Claims
- 1. An electronic device cooler for cooling a plurality of exothermic members, as arranged in a case, with an air flow established by a cooling fan, comprising:a heat pipe having portions partially and in series connected to said plurality of exothermic members in a heat transferable manner; a radiation unit, to which another portion of said heat pipe is connected in a heat transferable manner and configured to be cooled by said air flow; and an electromagnetic shield plate, to which said plurality of exothermic members are attached in a heat transferable manner and along which said heat pipe is arranged.
- 2. An electronic device cooler according to claim 1,wherein said radiation unit includes a heat sink to which one end portion of said heat pipe is connected in a heat transferable manner, and wherein said cooling fan is arranged in a heat transferable manner with respect to said heat sink.
- 3. An electronic device cooler according to claim 1,wherein said cooling fan is so attached to the peripheral wall of said case as to blow air from the inside to the outside of said case.
- 4. An electronic device cooler according to claim 1,wherein said plurality of exothermic members include electronic elements.
- 5. An electronic device cooler for cooling a plurality of exothermic members, as arranged in a case, with an air flow established by a cooling fan, comprising:a heat pipe having portions partially connected to the plurality of exothermic members in a heat transferable manner; a radiation unit, to which another portion of said heat pipe is connected in a heat transferable manner, and configured to be cooled by said air flow; and a radiation plate, to which the plurality of exothermic members are attached in a heat transferable manner and along which said heat pipe is arranged, wherein said radiation plate includes an electromagnetic shield plate.
- 6. An electronic device cooler according to claim 5,wherein said radiation unit includes a heat sink to which one end portion of said heat pipe is connected in a heat transferable manner, and wherein said cooling fan is arranged in a heat transferable manner with respect to said heat sink.
- 7. An electronic device cooler according to claim 5,wherein said cooling fan is attached to a peripheral wall of said case so as to blow air from the inside to the outside of the case.
- 8. An electronic device cooler according to claim 5,wherein the plurality of exothermic members include electronic elements.
Priority Claims (2)
Number |
Date |
Country |
Kind |
9-041544 |
Feb 1997 |
JP |
|
9-231839 |
Aug 1997 |
JP |
|
Parent Case Info
This application is a Div. Ser. No. 09/020,896 filed Feb. 9, 1998.
US Referenced Citations (15)
Foreign Referenced Citations (3)
Number |
Date |
Country |
487026 |
Jun 1938 |
GB |
403070975 |
Mar 1991 |
JP |
405223375 |
Aug 1993 |
JP |