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OPTIMIZED CHIP COOLING INFRASTRUCTURE
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Publication number 20250063688
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Publication date Feb 20, 2025
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Microsoft Technology Licensing, LLC
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Eric C. PETERSON
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H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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HEAT-PUMP HEAT SOURCE APPARATUS
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Publication number 20250063690
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Publication date Feb 20, 2025
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Mitsubishi Electric Corporation
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Naoto ISHII
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F24 - HEATING RANGES VENTILATING
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COOLING DEVICE
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Publication number 20250063705
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Publication date Feb 20, 2025
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MAGNA POWERTRAIN GMBH & CO KG
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Werner Ness
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H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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IMMERSION COOLING APPARATUS
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Publication number 20250056758
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Publication date Feb 13, 2025
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NEC Corporation
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Atsuki TOKUDA
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H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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ELECTRONIC DEVICE
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Publication number 20250048588
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Publication date Feb 6, 2025
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DENSO CORPORATION
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Hiroki CHITAKA
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H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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ELECTRONIC DEVICE AND SERVER
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Publication number 20250048600
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Publication date Feb 6, 2025
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xFusion Digital Technologies Co., Ltd
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Chenglong Wang
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H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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COOLING APPARATUS FOR POWER MODULE
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Publication number 20250048589
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Publication date Feb 6, 2025
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Hyundai Motor Company
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Sang Hun LEE
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H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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IMMERSION COOLING SYSTEM
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Publication number 20250040083
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Publication date Jan 30, 2025
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Modine LLC
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Edward King
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H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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Internal Recirculation Cooling Module
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Publication number 20250031342
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Publication date Jan 23, 2025
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Jetcool Technologies Inc.
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Ludwig C. HABER
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H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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