The invention relates to a cooler according to the present disclosure.
Due to ever increasing demands, for example, on PC processors with respect to their power, the cooling requirements of these processors increase correspondingly. Here, the cooling should be performed as quietly as possible.
The task of the invention is to make available an improved cooler, which is, however, economical as much as possible, especially one that can be produced economically, in particular for PC processors.
This task is accomplished by a cooler with the features of the present disclosure. Advantageous constructions are described hereinafter.
According to the invention, a cooler, which can be used advantageously for cooling one or more semiconductor components, especially PC processors, is provided with a heat-absorbing area and a heat-dissipating area, which has a channel system that is composed of profiled elements and/or stamped sheet-metal parts soldered to each other and that is filled at least partially with a coolant, and corrugated sheet-metal ribs arranged between the channels of the channel system in the heat-dissipating area. In this way, because the components are soldered to each other, simple production with only one soldering process is possible. Here, the coolant guidance can be constructed so that no other lines are necessary, i.e., the channel system is formed preferably exclusively by parts that can be soldered to each other.
The parts that are used preferably involve as many identical parts as possible, so that the tool and logistics costs can be kept low.
The channel system preferably has a square shape at least in the heat-dissipating area, which simplifies the use of identical parts.
In this way, in the heat-dissipating area there are several planes that are preferably interconnected by means of at least two connections. The connections are preferably arranged at the corners, especially at diagonally opposite corners.
For the use of stamped and bent sheet-metal parts, the connections are preferably constructed as formed areas of these parts, wherein they project upwards. In this way, the connections preferably have a round tube-like construction.
For simple filling, preferably a closable filling nozzle is provided opening into the heat-absorbing area. In this way, the filling nozzle can also have an air flow-specific task, for which it is constructed preferably at the highest position in the middle in the direction of the fan.
The heat-absorbing area is preferably formed by a chamber, in which a plurality of crossbars, pins, or other surface area-increasing elements project outwards from the side, at which the element to be cooled is attached. In this way, the longitudinal extent of the surface area-increasing element is preferably perpendicular to the planes of the channel system in the heat-dissipating area.
To allow good heat transfer, the corrugated sheet-metal ribs are preferably arranged running parallel to the stamped and bent sheet-metal parts forming the channels, wherein the crests and valleys of the corrugated sheet-metal ribs are arranged running perpendicular to the longitudinal extent and in the direction of the width of the channels. With an airtight attachment of the fan above the cooler, all of the air fed through the fan can flow through the heat-dissipating area, i.e., the entire amount of supplied air can be used, which makes possible an optimization of the cooling output.
Attachment openings or boreholes for bolts or threaded boreholes are preferably provided on the cooler for a fan, with the fan preferably being attached in the heat-dissipating area.
The cooler is preferably partially filled with an alcohol-water mixture as coolant, wherein the coolant is at a slightly reduced pressure, so that the boiling point is lowered and the boiling point is reached even for relatively low temperatures in the heat-absorbing area.
A cooler (1) for a PC processor comprises a heat absorption area (3), a heat dissipation area (4), and a channel system (2) consisting of profiled elements and/or stamped/bent components (8) welded together. The channel system is at least partially filled with a coolant and comprises between the channels of the channel system (2) corrugated sheets (9) that are provided in the heat dissipation area (4).
In the following, the invention is explained in detail using an embodiment with a variant with reference to the drawings.
a-c illustrate a sheet, which is used for a channel, from various perspectives.
For the purposes of promoting an understanding of the disclosure, reference will now be made to the embodiments illustrated in the drawings and specific language will be used to describe the same. It will nevertheless be understood that no limitation of the scope of the disclosure is thereby intended, such alterations and further modifications in the illustrated device and its use, and such further applications of the principles of the disclosure as illustrated therein being contemplated as would normally occur to one skilled in the art to which the disclosure relates.
A cooler 1 for a PC processor (not shown) has a channel system 2, in which a coolant is located, with a heat-absorbing area 3 and a heat-dissipating area 4. The heat-dissipating area 3, shown at the bottom in
A closable coolant filling nozzle 7, with whose help the channel system 2 is partially filled after successful production of the cooler 1 with the coolant, in the present case an alcohol-water mixture, which is at a slightly reduced pressure, opens into the heat-absorbing area 3.
The heat-absorbing area 3 is connected via openings (not shown in more detail) to the heat-dissipating area 4. The heat-dissipating area 4 is composed essentially from sheet-metal parts 8 constructed as stamped and bent parts (see
Corrugated ribs 9 are arranged between two planes of the channel system 2, wherein the orientation of the corrugated ribs 9 is such that good ventilation is possible with the help of a fan (not shown) attached by means of screws (at the top in
The arrangement of the cooler 1 is advantageous so that the heat-absorbing area 3 is arranged underneath the heat-dissipating area 4, so that the liquid coolant flows downward and collects there. Due to the reduced low pressure, the boiling point is reduced, so that even for a relatively small increase in the temperature, due to the heat output by the PC processor, boiling generates bubbles, which rise upwards, that is, also into the heat-dissipating area 4, and thus ensure a continuous thorough mixing of the coolant. In the heat-dissipating area 4, the coolant is cooled by the dissipation of heat outward to the air fed from the fan. The cooled coolant sinks back into the heat-absorbing area 3, where it can again absorb and dissipate heat.
According to one variant, instead of stamped and bent sheet-metal parts, profiled elements and plates are used, which allow a corresponding layout of the channel system. The profiled elements and plates can also be soldered to each other in one work process. The function corresponds to that of the first embodiment.
While the preferred embodiment of the invention has been illustrated and described in the drawings and foregoing description, the same is to be considered as illustrative and not restrictive in character, it being understood that all changes and modifications that come within the spirit of the invention are desired to be protected.
Number | Date | Country | Kind |
---|---|---|---|
10 2005 004 777.7 | Feb 2005 | DE | national |
This application is a National Stage filing of International Application PCT/EP2006/000681, filed Jan. 26, 2006, claiming priority to German Application No. 10 2005 004 777.7, filed Feb. 1, 2005, entitled “COOLER”. The present application claims priority to PCT/EP2006/000681, and to German Application No. 10 2005 004 777.7, and both references are expressly incorporated by reference herein, in their entireties.
Filing Document | Filing Date | Country | Kind | 371c Date |
---|---|---|---|---|
PCT/EP06/00681 | 1/26/2006 | WO | 00 | 12/6/2007 |