Cooling by change of state

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H01L23/427

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/427Cooling by change of state

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Embedded cooling systems for advanced device packaging and methods...
- Patent number 12,368,087
- Issue date Jul 22, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal module for a semiconductor package and methods of forming t...
- Patent number 12,362,258
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Po-Yao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vapor chamber
- Patent number 12,345,473
- Issue date Jul 1, 2025
- Cooler Master Co., Ltd.
- Lei-Lei Liu
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Heat dissipation device
- Patent number 12,347,746
- Issue date Jul 1, 2025
- AURAS TECHNOLOGY CO., LTD.
- Cheng-Ju Chang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Two-phase liquid-cooled electrical power apparatus
- Patent number 12,349,325
- Issue date Jul 1, 2025
- Raytheon Company
- Stephen B. Kuznetsov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip cooling package with multiple fluid paths
- Patent number 12,341,082
- Issue date Jun 24, 2025
- BAIDU USA LLC
- Tianyi Gao
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Heatsink, active energy irradiation device, and active energy irrad...
- Patent number 12,338,987
- Issue date Jun 24, 2025
- Hamamatsu Photonics K.K.
- Kyoichi Murayama
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Component cooler for a computing device
- Patent number 12,336,147
- Issue date Jun 17, 2025
- Advanced Micro Devices, Inc.
- Christopher M. Helberg
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Heat transfer device for high heat flux applications and related me...
- Patent number 12,332,000
- Issue date Jun 17, 2025
- University of Virginia Patent Foundation
- Hossein Haj-Hariri
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Baffles for electronic circuits immersed in cooling fluid in a tank
- Patent number 12,322,676
- Issue date Jun 3, 2025
- Auradine, Inc.
- Anuya Reddy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module comprising a pulsating heat pipe
- Patent number 12,322,675
- Issue date Jun 3, 2025
- Siemens Aktiengesellschaft
- Florian Schwarz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vapor chamber heat spreader for bare die processors
- Patent number 12,315,779
- Issue date May 27, 2025
- Amazon Technologies, Inc.
- Luke Thomas Gregory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat spreader for a semiconductor package
- Patent number 12,315,781
- Issue date May 27, 2025
- Xilinx, Inc.
- Gamal Refai-Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,300,573
- Issue date May 13, 2025
- Mediatek Inc.
- Bo-Jiun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vapor chamber, electronic device, metallic sheet for vapor chamber...
- Patent number 12,298,082
- Issue date May 13, 2025
- Dai Nippon Printing Co., Ltd.
- Shinichiro Takahashi
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Heat dissipation member
- Patent number 12,292,238
- Issue date May 6, 2025
- Kyocera Corporation
- Yuichi Abe
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Two-phase immersion-cooling heat-dissipation composite structure ha...
- Patent number 12,289,865
- Issue date Apr 29, 2025
- AMULAIRE THERMAL TECHNOLOGY, INC.
- Chun-Te Wu
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Chip cooling platform based on micro-nano structure
- Patent number 12,278,164
- Issue date Apr 15, 2025
- Guangdong Ocean University
- Haowei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heatsink for co-packaged optical switch rack package
- Patent number 12,274,036
- Issue date Apr 8, 2025
- MARVELL ASIA PTE. LTD.
- Radhakrishnan L. Nagarajan
- G02 - OPTICS
Information Patent Grant
Compliant thermal management devices, systems, and methods of fabri...
- Patent number 12,262,509
- Issue date Mar 25, 2025
- Georgios Karamanis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radiator module and method of manufacturing the same
- Patent number 12,261,096
- Issue date Mar 25, 2025
- Denso Corporation
- Shinya Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Phase change material (PCM)-based conductive thermal actuator switc...
- Patent number 12,258,948
- Issue date Mar 25, 2025
- Raytheon Company
- Andrew J. Pitts
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Heat sinks with beyond-board fins
- Patent number 12,262,514
- Issue date Mar 25, 2025
- International Business Machines Corporation
- Shurong Tian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management in integrated circuit packages
- Patent number 12,261,097
- Issue date Mar 25, 2025
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power overlay module with thermal storage
- Patent number 12,237,243
- Issue date Feb 25, 2025
- GE Aviation Systems LLC
- Rinaldo Luigi Miorini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat-transfer member and cooling system
- Patent number 12,222,166
- Issue date Feb 11, 2025
- Kyushu University, National University Corporation
- Yasuyuki Takata
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Substrate, electronic device, and method for manufacturing substrate
- Patent number 12,218,085
- Issue date Feb 4, 2025
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Hirofumi Makino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-noise heat exchanger
- Patent number 12,207,443
- Issue date Jan 21, 2025
- Dell Products L.P.
- Qinghong He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Housing comprising a composite wall integrating at least one coolin...
- Patent number 12,207,442
- Issue date Jan 21, 2025
- SAFRAN ELECTRONICS & DEFENSE
- Muriel Sabah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System for electrically decoupled, homogeneous temperature control...
- Patent number 12,198,907
- Issue date Jan 14, 2025
- Meyer Burger (Germany) GmbH
- Christian Böhm
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HEAT SINK WITH HEAT PIPE HANDLE PORTION
- Publication number 20250239503
- Publication date Jul 24, 2025
- ZT Group Int’l, Inc. dba ZT Systems
- Sruti Chigullapalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND METHO...
- Publication number 20250239504
- Publication date Jul 24, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH HEAT DISSIPATION STRUCTURE HAVING ONE OR MOR...
- Publication number 20250233047
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20250233048
- Publication date Jul 17, 2025
- Samsung Electronics Co., Ltd.
- Juno Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND MET...
- Publication number 20250233053
- Publication date Jul 17, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOVEL CHIP COOLING PLATFORM BASED ON MICRO-NANO STRUCTURE
- Publication number 20250226287
- Publication date Jul 10, 2025
- GUANGDONG OCEAN UNIVERSITY
- Haowei LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEATSINK FOR CO-PACKAGED OPTICAL SWITCH RACK PACKAGE
- Publication number 20250227888
- Publication date Jul 10, 2025
- Marvell Asia Pte Ltd.
- Radhakrishnan L. NAGARAJAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROL UNIT
- Publication number 20250210454
- Publication date Jun 26, 2025
- ROBERT BOSCH GmbH
- Maximilian Amberger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED COOLING SYSTEMS FOR ADVANCED DEVICE PACKAGING AND METHODS...
- Publication number 20250210459
- Publication date Jun 26, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VAPOR CHAMBER, ELECTRONIC DEVICE, AND CHIP PACKAGE STRUCTURE
- Publication number 20250212366
- Publication date Jun 26, 2025
- Huawei Technologies Co., Ltd
- Leonid Leonardovich VASILIEV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO VAPOR CHAMBER LIDS
- Publication number 20250210453
- Publication date Jun 26, 2025
- ADVANCED MICRO DEVICES, INC.
- Joshua Taylor Knight
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL STRUCTURE FOR SEMICONDUCTOR PACKAGE
- Publication number 20250210458
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Chang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reflowable Vapor Chamber Lid
- Publication number 20250201663
- Publication date Jun 19, 2025
- Marvell Asia Pte Ltd.
- Alaba Bamido
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND FORMATION METHOD OF PACKAGE WITH HEAT-SPREADING LID
- Publication number 20250201668
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VAPOR CHAMBER, ELECTRONIC APPARATUS, AND METHOD FOR MANUFACTURING V...
- Publication number 20250185214
- Publication date Jun 5, 2025
- DAI NIPPON PRINTING CO., LTD.
- Shinichiro TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVE THERMAL CONTROL LAYER FOR INTEGRATED DEVICE
- Publication number 20250167074
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sam Vaziri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS
- Publication number 20250157879
- Publication date May 15, 2025
- Samsung Electronics Co., Ltd.
- Dongkyun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONICS MODULE COMPRISING A PULSATING HEAT PIPE WITH A CHANNEL...
- Publication number 20250157878
- Publication date May 15, 2025
- SIEMENS AKTIENGESELLSCHAFT
- VLADIMIR DANOV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER CONVERSION DEVICE
- Publication number 20250157880
- Publication date May 15, 2025
- Hitachi Astemo, Ltd.
- Fusanori NISHIKIMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTIMIZED COMBINED MICROCHANNEL AND HEAT PIPES FOR ELECTRONICS COOLING
- Publication number 20250157881
- Publication date May 15, 2025
- Kambiz Vafai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION DEVICE
- Publication number 20250159841
- Publication date May 15, 2025
- National Tsing-Hua University
- Shwin-Chung Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLING SYSTEM FOR HETEROGENEOUS INTEGRATED SEMICONDUCTOR PACKAGE S...
- Publication number 20250149403
- Publication date May 8, 2025
- Wistron Corporation
- Tung-Yang TANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION BY NANO PIPES
- Publication number 20250140644
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hsien Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CHIP STRUCTURE WITH HIGH THERMAL CONDUCTIVITY LAYER
- Publication number 20250140697
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hsien Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER HIGH ASPECT RATIO MICROCHANNEL DEVICE
- Publication number 20250123058
- Publication date Apr 17, 2025
- ThermAvant Technologies, LLC
- Lily Ellebracht
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
INVERTED MEMORY STACK
- Publication number 20250125220
- Publication date Apr 17, 2025
- ADVANCED MICRO DEVICES, INC.
- Gabriel LOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID HEAT SINK
- Publication number 20250118627
- Publication date Apr 10, 2025
- SIEMENS AKTIENGESELLSCHAFT
- Hans Knauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION STRUCTURE OF HIGH-POWER CHIP POWER SUPPLY MODULE
- Publication number 20250118628
- Publication date Apr 10, 2025
- SHANGHAI METAPWR ELECTRONICS CO., LTD
- Qingdong CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLY COMPRISING A FIRST SEMICONDUCTOR ELEMENT AND...
- Publication number 20250112118
- Publication date Apr 3, 2025
- SIEMENS AKTIENGESELLSCHAFT
- VLADIMIR DANOV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power, Signaling and Thermal Path Co-optimization
- Publication number 20250112154
- Publication date Apr 3, 2025
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS

Cooling by change of state

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Embedded cooling systems for advanced device packaging and methods...

Thermal module for a semiconductor package and methods of forming t...

Vapor chamber

Heat dissipation device

Two-phase liquid-cooled electrical power apparatus

Chip cooling package with multiple fluid paths

Heatsink, active energy irradiation device, and active energy irrad...

Component cooler for a computing device

Heat transfer device for high heat flux applications and related me...

Baffles for electronic circuits immersed in cooling fluid in a tank

Electronic module comprising a pulsating heat pipe

Vapor chamber heat spreader for bare die processors

Heat spreader for a semiconductor package

Semiconductor device and manufacturing method thereof

Vapor chamber, electronic device, metallic sheet for vapor chamber...

Heat dissipation member

Two-phase immersion-cooling heat-dissipation composite structure ha...

Chip cooling platform based on micro-nano structure

Heatsink for co-packaged optical switch rack package

Compliant thermal management devices, systems, and methods of fabri...

Radiator module and method of manufacturing the same

Phase change material (PCM)-based conductive thermal actuator switc...

Heat sinks with beyond-board fins

Thermal management in integrated circuit packages

Power overlay module with thermal storage

Heat-transfer member and cooling system

Substrate, electronic device, and method for manufacturing substrate

Low-noise heat exchanger

Housing comprising a composite wall integrating at least one coolin...

System for electrically decoupled, homogeneous temperature control...

Patents Applicationslast 30 patents

HEAT SINK WITH HEAT PIPE HANDLE PORTION

EMBEDDED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND METHO...

PACKAGE STRUCTURE WITH HEAT DISSIPATION STRUCTURE HAVING ONE OR MOR...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

INTEGRATED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND MET...

NOVEL CHIP COOLING PLATFORM BASED ON MICRO-NANO STRUCTURE

HEATSINK FOR CO-PACKAGED OPTICAL SWITCH RACK PACKAGE

CONTROL UNIT

EMBEDDED COOLING SYSTEMS FOR ADVANCED DEVICE PACKAGING AND METHODS...

VAPOR CHAMBER, ELECTRONIC DEVICE, AND CHIP PACKAGE STRUCTURE

MICRO VAPOR CHAMBER LIDS

THERMAL STRUCTURE FOR SEMICONDUCTOR PACKAGE

Reflowable Vapor Chamber Lid

STRUCTURE AND FORMATION METHOD OF PACKAGE WITH HEAT-SPREADING LID

VAPOR CHAMBER, ELECTRONIC APPARATUS, AND METHOD FOR MANUFACTURING V...

PASSIVE THERMAL CONTROL LAYER FOR INTEGRATED DEVICE

SEMICONDUCTOR APPARATUS

ELECTRONICS MODULE COMPRISING A PULSATING HEAT PIPE WITH A CHANNEL...

POWER CONVERSION DEVICE

OPTIMIZED COMBINED MICROCHANNEL AND HEAT PIPES FOR ELECTRONICS COOLING

HEAT DISSIPATION DEVICE

COOLING SYSTEM FOR HETEROGENEOUS INTEGRATED SEMICONDUCTOR PACKAGE S...

HEAT DISSIPATION BY NANO PIPES

INTEGRATED CHIP STRUCTURE WITH HIGH THERMAL CONDUCTIVITY LAYER

MULTILAYER HIGH ASPECT RATIO MICROCHANNEL DEVICE

INVERTED MEMORY STACK

HYBRID HEAT SINK

HEAT DISSIPATION STRUCTURE OF HIGH-POWER CHIP POWER SUPPLY MODULE

SEMICONDUCTOR ASSEMBLY COMPRISING A FIRST SEMICONDUCTOR ELEMENT AND...

Power, Signaling and Thermal Path Co-optimization