |
WO-2007102960 | Sep 2007 | WO |
WO-2007104494 | Sep 2007 | WO |
WO-2007126432 | Nov 2007 | WO |
WO-2007126743 | Nov 2007 | WO |
WO-2007130294 | Nov 2007 | WO |
WO-2007149617 | Dec 2007 | WO |
WO-2008004828 | Jan 2008 | WO |
WO-2008006078 | Jan 2008 | WO |
WO-2008021791 | Feb 2008 | WO |
WO-2008035347 | Mar 2008 | WO |
WO-2008035917 | Mar 2008 | WO |
WO-2008045022 | Apr 2008 | WO |
WO-2008048498 | Apr 2008 | WO |
WO-2008050895 | May 2008 | WO |
WO-2008051221 | May 2008 | WO |
WO-2008066828 | Jun 2008 | WO |
WO-2008071983 | Jun 2008 | WO |
WO-2008078346 | Jul 2008 | WO |
WO-2008088116 | Jul 2008 | WO |
WO-2008106494 | Sep 2008 | WO |
WO-2008112158 | Sep 2008 | WO |
WO-2008123650 | Oct 2008 | WO |
WO-2008123955 | Oct 2008 | WO |
WO-2008123961 | Oct 2008 | WO |
WO-2008134243 | Nov 2008 | WO |
WO-2008137973 | Nov 2008 | WO |
WO-2008141971 | Nov 2008 | WO |
WO-2008151991 | Dec 2008 | WO |
WO-2008153687 | Dec 2008 | WO |
WO-2009003847 | Jan 2009 | WO |
WO-2009005465 | Jan 2009 | WO |
WO-2009012116 | Jan 2009 | WO |
WO-2009018327 | Feb 2009 | WO |
WO-2009028745 | Mar 2009 | WO |
WO-2009037717 | Mar 2009 | WO |
WO-2009041752 | Apr 2009 | WO |
WO-2009061199 | May 2009 | WO |
WO-2009073901 | Jun 2009 | WO |
WO-2009148611 | Dec 2009 | WO |
WO-2009158567 | Dec 2009 | WO |
WO-2010042191 | Apr 2010 | WO |
WO-2010042668 | Apr 2010 | WO |
WO-2012115986 | Aug 2012 | WO |
WO 2012115986 | Aug 2012 | WO |
Entry |
---|
“Fumed Silica”, Prodexim (downloaded 2012). |
“Hydrophobicity, hydrophilicity and silane surface modification”, Gelest, Inc. product catalog (2011). |
“Silicone Resin Applications”, product manual by VERTEC (now Johnson Matthey Catalysts) (available prior to Nov. 2, 2009). |
Burkarter et al., Superhydrophobic electrosprayed PTFE, Surface & Coatings Technology, 202:194-8 (2007). |
Chuppina et al., Synthesis of sodium-chromium pyrophosphate as a pigment for organosilicate hydrophobic heat-resistant coating, Seventh Russian-Israeli Bi-National Workshop 2008 (4 pages). |
Declaration of Chris B. Schechter filed before the Patent and Trial Board on Jun. 14, 2013. |
Du, Surfactants, Dispersants, and Defoamers for the Coatings, Inks, and Adhesives Industries, p. 7, IN: Tracton (ed.): Coatings Technology Handbook, 3rd edition, Taylor & Francis Group (2005). |
Elkin et al., Wettability, chemical and morphological data of hydrophobic layers by plasma polymerization on smooth substrates, Surface and Coatings Technology, 116-9: 836-40 (1999). |
EPO Communication regarding third-party observations in corresponding European application No. 09771098.2 (Dec. 5, 2011). |
European Examination Report for Application No. 10776886.3, dated May 8, 2013. |
Extended European search report from corresponding European application No. 09771098.2, dated Dec. 27, 2011. |
Feng et al., Fabrication of superhydrophobic and heat-insulating antimony doped tin oxide/polyurethane films by cast replica micromolding, J. Colloid Interface Sci., 336(1):268-72 (2009). |
Final Office Action for U.S. Appl. No. 13/651,842 dated Apr. 8, 2013. |
Final Office Action, U.S. Appl. No. 12/835,913, Badyal et al. Oct. 23, 2012. |
First Office Action from the State Intellectual Property Office of P.R. China from counterpart application CN200980124417.6 (Mar. 1, 2012) (English and Chinese). |
Gilath, Water repellent coating for welding electrodes based on sol-gel technology, J. Sol-Gel Sci. Technol., 10:101-4 (1997). |
Guilman, Limit the messes with the spillproof slideout shelf in the GE Profile refrigerators Nov. 13, 2008. |
International Preliminary Report on Patentability for corresponding international application No. PCT/US2009/048775, dated Jan. 13, 2011. |
International Search Report and Written Opinion for International Application No. PCT/US2010/048711, dated Mar. 17, 2011. |
International Search Report and Written Opinion from corresponding International Application No. PCT/US2009/048775, dated Nov. 19, 2009. |
International Search Report and Written Opinion from International Application No. PCT/US2010/054936, dated Feb. 16, 2011. |
Kobayashi et al., Surface Tension of Poly[(3,3,4,4,5,5,6,6,6-nonafluorohexyl)-methylsiloxane], Marcomolecules, 23:4929-4933 (1990). |
Le Marechal et al., Textile Finishing Industry as an Important Source of Organic Pollutants, IN: Puzyn (ed.), Organic Pollutants Ten Years After the Stockholm Convention—Environmental and Analytical Update, In Tech (2012). |
Lee et al., Surface modification of high heat resistant UV cured polyurethane dispersions, European Polymer J., 43(10):4271-8 (2007). |
Liu et al., Can superhydrophobic surfaces repel hot water? J. Mater. Chem., 19:5602 (2009). |
Mayer, The chemistry and properties of silicone resins, Surface Coatings Intl., 82(2):77-83 (1999). |
Mayer, The chemistry and properties of silicone resins: network formers (in paints and renders), Pigment & Resin Technology, 27(6):364-73 (1998). |
Ming et al., Toward Superlyophobic Surfaces, p. 200 IN: Mittal (ed.), Contact Angle, Wettability and Adhesion, vol. 6 (2006). |
NeverWet coatings are superhydrophobic surfaces, downloaded from the Internet at: <http://www.neverwet.com/product-characteristics.php> (Mar. 7, 2013). |
Nonfinal Office Action from U.S. Appl. No. 13/082,319 (Apr. 3, 2013). |
Nonfinal Office Action, U.S. Appl. No. 13/000,487 Sep. 6, 2012. |
Nonfinal Office Action, U.S. Appl. No. 13/082,327, Bleecher et al. Dec. 21, 2012. |
Office Action for U.S. Appl. No. 13/651,842 dated Jan. 10, 2013. |
Office action for U.S. Appl. No. 12/562,920 dated Mar. 29, 2012. |
Petition for Inter Partes Review of U.S. Patent No. 8,286,561 under 35 U.S.C. §§ 311-319 and 37 C.F.R. § 42.100 et seq., filed before the Patent and Trial Board on Jun. 14, 2013. |
Power of Attorney pursuant to 37 C.F.R. § 42.10(b) filed before the Patent and Trial Board on Jun. 14, 2013. |
Prosecution history of European application No. EP06787306.7 (published as EP1902091) as of Sep. 3, 2009. |
Researchers develop ultra-thin heat protective coatings for rockets, insulating coatings for microelectronics (Aug. 27, 2001). |
Shilova et al., The influence of low- and high-molecular Hydroxyl-Containing Additives on the Stability of Sol-Gel Tetraethoxysilane-Based Systems and on the Structure of Hybrid Organic-Inorganic Coatings, Glass Physics and Chemistry, 29(4): 379-89 (2003). |
Supplementary European Search Report, European Application No. 09771098 Completed date Dec. 9, 2011. |
Third party opposition filed in corresponding European applicaton No. 09771098.2 (Dec. 5, 2011). |
Uneiko Corporation, Rain Clear available at <http://web.archive.org/web/20070706032331/http:/www.rainclear.com/> (archived Jul. 6, 2007). |
Uyanik et al., Heat-resistant hydrophobic-oleophobic coatings, J. Appl. Polymer Sci., 100(3):2386-92 (2006). |
Van der Wal et al., Soft Matter, 3:426 (2009). |
Wang et al., Fabrication and anti-frosting performance of super hydrophobic coating based on modified nano-sized calcium carbonate and ordinary polyacrylate, Appl. Surface Sci., 253(22):8818-24 (2007). |
What's Hot in Beverage Centers, Kitchen & Bath Business, vol. 56, No. 7, pp. 20-21, Aug. 2009. |
Witucki, The evoluation of silicon-based technology in coatings, Dow Corning Corporation (2003). |
Wolf, “Haier Heralds 08 Applicance Line in NYC” Dec. 3, 2007. |
Zhang et al., Surface properties and gas permeability of Polybutadiene membrane treated with various fluorine containing gas plasmas, sen'i Gakkaishi, 47(12):635-43 ( 991). |
2009 R&D 100 Award Entry Form (p. 5 excerpt from another document) showing Fig. 1 Schematic of NICE (“no ice nanocoating”) (2009). |
Bayer Materials Science product information on Bayhydrol® 110 polyurethane dispersion (two first pages of this brochure) (Aug. 2002). |
Bayer Materials Science product information on Bayhydrol® 122 polyurethane dispersion (Jan. 2004). |
Bayer Materials Science product information on Bayhydrol® 124 polyurethane dispersion (Jan. 2004). |
Bayer Materials Science product information on Bayhydrol® 140AQ polyurethane dispersion (Aug. 2002). |
Bayer Materials Science product information on Bayhydrol® A145, aqueous hydroxyl-functional polyurethane dispersion (Jan. 2010). |
Clark et al., Paints and Pigments, dowloaded from the Internet at: <http://nzic.org.nz/ChemProcesses/polymers/10D.pdf> (copyright Aug. 2005). |
International Preliminary Report on Patentability, PCT/US2010/059909, Jul. 4, 2012. |
International Search Report and Written Opinion, PCT/US2009/005512, mailing date Dec. 8, 2009. |
International Search Report and Written Opinion, PCT/US2010/059909, mailing date Feb. 9, 2011. |
International Search Report and Written Opinion, PCT/US2012/025982, mailing date Jun. 13, 2012. |
Sherwin-Williams Chemical Coatings product information for CC-E14, POLANE® 700T, water reducible enamel (May 2010). |
Two webpages re pigment particle size downloaded from the Internet at: <http://www.specialchem4coatings.com/tc/tio2/index.aspx?id=whiteness>, SpecialChem S.A. (printed on Sep. 3, 2013). |
Nonfinal office action, U.S. Appl. No. 12/835,913, mail date Jun. 14, 2013. |
Final Office Action, U.S. Appl. No. 13/082,327, Sep. 23, 2013. |
“Composition”, in Collins English Dictionary (2000), viewed Aug. 26, 2013 from <http://www.credoreferences.com/entry/hcengdict/composition>. |
Decision, Institution of Inter Partes Review 37 C.F.R. § 42.108, Schott Gemtron Corp. v. SSW Holding Co., Inc., Case IPR2013-00358, Paper No. 14, Nov. 4, 2013, 20 pages. |
First Office Action, Chinese patent application No. 201080036561.7, dated Nov. 28, 2013 [in Chinese with English translation]. |
Trial No. IPR2013-00358, in re Inter Partes Review of United States Patent No. 8,286,561, Final Written Opinion (Aug. 20, 2014). |
Nonfinal office action, U.S. Appl. No. 13/082,319, mailed Sep. 22, 2014. |
Nonfinal office action, U.S. Appl. No. 13/082,327, mailed Sep. 19, 2014. |
Examination Report, European patent application No. 10776886.3, dated Mar. 11, 2015. |
Number | Date | Country | |
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20120216880 A1 | Aug 2012 | US |
Number | Date | Country | |
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61258124 | Nov 2009 | US |