Cooling by change of state

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H01L23/427

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/427Cooling by change of state

Industries

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Patents Grantslast 30 patents

Information Patent Grant
High speed network device with orthogonal pluggable optics modules
- Patent number 12,158,627
- Issue date Dec 3, 2024
- Arista Networks, Inc.
- Adam Hemp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation device assembly
- Patent number 12,146,714
- Issue date Nov 19, 2024
- Asia Vital Components Co., Ltd.
- Sheng-Huang Lin
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Alignment mechanism
- Patent number 12,140,625
- Issue date Nov 12, 2024
- Delta Design, Inc.
- Jerry Ihor Tustaniwskyj
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High performance two-phase cooling apparatus for portable applications
- Patent number 12,140,385
- Issue date Nov 12, 2024
- PiMEMS, Inc.
- Payam Bozorgi
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Heat-activated pump with integrated evaporator for electronic chip...
- Patent number 12,133,363
- Issue date Oct 29, 2024
- Hamfop Technologies LLC
- Mudasir Ahmad
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Device and method for a two phase heat transfer
- Patent number 12,130,093
- Issue date Oct 29, 2024
- National University of Singapore
- Poh Seng Lee
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Vapor chamber and manufacturing method of the same
- Patent number 12,117,244
- Issue date Oct 15, 2024
- Cooler Master Co., Ltd.
- Chi-Lung Chen
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Heat pipe with in-plane heat spreader and loading mechanism
- Patent number 12,114,466
- Issue date Oct 8, 2024
- Intel Corporation
- Penchala Pratap Binni Boyina
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Cooling of power semiconductors
- Patent number 12,107,032
- Issue date Oct 1, 2024
- ABB Schweiz AG
- Colin Tschida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermoelectric composite, preparation method therefor, and thermoel...
- Patent number 12,108,677
- Issue date Oct 1, 2024
- Industry-University Cooperation Foundation Hanyang University Erica Campus
- Tae Joo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for optimization of vapor transport in a thermal...
- Patent number 12,104,856
- Issue date Oct 1, 2024
- KELVIN THERMAL TECHNOLOGIES, INC.
- Ryan John Lewis
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 12,100,638
- Issue date Sep 24, 2024
- Denso Corporation
- Shohei Nagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Data processing device
- Patent number 12,094,802
- Issue date Sep 17, 2024
- Delta Electronics (Shanghai) Co., Ltd.
- Pengkai Ji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MEMS-based active cooling systems
- Patent number 12,089,374
- Issue date Sep 10, 2024
- Frore Systems Inc.
- Prabhu Sathyamurthy
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Grant
Heat exchanger
- Patent number 12,074,089
- Issue date Aug 27, 2024
- Denso Corporation
- Xiaolin Guo
- B08 - CLEANING
Information Patent Grant
Method of constructing a circuitry assembly for heat dispersal usin...
- Patent number 12,068,223
- Issue date Aug 20, 2024
- Elta Systems Ltd.
- Michael Kedem
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for cooling electronics
- Patent number 12,068,422
- Issue date Aug 20, 2024
- Simmonds Precision Products, Inc.
- Craig R. Bibeau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal material with high capacity and high conductivity, method f...
- Patent number 12,060,301
- Issue date Aug 13, 2024
- Thales
- Matthieu Pawlik
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Power device assemblies and cooling devices for cooling heat-genera...
- Patent number 12,062,593
- Issue date Aug 13, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling in conductors for chips
- Patent number 12,063,763
- Issue date Aug 13, 2024
- Hamilton Sundstrand Corporation
- Jeffrey Ewanchuk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component package for high power ASIC thermal management
- Patent number 12,057,368
- Issue date Aug 6, 2024
- BAIDU USA LLC
- Tianyi Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
EM and RF mitigation silicon structures in stacked die microprocess...
- Patent number 12,057,433
- Issue date Aug 6, 2024
- Intel Corporation
- Sameer Shekhar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shrouded powder patch
- Patent number 12,050,061
- Issue date Jul 30, 2024
- Aavid Thermalloy, LLC
- Sukhvinder S. Kang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
3D cooling block for heat dissipation in electronic devices
- Patent number 12,040,251
- Issue date Jul 16, 2024
- Yuci Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat pipe for vertically stacked field effect transistors
- Patent number 12,040,250
- Issue date Jul 16, 2024
- International Business Machines Corporation
- Terence Hook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems for evaporation of liquid from droplet confined...
- Patent number 12,009,283
- Issue date Jun 11, 2024
- Washington University
- Damena Agonafer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management in integrated circuit packages
- Patent number 12,007,170
- Issue date Jun 11, 2024
- Intel Corporation
- Feras Eid
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Semiconductor package including lid with integrated heat pipe for t...
- Patent number 12,009,276
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Yu-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallic thermal interface materials and associated devices, system...
- Patent number 12,004,324
- Issue date Jun 4, 2024
- Deeia Inc.
- Himanshu Pokharna
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor module assembly having a cooling body and at least on...
- Patent number 11,996,348
- Issue date May 28, 2024
- Siemens Aktiengesellschaft
- Florian Schwarz
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HEAT RADIATION DEVICES
- Publication number 20240413053
- Publication date Dec 12, 2024
- Samsung Electronics Co., Ltd.
- Youngjoon Koh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRESSURE RELIEF VALVE AND ADSORBENT CHAMBER FOR TWO-PHASE IMMERSION...
- Publication number 20240404916
- Publication date Dec 5, 2024
- MTS IP Holdings Ltd
- Nihal Joshua
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
DATA PROCESSING DEVICE
- Publication number 20240404915
- Publication date Dec 5, 2024
- DELTA ELECTRONICS (SHANGHAI) CO., LTD.
- Pengkai JI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MANAGEMENT MODULE OF AN INTEGRATED CIRCUIT ASSEMBLY
- Publication number 20240395660
- Publication date Nov 28, 2024
- Apple Inc.
- Halil Berberoglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED COOLING ASSEMBLIES INCLUDING SIGNAL REDISTRIBUTION AND M...
- Publication number 20240387324
- Publication date Nov 21, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Top-Mounted Heat Dissipation Photovoltaic Inverter Device
- Publication number 20240389282
- Publication date Nov 21, 2024
- Huawei Digital Power Technologies Co., Ltd.
- Maofan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MODULE FOR A SEMICONDUCTOR PACKAGE AND METHODS OF FORMING T...
- Publication number 20240387321
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Po-Yao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE THERMAL INTERFACE MATERIALS AND ASSOCIATED DEVICES, SYSTE...
- Publication number 20240389274
- Publication date Nov 21, 2024
- Deeia Inc.
- Himanshu Pokharna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REMOTE HEAT SINK SIDE ATTACH METHODOLOGY
- Publication number 20240387320
- Publication date Nov 21, 2024
- Cisco Technology, Inc.
- Gary K. CHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND MET...
- Publication number 20240387322
- Publication date Nov 21, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED COOLING ASSEMBLIES INCLUDING SIGNAL REDISTRIBUTION AND M...
- Publication number 20240387323
- Publication date Nov 21, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMS-BASED ACTIVE COOLING SYSTEMS
- Publication number 20240373593
- Publication date Nov 7, 2024
- Frore Systems Inc.
- Prabhu Sathyamurthy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MANAGEMENT PLANES
- Publication number 20240369306
- Publication date Nov 7, 2024
- KELVIN THERMAL TECHNOLOGIES, INC.
- Ryan J. Lewis
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
CHIP PACKAGE STRUCTURE AND FABRICATION
- Publication number 20240371716
- Publication date Nov 7, 2024
- Yangtze Memory Technologies Co., Ltd.
- Li TAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE WITH A SUBSTRATE AND AT LEAST ONE SEMICONDUCTO...
- Publication number 20240363487
- Publication date Oct 31, 2024
- SIEMENS AKTIENGESELLSCHAFT
- VOLKER MÜLLER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOCALIZED DAMPING ELEMENTS FOR MITIGATING INTERCONNECT VIBRATION DA...
- Publication number 20240355759
- Publication date Oct 24, 2024
- Intel Corporation
- Phil Geng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EM AND RF MITIGATION SILICON STRUCTURES IN STACKED DIE MICROPROCESS...
- Publication number 20240355778
- Publication date Oct 24, 2024
- Intel Corporation
- Sameer SHEKHAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-ON-CHIP POWER CARD HAVING IMMERSION COOLING
- Publication number 20240321698
- Publication date Sep 26, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE...
- Publication number 20240321679
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Youngjoon KOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH 2-PHASE COOLING STRUCTURE
- Publication number 20240321680
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Sungchan KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat Transfer Device for High Heat Flux Applications and Related Me...
- Publication number 20240310128
- Publication date Sep 19, 2024
- University of Virginia Patent Foundation
- Hossein Haj-Hariri
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
HEAT TRANSPORT DEVICE AND SEMICONDUCTOR MODULE
- Publication number 20240297095
- Publication date Sep 5, 2024
- DENSO CORPORATION
- Shinya ITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VAPOR CHAMBER
- Publication number 20240295366
- Publication date Sep 5, 2024
- Delta Electronics, Inc.
- Shih-Lin HUANG
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
THERMAL MANAGEMENT SYSTEM FOR ELECTRONIC DEVICE
- Publication number 20240290686
- Publication date Aug 29, 2024
- ADVANCED MICRO DEVICES, INC.
- Gamal REFAI-AHMED
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER DEVICE EMBEDDED PRINTED CIRCUIT BOARD ASSEMBLIES WITH THIN FI...
- Publication number 20240290687
- Publication date Aug 29, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE LID WITH A VAPOR CHAMBER BASE HAVING AN ANGLED PORTION AND...
- Publication number 20240274504
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Po-Yao LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION DEVICES
- Publication number 20240258199
- Publication date Aug 1, 2024
- THERO NEW MATERIAL TECHNOLOGY CO., LTD
- Xin NIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIMM COOLING ASSEMBLIES
- Publication number 20240260233
- Publication date Aug 1, 2024
- Intel Corporation
- Ming Zhang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FLOATING HEAT SPREADER WITH GUIDED MECHANISM
- Publication number 20240258190
- Publication date Aug 1, 2024
- ADVANCED MICRO DEVICES, INC.
- Gamal REFAI-AHMED
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR COOLING HIGH POWER DEVICES
- Publication number 20240243545
- Publication date Jul 18, 2024
- LAWRENCE LIVERMORE NATIONAL SECURITY, LLC
- Susant K. PATRA
- H01 - BASIC ELECTRIC ELEMENTS

Cooling by change of state

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

High speed network device with orthogonal pluggable optics modules

Heat dissipation device assembly

Alignment mechanism

High performance two-phase cooling apparatus for portable applications

Heat-activated pump with integrated evaporator for electronic chip...

Device and method for a two phase heat transfer

Vapor chamber and manufacturing method of the same

Heat pipe with in-plane heat spreader and loading mechanism

Cooling of power semiconductors

Thermoelectric composite, preparation method therefor, and thermoel...

Method and device for optimization of vapor transport in a thermal...

Semiconductor device

Data processing device

MEMS-based active cooling systems

Heat exchanger

Method of constructing a circuitry assembly for heat dispersal usin...

Systems and methods for cooling electronics

Thermal material with high capacity and high conductivity, method f...

Power device assemblies and cooling devices for cooling heat-genera...

Cooling in conductors for chips

Component package for high power ASIC thermal management

EM and RF mitigation silicon structures in stacked die microprocess...

Shrouded powder patch

3D cooling block for heat dissipation in electronic devices

Heat pipe for vertically stacked field effect transistors

Methods and systems for evaporation of liquid from droplet confined...

Thermal management in integrated circuit packages

Semiconductor package including lid with integrated heat pipe for t...

Metallic thermal interface materials and associated devices, system...

Semiconductor module assembly having a cooling body and at least on...

Patents Applicationslast 30 patents

HEAT RADIATION DEVICES

PRESSURE RELIEF VALVE AND ADSORBENT CHAMBER FOR TWO-PHASE IMMERSION...

DATA PROCESSING DEVICE

THERMAL MANAGEMENT MODULE OF AN INTEGRATED CIRCUIT ASSEMBLY

INTEGRATED COOLING ASSEMBLIES INCLUDING SIGNAL REDISTRIBUTION AND M...

Top-Mounted Heat Dissipation Photovoltaic Inverter Device

THERMAL MODULE FOR A SEMICONDUCTOR PACKAGE AND METHODS OF FORMING T...

COMPOSITE THERMAL INTERFACE MATERIALS AND ASSOCIATED DEVICES, SYSTE...

REMOTE HEAT SINK SIDE ATTACH METHODOLOGY

INTEGRATED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND MET...

INTEGRATED COOLING ASSEMBLIES INCLUDING SIGNAL REDISTRIBUTION AND M...

MEMS-BASED ACTIVE COOLING SYSTEMS

THERMAL MANAGEMENT PLANES

CHIP PACKAGE STRUCTURE AND FABRICATION

SEMICONDUCTOR MODULE WITH A SUBSTRATE AND AT LEAST ONE SEMICONDUCTO...

LOCALIZED DAMPING ELEMENTS FOR MITIGATING INTERCONNECT VIBRATION DA...

EM AND RF MITIGATION SILICON STRUCTURES IN STACKED DIE MICROPROCESS...

CHIP-ON-CHIP POWER CARD HAVING IMMERSION COOLING

HEAT DISSIPATION STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE...

SEMICONDUCTOR DEVICE WITH 2-PHASE COOLING STRUCTURE

Heat Transfer Device for High Heat Flux Applications and Related Me...

HEAT TRANSPORT DEVICE AND SEMICONDUCTOR MODULE

VAPOR CHAMBER

THERMAL MANAGEMENT SYSTEM FOR ELECTRONIC DEVICE

POWER DEVICE EMBEDDED PRINTED CIRCUIT BOARD ASSEMBLIES WITH THIN FI...

PACKAGE LID WITH A VAPOR CHAMBER BASE HAVING AN ANGLED PORTION AND...

HEAT DISSIPATION DEVICES

DIMM COOLING ASSEMBLIES

FLOATING HEAT SPREADER WITH GUIDED MECHANISM

SYSTEMS AND METHODS FOR COOLING HIGH POWER DEVICES