The technical field of the present disclosure relates to a cooling apparatus, and in particular, to a cooling apparatus for a server.
Server systems are known to generate heat during operation, and the installation of cooling apparatus in server systems to ensure stable operation of the systems is a common cooling solution. However, as technology advances, heat generated by electronic components also becomes higher. Accordingly, liquid-cooling apparatus of higher cooling efficiency is one of the design choices for electronic component cooling.
In addition, related-art liquid-cooling apparatus for servers typically includes the elements of pump, heat sink and fan to achieve cooling of heat-generating components. Nevertheless, since a server system is typically under continuous operation for a long period of time, in case where a pump of the cooling apparatus fails or requires repair, the entire cooling apparatus may need to be suspended or shut down and that may lead to operational risks of the server. Furthermore, most of the cooling apparatus of servers require the use of tools for installation, and their assembly operations are relatively difficult and inconvenient. Moreover, the pump quantity cannot be adjusted or the replacement cannot be made according to the actual needs, such that the flexibility of such cooling apparatus is reduced.
In view of the above, the inventor seeks to overcome the aforementioned drawbacks associated with the current technology and aims to provide an effective solution through extensive researches along with utilization of academic principles and knowledge.
An objective of the present disclosure is to provide a cooling apparatus for a server, and the cooling apparatus includes a hot-swap pump, an inlet anti-leakage pipe and an outlet anti-leakage pipe, such that when the pump is connected in a hot-swap manner, it may prevent leakage of the cooling fluid, thereby increasing the flexibility and convenience of the cooling apparatus during installation and assembly.
To achieve the aforementioned objective, the present disclosure provides a cooling apparatus for a server, including a heat exchanger, an external cooling loop, an internal cooling loop and a first hot-swap pump. The heat exchanger includes an external inlet opening, an external outlet opening, an internal inlet opening and an internal outlet opening. The external cooling loop includes an external inlet pipe and an external outlet pipe. An external cooling fluid flows into the external inlet opening from the external inlet pipe and passes through the heat exchanger to further flow out of the external outlet opening to the external outlet pipe. The internal cooling loop includes an internal inlet pipe and internal outlet pipe. An internal cooling fluid flows into the internal inlet pipe from the server and further flows into the internal inlet opening from the internal inlet pipe and passes through the heat exchanger to perform heat exchange with the external cooling fluid to flow out of the internal outlet opening to the internal outlet pipe. The first hot-swap pump includes a first pump main body, a first inlet anti-leakage pipe, a first outlet anti-leakage pipe and a first hot-swap connector. The first inlet anti-leakage pipe and the first outlet anti-leakage pipe communicate with the first pump main body. The first inlet anti-leakage pipe includes a first inlet connector and a first inlet anti-leakage valve arranged in the first inlet connector. The first outlet anti-leakage pipe includes a first outlet connector and a first outlet anti-leakage valve arranged in the first outlet connector. The first hot-swap connector is electrically connected to the first pump main body. The internal cooling fluid flows out of the internal outlet opening and flows into the first inlet connector and passes through the first inlet anti-leakage valve to enter the first pump main body. The internal cooling fluid flows out of the first pump main body and flows into the first outlet connector and further passes through the first outlet anti-leakage valve to enter the server.
In comparison with related art, the cooling apparatus for a server of the present disclosure includes a hot-swap pump, an inlet anti-leakage pipe and an outlet anti-leakage pipe, such that during the removal and insertion processes of the swappable pump, it may prevent leakage of the cooling fluid, and the use of tools required for installation of pumps in related-art cooling apparatus may be eliminated, thereby increasing the assembly convenience for users. Furthermore, the cooling apparatus of the present disclosure utilizes a hot-swap pump such that the pump quantity may be adjusted or replaced according to the actual needs, thereby increasing the flexibility of actual use of the cooling apparatus and improving the practicality.
The technical contents of this disclosure will become apparent with the detailed description of embodiments accompanied with the illustration of related drawings as follows. It is intended that the embodiments and drawings disclosed herein are to be considered illustrative rather than restrictive.
In an exemplary embodiment of the present disclosure, the cooling apparatus 1 further includes a power supply 50 and a control panel 60. The power supply 50 provides the electrical power necessary for the operation of the cooling apparatus 1. The control panel 60 is electrically connected to the first hot-swap pump 40 and is used to control the operation of the cooling apparatus 1.
Please refer to
As shown in
During the actual use, the external inlet pipe 21 and the external outlet pipe 22 are connected to an external fluid container (not shown in the drawings), such as a container of water tower. The external fluid container contains a cooling fluid for providing the cooling liquid necessary for the heat exchanger 10 to perform heat exchange. In addition, the external inlet pipe 21 is connected to the external inlet opening 11 of the heat exchanger 10. Furthermore, the external outlet pipe 22 is connected to the external outlet opening 12 of the heat exchanger 10.
As shown in
In addition, it shall also be noted that during the actual use of the cooling apparatus 1 of the present disclosure, the internal outlet pipe 32 is connected to the cooling fluid input end of the server system, and absorbs the heat generated by the internal heat-generating elements inside the server system. Moreover, as the cooling fluid carries away the heat, its temperature is increased to become a hot fluid. Finally, it further flows into the internal inlet pipe 31, and enters the internal cooling loop 30 of the present disclosure, and the cooling cycle is complete.
Please refer to
To be more specific, the first inlet anti-leakage pipe 42 includes a first inlet connector 421 and a first inlet anti-leakage valve 422 arranged inside the first inlet connector 421. Furthermore, the first outlet anti-leakage pipe 43 includes a first outlet connector 431 and a first outlet anti-leakage valve 432 arranged inside the first outlet connector 431.
Please also refer to
It shall be noted that the cooling device 1 may include single hot-swap pump or a plurality of hot-swap pumps. In an exemplary embodiment, the cooling apparatus 1 further includes a second hot-swap pump 40a, as shown in
Furthermore, as shown in
In some embodiments, the first outlet anti-leakage pipe 43 includes a first outlet non-return valve 433. The second outlet anti-leakage pipe 43a includes a second outlet non-return valve 433a. In addition, when the pressure settings of the first hot-swap pump 40 and the second hot-swap pump 40a are different, the first outlet non-return valve 433 and the second outlet non-return valve 433a may prevent back flow of the fluid due to pressure difference.
In an exemplary embodiment, the cooling apparatus 1 includes the first hot-swap pump 40 and the second hot-swap pump 40a. In addition, the cooling apparatus 1 further includes a first branch pipe box 70 and a second branch pipe box 80. The first outlet anti-leakage pipe 43 and the second outlet anti-leakage pipe 43a are connected to the first branch pipe box 70, and the first branch pipe box 70 is connected to the internal outlet pipe 32. Furthermore, the first inlet anti-leakage pipe 42 and the second outlet anti-leakage pipe 42a are connected to the second branch pipe box 80, and the second branch pipe box 80 is connected to the internal outlet opening 14.
It shall be noted that the cooling apparatus 1 further includes a water tank 90 and a connecting pipe 91. The water tank 90 is connected to the second branch pipe box 80 via the connecting pipe. Accordingly, the water tank 90 may supply the cooling fluid inside the internal cooling loop 30.
Please refer to
During the attachment of the hot-swap pump, it is necessary to consider the electrical and mechanical connections in order to prevent the occurrence of improper contact or water leakage. In view of the above, the cooling apparatus 1 of the present disclosure includes a positioning structure formed on the first hot-swap pump 40 and the chassis 100 respectively to facilitate the first hot-swap pump 40 being installed on the chassis 100 accurately.
To be more specific, the chassis 100 includes a guiding block 101 and a pair of guiding tracks 102. In addition, the first pump main body 41 includes a guiding slot 410 arranged corresponding to the guiding block 101 for positioning with each other. The first pump main body 41 enters the chassis 100 along the pair of guiding tracks 102 for engaging with the first inlet anti-leakage pipe 42 and the first outlet anti-leakage pipe 43. Accordingly, the first hot-swap pump 40 may achieve electrical connection with the cooling apparatus 1 via the hot-swap manner. Furthermore, the first inlet anti-leakage pipe 42 and the first outlet anti-leakage pipe 43 may prevent the occurrence of the cooling fluid leakage.
Please further refer to
As shown in
As shown in
The above description is provided to illustrate the exemplary embodiments of the present disclosure only such that it shall not be treated as limitation to the claimed scope of the present disclosure. In addition, any equivalent modification made based on the present disclosure shall be considered to be within the claimed scope of the present disclosure.
Number | Name | Date | Kind |
---|---|---|---|
7484552 | Pfahnl | Feb 2009 | B2 |
7486513 | Hall | Feb 2009 | B2 |
7639499 | Campbell | Dec 2009 | B1 |
7929305 | Pal | Apr 2011 | B1 |
7961465 | Goldrian | Jun 2011 | B2 |
9215832 | Chang | Dec 2015 | B2 |
9575521 | North | Feb 2017 | B1 |
10459499 | Shabbir | Oct 2019 | B2 |
10617042 | Shelnutt | Apr 2020 | B2 |
11310939 | Ye | Apr 2022 | B2 |
11395443 | Varela Benitez | Jul 2022 | B2 |
12013732 | Carver | Jun 2024 | B2 |
20090218072 | Eriksen | Sep 2009 | A1 |
20100101765 | Campbell | Apr 2010 | A1 |
20140262180 | Lyon | Sep 2014 | A1 |
20180279510 | Johnson | Sep 2018 | A1 |
20190178592 | Chen | Jun 2019 | A1 |
20190182988 | Lunsman | Jun 2019 | A1 |
20190337355 | Shah | Nov 2019 | A1 |
20200053916 | Bonnin | Feb 2020 | A1 |
20200107470 | Archer | Apr 2020 | A1 |
20210274680 | Ye | Sep 2021 | A1 |
20210352830 | Varela Benitez | Nov 2021 | A1 |
20220248570 | Chen | Aug 2022 | A1 |
20230180431 | Archibald | Jun 2023 | A1 |
Number | Date | Country |
---|---|---|
M587771 | Dec 2019 | TW |
1738571 | Sep 2021 | TW |
202210716 | Mar 2022 | TW |
Number | Date | Country | |
---|---|---|---|
20230320040 A1 | Oct 2023 | US |